KR20120076881A - Pigment composition for radiating heat and sheet for radiating heat using the same - Google Patents

Abstract

PURPOSE: A heat-radiating paint composition is provided to have excellent adhesion with substrate, and to have heat radiation, conductivity, solvent resistance, and water resistance all together. CONSTITUTION: A heat-radiating paint composition comprises 100.0 parts by weight of a binder resin solution, and 10-100 parts by weight of nanocarbon dispersion. The binder resin solution comprises 10-40 weight% of acrylic resin, 5-20 weight% of epoxy resin, 5-20 weight% of melamine resin, 5-20 weight% of alkyd resin, and 0.2-1 weight% of zircoaluminate coupling agent, and residual solvent. The nanocarbon dispersion comprises 5-10 weight% of the binder resin solution, 3-10 weight% of conductive carbon black with 40-100 nm size, 1-5 weight% of conductive graphite with 1-20 micron size, 0.3-1 weight% of coupling agent, 0.3-1 weight% of a dispersant, 0.3-1 weight% of a precipitation inhibitor, and a residual solvent.

Description

TECHNICAL FIELD [0001] The present invention relates to a heat dissipation coating composition and a heat dissipation sheet using the heat dissipation coating composition.

TECHNICAL FIELD The present invention relates to a heat dissipating coating composition which can be coated or adhered to the surfaces of electronic parts and LED lighting to effectively dissipate heat emitted from the devices and a heat-radiating sheet using the same.

Recently, with the increase in the performance, the miniaturization, and the high performance of electronic devices, the internal temperature of the device rises as the amount of heat generated by the electronic parts circuit increases, thereby causing malfunction of the semiconductor device, change of characteristics of the resistor component, and deterioration of component life. Various techniques have been applied to solve such a problem.

Such heat dissipation measures include a method of providing a heat sink or a heat sink. In addition, there is a method of inserting a heat transfer material such as a thermal grease, a heat radiation pad, a heat radiation tape or the like between the heat source and the heat sink.

However, the conventional heat dissipating method as described above merely serves to transfer the heat generated from the heat source to the heat sink, and fails to discharge the heat accumulated in the heat sink to the air. Moreover, if a conventional liquid coating material is coated on the surface of the electronic device in order to protect the heat source, the heat sink, and the heat dissipation plate of the electronic product, the coating prevents heat emission from the object, .

The present invention is intended to provide a heat-dissipating coating composition excellent in heat-releasing property, adhesiveness, heat resistance, solvent resistance and water resistance.

Another object of the present invention is to provide a heat-radiating sheet having excellent heat-radiating property even when the heat-radiating coating composition is used to form the heat-radiating layer as a thin film.

In order to attain the above object, the present invention provides a thermosetting resin composition comprising 10 to 40 wt% of an acrylic resin, 5 to 20 wt% of an epoxy resin, 5 to 20 wt% of a melamine resin, 5 to 20 wt% of an alkyd resin, 1 weight% of the binder resin solution and 100 parts by weight of the binder resin solution containing the residual solvent; The binder resin solution may contain 5 to 10% by weight, conductive carbon black of 3 to 10% by weight of 40 to 100 nm in size, 1 to 5% by weight of conductive graphite of 1 to 20 탆 in size, 0.3 to 1% by weight of at least one coupling agent selected from aluminate coupling agents, 0.3 to 1% by weight of a dispersing agent, 0.3 to 1% by weight of an anti-settling agent and 10 to 100 parts by weight of a nano- To a heat-dissipating coating composition.

The present invention also relates to a method of manufacturing a silicon carbide (SiC), alumina (Al ₂ O ₃ ), zirconia (Zr ₂ ), boron carbide (B ₄ C), silicon nitride 5 to 50 parts by weight of at least one ceramic powder selected from the group consisting of Si ₃ N ₄ , and the like.

Also, there is provided a heat-radiating coated composite sheet produced using the heat-radiating coating composition.

Hereinafter, the configuration of the present invention will be described in detail.

In the present invention, the binder resin solution comprises 10 to 40% by weight of an acrylic resin, 5 to 20% by weight of an epoxy resin, 5 to 20% by weight of a melamine resin, 5 to 20% by weight of an alkyd resin, 0.2 to 1 by weight of a zirconium aluminate coupling agent % And the balance solvent.

The acrylic resin is a polymer obtained by copolymerizing an acrylic compound selected from acrylate or methacrylate and a monomer copolymerizable with a monomer having various active functional groups in addition to styrene. Examples of the active functional group include -NH ₂ , -NH ₂ , -CH ₂ OH, -COOH, -OH, -CH, = CH ₂ , an epoxy group, and the like.

In the present invention, the acrylic resin is mixed with a curing resin and used as a main component of a coating film, and crosslinked with a curing resin by heating to form a coating film having a network structure.

In the present invention, since melamine resin for improving the hardness and stain resistance by lowering the firing temperature by the curing water-soluble resin, epoxy resin for improving stain resistance, adhesion property, chemical resistance, impact resistance and alkyd resin for improving bendability are mixed and used A coating film having excellent initial adhesiveness, excellent coating film appearance, excellent physical properties such as solvent resistance, water resistance, chemical resistance, water resistance, moisture resistance, heat resistance, heat resistance, salt water repellency and ultraviolet resistance can be obtained And has excellent miscibility with nano-carbon dispersions to be mixed together, thereby completing the present invention.

The binder resin according to the present invention is superior in weatherability to conventional acrylic resins, and has excellent gloss, gloss retention, color and complementarity, and further improved chemical resistance, adhesion and flexibility by using a zirconium aluminate coupling agent. .

The zirconia aluminate coupling agent can be used as a zirconium aluminate coupling agent having an organic functional group -CH (OH) -CH (OH) -COOH and an AL / ZR metal alkoxide as an inorganic functional group. Examples include, but are not limited to, C-523-2H from Chartwell. The metal alkoxide of the inorganic functional group of the zirconia aluminate coupling agent is chemically bonded to the hydroxy group on the surface of the adhesion surface and the carboxyl group of the zirconia aluminate coupling agent is condensed with the carboxyl group of the binder resin of the present invention. By such a mechanism, the physical properties of the binder resin prepared above are improved, and the thermal resistance of the interface between the thermally conductive filler such as conductive nano-carbon, graphite, aluminum oxide, silicon carbide and the binder resin is reduced, thereby improving the heat dissipation property.

The acrylic resin used in the present invention can be prepared by polymerizing an acrylic monomer in an organic solvent for 2 to 4 hours. As the acrylic monomer, the organic solvent and the polymerization initiator, the following types may be used.

Examples of the acrylic monomer include methyl acrylate, ethyl acrylate, isopropyl acrylate, n-butyl acrylate, isobutyl acrylate, t-butyl acrylate, 2-ethylhexyl acrylate, 2-ethylhexyl methacrylate, Acrylates such as methacrylate, methyl methacrylate, ethyl methacrylate, t-butyl methacrylate, macronutriyl, meta-nitrile, cyclohexyl methacrylate, acrylic acid, tricrylic acid, hydroxyl methacrylate, Acrylate, hydroxypropyl methacrylate, hydroxylpropyl acrylate, styrene monomer, lecan, ethaconic acid, acrylamide, n-methylol acrylamide, diacetone acrylamide, glycidyl methacrylate, vinyltoluene, vinyl Acetate, vinyl chloride, and the like can be used in combination.

As the comonomer, a public group may be used for imparting an active functional group such as -NH ₂ , -NH ₂ , -CH ₂ OH, -COOH, -OH, -CH, = CH ₂ , or an epoxy group.

Examples of the organic solvent include nonpolar solvents such as n-heptane, toluene, xylene, petroleum compounds and n-hexane, ethyl acetate, n-butyl acetate, isobutyl acetate, ethylene glycol monoethyl ether acetate, -Methoxybutyl acetate, amyl acetate, butyl glycol acetate, methyl ethyl ketone, methyl isobutyl ketone, acetone, diisobutyl ketone, isophorone and cyclohexanone, cellosolve acetate, ethyl cellosolve, butyl cellosolve And a mixture of the nonpolar solvent and the polar solvent can be appropriately selected depending on the characteristics of the binder and the volatilization rate.

In order to carry out the polymerization reaction, a polymerization initiator is used. Examples of the polymerization initiator include azobisisobutylonitrile, benzoyl peroxide, di-t-butyl peroxide, t-butyl perbenzoate, methyl ethyl ketone peroxide, p-methane hydroperoxide, di-t-butyl peroxide, 1,1-bis (t-butylperoxy) -3,3,5-trimethylcyclohexane, lauroyl peroxide, diisopropyl peroxydicarbonate , 3,5,5-trimethylhexanoyl peroxide, di-2-ethylhexyl peroxydicarbonate, t-butyl peroxyacetate, t-butyl peroxypivalate, t- butyl peroxyacetate, cumyl peroxyneodi Carbonate, t-butylperoxyl 2-ethylhexanoate, t-butylperoxybenzoate, and the like.

The acrylic resin of the present invention preferably has an acid value of 30-150 KOHmg / g and a hydroxyl value of 5-100 KOHmg / g, and when the acid value is less than 30 KOHmg / g, the curing property may be insufficient and the solvent resistance may be lowered, If it is more than 150 KOHmg / g, the solubility in a solvent is lowered, and the stability of the coating material may be deteriorated, for example, precipitates are formed in the coating material. A more preferable range of the acid value is 50-120 KOHmg / g. The number average molecular weight is suitably in the range of 3500 to 20000. When the number average molecular weight is less than 3500, the solvent resistance is lowered, the scratch resistance is lowered, the water resistance is lowered, and the durability is lowered. The number average molecular weight refers to a value obtained by measuring polystyrene using GPC as a standard.

It is also preferable to use those having a nonvolatile matter content of 40 to 70% by weight and a glass transition temperature of 0 to 60 캜. It is preferable to use 10 to 40% by weight. When it is used in an amount of less than 10% by weight, the effect is insignificant. When it exceeds 40% by weight, basic properties such as durability and chemical resistance decrease .

The epoxy resin is used for improving stain resistance, adhesion, and chemical resistance. And an epoxy resin of bis-phenol (A) type is used. Specifically, for example, Bis-Phenol (A) -based YD-128S available from Kukdo Chemical Co., Ltd. can be used. The content thereof is preferably 5 to 10% by weight, and when it is used in an amount of less than 5% by weight, its effect is insignificant. When it is used in an amount exceeding 10% by weight, transparency and chemical resistance are deteriorated and the drying temperature becomes too high .

The melamine resin is used for lowering the firing temperature and for improving hardness and stain resistance. Further, a mixture of one or two selected from isobutylated melamine resin, methylated melamine resin, N-butylated melamine resin, hexamethoxymethyl melamine and trimethoxymethyl melamine can be used. Specifically, for example, Super Beckamine 53-419 and Super Beckamine L-105-60 of Aekyung Chemical may be used. The content thereof is preferably 5 to 10% by weight, and when it is used in an amount of less than 5% by weight, its effect is insignificant. When it exceeds 10% by weight, physical properties such as impact resistance and bending property are deteriorated.

The alkyd resin is used to improve the adhesion. Specifically, for example, DR-1751 manufactured by Daeryung Corporation can be used. The content thereof is preferably 3 to 10% by weight, and when it is used in an amount of less than 3% by weight, its effect is insignificant. When it is used in an amount exceeding 10% by weight, the hardness of the coated film is excessively low.

In the present invention, the zirconium aluminate coupling agent improves the adhesive force and chemical resistance of the binder resin and improves the heat radiation property by reducing the interfacial thermal resistance between the thermally conductive filler such as conductive nano-carbon, graphite, aluminum oxide and silicon carbide and the binder resin . The zirconia aluminate coupling agent has an organic functional group -CH (OH) -CH (OH) -COOH and has an AL / ZR metal alkoxide as an inorganic functional group, and specifically, for example, C-523-2H Etc. may be used. When the amount of the binder resin used is less than 0.2 wt%, the effect is insignificant. When the amount of the binder resin is more than 1 wt%, the coupling agent is polymerized with the binder resin, The thermal resistance of the conductive filler interface is increased and the overall physical properties of the binder resin are lowered.

The solvent may be selected from the group consisting of toluene, xylene, n-butyl acetate, isobutyl acetate, ethyl acetate, isobutyl alcohol, cellosolve acetate, ethyl cellosolve and butyl cellosolve. .

In the present invention, the nano-carbon dispersion is prepared by mixing 5-10 wt% of the binder resin solution prepared above, 3-10 wt% of conductive carbon black, 1-5 wt% of conductive graphite, 0.3 to 1 wt% of at least one coupling agent selected from aluminate coupling agents and silane coupling agents, 0.3 to 1 wt% of a dispersant, 0.3 to 1 wt% of an anti-settling agent, and the balance solvent.

The present invention improves the dispersibility of conductive carbon black and conductive graphite and ceramic filler and enhances the bonding force between the polymer substrate and the filler by using a zirconia aluminate coupling agent to facilitate the phonon migration between the polymer substrate and the filler It is characterized in that it can be used as a dispersion to increase thermal conductivity and to improve storage stability. Generally, in the related art, a thermally conductive filler is directly mixed with a binder resin. However, it is difficult to obtain an adequate dispersibility and a heat conduction network due to an excessively high viscosity during dispersion, and the time and cost for manufacturing increase.

The binder resin used for the nano-carbon dispersion may be the same as the resin used for the binder resin solution.

The conductive nano-carbon black and the conductive graphite are used for improving the conductivity and heat dissipation. The conductive nano-carbon black preferably has a size of 40 to 100 nm, and the conductive graphite has a size of 1 to 20 탆. .

The content of the nano-carbon black is preferably in the range of 3 to 10% by weight. When the amount of the nano-carbon black is less than 3% by weight, the effect is insignificant. When it is used in excess of 10% by weight, There is a problem with. The carbon black is preferably a conductive carbon black. Specific examples of the conductive nano carbon black include Ketjen black EC-300jd and Ketjen black EC-600JD. In addition, various conductive carbon blacks such as acetylene black can be used. An example of acetylene black is Denka Black (Denki Kagaku Kogyo Co., Ltd.).

The graphite is preferably used in a range of 1 to 5 wt%, and when it is used in an amount of less than 1 wt%, it is insufficient to form a heat conduction network with the nanocarbon, and when it is used in an amount exceeding 5 wt% . The conductive graphite is impregnated graphite, and specifically COND 5,8 of the GK group. In addition, graphite powders of 4 to 17 μm in size can be used as impression graphite.

The coupling agent is used for surface treatment of nano-carbon, graphite and ceramic filler and for improving bonding force with the binder resin, and is preferably at least one selected from a zirconate coupling agent, a zirconium aluminate coupling agent and an aluminate coupling agent Can be used. The content thereof is preferably 0.3 to 1% by weight, more preferably 0.5 to 0.8% by weight. If it is used in an amount less than 0.3% by weight, the effect of using a coupling agent can not be obtained. If it exceeds 1% by weight, the heat resistance of the thermally conductive filler interface is increased.

The dispersant is used for securing the ease of wetting and dispersion of the nano-carbon black and the graphite. Specifically, for example, CFC-6330N of Chungwoo CFC may be used. The content thereof is preferably 0.3 to 1% by weight, and when it is used in an amount of less than 0.3% by weight, the effect is insignificant. When it is used in an amount exceeding 1% by weight, the physical properties of the coating film are lowered.

The anti-settling agent is used for preventing the re-aggregation and settling of the filler and imparting rigidity. Specifically, for example, CIMA 300-20 manufactured by Qing Wu CFC may be used. The content thereof is preferably 0.3 to 1% by weight, and when it is used in an amount of less than 0.3% by weight, the effect thereof is insignificant, and when it is used in an amount exceeding 1% by weight, the adhesion of the coating film is lowered.

The solvent may be selected from the group consisting of toluene, xylene, n-butyl acetate, isobutyl acetate, ethyl acetate, isobutyl alcohol, cellosolve acetate, ethyl cellosolve and butyl cellosolve. .

In the present invention, the nano-carbon dispersion is preferably used in an amount of 10 to 100 parts by weight based on 100 parts by weight of the binder resin solution. When the amount is less than 10 parts by weight, it is difficult to exhibit a desired heat- , No further effect is exhibited, and thus an economically excellent effect can be exhibited in the above range.

The present invention also relates to a method of manufacturing a semiconductor device, comprising the steps of: forming a silicon carbide (SiC), alumina (Al ₂ O ₃ ), zirconia (Zr ₂ ), boron carbide (B ₄ C) and 5 to 50 parts by weight of at least one ceramic powder selected from silicon nitride (Si ₃ N ₄ ).

In the present invention, the ceramic powder is used for improving the heat dissipation property by the pores between the particles. The ceramic powder is composed of silicon carbide (SiC), alumina (Al ₂ O ₃ ), zirconia (Zr ₂ ) It is preferable to use at least one ceramic powder selected from boron carbide (B ₄ C) and silicon nitride (Si ₃ N ₄ ). The ceramic powder preferably has an average particle diameter of 1 to 10 mu m, and if it is in excess of the above range, the adhesion with the base material is lowered, and the workability may be deteriorated. In the present invention, the ceramic powder is preferably a mixture of silicon carbide and aluminum oxide in a weight ratio of 1: 1 to 1: 2. The ceramic powder is preferably used in an amount of 5 to 50 parts by weight, and when it is used in an amount of less than 5 parts by weight, it is insufficient to constitute a heat conduction network. When the amount of the ceramic powder is more than 50 parts by weight,

The present invention relates to a heat-radiating sheet comprising a substrate selected from metal materials, glass and plastic, and a heat-radiating sheet coated with the heat-radiating coating composition on one side of the substrate and then baked at 100 to 180 ° C, ≪ / RTI >

The heat-radiating sheet may further include an adhesive layer on the opposite surface on which the heat-radiating layer is formed.

In the present invention, when the heat-radiating coating composition is coated on the surface of an electronic part or the like, the coating method is not particularly limited. Specifically, the coating is performed by spraying, dipping, comma, gravure, roll-to-roll or the like, which is a typical coating method. In this case, the thickness of the coating layer is preferably 10 to 30 탆, There is a possibility that a rise in cost and a crack may occur, and when it is less than that, a good heat radiation performance can not be exhibited.

When the coating process of the heat radiation coating composition is completed, the coating film is baked, preferably baked at a temperature of 100 ° C or higher, more preferably 100 to 150 ° C for 30 to 40 minutes to obtain a complete coating film .

The heat-radiating coating composition of the present invention can be used without limitation for various metal materials such as aluminum and copper, glass, and plastic, and is excellent in heat resistance and adhesion as well as excellent in hardness, solvent resistance and water resistance.

The heat dissipation coating composition according to the present invention uses a nano-carbon dispersion to form a uniform dispersion structure of nano-carbons, increases the heat radiation efficiency when coating the heat sink to improve the cooling efficiency of the heat sink, It also acts as a thermal diffusion layer to deliver.

The heat dissipation coating composition using the nano-carbon dispersion effectively solves the problem of heat dissipation of chips and elements of the integrated electronic circuit, thereby making it possible to miniaturize the heat sink for free placement of the electronic device, It is possible to extend the life of the entire product and to provide the function of miniaturization. Further, the amount of the added nano-carbon dispersion liquid can be controlled to provide a conductive and insulating heat-dissipating resin.

Fig. 1 is a view showing a heat radiation characteristic testing apparatus used in the embodiment. Fig.
2 is a cross-sectional view of the heat sink used in the evaluation of the heat dissipation characteristics of Table 3;
3 is an aluminum plate used for evaluating the heat radiation characteristics of the heat-radiating composite sheet in Table 4. [

Hereinafter, the present invention will be described in more detail by way of examples. However, the following examples are illustrative of the present invention, and the present invention is not limited to the following examples.

[Example 1]

Preparation of binder resin solution

56.50 g of xylene, 26.33 g of methyl methacrylate, 26.33 g of styrene, 10.80 g of ethyl acrylate monomer, 8.02 g of hydroformyl methacrylate, 1.45 g of itaconic acid, 1.08 g of benzoyl peroxide and 16.3 g of methoxyethanol were mixed 32% by weight of an acrylic resin having an acid value of 120 KOHmg / g, a hydroxyl value of 36 KOHmg / g and a number average molecular weight of 20,000, 10% by weight of a melamine resin (Aekyung Chemical, Super Beckamine 53-419) 4 wt% of an alkyd resin (DR1751), 0.5 wt% of a zirconia aluminate coupling agent (chartwell, C-523.2HR) and 46.5 wt% of a solvent were mixed and stirred to prepare a binder resin solution . The solvent used was a mixed solvent of xylene, n-butyl acetate, isobutyl acetate, isobutyl alcohol and toluene in a weight ratio of 4: 3: 1: 1: 1.

Nano carbon  Preparation of dispersion

5 wt% of conductive nano-carbon black (Ketjenblack 300J) having a size of 40 nm, 3 wt% of conductive graphite (GK, Cond 5) having a size of 4 mu m, 10 wt% of the binder resin solution, 0.5 wt% of a dispersant (Cheongwoo CFC, 6330N), 0.5 wt% of an anti-settling agent (Cheongwoo CFC, CIMA 300-20) and 80.3 wt% of a solvent were mixed and stirred to prepare a nano-carbon dispersion Respectively. The solvent used was a mixed solvent of xylene, n-butyl acetate, isobutyl acetate, isobutyl alcohol and toluene in a weight ratio of 4: 3: 1: 1: 1.

Preparation of heat-radiating coating composition

100 parts by weight of the binder resin solution was mixed with 100 parts by weight of the nano-carbon dispersion, and the mixture was stirred at a speed of 4000 RPM for 20 minutes using a high-speed stirrer to prepare a heat radiation coating composition.

[Example 2]

A heat dissipation coating composition was prepared in the same manner as in Example 1, except that the amounts of the binder resin solution and nano-carbon dispersion were adjusted as shown in Table 1 below.

[Example 3]

A heat dissipation coating composition was prepared in the same manner as in Example 1, except that the amounts of the binder resin solution and the nano-carbon dispersion were adjusted as shown in Table 1, and ceramic powder was further added.

At this time, alumina having an average particle diameter of 3 탆 and silicon carbide having an average particle diameter of 5 탆 were used as the ceramic powder.

[Example 4]

A heat radiation coating composition was prepared in the same manner as in Example 3 except that the content ratio of the ceramic powder was adjusted as shown in Table 1 below.

Example 1 Example 2 Example 3 Example 4 Binder resin solution 100 parts by weight 100 parts by weight 100 parts by weight 100 parts by weight
filler Nano-carbon dispersion 100 parts by weight 80 parts by weight 15 parts by weight 20 parts by weight Alumina - - 30 parts by weight 40 parts by weight Silicon carbide - - 20 parts by weight 10 parts by weight

The compositions prepared in Examples 1 to 4 were measured for physical properties by the following physical property measuring method.

1) Basic property evaluation

The basic physical properties of the heat-radiating resin composition prepared as in Examples 1 to 4 were evaluated and shown in Table 2

1. Film thickness: A456 BASIC (elcometer / UK) measurement

2. Gloss: Evaluate the presence or absence of gloss with the naked eye.

3. Appearance of coating film: It should be free of creator ring, crack, color unevenness when measured with naked eyes.

4. Initial Adhesion: 100 scales in the form of a checkerboard were formed at intervals of 1 mm after coating on the test specimens, and the initial adhesion was evaluated by the number of coating films peeled off from the tape when the coating was peeled off with a scotch tape.

5. Pencil hardness: Measured using MITSUBISHI-UNI PENCLE.

6. Solvent resistance: Methyl ethyl ketone was wetted on cotton, and the surface of the paint was repeated 50 times to determine whether rubbing exposure occurred.

7. Water retentivity: After immersing in water at 98 ° C for 2 hours, the adhesion of the coat was evaluated by four methods.

8. Chemical Resistance: The specimens were immersed in 5% H2SO4, 5% NAOH for 24 hours to evaluate the swelling, cracking and color change of the film.

9. Water temperature resistance: After immersing in hot water at 40 ° C for 3 days, the adhesive strength and appearance of the water were evaluated by four methods.

10. Moisture resistance: After keeping for 5 days at 50 ° C and 95% RH, adhesion and appearance were observed by four methods.

11. Resistance to cold tolerance: After maintaining at -40 ° C for 2 hours, holding at 80 ° C and 90% RH for 2 hours, the cycle was carried out three times, and adhesion and appearance were observed by 4 times.

12. Heat resistance: The specimens were allowed to stand for 1 hour in a 200 ° C chamber and evaluated for adhesion and appearance abnormality by four methods.

13. Salt-free water-repellency: After immersing in 5% NaCl at 35 ° C for 72 hours, swelling of the coating film and the occurrence of white rust were evaluated.

14. Ultraviolet ray resistance: Evaluate whether there is an abnormality of the coating after irradiation for 24 hours at a distance of 20 cm from the specimen at a power of 15 W with a UV irradiator.

Basic property evaluation division Example 1 Example 2 Example 3 Example 4  1. Film Thickness 20 20 20 20  2. Drying temperature 15020 minutes 15020 minutes 15020 minutes 15020 minutes  3. Polish Bright Bright Reflection Reflection  4. Exterior of the film clear clear clear clear  5. Initial adhesion 100/100 100/100 100/100 100/100  6. Pencil Hardness 3H 3H 5H 5H  7. Solvent resistance clear clear clear clear  8. Mouth water clear
100/100 clear
100/100 clear
100/100 clear
100/100  9. Chemical resistance clear clear clear clear  10. Water temperature clear
100/100 clear
100/100 clear
100/100 clear
100/100  11. Moisture resistance clear
100/100 clear
100/100 clear
100/100 clear
100/100  12. Cold resistance clear
100/100 clear
100/100 clear
100/100 clear
100/100  13. Heat resistance clear
100/100 clear
100/100 clear
100/100 clear
100/100  14. Flush with salt water clear
100/100 clear
100/100 clear
100/100 clear
100/100  15. UV resistance clear clear clear clear

As shown in Table 2, it was confirmed that Examples 1 to 4 of the present invention have properties suitable for use as a heat radiation composition.

Using the heat radiation coating composition prepared in Examples 1 to 4, the aluminum foil having a thickness of 38 탆 was coated on the outer surface with a thickness of 20 탆 by a comma coating method and then baked at 150 캜 for 7 minutes. After coating an acrylic pressure sensitive adhesive on the inner surface to a thickness of 20 탆 and attaching a releasing paper, a heat-radiating coated composite sheet was prepared and evaluated for its properties in the following manner.

The evaluation of the heat dissipation characteristics was carried out by making the test apparatus shown in Fig. The test apparatus of FIG. 1 is composed of an external current source made of stainless steel foil, an internal foil lined with aluminum foil, and an input current regulator with a K type temperature sensor at the center of the bottom of the testing apparatus I placed a thermoelectric semiconductor heater (c) connected to the heater. In addition, a K type thermometer (G) was attached inside the device to measure changes in room temperature. (Example) in which the heat radiation coating composition prepared in Examples 1 to 4 of the present invention was coated on a heat sink (Fig. 2) in a thickness of 20 mu m in a dipping manner and a specimen not coated (Comparative Example) Table 3 shows the change in the temperature and the internal temperature of the heater after 3 hours and 24 hours when the same current was applied at 3.29 W (DC 4.7 V / 0.70 A) on the upper part.

Evaluation of heat dissipation characteristics
Measuring time
Heat sink heat dissipation test Remarks
Heat block temperature Amb T Final T 82.9 25.9 57 Reference temperature 3 hours 72.6 26 46.6 10.4 Comparative Example 24 hours 72.4 26.2 46.2 10.8 3 hours 67.1 28 39.1 17.9 Example 1 24 hours 66.6 28.2 38.4 18.6 3 hours 67.4 27.8 39.6 17.4 Example 2 24 hours 67.2 28 39.2 17.8 3 hours 67.3 27.9 39.4 17.6 Example 3 24 hours 67 28.3 38.7 18.3 3 hours 67 28.2 38.8 18.2 Example 4 24 hours 66.8 28.6 38.2 18.8

As can be seen from the results of Table 3, although the heat sink treated by the method of the present invention is a thin film coating layer, Examples 1 to 4 exhibit excellent heat radiation characteristics at 7 ° C to 8 ° C as compared with Comparative Examples.

The heat-radiating coating composition prepared in Examples 1 to 4 of the present invention was coated on the outer surface of aluminum foil having a thickness of 38 탆 in a thickness of 20 탆 by a comma coating method and baked at 150 캜 for 7 minutes and then coated with an acrylic adhesive After coating with a thickness of 20 탆, a release sheet was attached to prepare a heat-radiating coating composite sheet. Then, the specimen (Example) and the specimen without the heat dissipation composite sheet (Comparative Example) The properties are shown in Table 4.

Evaluation of heat dissipation characteristics
Measuring time
Heat sink heat dissipation test Remarks
Heat block temperature Amb T Final ΔT 82.9 25.9 57 Reference temperature 3 hours 69 26.3 42.7 14.3 Comparative Example 24 hours 70 26.5 43.5 13.5 3 hours 61 29 32 25 Example 1 24 hours 60 29.4 30.6 26.4 3 hours 61.4 28.9 32.5 24.5 Example 2 24 hours 61.2 29 32.2 24.8 3 hours 61 28.9 32.1 24.9 Example 3 24 hours 60.5 29.4 31.1 25.9 3 hours 60.9 29.2 31.7 25.3 Example 4 24 hours 60.2 29.6 31.6 26.4

As shown in the results of Table 4, the heat-radiating composite sheet using the heat-radiating resin produced by the present invention exhibits excellent heat radiation characteristics at 10.2 to 12.9 ° C as compared with the comparative example.

end. The styrofoam,
I. Heatsink, c. Thermocouple heater,
la. Thermocouple heater input voltage regulation and temperature meter,
hemp. Styrofoam top openable / closable
bar. Aluminum foil,
four. Internal temperature meter

Claims (9)

A binder containing 10 to 40 wt% of an acrylic resin, 5 to 20 wt% of an epoxy resin, 5 to 20 wt% of a melamine resin, 5 to 20 wt% of an alkyd resin, 0.2 to 1 wt% of a zirconium aluminate coupling agent, Relative to 100 parts by weight of the resin solution;
The binder resin solution may contain 5 to 10% by weight, conductive carbon black of 3 to 10% by weight of 40 to 100 nm in size, 1 to 5% by weight of conductive graphite of 1 to 20 탆 in size, 0.3 to 1% by weight of at least one coupling agent selected from aluminate coupling agents, 0.3 to 1% by weight of a dispersing agent, 0.3 to 1% by weight of an anti-settling agent and 10 to 100 parts by weight of a nano- Heat radiation coating composition. The method according to claim 1,
The heat dissipation coating composition may include at least one of silicon carbide (SiC), alumina (Al ₂ O ₃ ), zirconia (Zr ₂ ), boron carbide (B ₄ C), silicon nitride ; heat the coating composition further comprises Si ₃ N ₄₎ 1 or more kinds of the ceramic powder 5 to 50 parts by weight is selected from the portions. The method according to claim 1,
Wherein the acrylic resin has an acid value of 30 to 150 KOH mg / g, a hydroxyl value of 5 to 100 KOH mg / g and a number average molecular weight of 3500 to 20,000. 3. The method of claim 2,
Wherein the ceramic powder has an average particle diameter of 1 to 10 占 퐉. 3. The method of claim 2,
Wherein the ceramic powder is a mixture of silicon carbide and aluminum oxide in a weight ratio of 1: 1 to 1: 2. The method according to claim 1,
Wherein the solvent is at least one selected from toluene, xylene, n-butyl acetate, isobutyl acetate, ethyl acetate, isobutyl alcohol, cellosolve acetate, ethyl cellosolve and butyl cellosolve, . A substrate selected from metal materials, glass and plastic;
A heat dissipation layer coated by applying the heat dissipation coating composition according to any one of claims 1 to 6 on one side of the substrate and baking at 100 to 180 ° C;
. 8. The method of claim 7,
Wherein the heat-radiating sheet further includes an adhesive layer on an opposite surface on which the heat-radiating layer is formed. 9. The method of claim 8,
Wherein the heat radiation paint composition has a coating thickness of 10 to 30 占 퐉.

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