KR100865771B1 - Coating agent composition for heat sink - Google Patents

Coating agent composition for heat sink Download PDF

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KR100865771B1
KR100865771B1 KR1020070141627A KR20070141627A KR100865771B1 KR 100865771 B1 KR100865771 B1 KR 100865771B1 KR 1020070141627 A KR1020070141627 A KR 1020070141627A KR 20070141627 A KR20070141627 A KR 20070141627A KR 100865771 B1 KR100865771 B1 KR 100865771B1
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heat dissipation
weight
agents
binder resin
silicate
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KR1020070141627A
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Korean (ko)
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곽순령
김용길
변영학
박상영
배세정
이규원
공정일
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주식회사 리뷰텍
곽순령
김용길
변영학
김종환
신진섭
박상영
권광섭
이지숙
배세정
이규원
공정일
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/18—Fireproof paints including high temperature resistant paints
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/61—Additives non-macromolecular inorganic

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  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Paints Or Removers (AREA)

Abstract

A coating agent composition for heat radiation, and a method for preparing the composition are provided to prevent the overheating of an electronic part by being coated on the surface of an electronic part. A coating agent composition for heat radiation comprises 40-70 wt% of a binder resin; 5-20 wt% of aluminum oxide; 5-30 wt% of boron nitride; 5-10 wt% of zirconium silicate; 5-10 wt% of titanium dioxide; and 10-40 wt% of at least one additive selected from the group consisting of a dispersant, an antisettling agent, an antifoaming agent, a slipping agent, a levelling agent and an adhesion improver. Preferably the binder resin is selected from the group consisting of tetraethylorthosilicate(TEOS), methyltrimethoxysilane(MTMS), sodium silicate and potassium silicate.

Description

방열용 코팅제 조성물 {Coating agent composition for heat sink}Coating composition for heat dissipation {Coating agent composition for heat sink}

본 발명은 전자 부품의 방열용 코팅제 조성물에 관한 것으로, 더욱 상세하게는 열이 발생하는 전자 부품의 표면에 코팅되어 소자에서 방출되는 열이 충분히 발산되지 못하여 과도하게 가열되는 것을 방지하기 위한 전자 부품의 방열용 코팅제 조성물에 관한 것이다. The present invention relates to a coating composition for heat dissipation of electronic components, and more particularly, to prevent excessive heating due to insufficient heat dissipation from the device by coating the surface of the electronic component that generates heat. It relates to a coating composition for heat dissipation.

최근 전기 · 전자산업과 정보통신기술이 급속하게 발전함에 따라 전자기기의 경박단소화가 이루어지고 있고, 이에 의하여 이들에 장착되는 회로의 집적도가 증대되고 있다.Recently, with the rapid development of the electrical and electronics industry and information and communication technology, electronic devices are becoming thin and light, and the density of circuits mounted thereon is increasing.

또한, 상기 집적 회로에 실장되는 전자부품은 전기 에너지를 기반으로 작동하는데, 이러한 작동 과정에서 필연적으로 열에너지가 발생한다. 특히, CPU 등의 패키지가 고도로 집적화되면서 소비전력과 발열량이 상승하고, 또한 정밀화 될수록 작은 충격과 간섭에도 민감해지기 때문에, 전자부품에서 발생하는 열을 제거하는 위한 방법이 요구되고 있다. In addition, electronic components mounted on the integrated circuit operate based on electrical energy, and thermal energy is inevitably generated during such an operation. In particular, as a package such as a CPU is highly integrated, power consumption and heat generation are increased, and as precision becomes more sensitive, it becomes more sensitive to small impacts and interferences, so a method for removing heat generated from electronic components is required.

종래 사용되던 방법으로는, 금속판 등으로 이루어지는 IC 패키지 등의 열을 전달하여 외부로 방출시키는 방열판(heat sink)을 이용하거나, 또는 IC 패키지와 방열판 사이의 열전도 효율을 높이기 위하여 양자 사이에 열전도성이 좋은 그리스, 실리콘 고무 시트 등을 끼워 실장하는 방법이 이용되고 있다.As a conventional method, a heat sink is used to transfer heat to an outside of an IC package made of a metal plate or the like, or to improve heat conduction efficiency between the IC package and the heat sink. A method of inserting good grease, a silicone rubber sheet, or the like is used.

그러나, 상기 열전도성 그리스는 전자부품, 방열판 등의 표면 요철 형상에 영양을 받지 않고, 이들의 피착면에 대응 또는 밀착이 가능하며, 계면 열저항이 낮다는 이점에도 불구하고, 다른 부품의 오염이나 장시간 사용함에 따라 오일이 분리되는 등의 결점이 있었다.However, the thermally conductive grease is not nourished by surface irregularities of electronic parts, heat sinks, etc., and can cope with or adhere to their adherend surfaces, and despite the advantage of low interfacial thermal resistance, There was a flaw such that the oil separated with the use for a long time.

또한, 열전도성 실리콘 고무 시트는 쉽게 장착이 가능하지만, 제조 과정의 가공 측면에서 열전도성 충전제의 함유량에 제한이 있고, 피착면관의 밀착이 불충분해지기 쉬워 실장 시의 계면 열저항이 크기 때문에 방열 특성이 충분히 발휘되지 아니하는 단점이 있었다.In addition, although the thermally conductive silicone rubber sheet can be easily mounted, there is a limit to the content of the thermally conductive filler in terms of processing in the manufacturing process, and the adhesion of the surface tube to be adhered is insufficient, so that the thermal resistance at the time of mounting is large, and thus the heat dissipation characteristics are high. There was a drawback that this was not exerted enough.

결국, 본 발명은 상기와 같은 문제를 해결하고자 안출된 것으로, 본 발명의 주된 목적은 열원 소재에 대하여 방열성, 부착성, 내열성, 내용제성 및 내수성이 우수한 방열용 코팅제 조성물을 제공하는데 있다.After all, the present invention has been made to solve the above problems, the main object of the present invention to provide a heat dissipating coating composition excellent in heat dissipation, adhesion, heat resistance, solvent resistance and water resistance.

또한, 본 발명의 다른 목적은 상기 방열용 코팅제 조성물을 이용하여 제조된 방열 코팅 복합 시트를 제공하는데 있다.In addition, another object of the present invention to provide a heat dissipation coating composite sheet prepared by using the heat dissipating coating composition.

상기 목적을 달성하기 위해, 본 발명은 바인더 수지, 방열 특성 분말, 산화티탄 및 분산제, 침강방지제, 소포제, 슬립제, 레벨링제, 부착증진제로 이루어진 군에서 선택된 1종 이상의 첨가제를 포함하는 방열용 코팅제 조성물을 제공한다. In order to achieve the above object, the present invention is a heat-resistant coating agent comprising at least one additive selected from the group consisting of binder resin, heat dissipation characteristics powder, titanium oxide and dispersant, sedimentation inhibitor, antifoaming agent, slip agent, leveling agent, adhesion promoter To provide a composition.

또한, 상기 방열용 코팅제 조성물을 이용하여 제조된 방열 코팅 복합 시트를 제공한다.In addition, it provides a heat dissipation coating composite sheet prepared using the heat dissipating coating composition.

본 발명에 따른 방열용 코팅 조성물은 전자부품 등에 코팅되었을 때, 전자부품에서 발생하는 열을 효과적으로 방출함과 동시에 그 코팅막 자체의 물리적, 화학적 물성이 우수하여, 방열을 필요로 하는 모든 전자제품 및 반도체 소자 등의 부품, 프로브 카드(Probe card), DMB, 네비게이션 등에 유용하게 사용될 수 있다. The coating composition for heat dissipation according to the present invention is effective in releasing heat generated from electronic parts when coated on electronic parts and the like, and having excellent physical and chemical properties of the coating film itself, all electronic products and semiconductors requiring heat dissipation. It can be usefully used for components such as devices, probe cards, probes, navigation systems, and the like.

이하, 본 발명을 상세히 설명한다.Hereinafter, the present invention will be described in detail.

본 발명은 바인더 수지, 방열 특성 분말, 산화티탄 및 분산제, 침강방지제, 소포제, 슬립제, 레벨링제, 부착증진제로 이루어진 군에서 선택된 1종 이상의 첨가제를 포함하는 방열용 코팅제 조성물을 제공한다. The present invention provides a coating composition for heat dissipation comprising at least one additive selected from the group consisting of a binder resin, a heat dissipating powder, a titanium oxide and a dispersing agent, an antisettling agent, an antifoaming agent, a slipping agent, a leveling agent and an adhesion promoter.

구체적으로, 본 발명은 바인더 수지 40 내지 70 중량%, 산화알루미늄(Aluminum oxide, 알루미나) 5 내지 20 중량%, 질화붕소(Boron nitride) 5 내지 50 중량%, 규산지르코늄(Zirconium silicate) 5 내지 10 중량%, 산화티탄(Titanium oxide) 5 내지 10 중량% 및 분산제, 침강방지제, 소포제, 슬립제, 레벨링제, 부착증진제로 이루어진 군에서 선택된 1종 이상의 첨가제 10 내지 40 중량%를 포함하는 방열용 코팅제 조성물을 제공한다.Specifically, the present invention is 40 to 70% by weight of binder resin, 5 to 20% by weight of aluminum oxide (Alumina), 5 to 50% by weight of boron nitride, 5 to 10% by weight of zirconium silicate %, 5 to 10 wt% of titanium oxide and 10 to 40 wt% of at least one additive selected from the group consisting of dispersants, antisettling agents, antifoaming agents, antifoaming agents, slipping agents, leveling agents and adhesion promoters. To provide.

본 발명에 있어서, 상기 바인더 수지는 TEOS(Tetraethylorthosilicate), MTMS(Methyltrimethoxysilane), 규산나트륨(Sodium silicate), 규산칼륨(Potassium silicate)로 이루어진 군에서 선택되는 1종 이상을 가수분해하여 사용하는 것이 바람직하며, 가수분해 된 바인더 수지는 방열용 코팅제 조성물에 대해 40 내지 70 중량%의 범위로 첨가되는 것이 좋다.  In the present invention, the binder resin is preferably used by hydrolyzing at least one selected from the group consisting of TEOS (Tetraethylorthosilicate), MTMS (Methyltrimethoxysilane), sodium silicate (Sodium silicate), potassium silicate (Potassium silicate) , The hydrolyzed binder resin is preferably added in the range of 40 to 70% by weight based on the heat dissipating coating composition.

상기 바인더 수지의 함량이 40 중량% 이하일 경우, 코팅막 형성 시 안료를 고정시키지 못하여 부착성이 떨어지며, 내용제성 및 내수성에서도 만족할 만한 결과를 얻을 수가 없고, 70 중량% 이상을 첨가하였을 경우에는 상대적으로 방열 안료의 양이 감소하여 방열 특성을 만족시키지 못한다.When the content of the binder resin is less than 40% by weight, it is difficult to fix the pigment when forming the coating film, the adhesion is poor, and satisfactory results in solvent resistance and water resistance are not obtained. The amount of pigment is reduced, which does not satisfy the heat dissipation characteristics.

또한, 본 발명에 있어서, 방열 특성 분말은 산화알루미늄 5 내지 20 중량%, 질화붕소 5 내지 50 중량%, 및 규산지르코늄(Zirconium silicate)을 5 내지 10 중 량%의 범위로 사용하는 것이 바람직한데, 이는 코팅막에서 많은 공극이 발생하지 않고, 안료들끼리 연속성을 가지기 위한 가장 이상적인 배합이다. 특히, 산화알루미늄은 방열성능이 우수한 육방결정(hexagonal) 구조를 가진 제품을 사용하는 것이 좋으며, 산화티탄은 백색을 나타내기 위한 원료로서 내후성을 위해 루틸(rutile) 결정을 사용하는 것이 바람직하다.In addition, in the present invention, the heat dissipation characteristics powder is preferably used in the range of 5 to 20% by weight of aluminum oxide, 5 to 50% by weight of boron nitride, and zirconium silicate in the range of 5 to 10% by weight, This is the most ideal combination for not having a lot of voids in the coating film, the continuity between the pigments. In particular, it is preferable to use a product having a hexagonal structure having excellent heat dissipation performance, and titanium oxide is preferably a rutile crystal for weather resistance as a raw material for showing white color.

또한, 본 발명은 방열 특성을 나타내는 분말을 혼합한 후, 10 ~ 30분 동안 건식 혼련하는 단계; 상기 방열 특성 분말 혼합물에 산화티탄을 첨가하고 30분 ~ 1시간 동안 건식 혼련하는 단계; 상기 혼합물에 바인더 수지를 첨가하여 30분 ~ 2시간 동안 혼련하는 단계; 및 통상적인 분산제, 침강방지제, 소포제, 슬립제, 레벨링제, 부착증진제 등으로 구성된 군에서 선택된 1종 이상의 첨가제를 첨가하여 10 ~ 30분 동안 혼련하는 단계;를 포함하는 방열용 코팅제 조성물의 제조방법을 제공한다. In addition, the present invention after mixing the powder exhibiting heat dissipation characteristics, the step of dry kneading for 10 to 30 minutes; Adding titanium oxide to the heat dissipating powder mixture and dry kneading for 30 minutes to 1 hour; Adding a binder resin to the mixture and kneading for 30 minutes to 2 hours; And kneading for 10 to 30 minutes by adding at least one additive selected from the group consisting of conventional dispersing agents, anti-settling agents, antifoaming agents, slip agents, leveling agents, adhesion promoters, and the like. To provide.

상기에서 방열 특성을 나타내는 분말은 산화알루미늄, 질화붕소 및 규산지르코늄에서 이루어진 군에서 선택되는 어느 하나 이상인 것이 바람직하다. 또한, 상기 바인더 수지는 TEOS(Tetraethylorthosilicate), MTMS(Methyltrimethoxysilane), 규산나트륨(Sodium silicate), 규산칼륨(Potassium silicate)로 이루어진 군에서 선택되는 1종 이상을 가수분해하여 사용하는 것이 바람직하며, 더욱 바람직하게는 TEOS와 MTMS를 가수분해하여 상기 방열 특성 분말 혼합물과 동량으로 혼합하는 것이 좋다. The powder exhibiting heat dissipation in the above is preferably any one or more selected from the group consisting of aluminum oxide, boron nitride and zirconium silicate. In addition, the binder resin is preferably used by hydrolyzing at least one selected from the group consisting of TEOS (Tetraethylorthosilicate), MTMS (Methyltrimethoxysilane), sodium silicate, and potassium silicate. Preferably, TEOS and MTMS are hydrolyzed and mixed with the heat dissipating powder mixture in the same amount.

본 발명에서 상기 방열용 코팅제 조성물을 전자부품 등의 표면에 코팅할 때, 코팅 방법은 특별히 제한되지 않는다. 구체적으로 통상적인 코팅 방법인 스프레 이(spray)나 디핑(dipping) 방법 등으로 코팅하는데, 이때 코팅막의 두께는 20 ~ 30 ㎛의 두께로 코팅되는 것이 바람직하고, 상기 두께 이상으로 코팅될 경우 비용 상승 및 크랙이 발생할 가능성이 있고, 그 이하일 경우에는 좋은 방열 성능을 발휘할 수 없다. When coating the heat dissipating coating composition on the surface of the electronic component or the like in the present invention, the coating method is not particularly limited. Specifically, a coating or spraying method, which is a conventional coating method, is used. In this case, the thickness of the coating film is preferably coated with a thickness of 20 to 30 μm, and the cost increases when the coating film is coated over the thickness. And cracks may occur, and when it is less than that, good heat dissipation performance cannot be exhibited.

상기 방열용 코팅제 조성물의 코팅 과정이 완료되면, 코팅막을 소성 처리하여야 하는데, 바람직하게는 100℃ 이상, 더욱 바람직하게는 150℃의 온도에서 40 ~ 50분 동안 소성하여 완전한 코팅막을 얻을 수 있다. When the coating process of the coating composition for the heat dissipation is completed, the coating film should be calcined, preferably 100 ° C. or more, more preferably, baked at a temperature of 150 ° C. for 40 to 50 minutes to obtain a complete coating film.

또한, 본 발명의 방열용 코팅제 조성물은 알루미늄, 구리 등의 여러 금속 소재에 대해 제한 없이 사용할 수 있으며, 방열성 및 부착성이 우수할 뿐만 아니라 경도, 내용제성 및 내수성도 뛰어나다.In addition, the coating composition for heat dissipation of the present invention can be used without limitation for various metal materials such as aluminum, copper, and excellent heat dissipation and adhesion, as well as excellent hardness, solvent resistance and water resistance.

또한, 본 발명은 상기의 방열용 코팅제 조성물을 이용하여 제조된 열전도도 2.5 W/mK 이상의 방열 코팅 복합 시트를 제공한다.In addition, the present invention provides a heat-dissipating coating composite sheet having a thermal conductivity of 2.5 W / mK or more prepared using the heat dissipating coating composition.

이하, 실시 예에 의하여 본 발명을 더욱 상세히 설명하고자 한다.Hereinafter, the present invention will be described in more detail with reference to Examples.

단, 하기 실시예는 본 발명을 예시하는 것일 뿐, 본 발명의 내용이 하기 실시 예에 한정되는 것은 아니다.However, the following examples are merely to illustrate the invention, but the content of the present invention is not limited to the following examples.

실시예 1 ~ 4. 방열용 코팅제 조성물의 제조Examples 1-4. Preparation of the coating composition for heat dissipation

방열 특성을 나타내는 분말 3종류, 즉 산화알루미늄, 질화붕소 및 규산지르코늄을 평량, 혼합하여 30분 동안 건식 혼련하여 방열 특성 분말 혼합물을 제조하 였다. 상기 방열 특성 분말 혼합물에 산화티탄과 더 첨가하여 혼합한 후 1시간 동안 건식 혼련한 다음 상기 혼합물에 바인더 수지를 첨가하였다.Three kinds of powders exhibiting heat dissipation properties, namely aluminum oxide, boron nitride and zirconium silicate, were weight-mixed and mixed for 30 minutes to prepare a heat dissipation powder mixture. Titanium oxide was further added to the heat dissipation powder mixture and mixed, followed by dry kneading for 1 hour, and then a binder resin was added to the mixture.

이때, 바인더 수지로는 TEOS(Tetraethylorthosilicate) 20 ~ 50 중량%와 MTMS(Methyltrimethoxysilane) 40 ~ 60 중량%, 물 10 ~ 50중량% 및 에탄올 10 ~ 50 중량% 범위로 가수분해하여 사용하였으며, 상기의 방열 특성 분말 혼합물과 동량의 비율로 첨가한 후 잘 혼합되도록 2시간 동안 혼련하고, 마지막으로 통상적인 분산제, 침강방지제, 소포제, 슬립제, 레벨링제, 부착증진제 등으로 구성된 첨가제를 첨가하여 30분 동안 혼합하여 제조하였다. 실시예 1 ~ 4에서 사용된 각 성분의 종류 및 함량은 하기 표 1에 나타내었다.In this case, the binder resin was hydrolyzed in the range of 20 to 50% by weight of TEOS (Tetraethylorthosilicate) and 40 to 60% by weight of MTMS (Methyltrimethoxysilane), 10 to 50% by weight of water and 10 to 50% by weight of ethanol. Add to the same powder mixture at the same amount and knead for 2 hours to mix well, and finally mix for 30 minutes by adding additives consisting of conventional dispersants, antisettling agents, antifoaming agents, slip agents, leveling agents, adhesion promoters, etc. It was prepared by. The type and content of each component used in Examples 1 to 4 are shown in Table 1 below.

한편, 하기 표 1에 나타낸 각 성분의 특징들을 간략히 설명하면 다음과 같다.On the other hand, briefly described the characteristics of each component shown in Table 1 as follows.

(1) 바인더 : TEOS와 MTMS를 가수분해한 수지(1) Binder: Resin obtained by hydrolyzing TEOS and MTMS

(2) 산화알루미늄 : 입자 지름이 10 ~ 45 ㎛의 방열 특성이 우수한 육방결정(hexagonal)구조를 가진 분말 (2) Aluminum oxide: powder with hexagonal structure with excellent heat dissipation of 10 ~ 45 ㎛ in particle diameter

(3) 질화붕소 : 입자 지름이 10 ㎛의 판상과 구형의 분말(3) Boron nitride: plate-shaped and spherical powder having a particle diameter of 10 µm

(4) 산화티탄 : 백색분말의 rutile 결정구조를 가진 분말(4) Titanium oxide: powder with rutile crystal structure of white powder

성분ingredient 실시예 1Example 1 실시예 2Example 2 실시예 3Example 3 실시예 4Example 4 바인더bookbinder 50중량%50 wt% 50중량%50 wt% 50중량%50 wt% 50중량%50 wt% 필러 filler 산화알루미늄Aluminum oxide 50중량% 50 wt% 2020 50중량% 50 wt% 1010 50중량% 50 wt% 1515 50중량% 50 wt% 2020 질화붕소Boron nitride 1010 2020 1010 55 규산지르코늄Zirconium Silicate 55 55 1010 55 산화티탄Titanium oxide 55 55 55 1010 첨가제additive 1010 1010 1010 1010

실험예. 방열 코팅 복합 시트의 제조Experimental Example Preparation of Heat-Resistant Coating Composite Sheets

상기 실시예 1 ~ 4에서 제조한 방열용 코팅제 조성물을 이용하여, 금속 스프레이 방식으로 알루미늄 판에 20 ~ 30 ㎛ 두께로 코팅한 것을 150℃ 온도에서 40 ~ 50분간 소성 처리하여 방열 코팅 복합 시트를 제조한 후 하기와 같은 방식으로 특성을 평가하였다.By using the coating composition for heat dissipation prepared in Examples 1 to 4, a 20 to 30 μm thickness coated on an aluminum plate by a metal spray method was fired at 150 ° C. for 40 to 50 minutes to prepare a heat dissipation coating composite sheet. After that, the properties were evaluated in the following manner.

(1) 방열특성 평가(1) Heat dissipation characteristics evaluation

본 발명에 따른 방열 코팅 복합 시트의 방열 특성을 평가하기 위하여, 방열성, 부착성, 경도, 내용제성, 내수성 등을 평가하여 그 결과를 하기 표 2에 나타내었다.In order to evaluate the heat dissipation characteristics of the heat dissipation coating composite sheet according to the present invention, the heat dissipation, adhesion, hardness, solvent resistance, water resistance and the like were evaluated and the results are shown in Table 2 below.

상기에서 방열성은 상기 실시예 5에서 제조한 방열 코팅 복합 시트 시편에 LED 소자를 부착하고, 1.2A의 전류를 흘려서 시간에 따른 온도 변화를 측정하였고(도 1 참조), 하기 표 3에는 온도 측정 후 50 ~ 60분 사이의 평균 온도(T) 및 평균 온도와 초기 온도와의 차이(ΔT = T - T초기)를 나타내었다. In the above heat dissipation was attached to the LED element to the heat-dissipating coating composite sheet specimen prepared in Example 5, and measured the change in temperature over time by flowing a current of 1.2A (see Fig. 1), Table 3 after the temperature measurement The average temperature (T) between 50 and 60 minutes and the difference between the average temperature and the initial temperature (ΔT = T-T initial ) are shown.

이때, 본 발명의 방열용 코팅제 조성물의 방열 특성을 평가를 위해 비교예 1로는 코팅하지 아니한 알루미늄판을 시편으로 사용하였다.At this time, in order to evaluate the heat dissipation characteristics of the coating composition for heat dissipation of the present invention, an aluminum plate not coated with Comparative Example 1 was used as a specimen.

조성물Composition 50~60분 사이의 평균 온도(T)Average temperature (T) between 50 and 60 minutes 온도 변화(ΔT = T - T초기)Temperature change (ΔT = T-T initial ) 실시예 1Example 1 60.060.0 37.737.7 실시예 2Example 2 60.660.6 38.338.3 실시예 3Example 3 61.061.0 38.738.7 실시예 4Example 4 60.860.8 38.538.5 비교예 1Comparative Example 1 67.767.7 45.445.4

(2) 물리적 특성 평가(2) physical property evaluation

상기 실시예 1 ~ 4에서 제조한 방열용 코팅제 조성물을 이용하여, 상기 실시예 5와 동일한 방법으로 방열 코팅 복합 시트를 제조하고, 상기 방열 코팅 복합 시트에 대하여 하기와 같이 물리적 특성을 평가하였다(표 3 참조).Using the heat dissipating coating composition prepared in Examples 1 to 4, a heat dissipation coating composite sheet was prepared in the same manner as in Example 5, and the physical properties of the heat dissipation coating composite sheet were evaluated as follows (Table 3).

실시예 1Example 1 실시예 2Example 2 실시예 3Example 3 실시예 4Example 4 외관Exterior 양호Good 양호Good 양호Good 양호Good 코팅막 두께Coating thickness 30 ㎛30 μm 30 ㎛30 μm 30 ㎛30 μm 30 ㎛30 μm 부착성Adhesion 100/100100/100 100/100100/100 100/100100/100 100/100100/100 경도Hardness 2H2H 2H2H 2H2H 2H2H

단, 상기에서 외관은 육안으로 평가하였으며, 코팅막 두께는 도막 두께 측정기(독일 Elektro사, MiniTest 2100 제품)를 사용하여 측정하였고, 부착성은 JIS-D0202법에 따라 측정하였으며, 경도를 연필을 이용한 연경도로 측정하였다. However, in the above, the appearance was visually evaluated, the coating film thickness was measured using a coating film thickness gauge (Elektro, Germany, MiniTest 2100 product), the adhesion was measured according to the JIS-D0202 method, the hardness of the hardness using a pencil Measured.

(3) 화학적 특성 평가(3) chemical property evaluation

상기 실시예 1 ~ 4에서 제조한 방열용 코팅제 조성물을 이용하여, 상기 실시예 5와 동일한 방법으로 방열 코팅 복합 시트를 제조하고, 상기 방열 코팅 복합 시트에 대하여 하기와 같이 화학적 특성을 평가하였다(표 4 참조).Using the heat dissipating coating composition prepared in Examples 1 to 4, a heat dissipation coating composite sheet was prepared in the same manner as in Example 5, and the chemical properties were evaluated for the heat dissipation coating composite sheet as follows (Table 4).

실시예 1Example 1 실시예 2Example 2 실시예 3Example 3 실시예 4Example 4 내용제성Solvent resistance 도막박리없음No peeling off 도막박리없음No peeling off 도막박리없음No peeling off 도막박리없음No peeling off 내수성Water resistance 양호Good 양호Good 양호Good 양호Good

단, 상기에서 내용제성은 이소프로판올(IPA)에 7일간 침지시킨 다음 측정하였으며, 내수성은 물에 7일간 침지시킨 후 코팅막의 상태를 관찰하였다.However, the solvent resistance in the above was measured after immersion in isopropanol (IPA) for 7 days, water resistance was observed for 7 days after immersion in water to observe the state of the coating film.

이상으로 본 발명 내용의 특정한 부분을 상세히 기술하였는바, 당업계의 통상의 지식을 가진 자에게 있어서, 이러한 구체적 기술은 단지 바람직한 실시양태일 뿐이며, 이에 의해 본 발명의 범위가 제한되는 것이 아닌 점은 명백할 것이다. 따라서 본 발명의 실질적인 범위는 첨부된 청구항들과 그것들의 등가물에 의하여 정의된다고 할 것이다.The specific parts of the present invention have been described in detail above, and it is apparent to those skilled in the art that such specific descriptions are merely preferred embodiments, and thus the scope of the present invention is not limited thereto. something to do. Thus, the substantial scope of the present invention will be defined by the appended claims and their equivalents.

도 1은 본 발명에 따른 방열 코팅 복합 시트의 시간에 따른 온도 변화를 나타낸 그래프이다.1 is a graph showing a temperature change with time of the heat dissipation coating composite sheet according to the present invention.

Claims (6)

바인더 수지 40 내지 70 중량%, 산화알루미늄(Aluminum oxide, 알루미나) 5 내지 20 중량%, 질화붕소(Boron nitride) 5 내지 30 중량%, 규산지르코늄(Zirconium silicate) 5 내지 10 중량%, 산화티탄(Titanium oxide) 5 내지 10 중량% 및 분산제, 침강방지제, 소포제, 슬립제, 레벨링제, 부착증진제로 이루어진 군에서 선택된 1종 이상의 첨가제 10 내지 40 중량%를 포함하는 방열용 코팅제 조성물.40 to 70% by weight of binder resin, 5 to 20% by weight of aluminum oxide (alumina), 5 to 30% by weight of boron nitride, 5 to 10% by weight of zirconium silicate, titanium oxide oxide) 5 to 10% by weight and 10 to 40% by weight of one or more additives selected from the group consisting of dispersants, antisettling agents, antifoams, slip agents, leveling agents, adhesion promoters. 제 1항에 있어서,The method of claim 1, 상기 바인더 수지는 TEOS(Tetraethylorthisilicate), MTMS(Methyltrimethoxysilane), 규산나트륨(Sodium silicate), 규산칼륨(Potassium silicate)로 이루어진 군에서 선택되는 것을 특징으로 하는 방열용 코팅제 조성물.The binder resin is TEOS (Tetraethylorthisilicate), MTMS (Methyltrimethoxysilane), sodium silicate (Sodium silicate), potassium silicate (Potassium silicate) is a coating composition for heat dissipation, characterized in that. 산화알루미늄, 질화붕소 및 규산지르코늄으로 이루어진 방열 특성을 나타내는 분말을 혼합한 후, 10 ~ 30분 동안 건식 혼련하는 단계; Mixing a powder exhibiting heat dissipation properties consisting of aluminum oxide, boron nitride, and zirconium silicate, followed by dry kneading for 10 to 30 minutes; 상기 방열 특성 분말 혼합물에 산화티탄을 첨가하고 30분 ~ 1시간 동안 건식 혼련하는 단계; Adding titanium oxide to the heat dissipating powder mixture and dry kneading for 30 minutes to 1 hour; 상기 혼합물에 바인더 수지를 첨가하여 30분 ~ 2시간 동안 혼련하는 단계; 및 Adding a binder resin to the mixture and kneading for 30 minutes to 2 hours; And 통상적인 분산제, 침강방지제, 소포제, 슬립제, 레벨링제, 부착증진제로 구성된 군에서 선택된 1종 이상의 첨가제를 첨가하여 10 ~ 30분 동안 혼련하는 단계;를 포함하는 방열용 코팅제 조성물의 제조방법.Method of preparing a coating composition for heat dissipation comprising the step of kneading for 10 to 30 minutes by adding one or more additives selected from the group consisting of conventional dispersing agents, anti-settling agents, anti-foaming agents, slip agents, leveling agents, adhesion promoters. 삭제delete 제 3항에 있어서,The method of claim 3, wherein 상기 바인더 수지는 TEOS(Tetraethylorthosilicate), MTMS(Methyltrimethoxysilane), 규산나트륨(Sodium silicate), 규산칼륨(Potassium silicate)로 이루어진 군에서 선택되는 1종 이상인 것을 특징으로 하는 제조방법.The binder resin is TEOS (Tetraethylorthosilicate), MTMS (Methyltrimethoxysilane), sodium silicate (Sodium silicate), potassium silicate (Potassium silicate) The production method, characterized in that at least one selected from the group consisting of. 제 3항 또는 제 5항에 있어서,The method according to claim 3 or 5, 상기 바인더 수지는 TEOS(Tetraethylorthosilicate)와 MTMS(Methyltrimethoxysilane)를 가수분해하여 상기 방열 특성 분말 혼합물과 동량으로 혼합하는 것을 특징으로 하는 제조방법. The binder resin is hydrolyzed by TEOS (Tetraethylorthosilicate) and MTMS (Methyltrimethoxysilane) to produce a mixture characterized in that the same amount of heat dissipation and mixing with the powder mixture.
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* Cited by examiner, † Cited by third party
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WO2011059153A1 (en) * 2009-11-13 2011-05-19 솔라원 Led illumination device formed with heat-dissipating film layer on outside of an upper housing
KR101072293B1 (en) * 2011-05-09 2011-10-11 한국전기연구원 Heat-radiant layer coated semiconductor
KR101072294B1 (en) * 2011-05-04 2011-10-11 한국전기연구원 Heat-radiant layer coated motor
KR101091182B1 (en) * 2011-04-25 2011-12-09 한국전기연구원 Heat-radiant layer coated computer parts
KR101132313B1 (en) * 2009-12-18 2012-04-05 주식회사 포스코 Coating agent and a ceremic roller coated it
KR101294672B1 (en) 2012-03-30 2013-08-09 엘지전자 주식회사 Thermal interface material and manufacturing method for thereof

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011059153A1 (en) * 2009-11-13 2011-05-19 솔라원 Led illumination device formed with heat-dissipating film layer on outside of an upper housing
KR100972753B1 (en) * 2009-11-19 2010-07-28 탁명수 Aluminum nitride coating composite for sinking heat, heat sink using the composite and manufacturing method of the heat sink
KR101132313B1 (en) * 2009-12-18 2012-04-05 주식회사 포스코 Coating agent and a ceremic roller coated it
KR101091182B1 (en) * 2011-04-25 2011-12-09 한국전기연구원 Heat-radiant layer coated computer parts
KR101072294B1 (en) * 2011-05-04 2011-10-11 한국전기연구원 Heat-radiant layer coated motor
KR101072293B1 (en) * 2011-05-09 2011-10-11 한국전기연구원 Heat-radiant layer coated semiconductor
KR101294672B1 (en) 2012-03-30 2013-08-09 엘지전자 주식회사 Thermal interface material and manufacturing method for thereof

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