KR101523144B1 - Epoxy composites with improved heat dissipation, and their applications for thermal conductive and dissipative products - Google Patents

Abstract

The present invention relates to an epoxy composite resin composition with thermal conductivity and a manufacturing method thereof. An epoxy composite resin composition according to the present invention comprises, as active ingredients, epoxy resin; curing agent; and aluminum alloy powder, graphite powder, or a mixture thereof. The epoxy composite resin composition according to the present invention can be employed as bonding materials of heat dissipation plates to enhance heat dissipation rates compared to traditional bonding material of dissipative plate, thereby being used in a dissipative product.

Description

TECHNICAL FIELD [0001] The present invention relates to an epoxy composite resin composition having improved heat dissipation properties and a heat dissipation structure using the same,

The present invention relates to an epoxy composite resin composition having improved heat dissipation properties and a heat dissipation structure using the same.

Recently, due to the high performance, miniaturization and high performance of electronic devices including LED lighting, the amount of heat generated by the electronic components circuit is increased. As a result, the internal temperature of the device rises and malfunctions of the semiconductor devices, characteristics of the resistor components, Problems are occurring. Accordingly, various technologies have been developed as heat dissipation measures for solving such problems.

Conventionally developed heat dissipation measures include a method of installing a heat sink or a heat sink and a method of inserting a heat transfer material such as a thermal grease, a heat radiation pad, a heat radiation tape or the like between a heat source and a heat sink have.

However, in the conventional heat dissipating method, only the heat generated from the heat source is transferred to the heat sink, and the heat accumulated in the heat sink is not discharged into the air. Furthermore, in order to protect the heat source, the heat sink, and the heat sink of the electronic product, the liquid coating material is coated on the surface thereof. In this case, the coating film interferes with the heat emission of the object, .

On the other hand, the thermal conductivity of general epoxy resin is very low (0.15 ~ 0.3 W / mK) compared to metal and ceramic. For this reason, gas has been combined (formed into a foam) in a polymer matrix and used as a heat insulating material in various fields. However, attention has been focused on high thermal conductivity characteristics of polymer composite materials, focusing on electric insulation, moisture absorption, workability, corrosion resistance and other materials having excellent heat conduction characteristics.

The technology using epoxy resin is widely used in the field of electronic parts. The development of complex polymeric materials such as thermoconductive grease, thermally conductive adhesive, and thermally conductive sheet has been developed in order to lower the contact thermal resistance between the surface where the metal and the ceramic are in contact and the part where the electronic component is attached. The thermally conductive grease helps heat conduction of metal parts such as heat exchangers and the thermally conductive adhesive is mainly used for bonding the cooling fin to the metal as the main body. The heat conductive sheet is sandwiched between the power transistor and the substrate, . In recent years, electronic products such as notebook computers and mobile phones have become more highly integrated and have a tendency to have high output specifications. In addition, as the substrate is becoming smaller and smaller, a large amount of heat is generated during operation of the apparatus. Which is a significant influence on the performance. Therefore, the heat dissipation problem of advanced electronic devices is becoming an important issue in product development for increasing the stability and reliability of the device more and more.

Epoxy resins, which are one of the thermosetting resins used in matrix resins in various industries, are used in various ranges due to their excellent physical properties. In the conventional bisphenol type epoxy resins, diglycidyl ether of bisphenol-A , DGEBA) and diglycidyl ether of bisphenol-F (DGEBF) are commercially available and widely used in a wide range of fields.

However, these resins are limited in their use as high-performance materials due to problems inherent in high brittleness properties and weathering resistance, and it is difficult to use these resins as a structural material. Thus, development of an epoxy resin having new properties, It is an urgent necessity.

Korean Patent Publication No. 10-2013-0122478

Accordingly, the present invention has been made to solve the above-mentioned problems, and the present invention has been accomplished by developing a new epoxy composite material which can improve the low thermal conductivity of epoxy resin and is excellent in adhesion to metal or ceramic materials.

Accordingly, an object of the present invention is to provide an epoxy composite resin composition applicable to a heat dissipation structure.

 Another object of the present invention is to provide a method for producing the epoxy composite resin composition.

Another object of the present invention is to provide a heat-dissipating adhesive composition comprising the above epoxy composite resin composition as an effective component.

Another object of the present invention is to provide a heat dissipation structure including the above-mentioned heat-dissipating adhesive composition.

Accordingly, the present invention provides an epoxy resin composition comprising: an epoxy resin; Curing agent; And an aluminum alloy powder or a graphite powder, or a mixture thereof, as an active ingredient.

In one embodiment of the present invention, the epoxy resin is selected from the group consisting of bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol S epoxy resin, phenol novolac epoxy resin, cresol novolak epoxy resin, alkylphenol novolak epoxy And at least one selected from the group consisting of a resin, a bisphenol-type epoxy resin, a naphthalene-type epoxy resin, a dicyclopentadiene-type epoxy resin, a triglycidylisocyanate epoxy resin and an acyclic epoxy resin.

In one embodiment of the present invention, the curing agent is selected from the group consisting of benzyldimethylamine, triethanolamine, triethylenetetraamine, diethylenetriamine, triethylenamine, dimethylaminoethanol and tri (dimethylaminomethyl) And at least one selected from the group consisting of

In one embodiment of the present invention, the epoxy resin and the curing agent are characterized in that the epoxy resin and the curing agent are contained in a weight ratio of 8: 1.

In an embodiment of the present invention, when the aluminum alloy powder is used, the aluminum alloy powder may include 10 to 80% by weight based on the total weight of the epoxy resin, the curing agent, and the aluminum alloy powder.

In one embodiment of the present invention, when the graphite powder is used, the graphite powder is contained in an amount of 10 to 80% by weight based on the total weight of the epoxy resin, the curing agent and the graphite powder.

In one embodiment of the present invention, the graphite powder is characterized by being natural graphite and artificial graphite alone or a mixture thereof.

In one embodiment of the present invention, when the aluminum alloy powder and the graphite powder are used together, the aluminum alloy powder and the graphite powder are mixed with the aluminum alloy powder and the graphite powder based on the total weight of the epoxy resin, the curing agent, the aluminum alloy powder, Graphite powder is contained in an amount of 40 to 60% by weight.

In one embodiment of the present invention, when the aluminum alloy powder and the graphite powder are used together, the mixing ratio of the aluminum alloy powder to the graphite powder is 1: 5 to 5: 1.

Dispersing and adding graphite powder and aluminum alloy powder alone or in combination to the bisphenol-type resin; And a step of adding a curing agent and a solvent to the dispersed solution, agitating the mixture, and then curing the mixture.

In one embodiment of the present invention, the bisphenol-type resin is bisphenol A epichlorohydrin, the curing agent is triethylenetetraamine, and the solvent is methyl ethyl ketone (MEK) and toluene (Toluene) do.

The present invention also relates to an epoxy resin composition comprising an epoxy resin; Curing agent; And an aluminum alloy powder or graphite powder alone or a mixture thereof as an active ingredient.

The present invention also provides a heat dissipation structure including an adhesive layer formed by applying the epoxy composite resin composition or the heat-dissipating adhesive composition.

In one embodiment of the present invention, the heat dissipation structure is selected from the group consisting of a heat dissipation plate, a heat dissipation film, a heat dissipation adhesive, a heat dissipation grease, and a heat dissipation tape.

The present invention can produce an epoxy composite material having improved thermal conductivity by adding graphite and SiC powder, which are additives having excellent thermal conductivity, to the epoxy resin having low insulating properties.

In addition, by manufacturing the adhesive using the epoxy resin, it is possible to reduce the air gap existing at the interface between the heat generating element module and the metal to reduce the shrinkage rate even after a long period of time, maintain the shape under stress, .

(B) Al 60 20 wt% (c) Al 60 30 wt% (d) Al 60 40 wt% (e) Al 60 50 wt% (f) Al 60 60 wt% (g) Al 60 80 wt%.
Fig. 2 shows FE-SEM images of EpGr (x1000) (a) Gr 3wt%, (b) Gr 5wt%, (c) Gr 10wt%, (d) Gr 20wt% (G) Gr 50wt%, (h) Gr 70wt%, (i) Gr 80wt%.
Figure 3 is a schematic diagram for evaluating thermal conductivity at the interface of an aluminum heat sink (a. An uncoated aluminum heat sink, b. An aluminum heat sink coated with EpAl)
FIG. 4 is a photo of an aluminum heat sink that is interfacially bonded with EpAl.
5 is a schematic diagram for measuring the heat radiation temperature of an aluminum heat sink (schematic model) (a. An uncoated aluminum heat sink, b. An EpGr-coated aluminum heat sink)
Figure 6 is a photograph of an aluminum heat sink coated with EpGr.

The present invention relates to a technique for producing an epoxy composite material having improved thermal conductivity by adding graphite and aluminum alloy powder to an epoxy resin, and a method for applying the epoxy composite material to a heat dissipation material.

Epoxy resins have good metal adhesiveness and development with heat-resistant adhesives is useful. Existing adhesives, despite high initial adhesion to common metals such as aluminum, are somewhat weaker in exposure to moisture and hot environments. In contrast, the epoxy adhesive is environmentally friendly and maintains a constant high adhesive force even at high temperatures.

In general, metals are corroded by moisture or air, which also has a considerable influence on heat dissipation properties.

However, adhesives using epoxy resin can reduce not only the effective heat transfer (heat dissipation) but also the corrosion caused by moisture by reducing the air gap existing at the interface between the heating element module and the metal.

Epoxy resin can be adhered with high strength even when it is bonded at room temperature. It has a low shrinkage rate even after a long period of time after adhesion between metal and interface, and maintains its shape even under stress.

The present invention relates to an epoxy resin composition comprising an epoxy resin; Curing agent; And an aluminum alloy powder or graphite powder alone or a mixture thereof as an active ingredient.

In one embodiment of the present invention, the epoxy resin is an epoxy resin having an average of more than two epoxy groups per molecule of one of the resins having two or more epoxy groups in one molecule. Epoxy resins are thermosetting resins that are excellent in electrical insulation, heat resistance and chemical stability.

Preferably, the epoxy resin is selected from the group consisting of bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol S epoxy resin, phenol novolac epoxy resin, cresol novolak epoxy resin, alkylphenol novolac epoxy resin, bisphenol epoxy At least one epoxy compound selected from resins, naphthalene type epoxy resins, dicyclopentadiene type epoxy resins, triglycidyl isocyanates and acyclic epoxy resins can be used, and a bisphenol-A type resin can be most preferably used .

The above epoxy resins such as bisphenol A type epoxy resin and bisphenol F type epoxy resin may be used in combination with one another such as methyl ethyl ketone (MEK), dimethyl formamide (DMF), methyl cellosolve (MCS), carbitol acetate, carbitol, PGMEA, PGME , Toluene, xylene, NMP, 2-methoxyethanol, etc. may be mixed and dissolved as a solvent.

In the present invention, usable epoxy resin curing agents are not particularly limited, and any curing agents conventionally used in epoxy compositions are not relevant. Preferably, the epoxy resin curing agent which can be used in the production of the epoxy resin composition of the present invention may be an amine type, imidazole type, acid anhydride type or a mixture thereof.

The amine-based curing agents usable in the present invention include linear amines, aliphatic amines, modified aliphatic amines, aromatic amines, secondary amines, and tertiary amines, and examples thereof include benzyldimethylamine, triethanolamine, triethylene Tetramine, diethylenetriamine, triethylenamine, dimethylaminoethanol, and tri (dimethylaminomethyl) phenol.

Examples of the imidazole-based curing agent include imidazole, isomimidazole, 2-methyl imidazole, 2-ethyl-4-methyl imidizole, 2,4-dimethyl imidizole, butyl imidizole, 2-methyldimidazole, 2-undecylidimidizole, 1-vinyl-2-methylimidizole, 2-n-heptadecylimidizole, 2- 2-methylimidizole, 1-propyl-2-methylimidizole, 1-cyanoethyl-2-methyl 1-cyanoethyl-2-ethyl-4-methylimidizole, 1-cyanoethyl-2-undecylimidizole, 1-cyanoethyl- 2-methylimidizole, an adduct of imidazole and methylimidizole, an adduct of imidazole and trimellitic acid, 2-n-heptadecyl-4-methylimidizole, phenylimidazole , Benzylimidizole, 2-methyl-4,5-diphenylimidizole, 2,3,5-triphenylimidizole, 2-styrylimidizole, 1- (dodecylbenzyl) -2- Methyl (2-hydroxy-4-t-butylphenyl) -4,5-diphenylimidazole, 2- (2-methoxyphenyl) (3-hydroxyphenyl) -4,5-diphenylimidazole, 2- (p-dimethyl-aminophenyl) -4,5-diphenylimidazole, 2- Diphenylimidazole, di (4,5-diphenyl-2-imidazole) -benzene-1,4,2-naphthyl-4,5-diphenylimidazole, 1-benzyl- -Methylimidizole and 2-p-methoxystyrylimidazole, and the like.

Examples of the acid anhydride-based curing agent include phthalic anhydride, maleic anhydride, trimellitic anhydride, pyromellitic anhydride, hexahydrophthalic anhydride, tetrahydrophthalic anhydride, methyl nadic anhydride, nadic anhydride, And an anhydride-based curing agent. The acid anhydride-based curing agent is preferably used by mixing the curing agents as a catalyst, rather than being used alone.

In one embodiment of the present invention, the epoxy resin and the curing agent contain an epoxy resin to curing agent in a weight ratio of 8: 1.

In an embodiment of the present invention, the filler is added in a weight ratio of 40 to 80 based on the epoxy resin. When the content of the filler is 80% or more, the mechanical properties of the composite composition are remarkably lowered and the structural stability is weakened .

In one embodiment of the present invention, when the aluminum alloy powder is used singly as the filler, the aluminum alloy powder is contained in an amount of 10 to 80 wt% based on the total weight of the epoxy resin, the curing agent, and the aluminum alloy powder, By weight is preferably 50 to 80% by weight.

In one embodiment of the present invention, when the graphite powder is used alone as the filler, the graphite powder is contained in an amount of 10 to 80% by weight based on the total weight of the epoxy resin, the curing agent and the graphite powder, When the content is less than 5% by weight, the thermal conductivity is low and the practical application possibility is low. When the content is more than 80% by weight, the mechanical properties are significantly deteriorated.

In one embodiment of the present invention, the graphite powder may be natural graphite or artificial graphite alone or a mixture thereof.

 In one embodiment of the present invention, when the aluminum alloy powder and the graphite powder are used together as the filler, the aluminum alloy powder and the graphite powder are mixed with the aluminum alloy powder and the graphite powder based on the total weight of the epoxy resin, the curing agent, Alloy powder and graphite powder is contained in an amount of 40 to 60 wt%, and the content ratio of Al / Gr can be adjusted in a range of 1/5 to 5/1 by weight, preferably 10 to 35 wt% %, And the graphite powder is used in an amount of 15 to 40 wt%.

The method for producing an epoxy composite resin of the present invention comprises the steps of dispersing graphite powder and aluminum alloy powder alone or in admixture in a bisphenol-type resin; And adding a curing agent and a solvent to the dispersed solution, agitating the mixture, and curing the mixture.

In one embodiment of the present invention, the bisphenol-type resin is bisphenol A epichlorohydrin, the curing agent is triethylenetetramine, and the solvent includes but is not limited to methyl ethyl ketone (MEK) and toluene (Toluene) .

In one embodiment of the present invention, the solvent is selected from the group consisting of methyl ethyl ketone (MEK), toluene, dimethylformamide (DMF), methylcellosolve (MCS), carbitol acetate, carbitol, PGMEA, Is at least one selected from the group consisting of PGME, toluene, xylene, NMP, and 2-methoxyethanol, preferably MEK / toluene at a v / v of 1/1 to 3/1.

Also, in an embodiment of the present invention, the solvent may be added with MEK / toluene at a v / v of 1/1 to 3/1.

Also, an epoxy resin; Curing agent; And aluminum alloy powder or graphite powder alone or a mixture thereof can be used as an exothermic adhesive composition. However, when the heat-radiating adhesive composition is used for interfacial bonding of a heat sink, heat transferred to the surface of the heat sink due to high emissivity of the composition It can be easily released into the atmosphere.

In one embodiment of the present invention, when the heat-radiating adhesive composition is applied to a heat sink, the thickness of the heat-radiating adhesive composition may be 10 to 100 탆, but the present invention is not limited thereto.

Also, the epoxy composite resin composition or the heat radiation adhesive composition of the present invention can be used as a heat dissipation structure. The heat dissipation structure can be used as a heat dissipation plate, a heat dissipation film, a heat dissipation adhesive, a heat dissipation grease and a heat dissipation tape.

EXAMPLES Hereinafter, the present invention will be described in more detail with reference to Examples. However, the following Examples are only the preferred embodiments of the present invention, and the present invention is not limited by the following Examples.

< Example  1>

Epoxy resin composite material composition manufacturing

<1-1> Bisphenol A Epichlorohydrin ( Bisphenol  A epichlrohydrin ) And Al6061 Preparation of epoxy resin composition containing

10-80wt% of Al6061 powder was dispersed evenly in 8g of bisphenol A epichlrohydrin (MW ≥700 Struers Epofix) for 24h, and then stirred for 24 hours in a 50 ° C oil bath using a mechanical stirrer.

1 g of triethyltetramine (hardener Struers Epofix) was added to the stirred reaction product and slowly stirred so as not to cause air bubbles. Then, the mixture was cured in a 70 ° C oven for 2 hours to prepare an epoxy composite resin composition in which Al6061 was mixed.

In order to facilitate the dispersion of the SiC filler added to the epoxy resin, the epoxy composite resin composition may be prepared by adding a small amount of a solvent (MEK (methyl ethyl ketone) / Toluene = 1/1 to 3/1 v / v) .

The contents of Al6061 used for the preparation of the epoxy composite resin composition in which bisphenol A epichlohydrin and Al6061 were mixed as described above are shown in Table 1 below.

Ingredients and contents for the production of an epoxy composite resin composition in which bisphenol A epichlorohydrin and Al 6061 were mixed Mixture composition of Al 6061 alloy powder to ((epoxy + curing agent) = (8 + 1) g) division Al 6061 (g) Thermal Conductivity @ 25 ^o C (W / mK) density
(g / mL) Production Example 1 EpAl-10 1.0 0.324 1.195 Production Example 2 EpAl-20 2.3 0.326 1.221 Production Example 3 EpAl-30 3.9 0.466 1.326 Production Example 4 EpAl-40 6.0 0.560 1.416 Production Example 5 EpAl-50 9.0 1.045 1.597 Production Example 6 EpAl-60 13.5 1.672 1.711 Production Example 7 EpAl-70 21.0 2.557 1.810 Production Example 8 EpAl-80 36.0 3.551 1.905

The surface of the epoxy composite resin composition thus prepared was observed through FE-SEM photographing, and the results are shown in Fig.

As a result of the analysis, when the composition of the Al 6061 filler is used in an amount exceeding 80% by weight, the mechanical properties and the adhesive strength of the composite resin composition are lowered, resulting in poor structural stability after curing. As shown in Table 1, when the content of the Al alloy powder is 50% or more, the heat conduction effect exceeds the effective level. When the content of the Al alloy powder is 80% or more, the mechanical properties of the composite composition are significantly lowered, And the stability becomes weak.

&Lt; 1-2 > Preparation of epoxy composite resin composition containing bisphenol A epichlrohydrin and graphite

The epoxy composite resin composition containing bisphenol A epichlrohydrin and graphite was prepared in the same manner as in Example <1-1> except that graphite powder was used in place of Al6061. The graphite powder content was used as shown in Table 2 below.

The epoxy composite resin composition was prepared by adding a small amount of a solvent (MEK (methyl ethyl ketone) / Toluene = 1/1 to 3/1 v / v) to help disperse the graphite filler added to the epoxy resin.

Ingredients and Content for the Preparation of Epoxy Composite Composition Mixed with Bisphenol A Epichlorohydrin and Graphite Powder Mixture Composition of Graphite Powder to <(Epoxy + Curing Agent) = (8 + 1) g> division Graphite (g) Thermal Conductivity @ 25 ^o C (W / mK) density
(g / mL) Production Example 9 EpGr-3 0.3 0.263 1.143 Production Example 10 EpGr-5 0.5 0.322 1.195 Production Example 11 EpGr-10 1.0 0.443 1.201 Production Example 12 EpGr-20 2.3 0.574 1.263 Production Example 13 EpGr-30 3.9 0.780 1.332 Production Example 14 EpGr-40 6.0 1.015 1.425 Production Example 15 EpGr-50 9.0 2.188 1.538 Production Example 16 EpGr-60 13.5 2.762 1.629 Production Example 17 EpGr-70 21.0 3.337 1.698 Production Example 18 EpGr-80 36.0 3.995 1.740

The surface of the epoxy composite resin composition thus prepared was observed through FE-SEM photographing, and the results are shown in Fig.

 As a result of the analysis, as shown in Table 2, the graphite powder added above the composition of EpGr-70 has poor mechanical properties and adhesion of the composite resin composition, resulting in poor structural stability after curing.

When the content of graphite powder is less than 5%, the practical application possibility is low due to low thermal conductivity. When the graphite powder content is in the range of 10-30%, it is possible to apply applied products such as thermoconductive interfacial adhesive / When the graphite powder content is 40-80%, it can be formed as a structural product having various heat conduction characteristics including an interfacial adhesive / pressure-sensitive adhesive because of its excellent thermal conductivity. However, when the content of graphite powder exceeds 80% And it is found that the military stability is weakened.

&Lt; 1-3 > Preparation of an epoxy composite resin composition containing bisphenol A epichlrohydrin, Al 6061 and graphite

The procedure of Example 1-1 was repeated except that Al6061 and graphite were used as shown in Table 3 below.

In order to facilitate the dispersion of the graphite and the SiC filler to be added to the epoxy resin, a small amount of a solvent (MEK (methyl ethyl ketone) / Toluene = 1/1 to 3/1 v / v) .

Ingredients and contents for the production of an epoxy composite resin composition in which bisphenol A epichlorohydrin, Al6061 and graphite powder were mixed. Mixture composition of graphite and Al 6061 alloy powder for (epoxy + curing agent) = (8 + 1) g > division Graphite (g) Al6061 (g) Thermal Conductivity @ 25 ^o C (W / mK) density
(g / mL) Production Example 19 EpAlGr-15/35 2.7 6.3 1.354 1.565 Production example 20 EpAlGr-10/40 1.8 7.2 1.197 1.574 Production Example 21 EpAlGr-10/50 2.7 10.8 1.702 1.700 Production Example 22 EpAlGr-40/10 7.2 1.8 1.121 1.623

As can be seen from the results of Examples and Production Examples, the filler mixing composition in Table 3 can improve the thermal conductivity effect while reducing the use of the Al alloy powder compared to the epoxy composite resin composition in which the Al alloy powder alone is used Respectively.

Further, as shown in Table 3, when Al6061 and graphite powder are mixed and used, Al6061 is contained in an amount of 10 to 35% by weight, , And 15 to 40 wt% of graphite powder is preferable.

<Experimental Example 1>

Evaluation of interfacial bonding of heat sink

<1-1> Aluminum heat sink  Interfacial bonding

Al 6061 (40 mm x 40 mm, t = 10 mm) used as the material of the heat sink was used to measure the interfacial thermal conductivity when the epoxy composite resin composition of the present invention manufactured through Example 1 was used for interfacial bonding. As shown in FIG. 3B, the Al plate was uniformly coated on the Al2 plate surface and the Al3 plate was laminated. Then, the Al plate was coated with a load cell (1 kg) under a constant pressure, followed by curing and drying at 50 ° C. for 2 hours 4).

<1-2> Aluminum heat sink interfacial bonding evaluation

For the measurement of the heat-dissipating plate of the experiment example 1-1 and the heat-dissipating plate of the same condition, the measurement of the heat-dissipating plate without bonding of the Al2 and Al3 plates was performed simultaneously.

Al2 & Al3 plate (interface thickness: 10 mu m, Hot plate = 100 DEG C) T1 (° C) T2 (占 폚) ΔT (T1-T2), ° C. join 98.7 ± 1.3 97.3 ± 1.1 1.4 ± 0.2 Non-bonding 98.7 ± 1.3 97.0 ± 0.9 1.7 ± 0.4

Al2 & Al3 plate (interface thickness: 10 mu m, hot plate = 120 DEG C) T1 (° C) T2 (占 폚) ΔT (T1-T2), ° C. join 117.4 ± 0.2 116.1 ± 0.2 1.4 ± 0.3 Non-bonding 117.5 ± 0.3 115.5 ± 0.1 2.0 ± 0.2

In the case of the interfacial bonding sample, the temperature difference was found to be relatively lower than that of the non-bonded sample. In addition, as shown in Table 5, the temperature difference (ΔT) can be confirmed more clearly when the temperature of the hot plate is increased.

Therefore, the results of the above table indicate that the thermal conductivity is improved by the epoxy resin composite composition of the present invention which is an interface bonding material.

<Experimental Example 2>

Aluminum heat sink  Surface Radiation Temperature Measurement

<2-1> Surface coating of aluminum heat sink

Al plate (40mm × 40mm, t = 10mm) was used as the heat sink material, Al6061. In order to coat the surface of Al 6061, a mixed solvent of MEK (methyl ethyl ketone) / Toluene was added in v / v of 1/1 to 3/1 to the epoxy composite resin composition of Production Example 7 of the above Example to adjust the viscosity, A coating film was formed on the thin film by coating, and cured and dried at 50 ° C for 2 hours to surface-coat the aluminum heat sink (see FIG. 6).

<2-2> Evaluation of heat radiation temperature of aluminum heat sink

In order to measure the heat radiation temperature of the aluminum heat sink (Al3) coated with the surface of Experimental Example 2-1, an aluminum heat sink (Al1, Al2) not having a surface as shown in FIG. 5 was placed on a hot plate, After placing the coated aluminum heat sink (Al3), place the Teflon cylinder in place to prevent the sensitive temperature from reacting by convection and diffusion of heat on it, and place the thermocouple tip at a distance of 10mm from the surface, (T3) was measured (3 times).

In addition, in order to ensure the measurement of the same condition, the T1 temperature of the Al1 surface was set to 100 deg. C and a comparative example without the surface coating of Al3 was made as shown in Fig.

Measurement result: Coating thickness 47 탆 coating Uncoated ΔT (T3, C-T3, NC), ° C T3 (占 폚) 47.5 ± 0.3 46.8 ± 0.4 0.8 ± 0.2

Measurement result: Coating thickness 200 탆 coating Uncoated ΔT (T3, C-T3, NC), ° C T3 (占 폚) 48.0 ± 0.2 46.3 ± 0.3 1.78 + - 0.4

As a result of the analysis, it was confirmed that when the surface of the aluminum heat sink was coated with the epoxy composition according to the present invention, the T3 temperature was higher than that of the non-coated heat sink. Also, it was confirmed that when the thickness of the surface coating increases, the degree of temperature rise is further increased.

The present invention has been described with reference to the preferred embodiments. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. Therefore, the disclosed embodiments should be considered in an illustrative rather than a restrictive sense. The scope of the present invention is indicated by the appended claims rather than by the foregoing description, and all differences within the scope of equivalents thereof should be construed as being included in the present invention.

Claims (14)

Epoxy resin; Triethyltetramine; Aluminum alloy powder; And graphite powder alone or a mixture thereof as an active ingredient. The method according to claim 1,
The epoxy resin may be at least one selected from the group consisting of bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol S epoxy resin, phenol novolac epoxy resin, cresol novolak epoxy resin, alkylphenol novolak epoxy resin, bisphenol epoxy resin, An epoxy resin, a dicyclopentadiene type epoxy resin, a triglycidyl isocyanate epoxy resin, and an acyclic epoxy resin. delete The method according to claim 1,
Wherein the epoxy resin and triethylenetetramine are contained in an amount of 8: 1 by weight based on the epoxy resin and triethylenetetramine. delete delete The method according to claim 1,
Wherein the graphite powder is natural graphite and artificial graphite alone or a mixture thereof. The method of claim 1,
Characterized in that the aluminum alloy powder and the graphite powder comprise 40 to 60 wt% of a mixture of an aluminum alloy powder and graphite powder based on the total weight of epoxy resin, triethylenetetramine, aluminum alloy powder and graphite powder Thermally conductive epoxy resin composition. 9. The method of claim 8,
Wherein when the aluminum alloy powder and the graphite powder are used together, the mixing ratio of the aluminum alloy powder to the graphite powder is used in a weight ratio of 1: 5 to 5: 1. The thermally conductive epoxy resin composition according to claim 1, Mixing 40 to 60% by weight of an aluminum alloy powder and graphite powder into 8 g of a bisphenol A type resin;
Adding a solvent to the mixture, and dispersing the mixture by ultrasonic treatment for 24 hours;
Reacting the dispersed solution with stirring for 50 to 24 hours; And
Adding 1 g of triethyltetramine to the reaction product, and curing the mixture at 70 for 2 hours. 11. The method of claim 10,
Wherein the solvent is a mixture of methyl ethyl ketone (MEK) and toluene (Toluene) at a volume ratio of 1: 3: 1. Epoxy resin; Triethylenetetraamine; Aluminum alloy powder; And a graphite powder as an effective component. A heat dissipation structure comprising an adhesive layer formed by applying the composition of any one of claims 1, 2, 4, or 7 to 9. 14. The method of claim 13,
Wherein the heat dissipation structure is selected from the group consisting of a heat dissipation plate, a heat dissipation film, a heat dissipation adhesive, a heat dissipation grease, and a heat dissipation tape.

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