CN110191582B - Production process of single-layer mirror aluminum substrate - Google Patents
Production process of single-layer mirror aluminum substrate Download PDFInfo
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- CN110191582B CN110191582B CN201910358625.8A CN201910358625A CN110191582B CN 110191582 B CN110191582 B CN 110191582B CN 201910358625 A CN201910358625 A CN 201910358625A CN 110191582 B CN110191582 B CN 110191582B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
The invention provides a production process of a single-layer mirror aluminum substrate, which comprises the following steps: the method comprises the following steps of S1 material sending, S2 super-roughening, S3 primary pre-pressing, S4 primary fishing, S5 secondary pre-pressing, S6 baking, S7 pressing, S8 film coating, S9 electroplating, S10 dry film, S11 etching, S12 anti-welding, S13 nickel-palladium-gold, S14 drilling and S15 secondary fishing. The production process of the single-layer mirror aluminum substrate provided by the invention has the advantages of high processing efficiency, high product quality, and excellent heat dissipation performance and waterproof performance.
Description
Technical Field
The invention relates to the field of circuit board processing, in particular to a production process of a single-layer mirror-surface aluminum substrate.
Background
Circuit boards, also known as printed circuit boards, are providers of electrical connections for electronic components. The development of the circuit board has been over 100 years old, the design is mainly a layout design, and the circuit board has the main advantages of greatly reducing errors of wiring and assembly and improving the automation level and the production labor rate. The printed circuit board can be divided into a single-sided board, a double-sided board, a four-layer board, a six-layer board and other multi-layer circuit boards according to the number of the layers of the circuit boards.
The corresponding circuit board substrate generally uses a copper plate or an aluminum plate, and the process flow comprises the following steps: sending material → digital punch press → abrasive belt grinding → pasting high temperature resistant glue → pressing → drilling → routing shape (inner groove) → primary electroplating → cleaning → secondary electroplating → etching → electrostatic spraying → routing shape → V-CUT → visual inspection → tearing glue → film removal → packaging → tin melting → bending → visual inspection → packaging → warehousing. Through once pressfitting, the laminating degree between the layer is lower, and the layer phenomenon appears falling easily in follow-up use, and utilizes copper base plate or aluminium base board, and its heat conductivility is good, but easy thermal-arrest leads to the circuit board whole to generate heat.
Disclosure of Invention
Aiming at the problems, the invention provides the production process of the single-layer mirror-surface aluminum substrate, which has the advantages of high processing efficiency, high product quality, excellent heat dissipation performance and excellent waterproof performance.
In order to achieve the purpose, the invention is solved by the following technical scheme:
a production process of a single-layer mirror aluminum substrate comprises the following steps:
s1 material distribution: preparing a mirror aluminum plate and a heat-conducting insulating plate;
s2 super-roughening: sand blasting is carried out on the upper end face and the lower end face of the mirror aluminum plate, then alkali liquor is used for carrying out micro-etching on the upper end face and the lower end face of the mirror aluminum plate, and the roughness Ra of the upper end face and the lower end face of the mirror aluminum plate after the micro-etching is 1.45-1.67;
s3, primary prepressing: the mirror aluminum plate and the heat-conducting insulating plate are stacked and then placed in a laminating machine under the pressure of 5Kg/cm2Strip with speed of 0.5m/min and temperature of 130 DEG CPressing and forming the parts;
s4 one-time fishing: milling the shape by using a milling cutter to obtain a primary plate;
s5, secondary prepressing: placing the primary plate in a pressing machine under the pressure of 5Kg/cm2Pressing at the speed of 0.5m/min and the temperature of 130 ℃ and pressing again to form a secondary plate;
s6 baking: placing the secondary plate in an oven, and baking for 12 hours at 40-45 ℃;
s7, pressing: placing the baked secondary plate in a pressing machine under the pressure of 5.5Kg/cm2Pressing and forming at the speed of 0.2m/min and the temperature of 170 ℃ to obtain a three-stage plate;
s8 film coating: plating a layer of fluorine polymer film on the lower end surface of the third-level plate;
s9 electroplating: electroplating the third-stage plate, forming a copper foil on the upper end face of the third-stage plate, and forming a hole copper layer in the through hole;
s10 dry film: carrying out film pasting, exposure and development on the surface of the copper foil to form an upper-layer circuit pattern;
s11 etching: etching off the non-circuit part on the upper circuit pattern to form an upper circuit, and then removing the dry film;
s12 solder mask: printing a layer of uniform solder mask ink on the upper circuit upper end face to form a solder mask ink layer;
s13 nickel palladium gold: sequentially carrying out oil removal, micro-etching, presoaking, activation, nickel precipitation, palladium precipitation, gold precipitation and drying on the upper end surface of the anti-welding ink layer, and forming a nickel film layer, a palladium film layer and a gold film layer after nickel precipitation, palladium precipitation and gold precipitation;
s14 drilling: drilling a hole on the three-stage plate to form a through hole;
s15 secondary fishing: and milling the shape by using a milling cutter to obtain the single-layer mirror-surface aluminum substrate.
Specifically, in the step S2 of super-roughening, the alkali solution used is a sodium hydroxide solution.
Specifically, the heat-conducting insulating plate is made of a BT resin substrate material.
Specifically, the thickness of the nickel film layer is 3 μm, the thickness of the palladium film layer is 3 μm, and the thickness of the gold film layer is 160 μm.
Specifically, the thickness of the fluorine polymer film layer is 0.8 μm.
Specifically, the fluorine polymer film layer is selected from one of a polytetrafluoroethylene film layer, a polyvinylidene fluoride film layer and a polychlorotrifluoroethylene film layer.
The invention has the beneficial effects that:
firstly, according to the production process of the single-layer mirror aluminum substrate, the mirror aluminum plate is used for replacing a traditional copper plate or aluminum plate, and the excellent reflection performance of the end face of the mirror aluminum plate is utilized, so that a large amount of heat radiation can be reflected, the heat radiation is prevented from being gathered near a circuit board, and the heat dissipation effect of the circuit board is improved;
secondly, before pressing, the procedures of primary prepressing, primary fishing, secondary prepressing and baking are added, the degree of fit of the mirror-surface aluminum plate and the heat-conducting insulating plate is improved, and the phenomenon of layer falling in the later period is avoided;
thirdly, a layer of fluorine polymer film layer is added on the bottom surface of the mirror aluminum plate, and fluorine ions have better hydrophobic property, so that the bottom surface of the mirror aluminum plate is always dry and water is not accumulated.
Detailed Description
The present invention will be described in further detail with reference to specific embodiments in order to provide a further understanding of the nature and technical means of the invention, as well as the specific objects and functions attained by the invention.
Example 1
A production process of a single-layer mirror aluminum substrate comprises the following steps:
s1 material distribution: preparing a mirror aluminum plate and a heat-conducting insulating plate;
s2 super-roughening: the surface of the mirror aluminum plate is smooth and is directly pressed with the heat-conducting insulating plate, and the heat-conducting insulating plate is easy to fall off, so that the roughness of the upper end surface of the mirror aluminum plate can be improved, the upper end surface and the lower end surface of the mirror aluminum plate are subjected to sand blasting, then the upper end surface and the lower end surface of the mirror aluminum plate are subjected to micro-etching by using alkali liquor, and the roughness Ra of the upper end surface and the lower end surface of the mirror aluminum plate after the micro-etching is 1.45-1.67;
s3, primary prepressing: the mirror aluminum plate and the heat-conducting insulating plate are stacked and then arranged in a press fitIn the machine, the pressure is 5Kg/cm2Pressing and molding at the speed of 0.5m/min and the temperature of 130 ℃;
s4 one-time fishing: milling the shape by using a milling cutter to obtain a primary plate;
s5, secondary prepressing: placing the primary plate in a pressing machine under the pressure of 5Kg/cm2Pressing at the speed of 0.5m/min and the temperature of 130 ℃ and pressing again to form a secondary plate;
s6 baking: placing the secondary plate in an oven, and baking for 12 hours at 40-45 ℃;
s7, pressing: placing the baked secondary plate in a pressing machine under the pressure of 5.5Kg/cm2Pressing and forming at the speed of 0.2m/min and the temperature of 170 ℃ to obtain a three-stage plate;
s8 film coating: plating a layer of fluorine polymer film on the lower end surface of the third-level plate;
s9 electroplating: electroplating the third-stage plate, forming a copper foil on the upper end face of the third-stage plate, and forming a hole copper layer in the through hole;
s10 dry film: carrying out film pasting, exposure and development on the surface of the copper foil to form an upper-layer circuit pattern;
s11 etching: etching off the non-circuit part on the upper circuit pattern to form an upper circuit, and then removing the dry film;
s12 solder mask: printing a layer of uniform solder mask ink on the upper circuit upper end face to form a solder mask ink layer;
s13 nickel palladium gold: sequentially carrying out oil removal, micro-etching, presoaking, activation, nickel precipitation, palladium precipitation, gold precipitation and drying processes on the upper end surface of the anti-welding ink layer, forming a nickel film layer, a palladium film layer and a gold film layer after nickel precipitation, palladium precipitation and gold precipitation, and coating nickel-palladium-gold on the surface to protect a copper foil from being polluted and oxidized and protect the welding reliability of components;
s14 drilling: drilling a hole on the three-stage plate to form a through hole;
s15 secondary fishing: and milling the shape by using a milling cutter to obtain the single-layer mirror-surface aluminum substrate.
Preferably, in the step S2 super-roughening, the alkali solution used is sodium hydroxide solution.
Preferably, the heat-conducting insulating plate is a BT resin substrate material.
Preferably, the thickness of the nickel film layer is 3 μm, the thickness of the palladium film layer is 3 μm, and the thickness of the gold film layer is 160 μm.
Preferably, the thickness of the fluorine polymer film layer is 0.8 μm.
Preferably, the fluorine polymer film layer is selected from polytetrafluoroethylene film layers.
The above examples only show 1 embodiment of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (6)
1. A production process of a single-layer mirror aluminum substrate is characterized by comprising the following steps:
s1 material distribution: preparing a mirror aluminum plate and a heat-conducting insulating plate;
s2 super-roughening: sand blasting is carried out on the upper end face and the lower end face of the mirror aluminum plate, then alkali liquor is used for carrying out micro-etching on the upper end face and the lower end face of the mirror aluminum plate, and the roughness Ra of the upper end face and the lower end face of the mirror aluminum plate after the micro-etching is 1.45-1.67;
s3, primary prepressing: the mirror aluminum plate and the heat-conducting insulating plate are stacked and then placed in a laminating machine under the pressure of 5Kg/cm2Pressing and molding at the speed of 0.5m/min and the temperature of 130 ℃;
s4 one-time fishing: milling the shape by using a milling cutter to obtain a primary plate;
s5, secondary prepressing: placing the primary plate in a pressing machine under the pressure of 5Kg/cm2Pressing at the speed of 0.5m/min and the temperature of 130 ℃ and pressing again to form a secondary plate;
s6 baking: placing the secondary plate in an oven, and baking for 12 hours at 40-45 ℃;
s7, pressing: placing the baked secondary plate in a pressing machine under the pressure of 5.5Kg/cm2And a speed of 0.2 m-min, pressing and forming at the temperature of 170 ℃ to obtain a three-stage plate;
s8 film coating: plating a layer of fluorine polymer film on the lower end surface of the third-level plate;
s9 electroplating: electroplating the third-stage plate, forming a copper foil on the upper end face of the third-stage plate, and forming a hole copper layer in the through hole;
s10 dry film: carrying out film pasting, exposure and development on the surface of the copper foil to form an upper-layer circuit pattern;
s11 etching: etching off the non-circuit part on the upper circuit pattern to form an upper circuit, and then removing the dry film;
s12 solder mask: printing a layer of uniform solder mask ink on the upper circuit upper end face to form a solder mask ink layer;
s13 nickel palladium gold: sequentially carrying out oil removal, microetching, presoaking, activation, nickel precipitation, palladium precipitation, gold precipitation and drying processes, and forming a nickel film layer, a palladium film layer and a gold film layer after nickel precipitation, palladium precipitation and gold precipitation;
s14 drilling: drilling a hole on the three-stage plate to form a through hole;
s15 secondary fishing: and milling the shape by using a milling cutter to obtain the single-layer mirror-surface aluminum substrate.
2. The process of claim 1, wherein in the step S2 of super-roughening, the alkali solution is sodium hydroxide solution.
3. The process according to claim 1, wherein the heat-conducting and insulating plate is made of a BT resin substrate material.
4. The process according to claim 1, wherein the thickness of the nickel film layer is 3 μm, the thickness of the palladium film layer is 3 μm, and the thickness of the gold film layer is 160 μm.
5. The process according to claim 1, wherein the fluorine polymer film layer has a thickness of 0.8 μm.
6. The process according to claim 5, wherein the fluorine polymer film is one selected from the group consisting of a polytetrafluoroethylene film, a polyvinylidene fluoride film, and a polychlorotrifluoroethylene film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910358625.8A CN110191582B (en) | 2019-04-30 | 2019-04-30 | Production process of single-layer mirror aluminum substrate |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910358625.8A CN110191582B (en) | 2019-04-30 | 2019-04-30 | Production process of single-layer mirror aluminum substrate |
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| CN110191582A CN110191582A (en) | 2019-08-30 |
| CN110191582B true CN110191582B (en) | 2021-09-07 |
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Citations (6)
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| CN101600307A (en) * | 2008-06-05 | 2009-12-09 | 欣兴电子股份有限公司 | Wiring board and manufacture method thereof |
| CN201937963U (en) * | 2011-01-04 | 2011-08-17 | 铜陵浩荣电子科技有限公司 | Pre-coating device for aluminum base plate |
| JP2012104585A (en) * | 2010-11-09 | 2012-05-31 | Yazaki Corp | Wiring board manufacturing method |
| CN104582250A (en) * | 2015-01-29 | 2015-04-29 | 高德(苏州)电子有限公司 | Heat-conduction PCB (printed circuit board) glue combination aluminum-based circuit board and manufacturing method thereof |
| CN107244128A (en) * | 2017-06-20 | 2017-10-13 | 深圳市景旺电子股份有限公司 | A kind of composite plate of FPC plates and aluminium base and preparation method thereof |
| CN107787131A (en) * | 2016-08-31 | 2018-03-09 | 博罗康佳精密科技有限公司 | A kind of preparation method of multilayer copper base |
-
2019
- 2019-04-30 CN CN201910358625.8A patent/CN110191582B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101600307A (en) * | 2008-06-05 | 2009-12-09 | 欣兴电子股份有限公司 | Wiring board and manufacture method thereof |
| JP2012104585A (en) * | 2010-11-09 | 2012-05-31 | Yazaki Corp | Wiring board manufacturing method |
| CN201937963U (en) * | 2011-01-04 | 2011-08-17 | 铜陵浩荣电子科技有限公司 | Pre-coating device for aluminum base plate |
| CN104582250A (en) * | 2015-01-29 | 2015-04-29 | 高德(苏州)电子有限公司 | Heat-conduction PCB (printed circuit board) glue combination aluminum-based circuit board and manufacturing method thereof |
| CN107787131A (en) * | 2016-08-31 | 2018-03-09 | 博罗康佳精密科技有限公司 | A kind of preparation method of multilayer copper base |
| CN107244128A (en) * | 2017-06-20 | 2017-10-13 | 深圳市景旺电子股份有限公司 | A kind of composite plate of FPC plates and aluminium base and preparation method thereof |
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| CN110191582A (en) | 2019-08-30 |
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