CN110191582A - A kind of production technology of single layer mirror-surface aluminum base board - Google Patents
A kind of production technology of single layer mirror-surface aluminum base board Download PDFInfo
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- CN110191582A CN110191582A CN201910358625.8A CN201910358625A CN110191582A CN 110191582 A CN110191582 A CN 110191582A CN 201910358625 A CN201910358625 A CN 201910358625A CN 110191582 A CN110191582 A CN 110191582A
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- Prior art keywords
- layer
- mirror
- base board
- aluminum base
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
Abstract
The present invention provides a kind of production technologies of single layer mirror-surface aluminum base board, comprising the following steps: S1 material issuance, the super roughening of S2, S3 precompressed, a S4 once fishing type, bis- precompressed of S5, S6 baking, S7 pressing, S8 plated film, S9 plating, S10 dry film, S11 are etched, S12 is anti-welding, S13 NiPdAu, S14 drill, bis- fishing types of S15.The production technology of single layer mirror-surface aluminum base board provided by the invention, high in machining efficiency, product quality is high, and heat dissipation performance and waterproof performance are excellent.
Description
Technical field
The present invention relates to circuit board manufacture fields, and in particular to a kind of production technology of single layer mirror-surface aluminum base board.
Background technique
Circuit board, also known as printed circuit board are the suppliers of electronic component electrical connection.Its development existing more than 100
The history in year, design are mainly layout design, and the major advantage using circuit board is to greatly reduce the difference of wiring and assembly
Mistake improves the gentle productive labor rate of Automated water.Printed circuit board according to the wiring board number of plies can be divided into single sided board, dual platen,
Four laminates, six laminates and other multilayer circuit boards.
Corresponding circuits plate substrate generally uses copper sheet or aluminium sheet, and process flow includes: material issuance → numerical digit punching machine → abrasive band
Grinding → patch high-temperature plastic → pressing → drilling → gong goes out shape (inside groove) → primary plating → cleaning → second time electroplating → etching
→ electrostatic spraying → gong go out shape → V-CUT → visual inspection → tears glue → take off film → packaging → change tin → bending → visual inspection → packaging →
Storage.By one step press, compactness between layers is lower, and subsequent use is easy to appear a layer phenomenon, and utilizes copper-based
Plate or aluminum substrate, good heat conductivity, but it is easy thermal-arrest, cause circuit board integrally to generate heat.
Summary of the invention
In view of the above problems, the present invention provides a kind of production technology of single layer mirror-surface aluminum base board, high in machining efficiency, product matter
Amount is high, and heat dissipation performance and waterproof performance are excellent.
To achieve the above object, the present invention solves by the following technical programs:
A kind of production technology of single layer mirror-surface aluminum base board, comprising the following steps:
S1 material issuance: prepare mirror surface aluminium sheet, heat conductive insulating plate；
The super roughening of S2: sandblasting is carried out to mirror surface aluminium sheet upper and lower end faces, then mirror surface aluminium sheet upper and lower end faces are carried out with lye
Microetch, the roughness Ra of mirror surface aluminium sheet upper and lower end faces is 1.45~1.67 after microetch；
Precompressed of S3: stacking mirror surface aluminium sheet, heat conductive insulating plate and be placed in pressing machine, is 5Kg/cm in pressure2, speed be
0.5m/min, temperature are pressing and forming under the conditions of 130 DEG C；
The primary fishing type of S4: shape is milled out with milling cutter, obtains primary plate；
Bis- precompressed of S5: primary plate is placed in pressing machine, is 5Kg/cm in pressure2, speed 0.5m/min, temperature 130
Pressing and forming again is pressed under the conditions of DEG C, obtains two steps；
S6 baking: two steps are placed in baking oven, toast 12h at 40~45 DEG C；
S7 pressing: two steps after baking are placed in pressing machine, are 5.5Kg/cm in pressure2, speed 0.2m/min, temperature
Pressing and forming under the conditions of being 170 DEG C, obtains three steps；
S8 plated film: the polymer film of one layer of fluorine is plated in the lower end surface of three steps；
S9 plating: being electroplated three steps, forms hole layers of copper in three step upper surfaces formation copper foil, through-hole；
S10 dry film: pad pasting, development, exposure are carried out in copper foil surface, forms upper layer circuit pattern；
S11 etching: non-line section on upper layer circuit pattern is etched away, and is formed upper layer circuit, is then removed dry film；
S12 is anti-welding: printing one layer of uniform anti-solder ink in upper layer circuit upper surface, forms anti-solder ink layer；
S13 NiPdAu: oil removing, microetch, preimpregnation, activation, heavy nickel, heavy palladium, turmeric, baking are successively carried out to anti-solder ink layer upper surface
Dry process sequentially forms nickel film layer, palladium film layer, golden membranous layer by heavy nickel, heavy palladium, turmeric rear defence solder paste layer of ink upper surface；
S14 drilling: drilling on three steps, forms through-hole；
Bis- fishing types of S15: milling out shape with milling cutter, and single layer mirror-surface aluminum base board is made.
Specifically, lye used is sodium hydroxide solution in the super roughening of the step S2.
Specifically, the heat conductive insulating plate is BT resin substrate material.
Specifically, the nickel film layer with a thickness of 3 μm, the palladium film layer with a thickness of 3 μm, the golden membranous layer with a thickness of
160μm。
Specifically, the polymer film of the fluorine with a thickness of 0.8 μm.
Specifically, the polymer film of the fluorine is selected from Teflon membranes, Kynoar film layer, polychlorostyrene trifluoro second
One of alkene film layer.
The beneficial effects of the present invention are:
First, a kind of production technology of single layer mirror-surface aluminum base board provided by the invention, using mirror surface aluminium sheet instead of traditional
Copper sheet or aluminium sheet can reflect a large amount of heat radiation, heat radiation avoided to be gathered in circuit using the reflecting properties that its end face is excellent
Near plate, the heat dissipation effect of circuit board is improved；
Second, before pressing, a precompressed, once fishing type, secondary precompressed and roasting procedure are increased, improves mirror surface aluminium sheet
With the compactness of heat conductive insulating plate, the later period is avoided to occur a layer phenomenon；
Third increases the polymer film of one layer of fluorine in specular aluminium board bottom face, and fluorine ion has preferable hydrophobic performance, makes mirror
Face aluminium sheet bottom surface remains drying, not ponding.
Specific embodiment
In order to further appreciate that feature of the invention, technological means and specific purposes achieved, function, tie below
Closing specific embodiment, the present invention is described in further detail.
Embodiment 1
A kind of production technology of single layer mirror-surface aluminum base board, comprising the following steps:
S1 material issuance: prepare mirror surface aluminium sheet, heat conductive insulating plate；
The super roughening of S2: since mirror surface surface of aluminum plate is smooth, directly pressing with heat conductive insulating plate, and heat conductive insulating plate is easy to fall off, because
This, can be improved the roughness of mirror surface aluminium sheet upper surface, sandblasting be carried out to mirror surface aluminium sheet upper and lower end faces, then with lye to mirror surface
Aluminium sheet upper and lower end faces carry out microetch, and the roughness Ra of mirror surface aluminium sheet upper and lower end faces is 1.45~1.67 after microetch；
Precompressed of S3: stacking mirror surface aluminium sheet, heat conductive insulating plate and be placed in pressing machine, is 5Kg/cm in pressure2, speed be
0.5m/min, temperature are pressing and forming under the conditions of 130 DEG C；
The primary fishing type of S4: shape is milled out with milling cutter, obtains primary plate；
Bis- precompressed of S5: primary plate is placed in pressing machine, is 5Kg/cm in pressure2, speed 0.5m/min, temperature 130
Pressing and forming again is pressed under the conditions of DEG C, obtains two steps；
S6 baking: two steps are placed in baking oven, toast 12h at 40~45 DEG C；
S7 pressing: two steps after baking are placed in pressing machine, are 5.5Kg/cm in pressure2, speed 0.2m/min, temperature
Pressing and forming under the conditions of being 170 DEG C, obtains three steps；
S8 plated film: the polymer film of one layer of fluorine is plated in the lower end surface of three steps；
S9 plating: being electroplated three steps, forms hole layers of copper in three step upper surfaces formation copper foil, through-hole；
S10 dry film: pad pasting, development, exposure are carried out in copper foil surface, forms upper layer circuit pattern；
S11 etching: non-line section on upper layer circuit pattern is etched away, and is formed upper layer circuit, is then removed dry film；
S12 is anti-welding: printing one layer of uniform anti-solder ink in upper layer circuit upper surface, forms anti-solder ink layer；
S13 NiPdAu: oil removing, microetch, preimpregnation, activation, heavy nickel, heavy palladium, turmeric, baking are successively carried out to anti-solder ink layer upper surface
Dry process sequentially forms nickel film layer, palladium film layer, golden membranous layer by heavy nickel, heavy palladium, turmeric rear defence solder paste layer of ink upper surface, passes through
Surface coats NiPdAu, to protect copper foil not contaminated and aoxidize, protects the soldering reliability of component；
S14 drilling: drilling on three steps, forms through-hole；
Bis- fishing types of S15: milling out shape with milling cutter, and single layer mirror-surface aluminum base board is made.
Preferably, in the super roughening of step S2, lye used is sodium hydroxide solution.
Preferably, heat conductive insulating plate is BT resin substrate material.
Preferably, nickel film layer with a thickness of 3 μm, palladium film layer with a thickness of 3 μm, golden membranous layer with a thickness of 160 μm.
Preferably, the polymer film of fluorine with a thickness of 0.8 μm.
Preferably, the polymer film of fluorine is selected from Teflon membranes.
Above embodiments only express a kind of embodiment of the invention, and the description thereof is more specific and detailed, but can not be because
This and be interpreted as limitations on the scope of the patent of the present invention.It should be pointed out that for those of ordinary skill in the art,
Under the premise of not departing from present inventive concept, various modifications and improvements can be made, and these are all within the scope of protection of the present invention.
Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (6)
1. a kind of production technology of single layer mirror-surface aluminum base board, which comprises the following steps:
S1 material issuance: prepare mirror surface aluminium sheet, heat conductive insulating plate；
The super roughening of S2: sandblasting is carried out to mirror surface aluminium sheet upper and lower end faces, then mirror surface aluminium sheet upper and lower end faces are carried out with lye
Microetch, the roughness Ra of mirror surface aluminium sheet upper and lower end faces is 1.45~1.67 after microetch；
Precompressed of S3: stacking mirror surface aluminium sheet, heat conductive insulating plate and be placed in pressing machine, is 5Kg/cm in pressure2, speed be
0.5m/min, temperature are pressing and forming under the conditions of 130 DEG C；
The primary fishing type of S4: shape is milled out with milling cutter, obtains primary plate；
Bis- precompressed of S5: primary plate is placed in pressing machine, is 5Kg/cm in pressure2, speed 0.5m/min, temperature be 130 DEG C
Under the conditions of press pressing and forming again, obtain two steps；
S6 baking: two steps are placed in baking oven, toast 12h at 40~45 DEG C；
S7 pressing: two steps after baking are placed in pressing machine, are 5.5Kg/cm in pressure2, speed 0.2m/min, temperature
Pressing and forming under the conditions of being 170 DEG C, obtains three steps；
S8 plated film: the polymer film of one layer of fluorine is plated in the lower end surface of three steps；
S9 plating: being electroplated three steps, forms hole layers of copper in three step upper surfaces formation copper foil, through-hole；
S10 dry film: pad pasting, development, exposure are carried out in copper foil surface, forms upper layer circuit pattern；
S11 etching: non-line section on upper layer circuit pattern is etched away, and is formed upper layer circuit, is then removed dry film；
S12 is anti-welding: printing one layer of uniform anti-solder ink in upper layer circuit upper surface, forms anti-solder ink layer；
S13 NiPdAu: oil removing, microetch, preimpregnation, activation, heavy nickel, heavy palladium, turmeric, baking are successively carried out to anti-solder ink layer upper surface
Dry process sequentially forms nickel film layer, palladium film layer, golden membranous layer by heavy nickel, heavy palladium, turmeric rear defence solder paste layer of ink upper surface；
S14 drilling: drilling on three steps, forms through-hole；
Bis- fishing types of S15: milling out shape with milling cutter, and single layer mirror-surface aluminum base board is made.
2. a kind of production technology of single layer mirror-surface aluminum base board according to claim 1, which is characterized in that the step S2 is super
In roughening, lye used is sodium hydroxide solution.
3. a kind of production technology of single layer mirror-surface aluminum base board according to claim 1, which is characterized in that the heat conductive insulating
Plate is BT resin substrate material.
4. a kind of production technology of single layer mirror-surface aluminum base board according to claim 1, which is characterized in that the nickel film layer
With a thickness of 3 μm, the palladium film layer with a thickness of 3 μm, the golden membranous layer with a thickness of 160 μm.
5. a kind of production technology of single layer mirror-surface aluminum base board according to claim 1, which is characterized in that the polymerization of the fluorine
Object film layer with a thickness of 0.8 μm.
6. a kind of production technology of single layer mirror-surface aluminum base board according to claim 5, which is characterized in that the polymerization of the fluorine
Object film layer is selected from one of Teflon membranes, Kynoar film layer, Polychlorotrifluoroefilmene filmene layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910358625.8A CN110191582B (en) | 2019-04-30 | 2019-04-30 | Production process of single-layer mirror aluminum substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910358625.8A CN110191582B (en) | 2019-04-30 | 2019-04-30 | Production process of single-layer mirror aluminum substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110191582A true CN110191582A (en) | 2019-08-30 |
| CN110191582B CN110191582B (en) | 2021-09-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910358625.8A Active CN110191582B (en) | 2019-04-30 | 2019-04-30 | Production process of single-layer mirror aluminum substrate |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101600307A (en) * | 2008-06-05 | 2009-12-09 | 欣兴电子股份有限公司 | Wiring board and manufacture method thereof |
| CN201937963U (en) * | 2011-01-04 | 2011-08-17 | 铜陵浩荣电子科技有限公司 | Pre-coating device for aluminum base plate |
| JP2012104585A (en) * | 2010-11-09 | 2012-05-31 | Yazaki Corp | Wiring board manufacturing method |
| CN104582250A (en) * | 2015-01-29 | 2015-04-29 | 高德(苏州)电子有限公司 | Heat-conduction PCB (printed circuit board) glue combination aluminum-based circuit board and manufacturing method thereof |
| CN107244128A (en) * | 2017-06-20 | 2017-10-13 | 深圳市景旺电子股份有限公司 | A kind of composite plate of FPC plates and aluminium base and preparation method thereof |
| CN107787131A (en) * | 2016-08-31 | 2018-03-09 | 博罗康佳精密科技有限公司 | A kind of preparation method of multilayer copper base |
-
2019
- 2019-04-30 CN CN201910358625.8A patent/CN110191582B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101600307A (en) * | 2008-06-05 | 2009-12-09 | 欣兴电子股份有限公司 | Wiring board and manufacture method thereof |
| JP2012104585A (en) * | 2010-11-09 | 2012-05-31 | Yazaki Corp | Wiring board manufacturing method |
| CN201937963U (en) * | 2011-01-04 | 2011-08-17 | 铜陵浩荣电子科技有限公司 | Pre-coating device for aluminum base plate |
| CN104582250A (en) * | 2015-01-29 | 2015-04-29 | 高德(苏州)电子有限公司 | Heat-conduction PCB (printed circuit board) glue combination aluminum-based circuit board and manufacturing method thereof |
| CN107787131A (en) * | 2016-08-31 | 2018-03-09 | 博罗康佳精密科技有限公司 | A kind of preparation method of multilayer copper base |
| CN107244128A (en) * | 2017-06-20 | 2017-10-13 | 深圳市景旺电子股份有限公司 | A kind of composite plate of FPC plates and aluminium base and preparation method thereof |
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| Publication number | Publication date |
|---|---|
| CN110191582B (en) | 2021-09-07 |
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