CN202335070U - Flexible printed circuit board with embedded bump interconnection structure - Google Patents
Flexible printed circuit board with embedded bump interconnection structure Download PDFInfo
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- CN202335070U CN202335070U CN2011204461916U CN201120446191U CN202335070U CN 202335070 U CN202335070 U CN 202335070U CN 2011204461916 U CN2011204461916 U CN 2011204461916U CN 201120446191 U CN201120446191 U CN 201120446191U CN 202335070 U CN202335070 U CN 202335070U
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- circuit board
- printed circuit
- flexible printed
- conductive
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Abstract
The utility model provides a flexible printed circuit board with an embedded bumps interconnection structure, which comprises a first copper layer, a semi-solidified layer, and a second copper layer, wherein the first copper layer is provided with at least one solidified conductive bump, the semi-solidified layer is arranged at two sides of the conductive bump, the second copper layer is arranged on the conductive bump and the semi-solidified layer, the second copper layer is connected with the first copper layer by the conductive bump. The flexible printed circuit board with the embedded bump interconnection structure has the advantages that the wiring density of the flexible printed circuit board is increased, and the manufacturing process of the flexible printed circuit board is simplified.
Description
Technical field
The utility model relates to flexible printed circuit board technology, particularly electrochemical field.
Background technology
(Flexible Printed Circuit is to have the printed circuit board (PCB) that flexible material is made, to have advantages such as distribution density is high, in light weight, thin thickness FPC) to flexible printed circuit board.Existing flexible printed circuit board is divided into single-sided flexible printed substrate, double-sided flexible printed circuit board.The manufacture method of existing double-side flexible printed circuit board please refer to shown in Fig. 1～3.At first; Please refer to Fig. 1; The first bronze medal layer 11 is provided, on the said first bronze medal layer 11, forms the bonding glue-line of the first bonding glue-line 12, first substrate layer 13, second 14, the second bronze medal layer 15 successively, utilize the existing technology that cuts then; The bonding glue-line of the bonding glue-line of the above-mentioned first bronze medal layer 11, first 12, first substrate layer 13, second 14, the second bronze medal layer 15 are cut, form satisfactory shape and size.Then, please refer to Fig. 2, form the through hole penetrate the bonding glue-line of the bonding glue-line of the said first bronze medal layer 11, first 12, first substrate layer 13, second 14, the second bronze medal layer 15, said through hole can adopt bore process to form.Then; Please refer to Fig. 3, be formed on the said first bronze medal layer 11 below and form first interconnection layer 16, above the said second bronze medal layer 12, form second interconnection layer 17; In said through hole, form the 3rd interconnection layer 18; Said the 3rd interconnection layer 18 is electrically connected said first interconnection layer 15 and second interconnection layer 17, and the material of said first interconnection layer 16, second interconnection layer 17 and the 3rd interconnection layer 18 is a copper, utilizes copper-plating technique to form.Then, said first interconnection layer 16 and second interconnection layer 18 are carried out etching technics, form interconnection line.
Above-mentioned technology is owing to need copper-plating technique, can discharge the discarded object that contains copper etc., needs to increase the offal treatment step, to reduce the pollution to environment; Owing to utilize through hole to realize the conducting between the two interconnect layers up and down, and through hole normally forms, and therefore can not weld pad be carried on the through hole, is unfavorable for improving the density of printed substrate through the machine drilling mode; Because first interconnection layer and second interconnection layer etc. are to utilize copper-plating technique to form, the thickness of the copper layer of formation is bigger than normal, so the wiring density of printed substrate is restricted.
Therefore, the structure of existing flexible printed circuit board needs to improve.
The utility model content
The problem that the utility model solves provides a kind of flexible printed circuit board with embedded conductive projection interconnection structure and preparation method thereof, has simplified processing step, has improved the wiring density of the flexible printed circuit board that forms.
For addressing the above problem, the utility model provides a kind of manufacture method with flexible printed circuit board of embedded projection interconnection structure, comprising:
The first bronze medal layer has the conductive projection that has a curing at least on the said first bronze medal layer;
The semi-solid preparation layer is positioned at said conductive projection both sides;
The second bronze medal layer is positioned on said conductive projection and the semi-solid preparation layer, and the said second bronze medal layer is electrically connected with the said first bronze medal layer through said conductive projection.
Alternatively, said conductive projection be shaped as taper shape, the diameter range of said conductive projection is 0.2～0.3 micron, the thickness range of said conductive projection is 100～130 microns.
Alternatively, the material of said conductive projection is conductive silver glue or conductive copper glue.
Alternatively, the material of said semi-solid preparation layer is the mixture of viscose glue material and insulation material, and said viscose glue material is acrylic or epoxy resin, and said insulation material is polyimides or polyester film.
Compared with prior art, the utlity model has following advantage:
The utility model is provided with conductive projection between two-layer copper layer; Said conductive projection is used for two electrical connections between the copper layer, thereby simplifies the manufacture craft of flexible printed circuit board, need not to carry out a plurality of processing steps such as boring, electroless copper and electro-coppering of prior art; Simplified production technology greatly; Compare with buried via hole, blind hole structure, the utility model can be saved the number of times of lamination, thereby the production cycle is shortened greatly; And owing to need not to hole, technologies such as electroless copper, electro-coppering, save and surpass 1/3 production cost; Adopt conductive projection that two-layer copper layer is formed interconnection, also can improve the interconnection density of flexible print circuit board.
Description of drawings
Fig. 1～Fig. 3 is the manufacture method cross-sectional view of the double-side flexible printed circuit board of prior art;
Fig. 4 is the manufacture method schematic flow sheet of the flexible print circuit board of an embodiment of the utility model;
Fig. 5～Fig. 9 is the manufacture method cross-sectional view of the flexible print circuit board of an embodiment of the utility model.
Embodiment
The utility model proposes a kind of flexible printed circuit board of embedded projection interconnection structure, please refer to Fig. 9, and said flexible printed circuit board comprises:
The first bronze medal layer 101 has the conductive projection 102 that has a curing at least on the said first bronze medal layer 101;
The second bronze medal layer 102 is positioned on said conductive projection 102 and the semi-solid preparation layer 103, and the said second bronze medal layer 102 is electrically connected with the said first bronze medal layer 101 through said conductive projection 102.
In the present embodiment, said conductive projection 102 be shaped as taper shape, the diameter range of said conductive projection 102 is 0.2～0.3 micron, the thickness range of said conductive projection 102 is 100～130 microns.
The material of said conductive projection 102 is conductive silver glue or conductive copper glue.Said conductive projection 102 forms through silk-screen printing technique and two steps of baking process.
The manufacture method of the flexible printed circuit board of above-mentioned embedded projection interconnection structure please refer to Fig. 4, comprising:
Step S1 provides the first bronze medal layer;
Step S2, printing conductive glue projection on the said first bronze medal layer;
Step S3 toasts said conducting resinl projection, forms the conductive projection that solidifies;
Step S4 forms the semi-solid preparation layer on the conductive projection of said curing;
Step S5 places the second bronze medal layer on said semi-solid preparation layer;
Step S6 carries out process for pressing, makes said semi-solid preparation layer be filled in said conducting resinl projection both sides, and said conducting resinl projection is electrically connected the said first bronze medal layer and the second bronze medal layer.
Below in conjunction with concrete embodiment the technical scheme of the utility model is carried out detailed explanation.For the technical scheme of the utility model is described better, please combine the manufacture method cross-sectional view of flexible print circuit board of the embodiment of the utility model of Fig. 5～shown in Figure 9.
At first, please refer to Fig. 5, the first bronze medal layer 101 is provided, the thickness range of the said first bronze medal layer 101 is 15～21 microns, is formed with circuit on the said first bronze medal layer 101.Form conducting resinl projection 1021 on the surface that is formed with circuit of the said first bronze medal layer 101 then, said conductive adhesive layer 1021 utilizes silk-screen printing technique to form.The thickness range of said conductive adhesive layer 1021 is 100～130 microns.The material of said conductive adhesive layer 1021 is conductive silver glue, conductive copper glue or both combinations.Said conductive adhesive layer 1021 will shrink to form at follow-up baking process and have conductive projection certain degree of hardness, that solidify.
Then, please refer to Fig. 6, said conductive adhesive layer 1021 is carried out baking process, make said conductive adhesive layer 1021 shrink and form to have conductive projection 102 certain degree of hardness, that solidify.The conductive projection 102 of said curing be shaped as taper shape, the diameter range of said conductive projection 102 is 0.2～0.3 micron.Said baking process utilization baking (oven) equipment carries out, and its technological parameter is set to: 60～70 degrees centigrade of preheatings, and such as 65 degrees centigrade, be 10～30 minutes warm-up time, such as being 20 minutes, the temperature range of said baking process is 60～70 degrees centigrade.
Then, please refer to Fig. 6, on the conductive projection 102 of said curing, form semi-solid preparation layer 103.Said semi-solid preparation layer 103 is used for melting at follow-up heating steps, and is filled in the both sides of the conductive projection 102 of said curing, mutually insulated between the conductive projection of realizing solidifying 102.The material of easy deformation and the material that can be punctured by conductive projection 102 when the material of said semi-solid preparation layer 103 should be chosen in high temperature.As an embodiment, the material of said semi-solid preparation layer 103 is the mixture of viscose glue material and insulation material, and said viscose glue material is acrylic or epoxy resin, and said insulation material is polyimides or polyester film.The proportion of said viscose glue material is 70%～90%, and the proportion of insulation material is 30%～10%, and the thickness range of semi-solid preparation layer is 0.1575 millimeter～0.1925 millimeter.As an embodiment, the proportion of said viscose glue material is 80%, and the proportion of insulation material is 20%, and the thickness range of semi-solid preparation layer is 0.175 millimeter.
Then, please refer to Fig. 7, on said semi-solid preparation layer 103, place the second bronze medal layer 104.The thickness range of the said second bronze medal layer 104 is 10～20 microns.
Then, please refer to Fig. 8, carry out process for pressing, make said semi-solid preparation layer 103 be filled in said conductive projection 102 both sides, said conductive projection 102 is electrically connected the said first bronze medal layer 101 and the second bronze medal layer 102.Said process for pressing at high temperature carries out, and the scope of said high temperature is 80-90 degree centigrade, and under the scope of above-mentioned high temperature, said semi-solid preparation layer 103 melts, and is filled in the both sides of said conductive projection 102, realizes mutually insulated between the conductive projection 102.Said process for pressing can apply certain pressure between the first bronze medal layer 101 and the second bronze medal layer 102; So that said conductive projection 102 penetrates the semi-solid preparation layer 103 under the melting state, thereby realize that conductive projection 102 is electrically connected the first bronze medal layer 101 and the second bronze medal layer 102.
To sum up, the utility model is provided with conductive projection between two-layer copper layer, and said conductive projection is used for two electrical connections between the copper layer; Thereby simplify the manufacture craft of flexible printed circuit board; Need not to carry out a plurality of processing steps such as boring, electroless copper and electro-coppering of prior art, simplified production technology greatly, compare with buried via hole, blind hole structure; The utility model can be saved the number of times of lamination, thereby the production cycle is shortened greatly; And owing to need not to hole, technologies such as electroless copper, electro-coppering, save and surpass 1/3 production cost; Adopt conductive projection that two-layer copper layer is formed interconnection, also can improve the interconnection density of flexible print circuit board.The above is merely the preferred embodiment of the utility model, and all equalizations of being done according to the utility model claim scope change and modify, and all should belong to the covering scope of the utility model claim.
Claims (3)
1. the flexible printed circuit board with embedded projection interconnection structure is characterized in that, comprising:
The first bronze medal layer has the conductive projection that has a curing at least on the said first bronze medal layer;
The semi-solid preparation layer is positioned at said conductive projection both sides;
The second bronze medal layer is positioned on said conductive projection and the semi-solid preparation layer, and the said second bronze medal layer is electrically connected with the said first bronze medal layer through said conductive projection.
2. the flexible printed circuit board with embedded projection interconnection structure as claimed in claim 1; It is characterized in that; Said conductive projection be shaped as taper shape, the diameter range of said conductive projection is 0.2～0.3 micron, the thickness range of said conductive projection is 100～130 microns.
3. the flexible printed circuit board with embedded projection interconnection structure as claimed in claim 1 is characterized in that, the material of said conductive projection is conductive silver glue or conductive copper glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204461916U CN202335070U (en) | 2011-11-11 | 2011-11-11 | Flexible printed circuit board with embedded bump interconnection structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204461916U CN202335070U (en) | 2011-11-11 | 2011-11-11 | Flexible printed circuit board with embedded bump interconnection structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202335070U true CN202335070U (en) | 2012-07-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011204461916U Expired - Fee Related CN202335070U (en) | 2011-11-11 | 2011-11-11 | Flexible printed circuit board with embedded bump interconnection structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202335070U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102427679A (en) * | 2011-11-11 | 2012-04-25 | 欣兴同泰科技（昆山）有限公司 | Flexible printed circuit board with embedded lug interconnection structure and manufacturing method of flexible printed circuit board |
| CN106658943A (en) * | 2016-12-13 | 2017-05-10 | 上海摩软通讯技术有限公司 | Circuit board |
-
2011
- 2011-11-11 CN CN2011204461916U patent/CN202335070U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102427679A (en) * | 2011-11-11 | 2012-04-25 | 欣兴同泰科技（昆山）有限公司 | Flexible printed circuit board with embedded lug interconnection structure and manufacturing method of flexible printed circuit board |
| CN106658943A (en) * | 2016-12-13 | 2017-05-10 | 上海摩软通讯技术有限公司 | Circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120711 Termination date: 20201111 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |