CN105142337B - A kind of Rigid Flex to open a window after internal layer pad and preparation method thereof - Google Patents
A kind of Rigid Flex to open a window after internal layer pad and preparation method thereof Download PDFInfo
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- CN105142337B CN105142337B CN201510571689.8A CN201510571689A CN105142337B CN 105142337 B CN105142337 B CN 105142337B CN 201510571689 A CN201510571689 A CN 201510571689A CN 105142337 B CN105142337 B CN 105142337B
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- internal layer
- layer pad
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- window
- rigid flex
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- 238000002360 preparation method Methods 0.000 title abstract description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 51
- 229910052802 copper Inorganic materials 0.000 claims abstract description 49
- 239000010949 copper Substances 0.000 claims abstract description 49
- 239000013039 cover film Substances 0.000 claims abstract description 23
- 239000000758 substrate Substances 0.000 claims abstract description 22
- 239000000463 material Substances 0.000 claims abstract description 19
- 239000011888 foil Substances 0.000 claims abstract description 16
- 238000005530 etching Methods 0.000 claims abstract description 15
- 238000001354 calcination Methods 0.000 claims abstract description 4
- 238000013461 design Methods 0.000 claims abstract description 4
- 238000004519 manufacturing process Methods 0.000 claims description 10
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 239000007787 solid Substances 0.000 claims description 6
- 238000005553 drilling Methods 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 description 12
- 239000010408 film Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 229910002090 carbon oxide Inorganic materials 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- -1 drilling Substances 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000011120 plywood Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Rigid Flex to open a window after a kind of internal layer pad and preparation method thereof, comprises the following steps：S1, flexible board substrate sawing sheet, the soft board layers of copper of flexible board substrate is etched to form internal layer circuit according to circuit design requirement, according to windowing etching is required to form internal layer pad corresponding with windowed regions simultaneously, etching should ensure that windowed regions can fall within the scope of corresponding internal layer pad when forming internal layer pad, then the internal layer cover film not opened a window is fitted in the flexible board substrate surface, flexible circuit board is made；S2, outer layer fine copper layers of foil is attached on hardboard base material and hardboard base material BASE is pressed together on to the hardboard area of flexible circuit board, Rigid Flex is made；S3, CO is used2Laser needs windowed regions to carry out windowing calcination, windowed regions break-through and the internal layer pad for exposing flexible circuit board to internal layer cover film, and the Rigid Flex to open a window after internal layer pad, efficiency of the invention and yield higher is made.
Description
Technical field
After the Rigid Flex of the digital products wiring board such as mobile phone, computer more particularly to internal layer pad
Rigid Flex of windowing and preparation method thereof.
Background technology
The birth and development of FPC (flexible circuit board) and PCB (hardboard) have expedited the emergence of Rigid Flex this new product.Cause
This, Rigid Flex (Rigid-Flexible Printed Circuit Board, R-F PCB) is exactly flexible circuit board with
Rigid wiring board by processes such as pressings, is combined by related process requirement, and formation has FPC characteristics and PCB characteristics
Wiring board.Advantage：Rigid Flex is provided simultaneously with the characteristic of FPC and the characteristic of PCB, and therefore, it, which can be used for some, spy
The products very required, existing certain flexure region, also there is certain rigid region, to saving interiors of products space, subtract
Few finished-product volume, enhances product performance and is very helpful.Shortcoming：Rigid Flex production process is various, and production difficulty is big, good
Product rate is relatively low, throws that material, manpower are more, and the production cycle is long.
With the continuous progress of science and technology, requirement of the people to quality life is higher and higher, and digital product is constantly to convenience
Develop with lightweight.The convenience of digital product and lightweight so that the requirement to circuit board is also higher and higher, particularly mobile phone,
The common Rigid Flex of the digital products such as computer, development it is more swift and violent, develop towards Highgrade integration direction, be not singly soft
Harden a large amount of components that the hardboard part of plywood is arranged, soft board part also arranges many devices.So internal layer is caused to cover
The corresponding device PAD of film needs to open a window.In addition, internal layer adds screened film ground connection and other reinforcing chips ground connection etc. all to need to carry out cover film
Windowing.
At present, the flexible board area windowing processing method of Rigid Flex mainly has flexible board area to open a window in advance behind facture and flexible board area
It uncaps method.
Flexible board area open a window in advance facture be using windowing treated rigid plate (FR-4 copper clad plates or No-Flow PP) with
Soft board presses, then obtains Rigid Flex after the copper facing etching that drills.But contain pad or golden hand for soft board windowed regions
The product of finger, when outer-layer circuit etches can soft board windowed regions be contained to pad or golden finger etches away together, institute
It is applicable in this way and less and makes the Rigid Flex that internal layer soft board windowed regions contain pad or golden finger.Although this
Kind of process technological process is shorter, but is only suitable for doing flexible region and does not have the rigid-flex combined board of pad or golden finger.
It uncaps behind flexible board area method, is the hardboard of flexible board area to be subjected to local line style cutting process according to actual production (mold rushes
Cut or be cut by laser), then plus glue applies the fitting of copper whole plate, then obtains Rigid Flex after the copper facing etching that drills, then using not
Same Method means (chemical etching, Numerical control cutting, laser cutting) carry out processing of uncapping to it.In this method can be effectively protected
Layer windowed regions pad or golden finger, so the Rigid Flex for having windowing in internal layer is widely adopted in producing.But it adopts
With such technique, flow about increases by 20%, and two layers of glue-line and two layers of pure copper foil need to be mostly used than former approach, and yield declines,
The production cost increases, reduces the market competitiveness.
The content of the invention
It is soft or hard the technical problem to be solved in the present invention is to provide opening a window after a kind of efficiency and yield more preferably internal layer pad
Board and preparation method thereof.
In order to solve the above technical problem, the present invention provides the Rigid Flex making sides to open a window after a kind of internal layer pad
Method comprises the following steps：
S1, flexible board substrate sawing sheet etch to form internal layer circuit according to circuit design requirement to the soft board layers of copper of flexible board substrate,
According to windowing etching is required to form internal layer pad corresponding with windowed regions simultaneously, etching should ensure that windowing when forming internal layer pad
Region can fall within the scope of corresponding internal layer pad, and the internal layer cover film not opened a window then is fitted in the flexible board substrate table
Flexible circuit board is made in face；
S2, outer layer fine copper layers of foil is attached on hardboard base material and hardboard base material BASE is pressed together on to the hardboard of flexible circuit board
Rigid Flex is made in area, to Rigid Flex copper coin drilling, copper facing, forms outer-layer circuit in hardboard substrate etch, simultaneously
Outer layer fine copper layers of foil on flexible board area is etched away together, exposes the flexible circuit board of flexible board area, it is then pure in outer layer
Copper foil layer coating solder mask forms solder mask；
S3, CO is used2Laser needs windowed regions to carry out windowing calcination to internal layer cover film, and windowed regions break-through is simultaneously exposed
The Rigid Flex to open a window after internal layer pad is made in the internal layer pad of flexible circuit board.
Preferably, in S1, internal layer pad edge than corresponding windowed regions edge at grade normal direction to extending out
Open up at least 0.075mm.
Preferably, the internal layer pad is solid layers of copper.
Preferably, in S1, perforate, copper facing are carried out after soft board base sawing sheet.
The present invention also provides the Rigid Flex to open a window after a kind of internal layer pad, including flexible circuit board and arranged on flexible wires
The hardboard base material in road plate hardboard area, outer layer fine copper layers of foil is pasted on the hardboard base material, and outer layer fine copper layers of foil is equipped with anti-welding
Layer, the flexible circuit board, which includes surface, to be had the flexible board substrate of soft board layers of copper, etches the internal layer circuit formed by soft board layers of copper
With internal layer pad and the whole internal layer cover film for being fitted in flexible board substrate surface, it is characterised in that：The internal layer cover film tool
There are windowed regions corresponding with internal layer pad, the internal layer pad falls than corresponding windowed regions area bigger, windowed regions
Within the scope of corresponding internal layer pad.
Preferably, than corresponding windowed regions edge, normal direction propagates outward into the internal layer pad edge at grade
Few 0.075mm.
Preferably, the internal layer pad is solid layers of copper.
Rigid Flex to open a window after internal layer pad of the present invention and preparation method thereof has the following advantages that：
1st, it is more efficient.Compared with method of uncapping behind flexible board area of the prior art, internal layer cover film is opened without opening a window in advance
Internal layer cover film whole plate is fitted in soft board layers of copper and internal layer pad after material, and the windowed regions of internal layer cover film are in the anti-of hardboard area
Layer just passes through CO after being formed2Laser is burnt, and saves two drilling, the windowing technique streams of cover film when making flexible circuit board
Journey；Additional Protection program need not be made to corrode the flexible circuit board in windowed regions when preventing etching outer-layer circuit simultaneously.
2nd, yield higher.Compared with opening a window facture in advance with flexible board area of the prior art, the present invention is suitable for containing golden hand
Refer to or the flexible circuit board of wiring board, internal layer bonding pad area are more than the area of corresponding windowed regions, CO2When laser burns cover film
Soft board layers of copper will not be burnt, can effectively protect the flexible board substrate and circuit of flexible circuit board；Further, since internal layer cover film is opened
The burn-through in window region can avoid damaging the circuit in windowed regions during etching outer-layer circuit after outer-layer circuit is etched, from
And effectively improve yield.
Description of the drawings
With reference to the accompanying drawings and detailed description, the present invention is described in further detail：
Fig. 1 is the front view of Rigid Flex of the present invention.
Fig. 2 is the sectional view of flexible circuit board.
Fig. 3 is the partial enlarged view in A portions in Fig. 2.
Fig. 4 is fitted in the sectional view after flexible circuit board for hardboard area.
Fig. 5 is the partial enlarged view in B portions in Fig. 4.
Fig. 6 is the sectional view of the Rigid Flex after the etching of outer layer fine copper layers of foil.
Fig. 7 is the partial enlarged view in C portions in Fig. 6.
Fig. 8 is the sectional view of the Rigid Flex after windowed regions break-through.
Fig. 9 is the partial enlarged view in D portions in Fig. 8.
Specific embodiment
The present invention provides the Rigid Flex production methods to open a window after a kind of internal layer pad, comprise the following steps：
S1,101 sawing sheet of flexible board substrate, drilling, copper facing, according to circuit design requirement to the soft board layers of copper of flexible board substrate 101
102 etchings form internal layer circuit, while according to windowing etching are required to be formed and 104 corresponding internal layer pad 103 of windowed regions, erosion
It should ensure that windowed regions 104 can fall within the scope of corresponding internal layer pad 103 when forming internal layer pad 103 quarter, will not open a window
Internal layer cover film 105 be fitted in 101 surface of flexible board substrate.The windowed regions 104 of internal layer cover film 105 are temporary in this step
Not break-through and pass through CO in step below2Laser is burnt, to avoid CO2Laser burns flexible board substrate 101, and internal layer pad 103 is excellent
Elect solid layers of copper as, and the area of internal layer pad 103 is more bigger than the area of corresponding windowed regions 104, windowed regions 104 fall
Within the scope of corresponding internal layer pad 103, it is preferable that 103 edge of internal layer pad is than corresponding 104 edge of windowed regions same
Normal direction propagates outward into few 0.075mm (i.e. between the edge of internal layer pad 103 and corresponding 104 edge of windowed regions in plane
Distance be at least 0.075mm), so as to be made needed for flexible circuit board 100, referring to Fig. 2 and Fig. 3.Flexible circuitry in this step
The etching of the internal layer circuit, internal layer pad 103 of plate 100 and the attachment of internal layer cover film 105 use existing way.
S2, outer layer fine copper layers of foil 202 is attached on hardboard base material 201 and hardboard base material 201BASE is pressed together on flexible wires
Rigid Flex (referring to Fig. 4 and Fig. 5) is made in the hardboard area 200 of road plate 100, drills to the Rigid Flex copper coin, copper facing,
Outer-layer circuit is formed in the etching of hardboard base material 201, while by flexible board area (i.e. middle part of the flexible circuit board 100 in addition to hardboard area 200
Region) on outer layer fine copper layers of foil 202 etch away together, expose the flexible circuit board 100 of flexible board area, then in outer layer
Fine copper layers of foil 202 applies solder mask and forms solder mask 203 (referring to Fig. 6 and Fig. 7)；
S3, CO is used2Laser carries out windowing calcination to the windowed regions 104 of internal layer cover film 105, and windowed regions 104 are worn
Lead to and expose the internal layer pad 103 of flexible circuit board 100, the Rigid Flex to open a window after internal layer pad 103 is made (referring to Fig. 8
And Fig. 9).Internal layer pad 103 is solid layers of copper and the area of internal layer pad 103 during due to preparing flexible circuit board 100 in S1
Area than corresponding windowed regions 104 is bigger, therefore CO2Laser can effectively avoid CO when burning windowed regions 1042Laser is burnt
Flexible board substrate 101.CO2For laser there are many advantages of uniqueness, its transfer efficiency is higher than other lasers, can be many non-
Metal material (such as organic glass, plastics, timber, multilayer composite board, quartz glass etc.) absorbs.What is more important, two
Carbon oxide laser device can carry out high-power output compared with other lasers, realize high-speed perforating；CO2Laser, which is only burnt up, to be had
The nonmetallic materials such as machine object will not injure copper face or even wash the copper face oxide brushing on surface under normal circumstances, can be straight
It connects and is surface-treated (chemical nickel and gold, electronickelling gold, OSP etc.) or fitting screened film etc..
The Rigid Flex to open a window after the internal layer pad finally obtained is referring to Fig. 1, Fig. 8 and Fig. 9, including flexible circuit board
100 and the hardboard base material 201 arranged on flexible circuit board hardboard area 200, outer layer fine copper layers of foil is pasted on the hardboard base material 201
202, outer layer fine copper layers of foil 202 is equipped with soldermask layer 203, and the flexible circuit board 100, which includes surface, has soft board layers of copper 102
Flexible board substrate 101 is etched the internal layer circuit formed and internal layer pad 103 by soft board layers of copper 102 and is integrally fitted in soft board base
The internal layer cover film 105 on 101 surface of material, the internal layer cover film 105 have with 103 corresponding windowed regions 104 of internal layer pad,
The internal layer pad 103 falls than corresponding 104 area bigger of windowed regions, i.e. windowed regions 104 in corresponding internal layer pad 103
Within the scope of, 103 edge of internal layer pad than corresponding 104 edge of windowed regions at grade normal direction propagate outward into it is few
0.075mm。
The flexible circuit board 100 of the present embodiment is doubling plate, and other kinds of flexible circuit board also can be in the manner described above
Production.
Claims (5)
1. the Rigid Flex production method to open a window after a kind of internal layer pad, it is characterised in that comprise the following steps：
S1, flexible board substrate sawing sheet etch to form internal layer circuit, simultaneously according to circuit design requirement to the soft board layers of copper of flexible board substrate
According to windowing etching is required to form internal layer pad corresponding with windowed regions, etching should ensure that windowed regions when forming internal layer pad
It can fall within the scope of corresponding internal layer pad, the internal layer cover film not opened a window is then fitted in the flexible board substrate surface,
Flexible circuit board is made；
S2, outer layer fine copper layers of foil is attached on hardboard base material and hardboard base material BASE is pressed together on to the hardboard area of flexible circuit board,
Rigid Flex is made, to Rigid Flex copper coin drilling, copper facing, outer-layer circuit is formed in hardboard substrate etch, simultaneously will
Outer layer fine copper layers of foil on flexible board area etches away together, exposes the flexible circuit board of flexible board area, then in outer layer fine copper
Layers of foil coating solder mask forms solder mask；
S3, CO is used2Laser needs windowed regions to carry out windowing calcination to internal layer cover film, and windowed regions break-through simultaneously exposes flexibility
The Rigid Flex to open a window after internal layer pad is made in the internal layer pad of wiring board；
The internal layer pad is solid layers of copper.
2. the Rigid Flex production method to open a window after a kind of internal layer pad according to claim 1, it is characterised in that：
In S1, than corresponding windowed regions edge, normal direction propagates outward into few 0.075mm to internal layer pad edge at grade.
3. the Rigid Flex production method to open a window after a kind of internal layer pad according to claim 1, it is characterised in that：
In S1, perforate, copper facing are carried out after soft board base sawing sheet.
4. a kind of Rigid Flex to open a window after internal layer pad, including flexible circuit board and arranged on the hard of flexible circuit board hardboard area
Plate base material, outer layer fine copper layers of foil is pasted on the hardboard base material, and outer layer fine copper layers of foil is equipped with soldermask layer, the flexible circuitry
Plate, which includes surface, has the flexible board substrate of soft board layers of copper, etches by soft board layers of copper the internal layer circuit formed and internal layer pad and whole
Body is fitted in the internal layer cover film on flexible board substrate surface, it is characterised in that：The internal layer cover film has corresponding with internal layer pad
Windowed regions, for the internal layer pad than corresponding windowed regions area bigger, windowed regions fall the model in corresponding internal layer pad
Within enclosing；The internal layer pad is solid layers of copper.
5. the Rigid Flex to open a window after a kind of internal layer pad according to claim 4, it is characterised in that：The internal layer weldering
Than corresponding windowed regions edge, normal direction propagates outward into few 0.075mm to plate edge at grade.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510571689.8A CN105142337B (en) | 2015-09-10 | 2015-09-10 | A kind of Rigid Flex to open a window after internal layer pad and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510571689.8A CN105142337B (en) | 2015-09-10 | 2015-09-10 | A kind of Rigid Flex to open a window after internal layer pad and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105142337A CN105142337A (en) | 2015-12-09 |
| CN105142337B true CN105142337B (en) | 2018-05-22 |
Family
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510571689.8A Active CN105142337B (en) | 2015-09-10 | 2015-09-10 | A kind of Rigid Flex to open a window after internal layer pad and preparation method thereof |
Country Status (1)
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| EP0928025A2 (en) * | 1997-12-27 | 1999-07-07 | TDK Corporation | Wiring board and process for the production thereof |
| CN1347276A (en) * | 2000-10-09 | 2002-05-01 | 耀华电子股份有限公司 | Method for making multi-layer PCB composed of flexible and rigid layers |
| CN202262057U (en) * | 2011-07-18 | 2012-05-30 | 惠州Tcl移动通信有限公司 | Breaking-resisting structure of flexible printed circuit (FPC) pad |
| CN104507258A (en) * | 2014-12-15 | 2015-04-08 | 台山市精诚达电路有限公司 | Soft and rigid combination board and cover film windowing and grounding method thereof |
| CN204948510U (en) * | 2015-09-10 | 2016-01-06 | 深圳华麟电路技术有限公司 | The Rigid Flex of windowing after a kind of internal layer pad |
-
2015
- 2015-09-10 CN CN201510571689.8A patent/CN105142337B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0928025A2 (en) * | 1997-12-27 | 1999-07-07 | TDK Corporation | Wiring board and process for the production thereof |
| CN1347276A (en) * | 2000-10-09 | 2002-05-01 | 耀华电子股份有限公司 | Method for making multi-layer PCB composed of flexible and rigid layers |
| CN202262057U (en) * | 2011-07-18 | 2012-05-30 | 惠州Tcl移动通信有限公司 | Breaking-resisting structure of flexible printed circuit (FPC) pad |
| CN104507258A (en) * | 2014-12-15 | 2015-04-08 | 台山市精诚达电路有限公司 | Soft and rigid combination board and cover film windowing and grounding method thereof |
| CN204948510U (en) * | 2015-09-10 | 2016-01-06 | 深圳华麟电路技术有限公司 | The Rigid Flex of windowing after a kind of internal layer pad |
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| CN105142337A (en) | 2015-12-09 |
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