CN112846486B - Processing method and system of FPC (Flexible printed Circuit) - Google Patents
Processing method and system of FPC (Flexible printed Circuit) Download PDFInfo
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- CN112846486B CN112846486B CN202011626232.XA CN202011626232A CN112846486B CN 112846486 B CN112846486 B CN 112846486B CN 202011626232 A CN202011626232 A CN 202011626232A CN 112846486 B CN112846486 B CN 112846486B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
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Abstract
The invention relates to the technical field of flexible circuit board processing, and provides a processing method of an FPC (flexible printed circuit) flexible circuit board, which comprises the following steps: s1, adhering the PI covering film without windows on the circuit layer; and S2, windowing the PI cover film at the position needing windowing in a laser ablation mode, and continuously ablating until the copper foil in the circuit layer is exposed to obtain the windowed FPC flexible circuit board. The processing system of the FPC flexible circuit board is provided, and the FPC flexible circuit board is processed by adopting the processing method of the FPC flexible circuit board. According to the invention, the PI cover film which is not windowed is firstly covered, and then the windowing procedure is carried out, so that the hole aligning process is omitted, the FPC product manufacturing process is simplified, the reject ratio of the product is reduced, the efficiency and the precision are improved, and the reliability of the product is improved; the optical system of the flat-top round light spot is adopted to obtain the flat-top round light spot with uniform energy distribution, and the negative problems of ablation of a copper foil layer and the like caused by overhigh central energy and insufficient edge energy of the Gaussian beam at present are effectively solved.
Description
Technical Field
The invention relates to the technical field of flexible circuit board processing, in particular to a processing method and a system of an FPC (flexible printed circuit) flexible circuit board.
Background
Flexible circuit boards (FPC for short) are widely used in electronic products due to their light weight, high wiring density, thin thickness, and the like. The surface of the FPC is usually provided with a resin film which plays roles of circuit protection, solder resistance and the like and is an important component of an FPC product (PI covering film for short). FPCs are generally classified into single-layer boards, double-layer boards, and multilayer boards according to structure; the adhesive can be classified into a rubber plate and a non-rubber plate according to the presence or absence of the adhesive.
When traditional FPC preparation, PI covers the membrane and needs before laminating with FPC circuit layer, cuts the window of different shapes at corresponding position according to circuit design requirement, then laminates with the circuit layer again. There is a risk of an excessively high fraction defective due to non-correspondence of hole sites.
When the existing FPC is manufactured, manual feeding is mostly adopted, or centralized feeding with small quantity is adopted, and the efficiency is not high.
In addition, when the existing FPC is manufactured, the FPC is directly sent to a processing area to be processed after being taken, preliminary positioning is not carried out, and the problem of low processing precision is easily caused.
In addition, during current FPC preparation, can meet the condition that the size of FPC flexible circuit board differs often, the material subassembly is expected to inhaling of corresponding model to the many meeting of existing equipment, changes when needs, but this kind of mode can waste time undoubtedly, reduces work efficiency.
Disclosure of Invention
The invention aims to provide a processing method and a system of an FPC flexible circuit board, which can at least solve part of defects in the prior art.
In order to achieve the above purpose, the embodiments of the present invention provide the following technical solutions: a processing method of an FPC flexible circuit board comprises the following steps:
s1, adhering the PI covering film without windows on the circuit layer;
and S2, windowing the PI cover film at the position needing windowing in a laser ablation mode, and continuously ablating until the copper foil in the circuit layer is exposed to obtain the windowed FPC flexible circuit board.
Further, when the processed FPC flexible circuit board is a single-layer adhesive board with an adhesive, the circuit layer is provided with a copper foil and the adhesive, the PI cover film is subjected to ablation windowing by laser, and then the adhesive is ablated until the copper foil is exposed.
Further, the laser ablation specifically comprises:
s20, adopting laser with Gaussian energy distribution, and modulating the laser beam into a flat-top circular light spot with uniform energy distribution;
and S21, focusing the laser beam on the position of the PI cover film needing to be windowed, and quickly ablating the PI cover film until the copper foil in the circuit layer is exposed.
Further, in S20, the modulation method specifically includes:
s200, blocking high-order components in an original beam by adopting an adjustable beam expander set with a light blocking diaphragm;
s201, modulating the light beam with Gaussian energy distribution into a light beam with uniform energy by using a reflective flat-top beam shaping mirror.
Further, after the laser beam is modulated, the beam is guided to the PI cover film through a collimating lens, a vibrating lens and a focusing lens which are sequentially arranged along the direction of the light path.
Further, the adjustable beam expander set adjusts the diameter of the emergent light beam to be determined D0F, small angle is incident to the reflecting flat-top beam shaping mirror and is in the reflecting emergent directionwPosition forming a diameter D1Flat top round spot, in the direction of reflected emergence fw+fzAt a position of a focal distance fzThe collimating lens is confocal with the reflective flat-top beam shaping lens, the beam enters the vibrating lens after passing through the collimating lens, and the focal length f is arranged along the emergent directioncI.e. the diameter D can be obtained on the PI cover film2＝D1×fc÷fzFlat-topped light spots.
Further, a plane mirror is placed in the optical path.
Further, the surface type of the reflective flat-top beam shaping mirror satisfies the following relationship:
wherein r is0Is the beam waist radius of an incident Gaussian beam; r is the radial coordinate of the incident beam; r is the radial coordinate of the emergent beam of the beam shaping mirror; f. ofwThe focal length of the reflecting flat-top beam shaping mirror; σ is the target amplitude of the output beam; and x is the surface type parameter of the reflecting flat-top beam shaping mirror at the radial coordinate r.
Further, in the step S21, an adjustable focusing mirror group is used to adjust the degree of focusing so as to change the size of the flat-top circular spot.
The embodiment of the invention provides another technical scheme: a processing system of an FPC flexible circuit board is used for processing the FPC flexible circuit board by adopting the processing method of the FPC flexible circuit board.
Compared with the prior art, the invention has the beneficial effects that:
1. the PI cover film which is not windowed is covered firstly, and then the windowing procedure is carried out, so that the hole aligning process is omitted, the FPC product manufacturing process is simplified, the reject ratio of products is reduced, the efficiency and the precision are improved, and the reliability of the products is improved.
2. The optical system of the flat-top round light spot is adopted to obtain the flat-top round light spot with uniform energy distribution, so that the negative problems of ablation of a copper foil layer and the like caused by overhigh central energy and insufficient edge energy of a Gaussian beam at present are effectively solved, and the size of the light spot is adjustable, the using method is flexible, and the energy utilization rate is high.
3. The FPC flexible circuit board to be processed is stored through the storage mechanism, and the processing efficiency can be improved.
4. And a double-channel processing form is adopted, so that two working positions can be used for processing simultaneously, and the processing efficiency is improved.
5. By adopting the feeding device, primary positioning can be carried out after material is taken, and a better processing position is ensured after the material is sent to a processing area.
6. Establish a plurality of installation positions on inhaling the flitch, the sucking disc is the form that can dismantle the connection with inhaling between each installation position of flitch, when needs adsorb the FPC flexible circuit board that the size differs, only need adjust the position of sucking disc, install on the installation position of suitable position can, simple structure and convenience can improve work efficiency and reduce cost.
Drawings
Fig. 1 is a schematic diagram of a processing system for an FPC flexible circuit board according to a first embodiment of the present invention;
fig. 2 is a diagram illustrating energy density distribution before and after beam modulation in a method for processing an FPC flexible circuit board according to an embodiment of the present invention;
fig. 3 is a schematic diagram illustrating that a flat-top circular light spot laser ablation is used to remove a PI cover film and an adhesive in the method for processing an FPC flexible circuit board according to an embodiment of the present invention;
fig. 4 is a schematic design diagram of a reflective flat-top beam shaping mirror of a method for processing an FPC flexible circuit board according to an embodiment of the present invention;
fig. 5 is a schematic diagram of a processing system for a single-channel FPC flexible circuit board according to a second embodiment of the present invention;
fig. 6 is a schematic diagram of a processing system for a dual-channel FPC flexible circuit board according to a third embodiment of the present invention;
fig. 7 is a partially enlarged schematic view of a processing system of a dual-channel FPC flexible circuit board according to a third embodiment of the present invention;
fig. 8 is a schematic view of a material storage assembly of a two-channel FPC flexible circuit board processing system according to a fourth embodiment of the present invention;
fig. 9 is a schematic view of a feeding mechanism of a two-channel FPC flexible circuit board processing system according to a fifth embodiment of the present invention;
fig. 10 is a schematic view of a feeding mechanism of a two-channel FPC flexible circuit board processing system according to a fifth embodiment of the present invention with a flat plate removed;
fig. 11 is a schematic view of a material taking device of a two-channel FPC flexible circuit board processing system according to a sixth embodiment of the present invention.
Detailed description of the preferred embodiments
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The first embodiment is as follows:
referring to fig. 1 to 4, an embodiment of the invention provides a method for processing an FPC flexible circuit board, including the following steps: s1, adhering the PI cover film a without the window on the circuit layer; and S2, windowing the PI cover film a at the position where windowing is needed by adopting a laser ablation mode, and continuously ablating until the copper foil in the circuit layer is exposed to obtain the windowed FPC flexible circuit board. In the prior art, the PI cover film a needs to be cut into windows of different shapes at corresponding positions according to circuit design requirements before being attached to the FPC circuit layer, and then is attached to the circuit layer. There is a risk of an excessively high fraction defective due to non-correspondence of hole sites. Therefore, in order to solve the defect, the invention develops a new method, firstly the PI cover film a without the window is pasted on the circuit layer, then the window is directly opened on the PI cover film a according to the position needing to be opened, and the window is continuously opened to the copper foil, thereby omitting the process of aligning the hole, simplifying the manufacturing process of the FPC product, reducing the reject ratio of the product, improving the efficiency and the precision, and improving the reliability of the product. Wherein, the circuit layer and the PI cover film a can form the FPC flexible circuit board before windowing, the FPC flexible circuit board can be divided into a single-layer board, a double-layer board and a multilayer board, and can also be divided into a rubber plate and a non-rubber plate according to the existence of an adhesive, however, no matter what type, the PI cover film a and the circuit layer are not opened, and referring to fig. 3, for example, when the FPC flexible circuit board is a single-layer and has a glue board with an adhesive, two adhesive layers b are arranged, the circuit layer comprises the adhesive layer b, a copper foil layer c and a base layer d which are sequentially arranged, a PI covering film a covers the adhesive layer b, a complete flexible printed circuit board can be formed, and for other types of FPC flexible circuit boards, the difference is only that the composition of the circuit layer has some changes, but at least comprises copper foil which is necessary for conducting subsequent circuits, so that the method can cover the opening processing of all types of FPC flexible circuit boards. When ablated, only the PI cover film a and the adhesive between the PI cover film a and the copper foil are ablated, and the copper foil and the substrate further below, as well as other types of boards where there is also adhesive or other structure between the copper foil and the substrate, are not ablated. Continuing with the above example, when the FPC flexible circuit board is a single-layer adhesive board with an adhesive, the circuit layer has a copper foil and an adhesive, the PI cover film a is first cut by laser ablation, and then the adhesive is subsequently cut by laser ablation until the copper foil is exposed.
As an optimization scheme of the embodiment of the present invention, please refer to fig. 1 to 4, the laser ablation method specifically includes: s20, adopting laser with Gaussian energy distribution, and modulating the laser beam into a flat-top circular light spot with uniform energy distribution; and S21, focusing the laser beam on the position of the PI cover film a where the window needs to be opened, and quickly ablating the PI cover film a until the copper foil in the circuit layer is exposed. Preferably, the modulation method specifically comprises: s200, blocking high-order components in an original beam by using an adjustable beam expander set 101 with a light blocking diaphragm; s201, then modulating the light beam with Gaussian energy distribution into a light beam with uniform energy by using the reflective flat-top beam shaping mirror 102. In this embodiment, the laser with gaussian distribution of energy needs to be modulated into a flat-top circular spot with uniform energy distribution before ablation, as shown in fig. 2, for the situation before beam modulation and the situation after beam modulation, it is obvious that the energy density is high, the radius is large, the flat-top circular spot is irregularly distributed, and the beam energy is not uniform before beam modulation, and after beam modulation, the energy density and the radius are regular, the beam energy is uniform, and the flat-top circular spot can be obtained. The light beam is controllable, so that the ablation quality is improved, the ablation precision is improved, and the product quality is improved. Preferably, a light blocking diaphragm is disposed on a back focal plane of the first lens of the adjustable beam expander set 101, so as to block high-order components in the original light beam and improve the quality of the light beam.
Further optimizing the above scheme, referring to fig. 1 to 4, after the laser beam is modulated, the beam is guided to the PI cover film a by the collimating lens 103, the vibrating lens 105 and the focusing lens 106 which are sequentially arranged along the direction of the optical path. In this embodimentThe modulated laser beam can be guided to the PI cover film a for action through the cooperation of the optical device. Specifically, the adjustable beam expander set 101 adjusts the diameter of the outgoing beam to a determined D0The small angle is incident to the reflective flat-top beam shaping mirror 102, and f is in the reflection emergent directionwPosition forming a diameter D1Flat top round spot, in the direction of reflected emergence fw+fzAt a position of a focal distance fzThe collimating mirror 103 is arranged to make the reflective flat-top beam shaping mirror 102 and the collimating mirror 103 confocal, after passing through the collimating mirror 103, the beam enters the vibrating mirror 105 through the reflecting mirror group 104, and then the focal length f is arranged along the emergent directioncI.e. the diameter D can be obtained on the PI cover film a2＝D1×fc÷fzFlat-topped light spots. In this embodiment, the collimator lens 103 is disposed in the light beam emitting direction of the reflective flat-top beam shaping mirror 102, so that the reflective flat-top beam shaping mirror 102 and the collimator lens 103 can have a common focus. After passing through the collimating mirror 103, the light beam is incident to the vibrating mirror 105 through the plane mirror group, and finally incident to the adjustable focusing mirror group to focus the light beam on the surface of the PI cover film a to be windowed. In addition, the planar mirror, i.e. the above-mentioned mirror group 104, is placed in the light path, so that the installation and debugging are convenient.
Referring to fig. 4 as an optimized solution of the embodiment of the present invention, the surface shape of the reflective flat-top beam shaping mirror 102 satisfies the following relationship:
wherein r is0Is the beam waist radius of an incident Gaussian beam; r is the radial coordinate of the incident beam; r is the radial coordinate of the emergent beam of the beam shaping mirror; f. ofwIs the focal length of the reflective flat-top beam-shaping mirror 102; σ is output lightA target amplitude of the beam; x is the profile parameter of the reflective flat-top beam shaper mirror 102 at radial coordinate r. In the present embodiment, r0And sigma are known values, so that the radial coordinate R of the emergent beam of the beam shaping mirror is known to change along with the change of the radial coordinate R of the incident beam in the first formula, and after the radial coordinate R of the emergent beam of the beam shaping mirror is obtained, the relationship satisfied by the surface type of the reflective flat-top beam shaping mirror 102 can be obtained through the second formula.
As an optimization solution of the embodiment of the present invention, in the step S21, the focusing mirror 106 is adopted to adjust the degree of focusing so as to change the size of the flat-top circular spot. In this embodiment, the focal length of the focusing mirror 106 set can be adjusted as required by using the focusing mirror 106 set, so as to change the size of the flat top circular light spot, increase the processing efficiency, and adjust the energy and action time of the light beam, thereby preventing the copper foil layer c from being ablated.
Referring to fig. 1 to 4, the processing method of the FPC flexible circuit board is adopted to process the FPC flexible circuit board. In the embodiment, the method is adopted to process the FPC flexible circuit board, the hole aligning process is omitted, the FPC product manufacturing process is simplified, the reject ratio of products is reduced, the efficiency and the precision are improved, and the reliability of the products is improved.
As shown in fig. 1, the system generally includes a laser 100, a beam expander, a reflective flat-top beam shaper 102, a collimator 103, a mirror, a galvanometer 105, and a focusing mirror 106, which are arranged in sequence along the direction of the optical path. The beam expanding lens and the focusing lens 106 can be set to be adjustable and used for adjusting the shape according to actual conditions, the reflecting mirror can be a plane reflecting mirror group, the direction of a light path is changed through a plurality of reflecting mirrors, and the layout, installation and debugging are facilitated. For the layout and functions of the mirrors, please refer to the above embodiments, which are not described herein. Preferably, the laser 100 may employ an ultraviolet picosecond laser.
Example two:
the above system can be subdivided into two types, one is a single channel system, that is, a system having only one processing station, and the other is a multi-channel system, that is, a system having a plurality of processing stations.
Referring to fig. 5, an embodiment of the present invention provides a processing system for a single-channel FPC flexible circuit board, including an optical platform 203, a laser 204 disposed on the optical platform 203, a placing platform for placing an FPC flexible circuit board to be processed, and an optical assembly for guiding light emitted by the laser 204 to the FPC flexible circuit board on the placing platform for processing, where the optical assembly includes a beam expander group 206 for removing high-order components in an original light beam and a reflective flat-top beam shaping mirror 207 for modulating the light beam into a light beam with uniform energy, and the beam expander group 206 and the reflective flat-top beam shaping mirror 207 are sequentially disposed along a light path. In this embodiment, as shown in fig. 2, the original laser emitted from the laser 204 has a higher energy density, a large radius, and an irregular distribution, and the beam energy is not uniform, and is not easy to control in ablation and the ablation quality is not good, so in this embodiment, the beam expander set 206 is used to remove high-order components in the beam, and the reflective flat-top beam shaper 207 is used to modulate the energy, and the energy density and the radius of the modulated beam are regular, and the beam energy is uniform, so that a flat-top round spot can be obtained, thereby effectively solving the negative problems of the ablation of the copper foil layer caused by the overhigh central energy and insufficient edge energy of the gaussian beam, and improving the beam quality. The light beam is controllable, so that the ablation quality is improved, the ablation precision is improved, and the product quality is improved. Therefore, the system can meet the processing mode that firstly the PI cover film which is not windowed is pasted and then the unified windowing is carried out. Preferably, the laser 204 may be an ultraviolet picosecond laser.
As an optimization scheme of the embodiment of the present invention, referring to fig. 1 and fig. 5, the beam expander set 206 is an adjustable beam expander, and is composed of a plurality of beam expander sets 206, which are adjusted by adjusting the distance between the beam expanders, and a light blocking diaphragm is disposed on the back focal plane of the first lens, so that the high-order components in the original light beam can be blocked, and the light beam quality can be improved. Specifically, if there are two lenses, the light blocking diaphragm is provided between the two lenses.
As an optimized solution of the embodiment of the present invention, referring to fig. 5, the optical assembly further includes a turning mirror assembly 205, and the turning mirror assembly 205 has a first turning mirror for turning the laser beam of the laser 204 into the beam expander set 206 and a second turning mirror for turning the beam processed by the beam expander set 206 into the reflective flat-top beam shaping mirror 207. In this embodiment, in order to optimize the layout of the whole device, the reflective flat-top beam shaping mirror 207 may be disposed on the other side of the optical platform 203, and at this time, the turning mirror may be used to assist the transmission of the light beam, so as to solve the spatial obstacle. Reference herein to first and second is merely for convenience of description and distinction and is not intended to be otherwise limiting.
As an optimized scheme of the embodiment of the present invention, please refer to fig. 5, the optical assembly further includes a collimating mirror 208, a vibrating mirror 209 and a focusing mirror 210 sequentially arranged along the optical path direction, and the light beam reflected by the reflective flat-top beam shaping mirror 207 sequentially passes through the collimating mirror 208 and the vibrating mirror 209, and is converged and emitted from the focusing mirror 210 onto the FPC flexible circuit board to be processed. The laser emitter and the collimator 208 are both disposed on the optical platform 203. When the last layer is removed, the collimating lens group and the focusing lens 210 move upwards to obtain a large flat-top circular light spot, so that the processing depth is reduced, and the damage to the bottom layer is reduced.
Further optimizing the above scheme, the focusing lens 210 is an adjustable focusing lens, which can change the size of the flat-top light spot on the working surface. Specifically, it is composed of two lenses, and the spacing between the lenses is changed to perform adjustment. When the pad hole processing is started, a small flat-top round light spot is obtained, so that a high action effect is obtained.
As an optimized solution of the embodiment of the present invention, please refer to fig. 5, the system further includes a CCD vision mechanism 214 for observing the position of the FPC flexible circuit board. In this embodiment, the CCD vision mechanism 214 is a system commonly used in the art, and is a device for assisting laser operation, which can measure mark position information of the FPC flexible circuit board.
As an optimization scheme of the embodiment of the present invention, please refer to fig. 5, the system further includes an XYZ movement mechanism for moving with the resting platform to cooperate with the laser processing. The XYZ motion mechanism is a motion mechanism commonly used in the art, and may include an X-axis motion system 211, a Y-axis motion system 212, and a Z-axis motion system 213, wherein the X-axis motion system 211 and the Y-axis motion system 212 are vertically fixed on the working platform 201, and the working platform 201 is described in detail in the following embodiments, which will not be mentioned here for the moment. By adopting the X-axis motion system 211 and the Y-axis motion system 212, the motion of the FPC flexible circuit board in the X-axis and Y-axis directions can be adjusted, so that the printed mark on the FPC flexible circuit board to be processed is within the field range of the CCD vision mechanism 214. The CCD vision mechanism 214 is located at the side of the Z-axis motion system 213, and the Z-axis motion system 213 can move up and down with the above-mentioned resting platform to adjust the position in this direction.
As an optimized solution of the embodiment of the present invention, please refer to fig. 5, in which the placing platform is a vacuum absorbing platform 215. In this embodiment, a vacuum adsorption mode is adopted, so that the FPC flexible circuit board to be processed can be tightly adsorbed on the surface of the FPC flexible circuit board by vacuumizing, and the FPC flexible circuit board can be ensured not to be displaced during processing. The vacuum chuck table 215 is fixed to the Y-axis motion system 212 and moves therewith. Preferably, the adsorption fan during adsorption can be controlled by an electromagnetic valve.
As an optimized solution of the embodiment of the present invention, please refer to fig. 5, the system further includes a dust suction mechanism 216 disposed at the resting platform. In this embodiment, the dust suction mechanism 216 is a conventional device in the art, and can absorb and collect the smoke generated during processing, so as to prevent the smoke from escaping. The vacuum system is located above the vacuum suction platform 215 and below the CCD vision mechanism 214.
As an optimization scheme of the embodiment of the present invention, please refer to fig. 5, the system further includes a base 200, a working platform 201 disposed on the base 200, and a column 202 disposed on the working platform 201, wherein the optical platform 203 is erected on the column 202. In this embodiment, the working platform 201 is elastically connected to the base 200, the upright 202 is located on two sides of the working platform 201 and is fixedly connected to the working platform 201, the optical platform 203 is fixedly connected to the upright 202, the top surface of the optical platform 203 is parallel to the working platform 201, and the side surface of the optical platform 203 is perpendicular to the working platform 201. In addition, the system is also provided with an industrial personal computer 217 and a display 218, wherein the industrial personal computer 217 is used for controlling and coordinating the work among all the parts, and the display 218 can display the condition observed by the CCD vision mechanism 214.
The structure of the multi-channel system will be described in detail below.
Example three:
referring to fig. 6 to 7, an embodiment of the present invention provides a processing system for a multi-channel FPC flexible circuit board, including a plurality of lasers 300, a plurality of shelves for placing the FPC flexible circuit board to be processed, and a plurality of optical assemblies for guiding light emitted by the lasers 300 to the FPC flexible circuit board on the shelves for processing, wherein each of the lasers 300 is configured to correspond to each of the shelves one by one, and each of the shelves is configured to correspond to each of the optical assemblies one by one; each optical component comprises a beam expander group 307 for removing high-order components in the original light beam and a reflective flat-top light beam shaping mirror 308 for modulating the light beam into a light beam with uniform energy, and the beam expander group 307 and the reflective flat-top light beam shaping mirror 308 are sequentially arranged along the light path. In this embodiment, a plurality of lasers 300, a plurality of placing platforms, and a plurality of optical components are adopted and configured correspondingly, so that the system has the capability of processing a plurality of FPC flexible circuit boards simultaneously, and of course, the specific number of processing positions and whether to simultaneously or selectively work at which station can be selected according to the actual situation, which is not limited in this embodiment. The original laser light emitted from the laser 300, as shown in fig. 2, has a high energy density, a large radius, and an irregular distribution, the beam energy is not uniform, and the beam energy is not easy to control and the ablation quality is not good when directly used for ablation, so in this embodiment, the beam expander set 307 is used to remove the high-order components in the beam, meanwhile, the energy is modulated by a reflective flat-top beam shaping mirror 308 (in the housing in fig. 7, not shown, the reflective flat-top beam shaping mirror 308, the collimating mirror, the reflecting mirror group and the vibrating mirror are arranged in the housing in sequence), the energy density and the radius of the modulated beam are regulated, the light beam energy is uniform, flat-top round light spots can be obtained, the negative problems of ablation and the like of a copper foil layer caused by overhigh central energy and insufficient edge energy of Gaussian light beams at present are effectively solved, and the light beam quality is improved. The light beam is controllable, so that the ablation quality is improved, the ablation precision is improved, and the product quality is improved. Therefore, the system can meet the processing mode that firstly the PI cover film which is not windowed is pasted and then the unified windowing is carried out. Preferably, the laser 300 may employ an ultraviolet picosecond laser. Preferably, several mirrors 316 are used to flexibly turn the optical path, and the light beam from the galvanometer is emitted through the field lens 317.
Further optimizing the above scheme, please refer to fig. 6 and 7, the number of the lasers 300, the resting platform and the optical components is two, the two lasers 300 are stacked, and the light emitting directions of the two lasers 300 are opposite. In this embodiment, in order to make reasonable use of space, two lasers 300 are stacked in the height direction, and the light outlets of the two lasers 300 face different directions, so as to avoid interference between optical components associated with the lasers 300, and to have enough space for arrangement of the components in the optical components.
In order to further optimize the above solution, please refer to fig. 6 and fig. 7, the laser device further includes an optical platform 304 for placing each laser device 300, each resting platform, and each optical component, wherein the optical platform 304 is disposed on a working platform 302, and the working platform 302 is disposed on a base 301. In this embodiment, the base 301, the working platform 302 and the optical platform 304 are arranged to hold the above-mentioned devices, and the working platform 302 is arranged on the base 301 through the upright 303, so that the observation and operation of the worker are facilitated.
Further optimizing the above scheme, please refer to fig. 6 and 7, further comprising a CCD vision mechanism 305 for observing the position of the FPC flexible circuit board. In this embodiment, the CCD vision mechanism 305 is a system commonly used in the art, and is a device for assisting laser operation, which can measure mark position information of the FPC flexible circuit board. Preferably, there are two CCD vision mechanisms 305, and two CCD vision mechanisms 305 are configured to correspond to two resting platforms one to one.
Further optimizing the above solution, please refer to fig. 6 and 7, and further comprising a dust suction mechanism 306 disposed at the resting platform. In this embodiment, the dust suction mechanism 306 is a conventional device in the art, and can absorb and collect the smoke generated during processing, so as to prevent the smoke from escaping. The dust collection system is located above the vacuum suction platform and below the CCD vision mechanism 305. Preferably, there are two dust suction mechanisms 306, and the two dust suction mechanisms 306 are configured to correspond to the two resting platforms one by one.
Further optimizing the above scheme, please refer to fig. 6 and 7, which further includes a stocker assembly 309, a feeding device 310, a material taking device 311, an adsorption platform 312, an X-axis motion system 313, a Y-axis motion system 314, and a Z-axis motion system 315.
Example four:
referring to fig. 6 and 8, the system further includes a storage assembly for storing the FPC flexible circuit board. In this embodiment, this system can dispose the storage assembly for with the storage of FPC flexible circuit board, specifically, change the storage assembly and can hold several hundred FPC flexible circuit boards simultaneously, can save time when adding man-hour like this, raise the efficiency. Of course, the present magazine mechanism may also be used in the single pass system described above, and even in other processing systems than single pass and multiple pass, which has versatility.
In order to further optimize the above solution, please refer to fig. 8, the storage mechanism includes a storage frame 400 and support legs 401 supported below the storage frame 400, the storage frame 400 has a storage cavity 402 for stacking a plurality of FPC flexible circuit boards therein along the height direction thereof, and a discharge hole 403 for moving the FPC flexible circuit boards out of the storage cavity 402 is formed above the storage frame 400. In this embodiment, a storage frame 400 with a first height is adopted, the FPC flexible circuit boards are stacked and placed in the discharging frame, the whole FPC flexible circuit boards are placed on the path of the material taking mechanism, the material taking mechanism only needs to move back and forth on the path of the material taking mechanism to continuously take the materials, after the FPC flexible circuit boards in the storage cavity 402 are taken out, the FPC flexible circuit boards are placed into the storage cavity once, a plurality of FPC flexible circuit boards can be placed each time, and the working efficiency is improved.
As an optimized solution of the embodiment of the present invention, please refer to fig. 8, the material storage frame 400 includes a movable plate 404 for carrying the stacked FPC flexible circuit boards and a driving mechanism for jacking up the movable plate 404 to jack the uppermost FPC flexible circuit board to the material outlet 403, and the movable plate 404 is horizontally disposed in the material storage frame 400. In this embodiment, the FPC flexible circuit board may be jacked up to the discharge port 403 in cooperation with the material taking mechanism, so as to facilitate material taking of the material taking mechanism, and thus the material taking mechanism may omit the action of descending and taking the material after reaching the position right above the storage frame 400, because the thickness of the stacked FPC flexible circuit boards is gradually reduced along with the reduction of the stacked FPC flexible circuit boards, and the height of the FPC flexible circuit boards is reduced and the FPC flexible circuit boards are more and more deep into the storage frame 400, and if the material taking mechanism is not provided with a displacement action in the vertical direction, the material cannot be taken again, so that the movable plate 404 on which the FPC flexible circuit board is placed may be jacked up by the driving mechanism, and the material taking mechanism is directly convenient to take the material at the discharge port 403. Of course, as mentioned above, the material taking mode may be to extend into the material storage frame 400 to take the material, and the material taking mechanism may also have the lifting action, which is also an embodiment mode, and the embodiment does not limit the material taking mode. Preferably, the driving mechanism comprises a screw motor 405, and a driving end of the screw motor 405 is mounted on the movable plate 404.
To further optimize the above solution, referring to fig. 8, the storage frame 400 further has a guiding rod 406 for guiding. In this embodiment, the guide rod 406 is vertically disposed to ensure that the movable platform is always kept horizontal when the driving mechanism pushes the movable platform. The implementation manner is various, and the guide rod 406 may be a telescopic rod which is extended and contracted along with the ascending and descending of the movable platform. Preferably, the guide rods 406 may be provided in plural, and each guide rod 406 is disposed around the driving mechanism. Thus, a more stable guiding function can be achieved.
Referring to fig. 8, the system further includes an adjusting mechanism for adjusting the size of the material storage chamber 402 as an optimized solution of the embodiment of the present invention. In this embodiment, when the FPC flexible circuit board size of processing is not for a while, fixed size's storage cavity 402 will unable the satisfying requirement, consequently can adopt guiding mechanism to adjust the size of storage cavity 402, makes it to match the size of all kinds of FPC flexible circuit boards.
In order to further optimize the above solution, referring to fig. 8, the adjusting mechanism includes a plurality of limiting rods 407 disposed around the movable plate 404 and a driving member for driving the limiting rods 407 to move horizontally, each of the limiting rods 407 is disposed vertically, and each of the limiting rods 407 and the movable plate 404 enclose to form the material storage cavity 402. In the present embodiment, the plate 404 is moved by the stop lever 407 to construct the storage chamber 402, so that the size of the storage chamber 402 can be changed after the stop lever 407 moves. For example, four stop rods 407 are provided, and the four stop rods 407 enclose to form a square. Of course, there may be other numbers, as long as the shape of the FPC flexible circuit board is formed by enclosure, and the shape is usually square. Preferably, the limiting rod 407 can move horizontally on the movable plate 404, or an open slot extending toward the inside of the movable plate 404 along the plane direction thereof may be formed on the movable plate 404, and the limiting rod 407 moves in the open slot, so that interference can be avoided. Preferably, the driving member is a hand wheel, the movement of the stop lever 407 is driven by the rotation of the hand wheel, and a hand wheel may be arranged on the stop lever 407 on each side to adjust them simultaneously, for example, the long stop lever 407 or the wide stop lever 407 is rectangular, the adjustment mode is conventional screw transmission, and fine adjustment can be achieved by the form of a screw.
As an optimized solution of the embodiment of the present invention, please refer to fig. 8, the system further includes a limiting mechanism for controlling the driving mechanism to stop at the stop position. In this embodiment, when the distance that the driving mechanism lifts up is constantly changed after the stacked FPC flexible circuit boards are removed, it is a problem to stop when the FPC flexible circuit boards are lifted up to prevent the FPC flexible circuit boards from being lifted up too much. Therefore, in the embodiment, through the limiting mechanism, when the driving mechanism jacks to the stop position, the driving mechanism can be controlled to stop jacking continuously, so that the automatic work of the system is improved.
To further optimize the above solution, please refer to fig. 8, the limiting mechanism includes a detection optical fiber sensor 408, and the detection optical fiber sensor 408 is disposed at the discharge hole 403. In this embodiment, the detection optical fiber sensor 408 is used to realize control, and is disposed at the discharge hole 403, and when it touches the FPC flexible circuit board, it can send out a high-frequency signal, and at this time, the driving mechanism receives the signal and then immediately cuts off the power supply to stop the continuous jacking. Of course, many similar photoelectric sensing devices exist in the prior art, and all of them can be used in the present embodiment, and the present embodiment does not limit this.
Example five:
referring to fig. 6, 9 and 10, the system further includes a feeding device for transporting the FPC flexible circuit board. In this embodiment, after the flexible printed circuit board is taken out from the storage frame by the material taking mechanism, the flexible printed circuit board is placed on the feeding device, which is usually used in conjunction with the XYZ motion mechanism, and the feeding device feeds the flexible printed circuit board to a processing position. Of course, the feeding device can also be used in the single-channel system, and even in other processing systems than single-channel and multi-channel, and has universality.
In order to further optimize the above scheme, please refer to fig. 9 and 10, the feeding device includes a placing platform for placing the FPC flexible circuit board and a positioning mechanism 501 capable of shifting the FPC flexible circuit board to perform initial positioning, and the positioning mechanism 501 is disposed below the placing platform. In this embodiment, picking mechanism places FPC flexible circuit board on this material feeding unit after, may have the position not good, is not in the condition of assigned position promptly, can stir FPC flexible circuit board through positioning mechanism 501 to stir FPC flexible circuit board to the assigned position, this action is preliminary location. After the initial positioning, the CCD vision positioning system carries out accurate positioning through MARK points at two opposite angles of the FPC flexible circuit board at the processing position.
In order to further optimize the above solution, referring to fig. 9 and 10, the positioning mechanism 501 includes a poke rod 502 capable of moving towards a direction of an area where the FPC flexible circuit board is appointed to be placed, and a displacement component for driving the poke rod 502 to displace, wherein the area where the FPC flexible circuit board is appointed to be placed is on an upper surface of the resting platform, and the displacement component is arranged below the resting platform. In this embodiment, what the form of stirring adopted is that the poker rod 502, drives to move towards the regional direction of appointed arrangement of FPC flexible circuit board through the displacement assembly, can tentatively push away the not good FPC flexible circuit board in the region of appointed arrangement of position to realize preliminary location.
In order to further optimize the above solution, referring to fig. 9 and 10, the positioning mechanism 501 further includes a telescopic assembly for driving the poke rod 502 to extend and retract, and at least one side of the resting platform has a hole 503 for the poke rod 502 to extend out of the upper surface thereof. In this embodiment, in cooperation with the above-mentioned displacement motion, the motion of the poke rod 502 can have two steps, one step is to stretch out from the hole 503 below the placement platform, and the second step is to poke the FPC flexible circuit board by horizontal displacement, and the FPC flexible circuit board can be initially sent to a designated position by the poke motion, so as to realize initial positioning. The telescopic action is added, so that the poke rod 502 can be stored below the laying platform when the FPC flexible circuit board does not need to be poked (namely the PFC flexible circuit board is placed in an area specified to be placed). Preferably, the telescopic assembly used for the telescopic action can be a conventional telescopic mechanism, such as an air cylinder, or a hydraulic telescopic rod directly, and the displacement assembly can also be a conventional mechanism, such as a screw rod or an air cylinder drive, and the specific structure thereof will not be described in detail here. In addition, the upper end of the poke rod 502 can be made into a spherical shape or an inclined plane, if the upper end is the inclined plane, the inclined plane faces the direction of the designated placement area, and if the FPC flexible circuit board is just fallen above the poke rod 502 and the poke rod 502 is positioned at the edge of the FPC flexible circuit board, the FPC flexible circuit board can conveniently slide to the designated placement area during jacking.
In order to further optimize the above solution, please refer to fig. 9 and fig. 10, the poke rod 502 and the holes 503 are disposed in a plurality of and one-to-one correspondence, the holes 503 are disposed on a plurality of sides of the resting platform, and the designated placement area is located in an area surrounded by the holes 503.
As an optimized solution of the embodiment of the present invention, please refer to fig. 9 and fig. 10, the hole 503 is an elongated shape, and the elongated hole 503 extends toward the designated placement area. In this embodiment, the hole 503 is formed in an elongated shape to guide the poke rod 502, so as to ensure that the poke rod 502 moves along a specific direction and ensure a poking path.
As an optimization solution of the embodiment of the present invention, please refer to fig. 9 and 10, the resting platform includes a flat plate 504 for resting the FPC flexible circuit board and a bottom plate 505 located below the flat plate 504, a receiving cavity 506 for receiving the positioning mechanism 501 is provided between the flat plate 504 and the bottom plate 505, and the designated placement area is on the flat plate 504.
As an optimized solution of the embodiment of the present invention, please refer to fig. 9 and fig. 10, the apparatus further includes a Y-axis motion system 507 for driving the resting platform to move along the Y-axis direction. In this embodiment, the placing platform can be driven by the Y-axis motion system 507 to move along the Y-axis, and cooperate with the overall system operation. The Y-axis motion system 507, including the X-axis motion system, the Z-axis motion system, etc. of the above embodiments are all existing moving mechanisms, and their specific structural forms will not be described in detail here.
As an optimization scheme of the embodiment of the present invention, please refer to fig. 9 and fig. 10, the placing platform is a vacuum adsorption platform 500. In this embodiment, a vacuum adsorption mode is adopted, so that the FPC flexible circuit board to be processed can be tightly adsorbed on the surface of the FPC flexible circuit board by vacuumizing, and the FPC flexible circuit board can be ensured not to be displaced during processing. Preferably, the adsorption fan during adsorption can be controlled by an electromagnetic valve.
Example six:
referring to fig. 11, the system further includes a material extracting apparatus for extracting material. In this embodiment, the material taking device can take out the FPC flexible circuit board, and then place the FPC flexible circuit board on the above feeding device to send to the next process. Of course, the material taking device can also be used in a single-channel system, even in other processing systems besides single-channel and multi-channel systems, and has universality.
As an optimized scheme of the embodiment of the present invention, please refer to fig. 11, where the material taking device includes a material sucking assembly for sucking the FPC flexible circuit board, the material sucking assembly includes a material sucking plate 600 and a plurality of suckers 601, the material sucking plate 600 has a plurality of mounting positions 602 for the suckers 601 to mount, and the mounting positions 602 are uniformly distributed on the material sucking plate 600. At the in-process of work, can meet the condition that the size of FPC flexible circuit board differs often, the material subassembly is expected to inhaling of corresponding model to the many meeting preparation of existing equipment, changes when needing, but this kind of mode can waste time undoubtedly, reduces work efficiency. Therefore, in this embodiment, a plurality of mounting positions 602 are directly arranged on the suction plate 600, and the suction cup 601 and each mounting position 602 of the suction plate 600 are detachably connected, so that when an FPC flexible circuit board with different sizes needs to be sucked, only the position of the suction cup 601 needs to be adjusted and the FPC flexible circuit board needs to be mounted on the mounting position 602 in a proper position. Preferably, each of the mounting locations 602 is disposed around the suction plate, and the FPC flexible circuit board is mostly in a square block shape, and the surrounding shape can match the shape.
To further optimize the above solution, referring to fig. 11, each of the suckers 601 is a vacuum sucker. In this embodiment, the flexible printed circuit board is sucked in a vacuum suction manner, so that smooth sucking and putting down actions can be performed. Of course, in addition to the form of vacuum adsorption, a form of mechanical adsorption may be adopted, and the form is various, as long as the FPC flexible circuit board can be grasped, and this embodiment does not limit this.
Further optimizing the above scheme, please refer to fig. 11, further including an air path for communicating each suction cup 601, where at least a portion of the air path is disposed in the suction plate 600, and another end of the air path is connected to a vacuum generator. In this embodiment, the arrangement of vacuum adsorption gas circuit can be hidden, hide in the adsorption plate promptly, have the inner chamber in the adsorption plate, can arrange the form through the trachea, also can let the inner chamber in the adsorption plate whole as the gas circuit, vacuum generator has used in this inner chamber, the inner chamber reapplies in the vacuum chuck who communicates with it, nevertheless need in time the during operation installation position 602 that does not use of shutoff when adopting this kind of form, avoid gas leakage, here can adopt shutoff piece shutoff installation position 602.
As an optimized scheme of the embodiment of the present invention, please refer to fig. 11, the present invention further includes two support columns 603 that can be vertically arranged on a base of the system, a cross beam 604 is arranged between the two support columns 603, along a length direction of the cross beam 604, a first moving assembly is arranged on the cross beam 604, and the material suction assembly is arranged on the moving assembly. In this embodiment, a moving assembly is used to carry the suction assembly to the feeding device. Preferably, the first moving component may be a servo motor matching screw module 605.
In order to further optimize the above solution, please refer to fig. 11, the apparatus further includes a second moving assembly capable of moving the suction assembly along the height direction of the supporting column 603, and the second moving assembly is mounted on the first moving assembly. In this embodiment, the action form of moving up and down is added, so that the material suction assembly can descend to suck materials and then move away along with the first moving assembly after being lifted. Preferably, the second moving assembly may employ an up-down cylinder 606.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. A processing method of an FPC flexible circuit board is characterized by comprising the following steps:
s1, adhering the PI covering film without windows on the circuit layer;
s2, windowing is conducted on the PI cover film in a laser ablation mode at the position where windowing is needed, and ablation is continued until copper foil in the circuit layer is exposed, so that the windowed FPC flexible circuit board is obtained;
the laser ablation mode specifically comprises the following steps:
s20, adopting laser with Gaussian energy distribution, and modulating the laser beam into a flat-top circular light spot with uniform energy distribution;
s21, focusing the laser beam on the position of the PI cover film needing to be windowed, and quickly ablating the PI cover film until the copper foil in the circuit layer is exposed;
in S20, the modulation method specifically includes:
s200, blocking high-order components in an original beam by adopting an adjustable beam expander set with a light blocking diaphragm;
s201, modulating the light beam with Gaussian energy distribution into a light beam with uniform energy by using a reflective flat-top beam shaping mirror;
after the laser beam is modulated, the beam is guided to the PI cover film through a collimating lens, a vibrating lens and a focusing lens which are sequentially arranged along the direction of the light path, and the diameter of the emergent beam is adjusted to be determined by the adjustable beam expander group
At small angles to the reflecting flat-top beam-shaping mirror in the direction of the reflected exit
Position forming a diameter
The light spot is flat-topped and round,in the direction of reflected emission
At a position of a focal distance of
The collimating lens is confocal with the reflective flat-top beam shaping lens, the beam enters the vibrating lens after passing through the collimating lens, and the focal length is set along the emergent direction
I.e. a diameter of
Flat-top light spots;
the surface type of the reflecting flat-top beam shaping mirror satisfies the following relation:
wherein the content of the first and second substances,
is the beam waist radius of an incident Gaussian beam;
is the radial coordinate of the incident beam;
radial coordinates of the emergent light beam of the light beam shaping mirror;
the focal length of the reflecting flat-top beam shaping mirror;
is the target amplitude of the output beam;
as radial coordinates
And (3) surface type parameters of the reflective flat-top beam shaping mirror.
2. A method of processing an FPC flexible circuit board as claimed in claim 1, characterized in that: when the processed FPC flexible circuit board is a single-layer adhesive board with an adhesive, a copper foil and the adhesive are arranged in the circuit layer, the PI cover film is subjected to ablation windowing by laser, and then the adhesive is ablated until the copper foil is exposed.
3. A method of processing an FPC flexible circuit board as claimed in claim 1, characterized in that: a planar mirror is placed in the light path.
4. A method of processing an FPC flexible circuit board as claimed in claim 1, characterized in that: in step S21, the adjustable focusing mirror set is used to adjust the degree of focusing so as to change the size of the flat-top circular spot.
5. The utility model provides a system of processing of FPC flexible circuit board which characterized in that: the FPC flexible circuit board is processed by the FPC flexible circuit board processing method as claimed in any one of claims 1 to 4.
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| CN114071885B (en) * | 2021-12-02 | 2023-01-17 | 广州源康精密电子股份有限公司 | Processing method of flexible circuit board for new energy automobile battery |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201965316U (en) * | 2011-04-01 | 2011-09-07 | 北京工业大学 | Device for reshaping Gaussian beam into flat-top beam |
| CN105226204A (en) * | 2014-05-30 | 2016-01-06 | 上海微电子装备有限公司 | A kind of laser package equipment and method for packing |
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| CN104570363B (en) * | 2015-02-03 | 2018-06-01 | 大族激光科技产业集团股份有限公司 | A kind of Gaussian laser beam shaping methods and device and precise laser micropore processing device |
| CN105142337B (en) * | 2015-09-10 | 2018-05-22 | 深圳华麟电路技术有限公司 | A kind of Rigid Flex to open a window after internal layer pad and preparation method thereof |
| CN108093570A (en) * | 2017-12-20 | 2018-05-29 | 深圳光韵达激光应用技术有限公司 | A kind of processing technology using laser-induced thermal etching removal circuit board local securing layer |
| CN110636702B (en) * | 2018-06-21 | 2021-02-26 | 鹏鼎控股(深圳)股份有限公司 | Circuit board and manufacturing method thereof |
| CN210967521U (en) * | 2019-06-25 | 2020-07-10 | 苏州德龙激光股份有限公司 | Equipment for ultrafast laser PCB drilling |
| CN111918482A (en) * | 2020-06-05 | 2020-11-10 | 江西一诺新材料有限公司 | Manufacturing method of FPC (flexible printed circuit) micropores |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201965316U (en) * | 2011-04-01 | 2011-09-07 | 北京工业大学 | Device for reshaping Gaussian beam into flat-top beam |
| CN105226204A (en) * | 2014-05-30 | 2016-01-06 | 上海微电子装备有限公司 | A kind of laser package equipment and method for packing |
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