CN219027541U

CN219027541U - Material taking device and processing system of FPC flexible circuit board

Info

Publication number: CN219027541U
Application number: CN202023304163.9U
Authority: CN
Inventors: 段光前; 黄树平; 童杰
Original assignee: Wuhan Preceder Laser Technology Co ltd
Current assignee: Wuhan Preceder Laser Technology Co ltd
Priority date: 2020-12-30
Filing date: 2020-12-30
Publication date: 2023-05-16
Anticipated expiration: 2030-12-30

Abstract

The utility model relates to the technical field of flexible circuit board processing, and provides a material taking device which comprises a material sucking component for sucking an FPC flexible circuit board, wherein the material sucking component comprises a material sucking plate and a plurality of suckers, the material sucking plate is provided with a plurality of mounting positions for mounting the suckers, and the mounting positions are uniformly distributed on the material sucking plate. The utility model also provides a processing system of FPC flexible circuit board, including foretell extracting device. According to the utility model, the plurality of mounting positions are arranged on the suction plate, the suction disc and each mounting position of the suction plate are in a detachable connection mode, when FPC flexible circuit boards with different sizes are required to be adsorbed, the positions of the suction disc are only required to be adjusted and the suction disc is mounted on the mounting position at a proper position, so that the suction plate is simple and convenient in structure, the working efficiency can be improved, and the cost can be reduced.

Description

Material taking device and processing system of FPC flexible circuit board

Technical Field

The utility model relates to the technical field of flexible circuit board processing, in particular to a material taking device and a Flexible Printed Circuit (FPC) processing system.

Background

Flexible circuit boards (FPCs) are widely used in electronic products due to their light weight, high wiring density, thin thickness, and the like. The surface of the FPC is usually provided with a layer of resin film, which plays roles of circuit protection, solder resist and the like, and is an important component part (PI cover film for short) of FPC products. FPCs are generally classified into single-layer boards, double-layer boards, and multi-layer boards by structure; the adhesive can be divided into a rubber plate and a non-rubber plate according to the existence of the adhesive.

When traditional FPC is manufactured, PI cover film need before laminating with FPC circuit layer, cut the window of different shapes in corresponding position according to the circuit design requirement, then laminate with the circuit layer again. There is a risk of excessively high yield due to the non-correspondence of the hole sites.

When the traditional FPC is manufactured, manual feeding is adopted, or centralized feeding with a small quantity is adopted, and the efficiency is low.

In addition, when current FPC preparation, just send to the processing region directly after getting the material and process, do not carry out preliminary location, cause the not high problem of machining precision very easily.

In addition, when current FPC makes, often meet the condition that FPC flexible circuit board size is different, current equipment can prepare the material subassembly that absorbs of corresponding model more, changes when needs, but this kind of mode can certainly waste time, reduces work efficiency.

Disclosure of Invention

The utility model aims to provide a material taking device and a processing system of an FPC flexible circuit board, which can at least solve part of defects in the prior art.

In order to achieve the above object, the embodiment of the present utility model provides the following technical solutions: the utility model provides a extracting device, is including being used for absorbing the material subassembly that inhales of FPC flexible circuit board, inhale the material subassembly and including inhaling flitch and a plurality of sucking disc, inhale and have a plurality of confession on the flitch a plurality of installation positions of sucking disc installation, each the installation position equipartition is in inhale on the flitch.

Further, each of the mounting locations is disposed around the suction plate.

Further, each of the suction cups is a vacuum suction cup.

Further, the vacuum suction device also comprises an air passage used for communicating the suckers, wherein the air passage is at least partially arranged in the suction plate, and the other end of the air passage is connected with a vacuum generator.

Further, the unused mounting locations are provided with plugs.

Further, still include can stand the support column of locating on the base of system, the support column has two, two install the crossbeam between the support column, follow the length direction of crossbeam, laid first removal subassembly on the crossbeam, inhale the material subassembly and install on the removal subassembly.

Further, the first moving assembly is a servo motor screw distribution rod module.

Further, the device also comprises a second moving component which can move along the height direction of the support column along with the suction component, and the second moving component is arranged on the first moving component.

Further, the second moving assembly is an up-down cylinder.

The embodiment of the utility model provides another technical scheme that: a processing system of an FPC flexible circuit board comprises the material taking device.

Compared with the prior art, the utility model has the beneficial effects that:

1. Establish a plurality of installation positions on inhaling the flitch, be the form of detachable connection between each installation position of sucking disc and inhaling the flitch, when the FPC flexible circuit board that the size is different is adsorbed to needs, only need adjust the position of sucking disc, install on the installation position of suitable position can, simple structure and convenient can improve work efficiency and reduce cost.

2. The PI cover film which is not windowed is covered firstly, and then the windowing procedure is carried out, so that the hole alignment process is omitted, the FPC product manufacturing process is simplified, the reject ratio of the product is reduced, the efficiency and the precision are improved, and the reliability of the product is improved.

3. The optical system of the flat-top round light spot is adopted to obtain the flat-top round light spot with uniform energy distribution, so that the negative problems of ablation and the like of the copper foil layer caused by overhigh energy in the center of the Gaussian beam and insufficient edge energy at present are effectively solved, the size of the light spot is adjustable, the using method is flexible, and the energy utilization rate is high.

4. The FPC flexible circuit board to be processed is stored through the storage mechanism, so that the processing efficiency can be improved.

5. The double-channel machining mode is adopted, two working positions can be machined simultaneously, and machining efficiency is improved.

6. The feeding device can be used for carrying out primary positioning after taking materials, so that the material is ensured to have a better processing position after being sent to a processing area.

Drawings

Fig. 1 is a schematic diagram of a processing system for an FPC flexible circuit board according to an embodiment of the present utility model;

fig. 2 is a graph showing energy density distribution before and after beam modulation in a method for manufacturing an FPC flexible circuit board according to an embodiment of the present utility model;

fig. 3 is a schematic diagram of a method for processing an FPC flexible circuit board according to a first embodiment of the present utility model, in which a flat-top circular spot laser ablation is used to remove PI cover film and adhesive;

fig. 4 is a schematic design diagram of a reflective flat-top beam shaping mirror according to a first embodiment of the present utility model;

fig. 5 is a schematic diagram of a processing system of a single-channel FPC flexible circuit board according to a second embodiment of the present utility model;

fig. 6 is a schematic diagram of a processing system of a dual-channel FPC flexible circuit board according to a third embodiment of the present utility model;

fig. 7 is a schematic diagram illustrating a partial enlarged view of a processing system of a dual-channel FPC flexible circuit board according to a third embodiment of the present utility model;

fig. 8 is a schematic diagram of a storage component of a processing system of a dual-channel FPC flexible circuit board according to a fourth embodiment of the present utility model;

fig. 9 is a schematic diagram of a feeding mechanism of a processing system of a dual-channel FPC flexible circuit board according to a fifth embodiment of the present utility model;

Fig. 10 is a schematic diagram of a feeding mechanism of a processing system of a dual-channel FPC flexible circuit board according to a fifth embodiment of the present utility model, with a flat plate removed;

fig. 11 is a schematic diagram of a material taking device of a processing system of a dual-channel FPC flexible circuit board according to a sixth embodiment of the present utility model.

Description of the preferred embodiments

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Embodiment one:

referring to fig. 1 to 4, an embodiment of the utility model provides a method for processing an FPC flexible circuit board, which includes the following steps: s1, attaching a PI cover film a without windowing to a circuit layer; s2, windowing is carried out on the PI covering film a in a position needing windowing in a laser ablation mode, and continuous ablation is carried out until copper foil in the circuit layer is exposed, so that the windowed FPC flexible circuit board is obtained. In the prior art, before the PI cover film a is attached to the FPC circuit layer, windows with different shapes are cut at corresponding positions according to circuit design requirements, and then the PI cover film a is attached to the circuit layer. There is a risk of excessively high yield due to the non-correspondence of the hole sites. Therefore, in order to solve the defect, the utility model develops a new way to firstly paste the PI cover film a without windowing on the circuit layer, then directly window the PI cover film a according to the position of windowing as required, and continuously window downwards to the copper foil, thereby omitting the process of hole alignment, simplifying the manufacturing flow of FPC products, reducing the reject ratio of the products, improving the efficiency and the precision and improving the reliability of the products. In this case, the circuit layer and the PI cover film a may be formed into an FPC flexible circuit board before being windowed, the FPC flexible circuit board may be divided into a single layer board, a double layer board and a multi layer board, or may be divided into a plastic board and a non-plastic board according to the presence or absence of an adhesive, but the PI cover film a and the circuit layer may not be separated regardless of the type, for example, when the FPC flexible circuit board is a single layer and has a plastic board with an adhesive, and two adhesive layers b are present, the circuit layer includes an adhesive layer b, a copper foil layer c and a base layer d sequentially arranged, and the PI cover film a covers the adhesive layer b, so that a complete plastic board may be formed. When ablated, only the PI cover film a and the adhesive between PI cover film a and copper foil, and the underlying copper foil and substrate, as well as other types of boards, will have adhesive or other structures between the copper foil and substrate, and will not be ablated. Continuing the above example, when the processed FPC flexible circuit board is a single-layer and adhesive-containing board, the circuit layer contains copper foil and adhesive, and the laser ablates the window on the PI cover film a first, and then ablates the adhesive until the copper foil is exposed.

As an optimization scheme of the embodiment of the present utility model, referring to fig. 1 to 4, the laser ablation method specifically includes: s20, adopting laser with Gaussian energy distribution, and modulating the laser beam into flat-top round light spots with uniform energy distribution; s21, focusing the laser beam on a position of the PI covering film a, which needs to be windowed, and rapidly ablating the PI covering film a until the copper foil in the circuit layer is exposed. Preferably, the modulation mode is specifically as follows: s200, firstly, blocking higher-order components in an original light beam by adopting an adjustable beam expander group 101 with a light blocking diaphragm; s201, the reflection type flat-top beam shaping mirror 102 is adopted to modulate the beam with the energy Gaussian distribution into the beam with uniform energy. In this embodiment, before ablation, the laser with gaussian energy distribution needs to be modulated into a flat-top circular spot with uniform energy distribution, as shown in fig. 2, which is a situation before beam modulation and a situation after beam modulation, it is obvious that before beam modulation, the energy density is higher, the radius is large, the beam energy is irregularly distributed, the energy density and the radius are regular after beam modulation, and the beam energy is uniform, so that the flat-top circular spot can be obtained, because the adjustable beam expanding lens group 101 with the light blocking diaphragm is adopted to block the higher-order component in the original beam, the negative problems that the copper foil layer c is ablated due to the too high central energy of the gaussian beam and the insufficient edge energy at present are effectively solved, and the beam quality is improved. Such a beam is controllable, which improves the quality of the ablation on the one hand and the accuracy of the ablation on the other hand, and improves the quality of the product. Preferably, a light blocking diaphragm is placed on the back focal plane of the first lens of the adjustable beam expanding lens group 101, so that higher-order components in the original light beam can be blocked, and the quality of the light beam is improved.

Further optimizing the above scheme, referring to fig. 1 to 4, after modulating the laser beam, the beam is guided to the PI cover film a through a collimator mirror 103, a galvanometer 105 and a focusing mirror 106 sequentially arranged along the direction of the optical path. In this embodiment, the modulated laser beam is guided to the PI cover film a to act through the cooperation of the optical device. Specifically, the adjustable beam expander 101 adjusts the diameter of the outgoing beam to a certain D ₀ Incident to the reflective flat-top beam shaper 102 at a small angle, f in the reflective exit direction _w The position forms a diameter D ₁ Flat-top circular spot, f in the reflection exit direction _w +f _z Is placed at a focal length f _z The reflecting flat-top beam shaping mirror 102 and the collimating mirror 103 are confocalized, the light beam is incident to the vibrating mirror 105 through the reflecting mirror group 104 after passing through the collimating mirror 103, and then the focal length f is set along the emergent direction _c I.e. a diameter D can be obtained on the PI cover film a ₂ ＝D ₁ ×f _c ÷f _z Flat-topped spot of (c). In the present embodiment, in the reflective flatThe collimating lens 103 is arranged in the outgoing direction of the top beam shaping lens 102, so that the reflecting flat top beam shaping lens 102 and the collimating lens 103 are confocal. After passing through the collimating mirror 103, the light beam is incident to the vibrating mirror 105 through the plane reflecting mirror group, and finally is incident to the adjustable focusing mirror group to focus the light beam on the surface of the PI cover film a to be windowed. In addition, the plane reflecting mirror plate, that is, the reflecting mirror group 104 is placed in the light path, so that the installation and the debugging can be facilitated.

As an optimization scheme of the embodiment of the present utility model, referring to fig. 4, the surface type of the reflective flat-top beam shaper 102 satisfies the following relationship:

wherein r is ₀ The beam waist radius is the incident Gaussian beam; r is the radial coordinate of the incident beam; r is the radial coordinate of the emergent beam of the beam shaping mirror; f (f) _w Focal length of the reflective flat-top beam shaper 102; sigma is the target amplitude of the output beam; x is the plane type parameter of the reflective flat-top beam shaper 102 at radial coordinate r. In the present embodiment, r ₀ And sigma are known values, so that in the first formula, the radial coordinate R of the outgoing beam of the beam shaper is changed along with the change of the radial coordinate R of the incoming beam, and after the radial coordinate R of the outgoing beam of the beam shaper is obtained, the relationship satisfied by the surface type of the reflective flat-top beam shaper 102 can be obtained through the second formula.

As an optimization scheme of the embodiment of the present utility model, in the step S21, a focusing lens 106 is used to adjust the focusing degree so as to change the size of the flat-top circular light spot. In this embodiment, the focal length of the focusing lens 106 set is adjusted as required by adopting the focusing lens 106 set, so as to change the size of the flat-top round light spot, increase the processing efficiency, and adjust the beam energy and the acting time, thereby ensuring that the copper foil layer c is not ablated.

An embodiment of the utility model provides a processing system for an FPC (flexible printed Circuit) board, referring to FIGS. 1 to 4, and the FPC flexible printed circuit board is processed by adopting the processing method for the FPC flexible printed circuit board. In the embodiment, the method is adopted to process the FPC flexible circuit board, the hole aligning process is omitted, the FPC product manufacturing process is simplified, the reject ratio of the product is reduced, the efficiency and the precision are improved, the reliability of the product is improved, in addition, a flat-top round light spot with uniform energy distribution is obtained by adopting an optical system of flat-top round light spots, the negative problems that the copper foil layer c is ablated and the like due to overhigh energy in the center of a Gaussian beam and insufficient edge energy at present are effectively solved, the light spot size is adjustable, the use method is flexible, and the energy utilization rate is high.

As shown in fig. 1, the system generally includes a laser 100, a beam expander, a reflective flat-top beam shaper 102, a collimator 103, a reflector, a galvanometer 105, and a focusing mirror 106, which are sequentially arranged along the direction of the optical path. The beam expander and the focusing mirror 106 can be adjustable, so as to be adjusted according to the actual situation, the reflecting mirror can be a plane reflecting mirror group, and the direction of the light path is changed through a plurality of reflecting mirrors, so that the layout, the installation and the debugging are convenient. The layout and function of the mirrors are shown in the above embodiments, and will not be described here again. Preferably, the laser 100 may employ a violet skin second laser.

Embodiment two:

the above-mentioned system can be subdivided into two types, one is a single-channel system, i.e. a system with only one processing station, and the other is a multi-channel system, i.e. a system with multiple processing stations, and the structure of the single-channel system is described in detail in this embodiment.

Referring to fig. 5, an embodiment of the present utility model provides a processing system for a single-channel FPC flexible circuit board, which includes an optical platform 203, a laser 204 disposed on the optical platform 203, a placing platform on which the FPC flexible circuit board to be processed is placed, and an optical assembly for transmitting light emitted by the laser 204 to the FPC flexible circuit board on the placing platform for processing, where the optical assembly includes a beam expander group 206 for removing higher-order components in an original beam and a reflective flat-top beam shaper 207 for modulating the beam into a beam with uniform energy, and the beam expander group 206 and the reflective flat-top beam shaper 207 are sequentially disposed along an optical path. In this embodiment, as shown in fig. 2, the original laser beam emitted from the laser 204 has a higher energy density, a large radius and irregular distribution, and the beam energy is not uniform and is not easy to control and has poor ablation quality when being directly used for ablation, so in this embodiment, the beam expander group 206 is used to remove the higher-order component in the beam, and the reflective flat-top beam shaper 207 is used to modulate the energy, so that the energy density and the radius of the modulated beam are regular, the beam energy is uniform, flat-top round light spots can be obtained, the negative problems of ablation of copper foil layers caused by the overhigh energy in the center of the gaussian beam and insufficient edge energy at present are effectively solved, and the beam quality is improved. Such a beam is controllable, which improves the quality of the ablation on the one hand and the accuracy of the ablation on the other hand, and improves the quality of the product. Therefore, the system can meet the requirements of a processing mode of firstly attaching a PI cover film without windowing and then uniformly windowing. Preferably, the laser 204 may be a violet skin second laser.

As an optimization scheme of the embodiment of the present utility model, please refer to fig. 1 and 5, the beam expander group 206 is an adjustable beam expander, which is formed by a plurality of beam expanders 206, the distance between the beam expanders is adjusted, and a light blocking diaphragm is disposed on the back focal plane of the first lens, so that the higher order component in the original beam can be blocked, and the beam quality is improved. Specifically, if there are two lenses, the light-blocking diaphragm is provided between the two lenses.

As an optimization scheme of the embodiment of the present utility model, referring to fig. 5, the optical assembly further includes a turning mirror assembly 205, where the turning mirror assembly 205 has a first turning mirror for turning the laser beam of the laser 204 into the beam expander group 206 and a second turning mirror for turning the beam processed by the beam expander group 206 to the reflective flat-top beam shaper 207. In this embodiment, in order to optimize the layout of the whole device, the reflective flat-top beam shaper 207 may be disposed on the other side of the optical platform 203, and at this time, a turning mirror may be used to assist in the transmission of the beam, so as to solve the space obstacle. The first and second are referred to herein for convenience of description only and are not otherwise limiting.

As an optimization scheme of the embodiment of the present utility model, referring to fig. 5, the optical assembly further includes a collimator lens 208, a galvanometer 209, and a focusing lens 210 sequentially arranged along the optical path direction, and the light beam reflected by the reflective flat-top beam shaper 207 sequentially passes through the collimator lens 208 and the galvanometer 209, and is converged and emitted from the focusing lens 210 onto the FPC flexible circuit board to be processed. The laser emitters and the collimator 208 are disposed on the optical stage 203. When the last layer is removed, the collimating lens group and the focusing lens 210 move upwards to obtain a larger flat-top round light spot, reduce the processing depth and reduce the damage to the bottom layer.

Further optimizing the above scheme, the focusing mirror 210 is an adjustable focusing mirror, which can change the flat-top spot size on the working surface. Specifically, it consists of two lenses, the spacing between which is changed to make the adjustment. When the pad hole processing is started, small flat-top round light spots are obtained so as to obtain higher action and effect.

As an optimization of an embodiment of the present utility model, referring to fig. 5, the system further includes a CCD vision mechanism 214 for observing the position of the FPC flexible circuit board. In this embodiment, the CCD vision mechanism 214 is a system commonly used in the art that is a device that assists in laser operation and that can measure the position information of the FPC flex circuit board markings.

As an optimization scheme of the embodiment of the present utility model, referring to fig. 5, the system further includes an XYZ motion mechanism for moving with the rest platform to cooperate with laser processing. The XYZ motion mechanism is a motion mechanism commonly used in the art, and may include an X-axis motion system 211, a Y-axis motion system 212, and a Z-axis motion system 213, where the X-axis motion system 211 and the Y-axis motion system 212 are fixed on the working platform 201 perpendicular to each other, and the following embodiments of the working platform 201 are described in detail herein and not mentioned here. The movement of the FPC flexible circuit board in the X-axis and Y-axis directions can be adjusted by adopting the X-axis movement system 211 and the Y-axis movement system 212, so that the printing mark on the FPC flexible circuit board to be processed is positioned in the field of view of the CCD vision mechanism 214. The CCD vision mechanism 214 is located on the side of the Z-axis movement system 213, and the Z-axis movement system 213 can move up and down with the rest platform to adjust the position in the direction.

As an optimization scheme of the embodiment of the present utility model, referring to fig. 5, the rest platform is a vacuum adsorption platform 215. In the embodiment, the FPC flexible circuit board to be processed can be tightly adsorbed on the surface of the FPC flexible circuit board by vacuumizing in a vacuum adsorption mode, so that the FPC flexible circuit board can be ensured not to generate displacement during processing. The vacuum chuck 215 is fixed to the Y-axis motion system 212 and moves with it. Preferably, the adsorption fan during adsorption can be controlled by an electromagnetic valve.

As an optimization of the embodiment of the present utility model, referring to fig. 5, the system further includes a dust suction mechanism 216 disposed at the rest platform. In this embodiment, the dust extraction mechanism 216 is conventional in the art and is capable of absorbing and collecting the fumes generated during processing to avoid the fumes escaping. The vacuum system is located above the vacuum suction platform 215 and below the CCD vision mechanism 214.

As an optimization scheme of the embodiment of the present utility model, referring to fig. 5, the system further includes a base 200, a working platform 201 disposed on the base 200, and a stand 202 disposed on the working platform 201, where the optical platform 203 is erected on the stand 202. In this embodiment, the working platform 201 is elastically connected to the base 200, the upright posts 202 are located at two sides of the working platform 201 and are fixedly connected to the working platform 201, the optical platform 203 is fixedly connected to the upright posts 202, the top surface of the optical platform 203 is parallel to the working platform 201, and the side surface of the optical platform 203 is perpendicular to the working platform 201. In addition, the system is also provided with an industrial personal computer 217 and a display 218, wherein the industrial personal computer 217 is used for controlling and coordinating the work among the components, and the display 218 can display the condition observed by the CCD visual mechanism 214.

The structure of the multi-channel system is described in more detail below.

Embodiment III:

referring to fig. 6 to 7, an embodiment of the present utility model provides a processing system for a multi-channel FPC flexible circuit board, which includes a plurality of lasers 300, a plurality of rest platforms for placing FPC flexible circuit boards to be processed, and a plurality of optical components for guiding light emitted by the lasers 300 onto the FPC flexible circuit board on the rest platforms for processing, wherein each of the lasers 300 is configured in a one-to-one correspondence with each of the rest platforms, and each of the rest platforms is configured in a one-to-one correspondence with each of the optical components; each optical assembly includes a beam expander 307 for removing higher order components in the original beam, and a reflective flat-top beam shaper 308 for modulating the beam into a beam with uniform energy, where the beam expander 307 and the reflective flat-top beam shaper 308 are sequentially arranged along the optical path. In this embodiment, the multiple lasers 300, the multiple rest platforms and the multiple optical components are correspondingly configured, so that the system has the capability of simultaneously processing multiple FPC flexible circuit boards, and of course, how many processing stations and whether or not or which station is selected to work simultaneously can be selected according to the actual situation, which is not limited in this embodiment. As shown in fig. 2, the original laser beam emitted from the laser 300 has higher energy density, large radius and irregular distribution, and the beam energy is uneven and is directly used for ablation, so that the beam expander 307 is used for removing higher-order components in the beam, and the reflective flat-top beam shaper 308 (in a shell in fig. 7, not shown) is used for modulating the energy, and the reflective flat-top beam shaper 308, the collimating mirror, the reflecting mirror and the vibrating mirror are sequentially arranged in the shell, so that the energy density and the radius of the modulated beam are regular, the beam energy is uniform, flat-top round light spots can be obtained, the negative problems of ablation and the like of a copper foil layer caused by overhigh energy and insufficient edge energy of a gaussian beam at present are effectively solved, and the beam quality is improved. Such a beam is controllable, which improves the quality of the ablation on the one hand and the accuracy of the ablation on the other hand, and improves the quality of the product. Therefore, the system can meet the requirements of a processing mode of firstly attaching a PI cover film without windowing and then uniformly windowing. Preferably, the laser 300 may employ a violet skin second laser. Preferably, the whole light path can adopt a plurality of reflectors 316 to flexibly turn the light path, and the light beams coming out of the vibrating mirror are emitted through the field lens 317.

With further optimization of the above-mentioned scheme, referring to fig. 6 and 7, the number of the lasers 300, the rest platform and the optical components is two, the two lasers 300 are stacked, and the light emitting directions of the two lasers 300 are opposite. In this embodiment, in order to reasonably use space, two lasers 300 are stacked along the height direction, and the light outlets of the two lasers 300 face different directions, so as to avoid interference with the optical components matched with the lasers 300, and have enough space to facilitate the layout of each component in the optical components.

Further optimizing the above, referring to fig. 6 and 7, the optical bench further includes an optical bench 304 for placing each of the lasers 300, each of the rest platforms, and each of the optical components, wherein the optical bench 304 is disposed on a working bench 302, and the working bench 302 is disposed on a base 301. In this embodiment, the base 301, the working platform 302 and the optical platform 304 are provided to put the above devices on the base 301, and the working platform 302 is provided on the base 301 through the upright post 303, so that the operator can observe and operate conveniently.

Further optimizing the above, please refer to fig. 6 and 7, further comprising a CCD vision mechanism 305 for observing the position of the FPC flexible circuit board. In this embodiment, the CCD vision mechanism 305 is a system commonly used in the art, which is a device that assists in laser operation and which can measure the position information of the FPC flex circuit board marks. Preferably, there are two CCD vision mechanisms 305, and the two CCD vision mechanisms 305 are arranged in one-to-one correspondence with the two rest platforms.

Further optimizing the above, referring to fig. 6 and 7, the vacuum cleaner further comprises a dust suction mechanism 306 disposed at the rest platform. In this embodiment, the dust extraction mechanism 306 is conventional in the art and is capable of absorbing and collecting the fumes generated during processing to avoid the fumes escaping. The vacuum system is located above the vacuum suction platform and below the CCD vision mechanism 305. Preferably, there are two dust sucking mechanisms 306, and the two dust sucking mechanisms 306 are configured in a one-to-one correspondence with the two rest platforms.

Further optimizing the above scheme, please refer to fig. 6 and 7, further comprising a storage assembly 309, a feeding device 310, a material taking device 311, an adsorption platform 312, an X-axis motion system 313, a Y-axis motion system 314, and a Z-axis motion system 315.

Embodiment four:

referring to fig. 6 and 8, the system further includes a storage assembly for storing the FPC flexible circuit board. In this embodiment, the storage subassembly can be disposed to this system for store up FPC flexible circuit board, concretely, change the storage subassembly and can hold several hundred FPC flexible circuit boards simultaneously, can save time when processing like this, raise the efficiency. Of course, the storage mechanism can be used in the single-channel system, even in other processing systems except single channels and multiple channels, and has universality.

With further optimization of the above-mentioned scheme, referring to fig. 8, the storage mechanism includes a storage frame 400 and support legs 401 supported below the storage frame 400, the storage frame 400 has a storage cavity 402 in which a plurality of FPC flexible circuit boards are stacked along a height direction thereof, and a discharge port 403 for removing the FPC flexible circuit boards from the storage cavity 402 is provided above the storage frame 400. In this embodiment, a storage frame 400 with a first height is adopted, the FPC flexible circuit boards are stacked up and placed in the discharge frame, the whole FPC flexible circuit boards are placed on the path of the material taking mechanism, the material taking mechanism can continuously take materials only by reciprocating on the path of the material taking mechanism, after the FPC flexible circuit boards in the storage cavity 402 are all taken out, the FPC flexible circuit boards are placed once again, a plurality of FPC flexible circuit boards can be placed each time, and the working efficiency is improved.

As an optimization scheme of the embodiment of the present utility model, referring to fig. 8, the storage frame 400 includes a movable plate 404 for carrying the stacked FPC flexible circuit boards, and a driving mechanism for lifting up the movable plate 404 to lift the FPC flexible circuit board on the uppermost layer to the position of the discharge port 403, where the movable plate 404 is horizontally disposed in the storage frame 400. In this embodiment, the form of matching with the material taking mechanism may be to jack up the FPC flexible circuit board to the position of the discharge port 403, so as to facilitate the material taking by the material taking mechanism, so that the material taking mechanism may omit the action of lowering the material after reaching the position right above the material storage frame 400, because the thickness of the stacked FPC flexible circuit board is gradually reduced along with the reduction of the stacked FPC flexible circuit board, the height of the stacked FPC flexible circuit board will be reduced correspondingly in the material storage frame 400, and the stacked FPC flexible circuit board will extend deeper and deeper into the material storage frame 400, if the material taking mechanism is not provided with the displacement action in the vertical direction, the material cannot be taken again, so that the movable plate 404 on which the FPC flexible circuit board is placed may be jacked up by the driving mechanism, so that the material taking mechanism is convenient to take the material directly at the position of the discharge port 403. Of course, as mentioned above, the material taking manner may be that of extending into the material storage frame 400, and the material taking mechanism may also have such a lifting motion, which is also an embodiment, and the embodiment does not limit the material taking manner. Preferably, the driving mechanism comprises a screw motor 405, and a driving end of the screw motor 405 is mounted on the movable plate 404.

Further optimizing the above, referring to fig. 8, the storage frame 400 further has a guide rod 406 for guiding. In this embodiment, the guide rods 406 are vertically disposed, so that the movable platform can be ensured to be always kept in a horizontal state when the driving mechanism pushes the movable platform. The guide bar 406 may be a telescopic bar that expands and contracts as the movable floor rises and falls in a wide variety of ways. Preferably, a plurality of guide rods 406 may be provided, each guide rod 406 being disposed around the driving mechanism. Thus, a more stable guiding effect can be achieved.

As an optimization scheme of the embodiment of the present utility model, referring to fig. 8, the system further includes an adjusting mechanism for adjusting the size of the storage cavity 402. In this embodiment, when the sizes of the processed FPC flexible circuit boards are different, the storage cavities 402 with fixed sizes cannot meet the requirements, so that the sizes of the storage cavities 402 can be adjusted by adopting the adjusting mechanism, so that the sizes of various FPC flexible circuit boards can be matched.

With further optimization of the above-mentioned scheme, referring to fig. 8, the adjusting mechanism includes a plurality of limiting rods 407 surrounding the movable plate 404 and a driving member for driving the limiting rods 407 to move horizontally, each limiting rod 407 is vertically disposed, and each limiting rod 407 and the movable plate 404 enclose to form the storage cavity 402. In this embodiment, the storage cavity 402 is constructed by moving the plate 404 through the stop lever 407, so that the size of the storage cavity 402 can be changed after the stop lever 407 moves. For example, the number of the limit rods 407 is four, and the four limit rods 407 are enclosed to form a square. Of course, there are other numbers, and the flexible circuit board is usually square as long as the flexible circuit board is enclosed and formed. Preferably, the stop lever 407 may move horizontally on the movable plate 404, or may have an open slot extending inward along the plane direction of the movable plate 404, where the stop lever 407 moves, so that interference may be avoided. Preferably, the driving member is a hand wheel, the movement of the limit rods 407 is driven by rotation of the hand wheel, and each side of the limit rods 407 can be provided with a hand wheel to adjust them simultaneously, for example, the rectangular long limit rods 407 or the wide limit rods 407, and the adjustment mode is conventional screw transmission, so that fine adjustment can be achieved through the form of a screw.

As an optimization scheme of the embodiment of the present utility model, referring to fig. 8, the system further includes a limiting mechanism for controlling the driving mechanism to stop at a stop position. In this embodiment, when the distance by which the driving mechanism is lifted is continuously changed after the stacked FPC flexible circuit boards are less and less as they are removed, it is a problem to be faced when stopping to prevent the FPC flexible circuit boards from being lifted too high. Therefore, in the embodiment, through the limiting mechanism, when the driving mechanism is lifted to the stop position, the driving mechanism can be controlled to stop lifting continuously, so that the automatic operation of the system is improved.

With further optimization of the above-mentioned scheme, referring to fig. 8, the limiting mechanism includes a detecting fiber sensor 408, where the detecting fiber sensor 408 is disposed at the discharge port 403. In this embodiment, the control is implemented by detecting the optical fiber sensor 408, which is disposed at the discharge port 403, and when it touches the FPC flexible circuit board, it can send out a high-frequency signal, and the driving mechanism immediately stops the power-off and continues to lift up after receiving the signal. Of course, in the prior art, similar photoelectric sensing devices are also available, and the present embodiment is not limited thereto.

Fifth embodiment:

referring to fig. 6, 9 and 10, the system further includes a feeding device for conveying the FPC flexible circuit board. In this embodiment, after the flexible circuit board of FPC is taken out from the above-mentioned storage frame by the material taking mechanism, the flexible circuit board of FPC will be put on this feeding device, this feeding device is usually used with the above-mentioned XYZ motion mechanism, send the flexible circuit board of FPC to the position of processing by this feeding device. Of course, the feeding device can be used in the single-channel system, even in other processing systems except single channels and multiple channels, and has universality.

With further optimization of the above-mentioned scheme, referring to fig. 9 and 10, the feeding device includes a rest platform for placing the FPC flexible circuit board and a positioning mechanism 501 capable of pulling the FPC flexible circuit board to perform preliminary positioning, and the positioning mechanism 501 is disposed below the rest platform. In this embodiment, after the feeding device is placed on the FPC flexible circuit board by the material taking mechanism, there may be a situation that the position is not good, that is, not at the designated position, the FPC flexible circuit board may be shifted by the positioning mechanism 501, so that the FPC flexible circuit board is shifted to the designated position, and this action is preliminary positioning. After preliminary positioning, the CCD visual positioning system accurately positions through MARK points of two opposite angles of the FPC flexible circuit board at the processing position.

Further optimizing the above, referring to fig. 9 and 10, the positioning mechanism 501 includes a toggle rod 502 that can move toward a direction of an area where the FPC flexible circuit board is designated to be placed, and a displacement component for driving the toggle rod 502 to displace, where the designated placement area is on the upper surface of the rest platform, and the displacement component is disposed below the rest platform. In this embodiment, the toggle lever 502 is adopted in the toggle mode, and is driven to move towards the direction of the appointed placement area of the FPC flexible circuit board by the displacement assembly, so that the FPC flexible circuit board with a bad position can be initially pushed into the appointed placement area, and the initial positioning is realized.

With further optimization of the above-mentioned solution, referring to fig. 9 and 10, the positioning mechanism 501 further includes a telescopic assembly for driving the toggle rod 502 to retract, and at least one side of the rest platform has a hole 503 for the toggle rod 502 to extend out of the upper surface thereof. In this embodiment, in combination with the above displacement action, the movement of the toggle lever 502 may have two steps, one step is to extend from the hole 503 below the rest platform, and the second step is to toggle the FPC flexible circuit board by horizontal displacement, and the FPC flexible circuit board may be initially sent to the designated position by this toggle action, so as to achieve the initial positioning. By adding the telescoping action, the toggle rod 502 can be stored under the rest platform when the FPC flexible circuit board does not need to be toggled (namely, the PFC flexible circuit board is placed in the appointed placement area). Preferably, the telescopic assembly used for the telescopic action can be an existing conventional telescopic mechanism, such as a cylinder, or a hydraulic telescopic rod can be directly used, and the displacement assembly can also be a conventional mechanism, such as a screw rod or a cylinder drive, and the specific structure of the telescopic mechanism is not described in detail here. In addition, the upper end of the toggle rod 502 can be prepared into a sphere or an inclined plane, if the upper end is the inclined plane, the inclined plane faces the direction of the appointed arrangement area, if the FPC flexible circuit board is well located above the toggle rod 502, and the toggle rod 502 is located at the edge of the FPC flexible circuit board, the FPC flexible circuit board can conveniently slide into the appointed arrangement area when jacking.

With further optimization of the above-mentioned solution, referring to fig. 9 and 10, the toggle rod 502 and the holes 503 are configured in a plurality of one-to-one correspondence, the holes 503 are formed on multiple sides of the rest platform, and the designated placement area is in an area formed by surrounding each hole 503.

As an optimization scheme of the embodiment of the present utility model, referring to fig. 9 and 10, the hole 503 is elongated, and the elongated hole 503 extends toward the direction of the designated placement area. In this embodiment, the hole 503 is long, so as to guide the toggle rod 502, so as to ensure that the toggle rod 502 moves along a specific direction, and ensure a toggle path.

As an optimization scheme of the embodiment of the present utility model, referring to fig. 9 and 10, the rest platform includes a flat plate 504 for the FPC to rest on, and a bottom plate 505 located below the flat plate 504, where a receiving cavity 506 for receiving the positioning mechanism 501 is provided between the flat plate 504 and the bottom plate 505, and the designated area is located on the flat plate 504.

As an optimization scheme of the embodiment of the present utility model, referring to fig. 9 and 10, the apparatus further includes a Y-axis motion system 507 for driving the rest platform to move along the Y-axis direction. In this embodiment, the shelving platform can be driven by the Y-axis motion system 507 to move along the Y-axis to cooperate with the overall system operation. The Y-axis motion system 507, including the X-axis motion system, the Z-axis motion system, etc. of the above embodiments are conventional moving mechanisms, and their specific configurations will not be described in detail herein.

As an optimization scheme of the embodiment of the present utility model, referring to fig. 9 and 10, the rest platform is a vacuum adsorption platform 500. In the embodiment, the FPC flexible circuit board to be processed can be tightly adsorbed on the surface of the FPC flexible circuit board by vacuumizing in a vacuum adsorption mode, so that the FPC flexible circuit board can be ensured not to generate displacement during processing. Preferably, the adsorption fan during adsorption can be controlled by an electromagnetic valve.

Example six:

referring to fig. 11, the system further includes a material taking device for taking materials. In this embodiment, the material taking device may take out the FPC flexible circuit board, and then put on the above-mentioned material feeding device, and send to the next process. Of course, the material taking device can be used in the single-channel system, even can be used in other processing systems besides single channels and multiple channels, and has universality.

As an optimization scheme of the embodiment of the present utility model, referring to fig. 11, the material taking device includes a material sucking assembly for sucking an FPC flexible circuit board, the material sucking assembly includes a material sucking plate 600 and a plurality of suction cups 601, the material sucking plate 600 has a plurality of mounting positions 602 for mounting the suction cups 601, and each mounting position 602 is uniformly distributed on the material sucking plate 600. In the process of work, often meet the condition that FPC flexible circuit board size is different, current equipment can prepare the material subassembly that absorbs of corresponding model more, changes when needs, but this kind of mode can certainly waste time, reduces work efficiency. Therefore, in this embodiment, a plurality of mounting positions 602 are directly provided on the suction plate 600, and the suction plate 601 and each mounting position 602 of the suction plate 600 are detachably connected, so that when flexible circuit boards with different sizes are required to be adsorbed, only the positions of the suction plate 601 need to be adjusted and the flexible circuit boards are mounted on the mounting positions 602 at appropriate positions. Preferably, each of the mounting locations 602 is disposed around the suction plate, and the FPC flexible circuit board is in a square shape, and the shape of the surrounding may be matched with the shape.

Further optimizing the above, referring to fig. 11, each suction cup 601 is a vacuum suction cup. In the embodiment, the FPC flexible circuit board is sucked in a vacuum adsorption mode, so that smoother sucking and putting down actions can be achieved. Of course, in addition to the vacuum adsorption form, a mechanical adsorption form may be used, and various forms may be used, so long as the FPC flexible circuit board can be grasped, and this embodiment is not limited thereto.

Further optimizing the above scheme, referring to fig. 11, the vacuum suction device further includes a gas path for communicating with each suction cup 601, where the gas path is at least partially disposed in the suction plate 600, and the other end of the gas path is connected to a vacuum generator. In this embodiment, the vacuum adsorption gas path may be hidden, i.e. hidden in the suction plate, and the suction plate has an inner cavity therein, which may be in the form of gas pipe arrangement, or may be in the form of making the inner cavity in the suction plate integral as a gas path, the vacuum generator acts on the inner cavity, and the inner cavity acts on the vacuum chuck in communication with the inner cavity, but in this form, the installation site 602 is required to be plugged in time during working, so as to avoid gas leakage, and the plugging piece can be used to plug the installation site 602.

As an optimization scheme of the embodiment of the present utility model, referring to fig. 11, the system further includes two support columns 603 that can be vertically arranged on a base of the system, a cross beam 604 is installed between the two support columns 603, a first moving component is arranged on the cross beam 604 along the length direction of the cross beam 604, and the material sucking component is installed on the moving component. In this embodiment, a moving assembly is used to displace the sorbent assembly to the feed device. Preferably, the first moving assembly may be a servomotor feed screw module 605.

Further to the above solution, please refer to fig. 11, further comprising a second moving assembly capable of moving along the height direction of the support column 603 with the suction assembly, wherein the second moving assembly is mounted on the first moving assembly. In this embodiment, the up-and-down movement mode is added, so that the suction component can conveniently descend the suction material and then lift the suction material and then move along with the first movement component. Preferably, the second moving assembly may employ an up-down cylinder 606.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A reclaimer device, its characterized in that: the flexible printed circuit board sucking device comprises a sucking component for sucking an FPC flexible printed circuit board, wherein the sucking component comprises a sucking board and a plurality of suckers, the sucking board is provided with a plurality of mounting positions for mounting the suckers, and the mounting positions are uniformly distributed on the sucking board.

2. The take-off device of claim 1, wherein: each mounting position is arranged around the material sucking plate.

3. The take-off device of claim 1, wherein: each sucking disc is a vacuum sucking disc.

4. A pick-up device as claimed in claim 3, wherein: the vacuum suction device further comprises an air passage used for communicating the suckers, wherein the air passage is at least partially arranged in the suction plate, and the other end of the air passage is connected with a vacuum generator.

5. The take-off device of claim 4, wherein: the unused mounting locations are provided with plugs.

6. The take-off device of claim 1, wherein: the device comprises a base, a plurality of support columns, a beam, a first moving assembly and a material sucking assembly, wherein the base is arranged on the base, the number of the support columns is two, the beam is arranged between the two support columns, the length direction of the beam is along, the beam is provided with the first moving assembly, and the material sucking assembly is arranged on the moving assembly.

7. The take-off device of claim 6, wherein: the first moving assembly is a servo motor screw distribution rod module.

8. The take-off device of claim 6, wherein: the device also comprises a second moving assembly capable of moving along the height direction of the support column with the suction assembly, and the second moving assembly is mounted on the first moving assembly.

9. The take-off device of claim 8, wherein: the second moving assembly is an up-down cylinder.

10. A processing system of FPC flexible circuit board, its characterized in that: a pick-up device as claimed in any one of claims 1 to 9.