CN109014610A - A kind of system and method for passive zoom laser processing transparent material - Google Patents

A kind of system and method for passive zoom laser processing transparent material Download PDF

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Publication number
CN109014610A
CN109014610A CN201811009711.XA CN201811009711A CN109014610A CN 109014610 A CN109014610 A CN 109014610A CN 201811009711 A CN201811009711 A CN 201811009711A CN 109014610 A CN109014610 A CN 109014610A
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CN
China
Prior art keywords
transparent material
passive
laser
electrical
lifting platform
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201811009711.XA
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Chinese (zh)
Inventor
李华杰
刘三定
高冉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Echo Radium Photoelectric Technology Co Ltd
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Suzhou Echo Radium Photoelectric Technology Co Ltd
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Application filed by Suzhou Echo Radium Photoelectric Technology Co Ltd filed Critical Suzhou Echo Radium Photoelectric Technology Co Ltd
Priority to CN201811009711.XA priority Critical patent/CN109014610A/en
Publication of CN109014610A publication Critical patent/CN109014610A/en
Pending legal-status Critical Current

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • B23K26/382Removing material by boring or cutting by boring
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70Auxiliary operations or equipment
    • B23K26/702Auxiliary equipment

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

The invention discloses a kind of system and methods of passive zoom laser processing transparent material, and system of the present invention includes laser source, laser source support post, vibration mirror scanning head, scanning lens, host computer, motor, electrical-controlled lifting platform, platform floor, motion control card and galvanometer control card;Method of the present invention is the following steps are included: (1) PC control electrical-controlled lifting platform operates;(2) the X/Y axis movement of PC control vibration mirror scanning head;(3) laser beam that laser source issues is swung by the direction vibration mirror scanning head X/Y;(4) laser beam is focused on transparent material by scanning lens, is processed to material.System light path structure of the present invention is simple, and optical device is few, greatly reduces cost;The method carries out passive zoom to the focus point of laser beam, realizes that transparent material from bottom to top, is successively processed, improves processing efficiency and processing effect, expand the thickness range of material to be processed.

Description

A kind of system and method for passive zoom laser processing transparent material
Technical field
The present invention relates to laser-processing system and method, more particularly to one kind are transparent for glass, quartz and sapphire etc. The passive variable focus laser machining system and method for material.
Background technique
When using laser processing transparent material such as glass, quartz and sapphire, existing method generallys use autozoom Come realize laser three-D cutting and drilling, mainly comprise the steps that (1) laser emit laser beam, laser beam enter In laser cutting head, after the reflection of the first variable curvature reflection unit and the reflection of the second variable curvature reflection unit, then it is poly- through lens group Jiaozhuo is used in workpiece surface;(2) air pressure for adjusting cylinder in the first variable curvature reflection unit and the second variable curvature reflection unit, makes The Deformation Curvature of two reflecting mirrors changes, and then realizes the automatic adjustment of laser beam focal length.Also have currently on the market specially Equipment of the door using the method for such autozoom for laser processing, as Three-Dimensional Dynamic focusing laser galvanometer scanning system is exactly Realize that the material different to thickness such as is cut and punched at the processing technologys by autozoom.
And the existing method laser machined using autozoom, that there are optical paths is complicated for technique device system, Optical device is more, the problem of probability of damage is higher, processing thickness is easy to be restricted, higher cost occurs in device.It would therefore be highly desirable to It solves the above problems.
Summary of the invention
Goal of the invention: in view of the above drawbacks of the prior art, the purpose of the present invention is to provide a kind of passive zoom laser The system and method for transparent material is processed, the Three-Dimensional Dynamic of substitution active dynamic zoom focuses laser galvanometer scanning system, realizes The processing method that transparent material from bottom to top, is successively cut or drilled, while cost is reduced, the three-dimensional for reaching needs is cut It the effects of processing such as cuts and drills.
Technical solution: in order to achieve the above object, the system packet of passive zoom laser processing transparent material of the present invention Include laser source, laser source support post, vibration mirror scanning head, scanning lens, host computer, motor, electrical-controlled lifting platform, platform bottom Plate, motion control card and galvanometer control card;Laser source support post is located on the upside of electrical-controlled lifting platform, and fixes with platform floor Connection.
Further, laser source is fixedly connected on laser source support post.
Further, platform floor is connect with electrical-controlled lifting platform;The top surface of laser source is parallel with platform floor, side It is vertical with platform floor.
Further, transparent material to be processed is placed on electrical-controlled lifting platform, and the electrical-controlled lifting platform is using high Negative-pressure vacuum machine adsorbs the transparent material.
The method of passive zoom laser processing transparent material of the present invention the following steps are included:
(1) host computer is operated by motor control electrical-controlled lifting platform;
(2) while PC control electrical-controlled lifting platform operates, the X/Y axis movement of control vibration mirror scanning head;
(3) galvanometer control card issues control signal, controls the energy and frequency of laser source outgoing laser beam;Laser beam passes through The swing in the direction vibration mirror scanning head X/Y, the figure for keeping laser beam as needed change;
(4) it is focused on transparent material through vibration mirror scanning head laser beam adjusted by scanning lens, material is carried out Processing.
Further, in step (1), host computer sends control instruction to motion control card, and motion control card sends pulse It goes here and there to motor, train of pulse is operated motor based on the received, to drive electrical-controlled lifting platform to carry out rise and fall fortune in real time It is dynamic.
Further, in step (2), host computer sends control instruction and gives galvanometer control card, and galvanometer controls card control galvanometer The X/Y axis of probe moves.
Further, in step (4), laser beam from below to up, cutting and drilling processing is successively carried out to transparent material.
The utility model has the advantages that compared with prior art, the present invention has following remarkable advantage:
(1) structure is simple, at low cost: it is passive that the present invention is carried out by focus point of the adjustment hoistable platform in real time to laser beam The method of zoom, the technique device to compare using the method for traditional autozoom for laser processing, light channel structure is simple, Optical device is few;The price of the motor and electric lifting platform that use is three points that Three-Dimensional Dynamic focuses laser galvanometer scanning system One of to 1/6th, cost of the totle drilling cost well below conventional laser processing unit (plant);
(2) maintenance of equipment is simple: light channel structure of the invention is simple, and optical device is few, therefore optical device damages Probability is low;And because device cost is lower, inventory can be prepared, thus after sale, it is easy to maintenance quick;And conventional three-dimensional dynamic focusing Laser galvanometer scanning system light path is complicated, optical device is more, and it is higher that probability of damage occurs in device, and maintenance difficulty is relatively Greatly, the period is longer;
(3) rapidoprint thickness range is big: method of the invention can be adjusted by electrical-controlled lifting platform is processed The thickness range of transparent material, the maximum gauge of material are shaken in 12mm or so much larger than using conventional three-dimensional dynamic focusing laser When scarnning mirror system is processed, maximum processing thickness 5mm of material or so;
(4) machining accuracy, high-efficient: electrical-controlled lifting platform uses high negative pressure vacuum machine adsorption production, protects positions of materials It is fixed to keep steady;Meanwhile the automatic whereabouts such as powder, clast generated when subsurface material cutting or drilling, and inhaled by high negative pressure vacuum machine It is attached, powder, clast are effectively prevented in incision accumulation, substantially increase cutting, drilling efficiency and kerf quality;Pass through three axis Linkage control is always positioned at light spot focus on machining locus during cutting material, thus realize high-precision, it is high-quality The special-shaped glass of amount is cut, and the high standard that the material cut and edge quality for processing it can satisfy specific industry is wanted It asks.
Detailed description of the invention
Fig. 1 is the system schematic that the passive zoom of the present invention laser machines transparent material;
Fig. 2 is flow chart of the method for the present invention.
Specific embodiment
Technical solution of the present invention is described further with reference to the accompanying drawing.
As shown in Figure 1, the system of passive zoom laser processing transparent material of the present invention includes laser source 1, laser Source support post 2, vibration mirror scanning head 3, scanning lens 4, host computer 5, motor 6, electrical-controlled lifting platform 7, platform floor 8, movement Control card 9 and galvanometer control card 10.
Platform floor 8 and 7 elastic connection of electrical-controlled lifting platform;Laser source support post 2 is located on electrical-controlled lifting platform 7 Side, and be fixedly connected with platform floor 8;Laser source 1 is fixedly connected on 2 on laser source support post, and platform floor 8 passes through precision Processing guarantees the flatness and the depth of parallelism of its upper and lower surface, thus keep the top surface of laser source 1 parallel with platform floor 8, side It is vertical with platform floor 8;The transparent material that need to be processed is placed above in electrical-controlled lifting platform 7, is adsorbed and is produced using high negative pressure vacuum machine Product guarantee position stability.
As shown in Fig. 2, coming the invention also discloses a kind of system using above-mentioned passive zoom laser processing transparent material The method for carrying out passive zoom laser processing transparent material, step include: that the transmission control instruction of (1) host computer 5 is controlled to movement Fabrication 9, motion control card 9 send train of pulse to motor 6, and train of pulse is operated motor 6 based on the received, to drive in real time Executing agency, that is, electrical-controlled lifting platform 7 carries out rise and fall campaign;
(2) it while host computer 5 controls the operating of electrical-controlled lifting platform 7 by motor 6, sends control instruction and is controlled to galvanometer Card 10, the X/Y axis movement of control vibration mirror scanning head 3;
(3) galvanometer control card 10 issues control signal while controlling vibration mirror scanning head 3, and control laser source 1, which projects, to swash The energy and frequency of light beam, laser beam make the figure that laser beam is as needed by the swing in the direction X/Y of vibration mirror scanning head 3 It changes, guarantees that laser facula and predetermined material processing route precision coincide;
(4) it is focused on transparent material through vibration mirror scanning head laser beam adjusted by scanning lens 4, from below to up, Successively carry out cutting and drilling processing.

Claims (8)

1. a kind of system of passive zoom laser processing transparent material, it is characterised in that: supported including laser source (1), laser source Column (2), vibration mirror scanning head (3), scanning lens (4), host computer (5), motor (6), electrical-controlled lifting platform (7), platform floor (8), motion control card (9) and galvanometer control card (10);Laser source support post (2) is located on the upside of electrical-controlled lifting platform (7), and It is fixedly connected with platform floor (8).
2. the system of passive zoom laser processing transparent material according to claim 1, it is characterised in that: laser source (1) It is fixedly connected on laser source support post (2).
3. the system of passive zoom laser processing transparent material according to claim 2, it is characterised in that: platform floor (8) it is connect with electrical-controlled lifting platform (7);The top surface of laser source (1) is parallel with platform floor (8), side and platform floor (8) Vertically.
4. the system of passive zoom laser processing transparent material according to claim 1, it is characterised in that: to be processed is saturating Bright material is placed on electrical-controlled lifting platform (7), and the electrical-controlled lifting platform (7) adsorbs the transparent material using high negative pressure vacuum machine Material.
5. a kind of method of the passive zoom laser processing transparent material based on system described in any one of claim 1-4, It is characterized in that: the following steps are included:
(1) host computer (5) passes through motor (6) control electrical-controlled lifting platform (7) operating;
(2) while host computer (5) control electrical-controlled lifting platform (7) operating, the X-Y axis movement of control vibration mirror scanning head (3);
(3) galvanometer control card (10) issues control signal, controls the energy and frequency of laser source (1) outgoing laser beam;Laser beam By the swing in vibration mirror scanning head (3) direction X-Y, the figure for keeping laser beam as needed changes;
(4) focused on transparent material through vibration mirror scanning head (3) laser beam adjusted by scanning lens (4), to material into Row processing.
6. the method for passive zoom laser processing transparent material according to claim 5, it is characterised in that: in step (1), Host computer (5) sends control instruction and gives motion control card (9), and motion control card (9) sends train of pulse and gives motor (6), motor (6) Train of pulse is operated based on the received, to drive electrical-controlled lifting platform (7) to carry out rise and fall campaign in real time.
7. the method for passive zoom laser processing transparent material according to claim 5, it is characterised in that: in step (2), Host computer (5) sends control instruction and gives galvanometer control card (10), and galvanometer control card (10) controls the X/Y axis of vibration mirror scanning head (3) Movement.
8. the method for passive zoom laser processing transparent material according to claim 5, it is characterised in that: in step (4), Laser beam from below to up, cutting and drilling processing is successively carried out to transparent material.
CN201811009711.XA 2018-08-31 2018-08-31 A kind of system and method for passive zoom laser processing transparent material Pending CN109014610A (en)

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CN201811009711.XA CN109014610A (en) 2018-08-31 2018-08-31 A kind of system and method for passive zoom laser processing transparent material

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Application Number Priority Date Filing Date Title
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110560891A (en) * 2019-09-25 2019-12-13 吉林大学 Device and method for processing transparent dielectric material by using static pressure water to assist nanosecond laser
CN114178718A (en) * 2021-12-31 2022-03-15 南京萃智激光应用技术研究院有限公司 Dust-free laser processing device and method for photomask
CN114619157A (en) * 2022-03-16 2022-06-14 新代科技(苏州)有限公司 Glass drilling device based on 2D galvanometer laser machining and Z-axis movement

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Publication number Priority date Publication date Assignee Title
CN101152819A (en) * 2006-09-28 2008-04-02 深圳市大族激光科技股份有限公司 Device with internal laser carving
CN101564947A (en) * 2009-05-25 2009-10-28 深圳市大族激光科技股份有限公司 Laser marking method on plastic
CN105033464A (en) * 2015-06-04 2015-11-11 武汉立德激光有限公司 Vehicle-mounted laser engraving machine suitable for field application
WO2016050101A1 (en) * 2014-09-30 2016-04-07 广州创乐激光设备有限公司 Controllable distance indication method and controllable distance indication device for 3d laser marking machine
CN107030390A (en) * 2016-02-04 2017-08-11 苏州沃特维自动化系统有限公司 A kind of solar battery sheet cutter device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101152819A (en) * 2006-09-28 2008-04-02 深圳市大族激光科技股份有限公司 Device with internal laser carving
CN101564947A (en) * 2009-05-25 2009-10-28 深圳市大族激光科技股份有限公司 Laser marking method on plastic
WO2016050101A1 (en) * 2014-09-30 2016-04-07 广州创乐激光设备有限公司 Controllable distance indication method and controllable distance indication device for 3d laser marking machine
CN105033464A (en) * 2015-06-04 2015-11-11 武汉立德激光有限公司 Vehicle-mounted laser engraving machine suitable for field application
CN107030390A (en) * 2016-02-04 2017-08-11 苏州沃特维自动化系统有限公司 A kind of solar battery sheet cutter device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110560891A (en) * 2019-09-25 2019-12-13 吉林大学 Device and method for processing transparent dielectric material by using static pressure water to assist nanosecond laser
CN114178718A (en) * 2021-12-31 2022-03-15 南京萃智激光应用技术研究院有限公司 Dust-free laser processing device and method for photomask
CN114619157A (en) * 2022-03-16 2022-06-14 新代科技(苏州)有限公司 Glass drilling device based on 2D galvanometer laser machining and Z-axis movement

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