CN110052723A - A kind of double galvanometer picosecond laser galvanometer equipment of same light source - Google Patents
A kind of double galvanometer picosecond laser galvanometer equipment of same light source Download PDFInfo
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- CN110052723A CN110052723A CN201910307058.3A CN201910307058A CN110052723A CN 110052723 A CN110052723 A CN 110052723A CN 201910307058 A CN201910307058 A CN 201910307058A CN 110052723 A CN110052723 A CN 110052723A
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- Prior art keywords
- galvanometer
- axis
- laser
- axis mobile
- pedestal
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
- B23K26/0673—Dividing the beam into multiple beams, e.g. multifocusing into independently operating sub-beams, e.g. beam multiplexing to provide laser beams for several stations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
- B23K26/0821—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head using multifaceted mirrors, e.g. polygonal mirror
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/54—Glass
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a kind of double galvanometer picosecond laser galvanometer equipment of same light source, including rack, marble pedestal, power distribution cabinet, control system, display system, door operating mechanisms, cover member, vacuum generator, vacuum suction system, XYZ axis mobile system, laser, optical path be integrated, galvanometer, telecentricity variable focus mirror；Marble pedestal is integrally made of pedestal, stand, footstock, is above disposed with and is provided with Y-axis mobile system, X-axis mobile system, two Z axis mobile systems, vacuum suction systems；Telecentricity variable focus mirror and galvanometer are concentric installation；The distance between axle center is consistent；Laser is the other generating device of laser of picosecond.The present invention has ensured product quality consistency with light source；Marble pedestal takes integral structure, cooperates telecentricity variable focus mirror to realize high-precision curve cutting, punching, grooving, edging by galvanometer；Improve machining accuracy, product quality and production efficiency；Technological adaptability is good, has significant practical function.
Description
Technical field
The present invention relates to a kind of laser process equipments mainly to relate to more particularly to a kind of picosecond laser galvanometer precision equipment
And the accurate cutting equipment technical field for glass-cutting.
Background technique
Glassware is used in the every aspect every field of daily life at present, is in great demand.Accordingly not
Cutting processing with glass material also has a large amount of market demand.
With the development of technology, the cutting method of glass is also being constantly updated, at present mainly in laser cutting parameter method
Based on, there is many superiority compared to tradition machinery cutting method, mainly there is melt cut, stress cutting (crackle control
Method), several cutting methods such as ablation (ablation) cutting.(1) laser power that melt-cut method needs is higher, and cut lengths are difficult
Accurately to control, cut surface is coarse, and processing quality is to be improved.(2) stress patterning method can not solve curved surface and abnormity cutting
The problem of.(3) laser ablation (ablation) cutting processing speed is slow, and processing efficiency is not high.
As demand of the market to glass curvilinear cut is increasing, especially in mobile phone manufacturing, manufacturers are uncommon
The screen for hoping production geometry more complicated, including punch on material to accommodate key, control key, LED and camera lens；
Simultaneously the processing thickness range of the glass such as mobile phone touch, cover board and display pannel from 0.03mm to 20mm more than；Glass material
Matter is also different: some glass have passed through chemical strengthening.So existing glass carries out curvilinear cut, punching, grooving, bending, mill
The various curved surfaces such as side and its requirement on machining accuracy of the cutting processing of special-shaped shape are higher and higher.The source, laser apparatus of existing glass-cutting
Standby, marble pedestal structure is single, it constructs the requirement for being unable to satisfy intensity and stability；Galvanometer system is usually all installed simultaneously
On mobile Y or Z axis motion platform, glass can not be met comprehensively and split in cutting profile, cutting accuracy, processing efficiency, cutting
The high-precision requirement of line, cutting intensity, Technological adaptability etc., there are biggish limitations.
Summary of the invention
Goal of the invention: it is directed to the above-mentioned problems of the prior art and deficiency, the object of the present invention is to provide a kind of structures
It consolidates, Technological adaptability is strong, cutting accuracy is high, the double galvanometer picosecond laser galvanometer equipment of the same light source of high production efficiency.
Technical solution: for achieving the above object, the technical solution adopted by the present invention are as follows:
A kind of double galvanometer picosecond laser galvanometer equipment of same light source, including rack, marble pedestal, power distribution cabinet, control system, display
System, door operating mechanisms, cover member, vacuum generator, vacuum suction system, X-axis mobile system, Y-axis mobile system, Z axis move
Dynamic system, further includes: laser, optical path be integrated, galvanometer, telecentricity variable focus mirror；The left and right sides is equipped with and matches above the rack
Electric cabinet, centre are equipped with marble pedestal；The marble pedestal is integrally made of pedestal, left and right two stands, footstocks, left and right
Rear end of pedestal or so position is arranged in two stands, and strip footstock is arranged in above the front end of left and right stand；
It is provided with Y-axis mobile system on the base, is equipped with X-axis mobile system in the top of Y-axis mobile system, is moved in X-axis
Z axis mobile system there are two being set side by side in dynamic system；Vacuum suction system is installed above the Z axis mobile system；Institute
Vacuum suction system is stated to be connected with vacuum generator；
It is the system that the laser issued from laser is divided into two optical paths of same light source by analyzing crystal that the optical path is integrated,
It is mounted on footstock, rear end is connected with laser, and front end is connected with two galvanometers of arranged in parallel along the x axis, the galvanometer
Lower section is equipped with telecentricity variable focus mirror, and the telecentricity variable focus mirror and galvanometer are concentric installation；Described two galvanometer axis
The distance between the distance between heart and two Z axis mobile system centers are consistent；On the outside of the galvanometer of right side, on footstock leading flank
Vision positioning system is installed；The laser is picosecond laser generating device.
Optimization, it includes optical path bottom plate, optical path sealing plate that the optical path is integrated, reflecting mirror, Reflector base, analyzing crystal,
Seperated crystal base, expands mirror support at beam expanding lens；Intersection, orthogonal groove in length and breadth are provided on the optical path bottom plate；
The Reflector base and seperated crystal base are incorporated into the groove on optical path route；The reflecting mirror is mounted on reflecting mirror base
On seat, first group of reflecting mirror projects 90 degree of laser reflection issued from laser on second group of reflecting mirror, second group of reflection
90 degree of laser are reflexed on analyzing crystal on mirror；Analyzing crystal is mounted on seperated crystal base, and is mounted on one group and is expanded
Behind mirror；Laser is divided to by the analyzing crystal penetrates into two optical paths, and an optical path directly passes through the galvanometer of beam expanding lens to front end, separately
One third group reflecting mirror by setting is reflected into another group of beam expanding lens again to the galvanometer of front end.So double galvanometers swash
Light comes from same light source, and power is identical, can be realized simultaneously the processing to the product phase homogenous quantities under double galvanometers, ensures double galvanometers
The consistency of double-station converted products.The particular design of groove can be used for the quick positioning of optical path, cooperate the installation of pedestal fixed
Position can be realized from technique machining angle and position to the accurate angle of optical path；It is also very convenient to adjust replacement.
Specifically, the Y-axis mobile system, comprising: two moving guide rails, Y-axis mobile platform, Y-axis driving motor, bottom
The front and back end of seat is equipped with Y-axis stroke limit item；The X-axis mobile system, comprising: X-axis fixed platform, two X-axis movements are led
Rail, X-axis driving motor, X-axis mobile platform, the X-axis fixed platform are fixedly connected on Y-axis mobile platform, successively set above
There are X-axis moving guide rail, X-axis mobile platform, the left and right sides is equipped with X-axis stroke limit item；The Z axis mobile system is mounted on X
On axis mobile platform, including Z axis driving device, hoistable platform.
Optimization, the Y-axis driving motor, X-axis driving motor is arranged on the back-end location of pedestal.
Optimization, the stand is equipped with hollow structure, and vacuum generator is mounted in hollow structure.
Optimization, the rack is the hardware of projective table type construction, and marble pedestal is mounted on intermediate lands, power distribution cabinet
It is arranged at the low platform of the left and right sides.Such setting can effectively reduce the overall height dimension of equipment, more compact structure
Rationally.
The utility model has the advantages that compared with prior art, the double galvanometer picosecond laser galvanometer equipment of same light source of the invention swash with light source
Double galvanometers of light, power is identical, has ensured product quality consistency；Marble pedestal takes integral structure, whole equipment
Y, X, Z axis mobile system are successively orderly arranged under the overlay from bottom to top, the integrated footstock for being also mounted at marble pedestal of galvanometer optical path
On, the requirement of intensity and stability is met in structure, cooperates telecentricity variable focus mirror to realize to various material glass by galvanometer
Glass includes high-precision curve cutting, the punching, grooving, edging of strengthened glass；Improve machining accuracy, product quality and production effect
Rate；Technological adaptability is good, is particularly suitable for the Precision Machining of electronics industry glass laser；With significant practical function.
Detailed description of the invention
Fig. 1 is main component topology layout figure of the invention；
Fig. 2 is overall structure diagram of the invention；
Fig. 3 is partial structural diagram of the invention;
When Fig. 4 the present invention in optical path integration section topology layout stereoscopic schematic diagram；
Fig. 5 is the topology layout top view of optical path integration section in the present invention.
Wherein: 1 power distribution cabinet, 2 lasers, 3 optical paths are integrated, 4 marble pedestals, 5 Y-axis mobile systems, and 6 X-axis are moved
Dynamic system (X-axis fixed platform 61, X-axis moving guide rail 62, X-axis mobile platform 64, X-axis stroke limit item 63), 7 Z axis move
Dynamic system, 8 vision positioning systems, 9 galvanometers, 10 telecentricity variable focus mirrors, 11 racks, 12 vacuum generators, 13 vacuum suctions
System, 14 door operating mechanisms, 15 cover members, 16 control systems, 17 display systems；
It is integrated in 3 in optical path: 31 optical path bottom plates, 32 optical path sealing plates, 33 reflecting mirrors, 34 reflecting mirror pedestals, 35 analyzing crystals, 36 points
Luminescent crystal pedestal, 37 beam expanding lens, 38 expand mirror support；
In 4 marble pedestals: 41 pedestals, 42 stands, 43 footstocks；
In 5 Y-axis mobile systems: 51 moving guide rails, 52 mobile platforms, 53Y axis stroke limit item；
In 6 X-axis mobile systems: 61 X-axis fixed platforms, 62 X-axis moving guide rails, 64 X-axis mobile platforms, 63 X-axis strokes
Positive stop strip.
Specific embodiment
In the following with reference to the drawings and specific embodiments, the present invention is furture elucidated, it should be understood that these embodiments are merely to illustrate
It the present invention rather than limits the scope of the invention, after the present invention has been read, those skilled in the art are to of the invention each
The modification of kind equivalent form falls within the application range as defined in the appended claims.
As shown in Figure 1, Figure 2, Figure 3 shows, the double galvanometer picosecond laser galvanometer equipment of a kind of same light source, including rack 11, marble
Pedestal 4, power distribution cabinet 1, control system 16, display system 17, door operating mechanisms 14, cover member 15, vacuum generator 12, vacuum are inhaled
Attached system 13, X-axis mobile system 6, Y-axis mobile system 5, Z axis mobile system 7, further includes: laser 2, optical path integrate 3, galvanometer
9, telecentricity variable focus mirror 10；The 11 top left and right sides of rack is equipped with power distribution cabinet 1, and centre is equipped with marble pedestal 4；Marble
Pedestal 4 is integrally made of pedestal 41, two stands 42 in left and right, footstock 43, and the rear end of pedestal 41 is arranged in two stands 42 in left and right
Left and right position, strip footstock 43 are arranged in above the front end of left and right stand 42；The integrated structure mode of marble pedestal this
Setting, can be left and right stand and footstock be firm firm is connected on pedestal, it is ensured that set as reference for installation other
Standby component installation is firm, meets the requirement of equipment intensity and stability, improves machining accuracy.
It is provided with Y-axis mobile system 5 on pedestal 41, X-axis mobile system 6 is equipped in the top of Y-axis mobile system 5, in X
Z axis mobile system 7 there are two being set side by side on axis mobile system 6；The top of Z axis mobile system 7 is equipped with vacuum suction system
13；Vacuum suction system 13 is connected with vacuum generator 12；Such setting, the fortune in tri- directions X, Y, Z of workpieces processing
Row is built up on the benchmark of Y-axis platform movement, substantially increases the precision of workpieces processing cutting.
Optical path integrated 3 is to be by two optical paths that analyzing crystal is divided into same light source by the laser issued from laser
System, is mounted on footstock 43, and rear end is connected with laser 2, and front end is connected with two galvanometers 9 of arranged in parallel along the x axis, vibration
Telecentricity variable focus mirror 10 is installed, telecentricity variable focus mirror 10 and galvanometer 9 are concentric installation below mirror 9；Two 9 axis of galvanometer
The distance between the distance between heart and two 7 centers of Z axis mobile system are consistent；9 outside of galvanometer on right side, in footstock leading flank
On vision positioning system 8 is installed；Laser 2 is picosecond laser generating device.Galvanometer optical path integrated installation is fixed
On footstock, firm stable, workpieces processing movement motionless by galvanometer laser is to realize the cutting operation of relative motion.
As shown in Figure 4, Figure 5, optical path integrated 3 includes optical path bottom plate 31, optical path sealing plate 32, reflecting mirror 33, Reflector base
34, analyzing crystal 35, seperated crystal base 36, beam expanding lens 37, expand mirror support 38；It is provided on the optical path bottom plate 31 vertical
Horizontal intersection, orthogonal groove；Reflector base 34 and seperated crystal base 36 are incorporated into the groove on optical path route；Instead
It penetrates mirror 33 to be mounted on Reflector base 34, first group of reflecting mirror 33 projects for 90 degree of laser reflection issued from laser
On two groups of reflecting mirrors 33,90 degree of laser are reflexed on analyzing crystal on second group of reflecting mirror 33；Analyzing crystal 35 is mounted on point
On body crystal base 36, and it is mounted on behind one group of beam expanding lens 37；Laser is divided to by analyzing crystal 35 penetrates into two optical paths, a light
Road directly passes through the galvanometer 9 of beam expanding lens 37 to front end, and another third group reflecting mirror 33 by setting is reflected into another group of expansion
Beam mirror 37 is again to the galvanometer 9 of front end.So the laser of double galvanometers, comes from same light source, power is identical, can be realized simultaneously to double
The processing of product phase homogenous quantities under galvanometer ensures the consistency of double galvanometer double-station converted products.The particular design of groove, can
With the quick positioning for optical path, the installation of pedestal is cooperated to position, the accurate angle to optical path can be realized from technique machining angle
Degree positioning；It is also very convenient to adjust replacement.
It is as shown in Figure 3: specifically, Y-axis mobile system 5, comprising: two moving guide rails 51, Y-axis mobile platform 52, Y-axis are driven
The front and back end of dynamic motor, pedestal 41 is equipped with Y-axis stroke limit item 53；X-axis mobile system 6, comprising: X-axis fixed platform 61, two
X-axis moving guide rail 62, X-axis driving motor, X-axis mobile platform 64, X-axis fixed platform 61 are fixedly connected on Y-axis mobile platform
On 52, it is successively arranged X-axis moving guide rail 62, X-axis mobile platform 64 above, the left and right sides is equipped with X-axis stroke limit item 63；Z
Axis mobile system 7 is mounted on X-axis mobile platform 64, including Z axis driving device, hoistable platform.
Optimization, Y-axis driving motor, X-axis driving motor is arranged on the back-end location of pedestal 41.
Optimization, stand 42 is equipped with hollow structure, and vacuum generator 12 is mounted in hollow structure.
Optimization, rack 11 is that projective table type constructs hardware, and marble pedestal 4 is mounted on intermediate lands, and power distribution cabinet 1 is set
It sets at the low platform of the left and right sides.Such setting, can effectively reduce the overall height dimension of equipment, and more compact structure is closed
Reason.
Vacuum suction system is the small-sized absorption platform that inside is cavity, upper surface be equipped with it is multiple be connected to cavity it is small
Hole, side or lower part are provided with the multiple through-holes being connected to cavity, and wherein at least one through-hole is connect with vacuum generator.Carry out essence
When close glassware is processed, by absorption of workpieces on absorption platform, processing is completed.
For the precision for guaranteeing processing, two galvanometers in left and right are located on the axis of same X-direction, and longitudinal separation deviation is by vision
Positioning system is adjusted within the scope of small deviation after carrying out contraposition detection, it is possible thereby to guarantee the glass on the vacuum suction system of left and right
Glass workpiece processing quality is consistent with precision.
The double galvanometer picosecond laser galvanometer equipment of same light source of the invention, Y, X of whole equipment, Z axis mobile system from it is lower to
On be successively orderly arranged under the overlay, the mobile system structural arrangement novelty of three dimensions is compact, suitable for high-precision processing request
The laser processing of tiny glass artifacts is combined by Y, X-axis mobile system, forms the operation platform of two dimensions, can be arbitrarily real
The processing requests such as existing curvilinear cut, bending, edging；On the basis of the operation platform of two dimensions, after increasing Z axis mobile system,
The aggregate motions of three dimension motion platforms such as moves up and down, it can be achieved that the high-precision such as punching, grooving in glass-cutting is processed
By the embedded processing of spacing staggered floor, the processing request of different depth different-thickness glass material can be met.
Laser, optical path be integrated simultaneously, galvanometer, telecentricity variable focus microscope group at laser light path system, installation site is solid
Fixed motionless, avoiding influences because focusing caused by the installation error of mobile or vibration or mounting parts, and focusing stabilizer is lasting
Property is good；Galvanometer and the high-precision concentric composite structure of telecentricity variable focus mirror, the focal beam spot of acquisition is more tiny, can satisfy
High-precision processing request.(1) telecentricity variable focus mirror is cooperated to realize that picosecond stress cuts and melt the same of cutting by galvanometer
Optical path is exported with cutting head laser；(2) punching of glass, grooving even edging are realized by ablation cutting；(3) by galvanometer and
Stress cutting realizes that curved surface profile, cutting accuracy, processing efficiency, cutting intensity are greatly improved；(4) pass through spacing staggered floor
The form of insertion realizes deep glass processing, makes glass easily separated, and crackle very little.Synthesis solves existing melt cut
Precision and intensity, needed after processing edging slagging-off etc. prior art problems；Solve stress cutting can not punch, grooving and
The technical problem cut on curved surface；Also solve the problems, such as that laser ablation ablation cutting equipment is inefficient simultaneously.It, can using the present invention
To realize that the various material glass from 0.03mm to 20mm include high-precision curve cutting, the punching, grooving, mill of strengthened glass
Side.
The double galvanometer picosecond laser galvanometer equipment of same light source of the invention, the double galvanometers for source laser of sharing the same light, power is identical, protects
Product quality consistency is hindered；Marble pedestal takes integral structure, and Y, X of whole equipment, Z axis mobile system are from bottom to top
It is successively orderly arranged under the overlay, galvanometer optical path is integrated to be also mounted on the footstock of marble pedestal, and intensity and steady is met in structure
It qualitatively requires, cooperates the realization of telecentricity variable focus mirror to include that the high-precision of strengthened glass is write music to various material glass by galvanometer
Wire cutting, punching, grooving, edging；Improve machining accuracy, product quality and production efficiency；Technological adaptability is good, is particularly suitable for
The Precision Machining of electronics industry glass laser；With significant practical function.
Claims (6)
1. a kind of double galvanometer picosecond laser galvanometer equipment of same light source, including rack (11), marble pedestal (4), power distribution cabinet (1),
Control system (16), display system (17), door operating mechanisms (14), cover member (15), vacuum generator (12), vacuum suction system
System (13), X-axis mobile system (6), Y-axis mobile system (5), Z axis mobile system (7), it is characterised in that: further include laser
(2), optical path integrates (3), galvanometer (9), telecentricity variable focus mirror (10)；The left and right sides is equipped with power distribution cabinet above the rack (11)
(1), centre is equipped with marble pedestal (4)；The marble pedestal (4) is by pedestal (41), left and right two stands (42), footstocks
(43) one composition, stand (42) setting of left and right two is in the rear end of pedestal (41) or so position, strip footstock (43) setting
On the front end of left and right stand (42)；
It is provided with Y-axis mobile system (5) on the pedestal (41), is equipped with the mobile system of X-axis in the top of Y-axis mobile system (5)
It unites (6), is set side by side on X-axis mobile system (6) there are two Z axis mobile system (7)；The top of the Z axis mobile system (7)
Vacuum suction system (13) are installed；The vacuum suction system (13) is connected with vacuum generator (12)；
It is to be by two optical paths that analyzing crystal is divided into same light source by the laser issued from laser that the optical path, which integrates (3),
System, is mounted on footstock (43), rear end is connected with laser (2), and front end is connected with two galvanometers of arranged in parallel along the x axis
(9), telecentricity variable focus mirror (10) is installed below the galvanometer (9), the telecentricity variable focus mirror (10) is with galvanometer (9)
Concentric installation；The distance between two Z axis mobile system (7) centers in the distance between described two galvanometer (9) axle center one
It causes；On right side on the outside of galvanometer (9), vision positioning system (8) are installed on footstock leading flank；The laser (2) is picosecond
Generating device of laser.
2. the double galvanometer picosecond laser galvanometer equipment of same light source according to claim 1, it is characterised in that: the optical path is integrated
It (3) include optical path bottom plate (31), optical path sealing plate (32), reflecting mirror (33), Reflector base (34), analyzing crystal (35), fission
Crystal base (36), expands mirror support (38) at beam expanding lens (37)；Intersection, phase in length and breadth are provided on the optical path bottom plate (31)
Mutually vertical groove；The Reflector base (34) and seperated crystal base (36) are incorporated into the groove on optical path route；Institute
It states reflecting mirror (33) to be mounted on Reflector base (34), the laser reflection 90 that first group of reflecting mirror (33) will issue from laser
Degree projects on second group of reflecting mirror (33), reflexes to 90 degree of laser on analyzing crystal (35) on second group of reflecting mirror (33)；
The analyzing crystal (35) is mounted on seperated crystal base (36), and is mounted on behind one group of beam expanding lens 37；The light splitting is brilliant
Laser is divided to by body (35) penetrates into two optical paths, and an optical path directly passes through the galvanometer (9) of beam expanding lens (37) to front end, another warp
The third group reflecting mirror (33) for crossing setting, is reflected into another group of beam expanding lens (37) again to the galvanometer (9) of front end.
3. the double galvanometer picosecond laser galvanometer equipment of same light source according to claim 1, it is characterised in that: the Y-axis is mobile
System (5), comprising: two moving guide rails (51), Y-axis mobile platform (52), Y-axis driving motor, the front and back of the pedestal (41)
End is equipped with Y-axis stroke limit item (53)；The X-axis mobile system (6), comprising: X-axis fixed platform (61), two X-axis are mobile
Guide rail (62), X-axis driving motor, X-axis mobile platform (64), the X-axis fixed platform (61) are fixedly connected on Y-axis mobile platform
(52) it on, is successively arranged above X-axis moving guide rail (62), X-axis mobile platform (64), the left and right sides is equipped with X-axis stroke limit
Item (63)；The Z axis mobile system (7) is mounted on X-axis mobile platform (64), including Z axis driving device, hoistable platform.
4. the double galvanometer picosecond laser galvanometer equipment of same light source according to claim 3, it is characterised in that: the Y-axis driving
Motor, X-axis driving motor are arranged on the back-end location of pedestal (41).
5. the double galvanometer picosecond laser galvanometer equipment of same light source according to claim 1, it is characterised in that: the stand (42)
Equipped with hollow structure, vacuum generator (12) is mounted in hollow structure.
6. the double galvanometer picosecond laser galvanometer equipment of same light source according to claim 1, it is characterised in that: the rack (11)
For the hardware of projective table type construction, marble pedestal (4) is mounted on intermediate lands, and power distribution cabinet (1) setting is in left and right two
At the low platform of side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910307058.3A CN110052723A (en) | 2019-04-17 | 2019-04-17 | A kind of double galvanometer picosecond laser galvanometer equipment of same light source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910307058.3A CN110052723A (en) | 2019-04-17 | 2019-04-17 | A kind of double galvanometer picosecond laser galvanometer equipment of same light source |
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| Publication Number | Publication Date |
|---|---|
| CN110052723A true CN110052723A (en) | 2019-07-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910307058.3A Pending CN110052723A (en) | 2019-04-17 | 2019-04-17 | A kind of double galvanometer picosecond laser galvanometer equipment of same light source |
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| Country | Link |
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| CN (1) | CN110052723A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110434471A (en) * | 2019-08-21 | 2019-11-12 | 南京魔迪多维数码科技有限公司 | The experimental provision of integrated three kinds of laser processing technologies |
| CN111482718A (en) * | 2020-05-18 | 2020-08-04 | 名光智能科技(佛山)有限公司 | High-precision gantry laser cutting equipment |
| CN113618251A (en) * | 2021-08-04 | 2021-11-09 | 昆山燎原自动化设备有限责任公司 | Laser processing equipment for substrate scribing |
| CN117226280A (en) * | 2023-11-13 | 2023-12-15 | 珠海市申科谱工业科技有限公司 | Full-automatic laser marking equipment |
-
2019
- 2019-04-17 CN CN201910307058.3A patent/CN110052723A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110434471A (en) * | 2019-08-21 | 2019-11-12 | 南京魔迪多维数码科技有限公司 | The experimental provision of integrated three kinds of laser processing technologies |
| CN111482718A (en) * | 2020-05-18 | 2020-08-04 | 名光智能科技(佛山)有限公司 | High-precision gantry laser cutting equipment |
| CN113618251A (en) * | 2021-08-04 | 2021-11-09 | 昆山燎原自动化设备有限责任公司 | Laser processing equipment for substrate scribing |
| CN117226280A (en) * | 2023-11-13 | 2023-12-15 | 珠海市申科谱工业科技有限公司 | Full-automatic laser marking equipment |
| CN117226280B (en) * | 2023-11-13 | 2024-03-19 | 珠海市申科谱工业科技有限公司 | Full-automatic laser marking equipment |
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