CN110052723A - A kind of double galvanometer picosecond laser galvanometer equipment of same light source - Google Patents

A kind of double galvanometer picosecond laser galvanometer equipment of same light source Download PDF

Info

Publication number
CN110052723A
CN110052723A CN201910307058.3A CN201910307058A CN110052723A CN 110052723 A CN110052723 A CN 110052723A CN 201910307058 A CN201910307058 A CN 201910307058A CN 110052723 A CN110052723 A CN 110052723A
Authority
CN
China
Prior art keywords
galvanometer
axis
laser
axis mobile
pedestal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201910307058.3A
Other languages
Chinese (zh)
Inventor
陈刚
袁聪
万光健
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
WUHAN GSTAR TECHNOLOGY Co Ltd
Original Assignee
WUHAN GSTAR TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by WUHAN GSTAR TECHNOLOGY Co Ltd filed Critical WUHAN GSTAR TECHNOLOGY Co Ltd
Priority to CN201910307058.3A priority Critical patent/CN110052723A/en
Publication of CN110052723A publication Critical patent/CN110052723A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067Dividing the beam into multiple beams, e.g. multifocusing
    • B23K26/0673Dividing the beam into multiple beams, e.g. multifocusing into independently operating sub-beams, e.g. beam multiplexing to provide laser beams for several stations
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/082Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B23K26/0821Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head using multifaceted mirrors, e.g. polygonal mirror
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70Auxiliary operations or equipment
    • B23K26/702Auxiliary equipment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/50Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/54Glass

Abstract

The invention discloses a kind of double galvanometer picosecond laser galvanometer equipment of same light source, including rack, marble pedestal, power distribution cabinet, control system, display system, door operating mechanisms, cover member, vacuum generator, vacuum suction system, XYZ axis mobile system, laser, optical path be integrated, galvanometer, telecentricity variable focus mirror;Marble pedestal is integrally made of pedestal, stand, footstock, is above disposed with and is provided with Y-axis mobile system, X-axis mobile system, two Z axis mobile systems, vacuum suction systems;Telecentricity variable focus mirror and galvanometer are concentric installation;The distance between axle center is consistent;Laser is the other generating device of laser of picosecond.The present invention has ensured product quality consistency with light source;Marble pedestal takes integral structure, cooperates telecentricity variable focus mirror to realize high-precision curve cutting, punching, grooving, edging by galvanometer;Improve machining accuracy, product quality and production efficiency;Technological adaptability is good, has significant practical function.

Description

A kind of double galvanometer picosecond laser galvanometer equipment of same light source
Technical field
The present invention relates to a kind of laser process equipments mainly to relate to more particularly to a kind of picosecond laser galvanometer precision equipment And the accurate cutting equipment technical field for glass-cutting.
Background technique
Glassware is used in the every aspect every field of daily life at present, is in great demand.Accordingly not Cutting processing with glass material also has a large amount of market demand.
With the development of technology, the cutting method of glass is also being constantly updated, at present mainly in laser cutting parameter method Based on, there is many superiority compared to tradition machinery cutting method, mainly there is melt cut, stress cutting (crackle control Method), several cutting methods such as ablation (ablation) cutting.(1) laser power that melt-cut method needs is higher, and cut lengths are difficult Accurately to control, cut surface is coarse, and processing quality is to be improved.(2) stress patterning method can not solve curved surface and abnormity cutting The problem of.(3) laser ablation (ablation) cutting processing speed is slow, and processing efficiency is not high.
As demand of the market to glass curvilinear cut is increasing, especially in mobile phone manufacturing, manufacturers are uncommon The screen for hoping production geometry more complicated, including punch on material to accommodate key, control key, LED and camera lens; Simultaneously the processing thickness range of the glass such as mobile phone touch, cover board and display pannel from 0.03mm to 20mm more than;Glass material Matter is also different: some glass have passed through chemical strengthening.So existing glass carries out curvilinear cut, punching, grooving, bending, mill The various curved surfaces such as side and its requirement on machining accuracy of the cutting processing of special-shaped shape are higher and higher.The source, laser apparatus of existing glass-cutting Standby, marble pedestal structure is single, it constructs the requirement for being unable to satisfy intensity and stability;Galvanometer system is usually all installed simultaneously On mobile Y or Z axis motion platform, glass can not be met comprehensively and split in cutting profile, cutting accuracy, processing efficiency, cutting The high-precision requirement of line, cutting intensity, Technological adaptability etc., there are biggish limitations.
Summary of the invention
Goal of the invention: it is directed to the above-mentioned problems of the prior art and deficiency, the object of the present invention is to provide a kind of structures It consolidates, Technological adaptability is strong, cutting accuracy is high, the double galvanometer picosecond laser galvanometer equipment of the same light source of high production efficiency.
Technical solution: for achieving the above object, the technical solution adopted by the present invention are as follows:
A kind of double galvanometer picosecond laser galvanometer equipment of same light source, including rack, marble pedestal, power distribution cabinet, control system, display System, door operating mechanisms, cover member, vacuum generator, vacuum suction system, X-axis mobile system, Y-axis mobile system, Z axis move Dynamic system, further includes: laser, optical path be integrated, galvanometer, telecentricity variable focus mirror;The left and right sides is equipped with and matches above the rack Electric cabinet, centre are equipped with marble pedestal;The marble pedestal is integrally made of pedestal, left and right two stands, footstocks, left and right Rear end of pedestal or so position is arranged in two stands, and strip footstock is arranged in above the front end of left and right stand;
It is provided with Y-axis mobile system on the base, is equipped with X-axis mobile system in the top of Y-axis mobile system, is moved in X-axis Z axis mobile system there are two being set side by side in dynamic system;Vacuum suction system is installed above the Z axis mobile system;Institute Vacuum suction system is stated to be connected with vacuum generator;
It is the system that the laser issued from laser is divided into two optical paths of same light source by analyzing crystal that the optical path is integrated, It is mounted on footstock, rear end is connected with laser, and front end is connected with two galvanometers of arranged in parallel along the x axis, the galvanometer Lower section is equipped with telecentricity variable focus mirror, and the telecentricity variable focus mirror and galvanometer are concentric installation;Described two galvanometer axis The distance between the distance between heart and two Z axis mobile system centers are consistent;On the outside of the galvanometer of right side, on footstock leading flank Vision positioning system is installed;The laser is picosecond laser generating device.
Optimization, it includes optical path bottom plate, optical path sealing plate that the optical path is integrated, reflecting mirror, Reflector base, analyzing crystal, Seperated crystal base, expands mirror support at beam expanding lens;Intersection, orthogonal groove in length and breadth are provided on the optical path bottom plate; The Reflector base and seperated crystal base are incorporated into the groove on optical path route;The reflecting mirror is mounted on reflecting mirror base On seat, first group of reflecting mirror projects 90 degree of laser reflection issued from laser on second group of reflecting mirror, second group of reflection 90 degree of laser are reflexed on analyzing crystal on mirror;Analyzing crystal is mounted on seperated crystal base, and is mounted on one group and is expanded Behind mirror;Laser is divided to by the analyzing crystal penetrates into two optical paths, and an optical path directly passes through the galvanometer of beam expanding lens to front end, separately One third group reflecting mirror by setting is reflected into another group of beam expanding lens again to the galvanometer of front end.So double galvanometers swash Light comes from same light source, and power is identical, can be realized simultaneously the processing to the product phase homogenous quantities under double galvanometers, ensures double galvanometers The consistency of double-station converted products.The particular design of groove can be used for the quick positioning of optical path, cooperate the installation of pedestal fixed Position can be realized from technique machining angle and position to the accurate angle of optical path;It is also very convenient to adjust replacement.
Specifically, the Y-axis mobile system, comprising: two moving guide rails, Y-axis mobile platform, Y-axis driving motor, bottom The front and back end of seat is equipped with Y-axis stroke limit item;The X-axis mobile system, comprising: X-axis fixed platform, two X-axis movements are led Rail, X-axis driving motor, X-axis mobile platform, the X-axis fixed platform are fixedly connected on Y-axis mobile platform, successively set above There are X-axis moving guide rail, X-axis mobile platform, the left and right sides is equipped with X-axis stroke limit item;The Z axis mobile system is mounted on X On axis mobile platform, including Z axis driving device, hoistable platform.
Optimization, the Y-axis driving motor, X-axis driving motor is arranged on the back-end location of pedestal.
Optimization, the stand is equipped with hollow structure, and vacuum generator is mounted in hollow structure.
Optimization, the rack is the hardware of projective table type construction, and marble pedestal is mounted on intermediate lands, power distribution cabinet It is arranged at the low platform of the left and right sides.Such setting can effectively reduce the overall height dimension of equipment, more compact structure Rationally.
The utility model has the advantages that compared with prior art, the double galvanometer picosecond laser galvanometer equipment of same light source of the invention swash with light source Double galvanometers of light, power is identical, has ensured product quality consistency;Marble pedestal takes integral structure, whole equipment Y, X, Z axis mobile system are successively orderly arranged under the overlay from bottom to top, the integrated footstock for being also mounted at marble pedestal of galvanometer optical path On, the requirement of intensity and stability is met in structure, cooperates telecentricity variable focus mirror to realize to various material glass by galvanometer Glass includes high-precision curve cutting, the punching, grooving, edging of strengthened glass;Improve machining accuracy, product quality and production effect Rate;Technological adaptability is good, is particularly suitable for the Precision Machining of electronics industry glass laser;With significant practical function.
Detailed description of the invention
Fig. 1 is main component topology layout figure of the invention;
Fig. 2 is overall structure diagram of the invention;
Fig. 3 is partial structural diagram of the invention;
When Fig. 4 the present invention in optical path integration section topology layout stereoscopic schematic diagram;
Fig. 5 is the topology layout top view of optical path integration section in the present invention.
Wherein: 1 power distribution cabinet, 2 lasers, 3 optical paths are integrated, 4 marble pedestals, 5 Y-axis mobile systems, and 6 X-axis are moved Dynamic system (X-axis fixed platform 61, X-axis moving guide rail 62, X-axis mobile platform 64, X-axis stroke limit item 63), 7 Z axis move Dynamic system, 8 vision positioning systems, 9 galvanometers, 10 telecentricity variable focus mirrors, 11 racks, 12 vacuum generators, 13 vacuum suctions System, 14 door operating mechanisms, 15 cover members, 16 control systems, 17 display systems;
It is integrated in 3 in optical path: 31 optical path bottom plates, 32 optical path sealing plates, 33 reflecting mirrors, 34 reflecting mirror pedestals, 35 analyzing crystals, 36 points Luminescent crystal pedestal, 37 beam expanding lens, 38 expand mirror support;
In 4 marble pedestals: 41 pedestals, 42 stands, 43 footstocks;
In 5 Y-axis mobile systems: 51 moving guide rails, 52 mobile platforms, 53Y axis stroke limit item;
In 6 X-axis mobile systems: 61 X-axis fixed platforms, 62 X-axis moving guide rails, 64 X-axis mobile platforms, 63 X-axis strokes Positive stop strip.
Specific embodiment
In the following with reference to the drawings and specific embodiments, the present invention is furture elucidated, it should be understood that these embodiments are merely to illustrate It the present invention rather than limits the scope of the invention, after the present invention has been read, those skilled in the art are to of the invention each The modification of kind equivalent form falls within the application range as defined in the appended claims.
As shown in Figure 1, Figure 2, Figure 3 shows, the double galvanometer picosecond laser galvanometer equipment of a kind of same light source, including rack 11, marble Pedestal 4, power distribution cabinet 1, control system 16, display system 17, door operating mechanisms 14, cover member 15, vacuum generator 12, vacuum are inhaled Attached system 13, X-axis mobile system 6, Y-axis mobile system 5, Z axis mobile system 7, further includes: laser 2, optical path integrate 3, galvanometer 9, telecentricity variable focus mirror 10;The 11 top left and right sides of rack is equipped with power distribution cabinet 1, and centre is equipped with marble pedestal 4;Marble Pedestal 4 is integrally made of pedestal 41, two stands 42 in left and right, footstock 43, and the rear end of pedestal 41 is arranged in two stands 42 in left and right Left and right position, strip footstock 43 are arranged in above the front end of left and right stand 42;The integrated structure mode of marble pedestal this Setting, can be left and right stand and footstock be firm firm is connected on pedestal, it is ensured that set as reference for installation other Standby component installation is firm, meets the requirement of equipment intensity and stability, improves machining accuracy.
It is provided with Y-axis mobile system 5 on pedestal 41, X-axis mobile system 6 is equipped in the top of Y-axis mobile system 5, in X Z axis mobile system 7 there are two being set side by side on axis mobile system 6;The top of Z axis mobile system 7 is equipped with vacuum suction system 13;Vacuum suction system 13 is connected with vacuum generator 12;Such setting, the fortune in tri- directions X, Y, Z of workpieces processing Row is built up on the benchmark of Y-axis platform movement, substantially increases the precision of workpieces processing cutting.
Optical path integrated 3 is to be by two optical paths that analyzing crystal is divided into same light source by the laser issued from laser System, is mounted on footstock 43, and rear end is connected with laser 2, and front end is connected with two galvanometers 9 of arranged in parallel along the x axis, vibration Telecentricity variable focus mirror 10 is installed, telecentricity variable focus mirror 10 and galvanometer 9 are concentric installation below mirror 9;Two 9 axis of galvanometer The distance between the distance between heart and two 7 centers of Z axis mobile system are consistent;9 outside of galvanometer on right side, in footstock leading flank On vision positioning system 8 is installed;Laser 2 is picosecond laser generating device.Galvanometer optical path integrated installation is fixed On footstock, firm stable, workpieces processing movement motionless by galvanometer laser is to realize the cutting operation of relative motion.
As shown in Figure 4, Figure 5, optical path integrated 3 includes optical path bottom plate 31, optical path sealing plate 32, reflecting mirror 33, Reflector base 34, analyzing crystal 35, seperated crystal base 36, beam expanding lens 37, expand mirror support 38;It is provided on the optical path bottom plate 31 vertical Horizontal intersection, orthogonal groove;Reflector base 34 and seperated crystal base 36 are incorporated into the groove on optical path route;Instead It penetrates mirror 33 to be mounted on Reflector base 34, first group of reflecting mirror 33 projects for 90 degree of laser reflection issued from laser On two groups of reflecting mirrors 33,90 degree of laser are reflexed on analyzing crystal on second group of reflecting mirror 33;Analyzing crystal 35 is mounted on point On body crystal base 36, and it is mounted on behind one group of beam expanding lens 37;Laser is divided to by analyzing crystal 35 penetrates into two optical paths, a light Road directly passes through the galvanometer 9 of beam expanding lens 37 to front end, and another third group reflecting mirror 33 by setting is reflected into another group of expansion Beam mirror 37 is again to the galvanometer 9 of front end.So the laser of double galvanometers, comes from same light source, power is identical, can be realized simultaneously to double The processing of product phase homogenous quantities under galvanometer ensures the consistency of double galvanometer double-station converted products.The particular design of groove, can With the quick positioning for optical path, the installation of pedestal is cooperated to position, the accurate angle to optical path can be realized from technique machining angle Degree positioning;It is also very convenient to adjust replacement.
It is as shown in Figure 3: specifically, Y-axis mobile system 5, comprising: two moving guide rails 51, Y-axis mobile platform 52, Y-axis are driven The front and back end of dynamic motor, pedestal 41 is equipped with Y-axis stroke limit item 53;X-axis mobile system 6, comprising: X-axis fixed platform 61, two X-axis moving guide rail 62, X-axis driving motor, X-axis mobile platform 64, X-axis fixed platform 61 are fixedly connected on Y-axis mobile platform On 52, it is successively arranged X-axis moving guide rail 62, X-axis mobile platform 64 above, the left and right sides is equipped with X-axis stroke limit item 63;Z Axis mobile system 7 is mounted on X-axis mobile platform 64, including Z axis driving device, hoistable platform.
Optimization, Y-axis driving motor, X-axis driving motor is arranged on the back-end location of pedestal 41.
Optimization, stand 42 is equipped with hollow structure, and vacuum generator 12 is mounted in hollow structure.
Optimization, rack 11 is that projective table type constructs hardware, and marble pedestal 4 is mounted on intermediate lands, and power distribution cabinet 1 is set It sets at the low platform of the left and right sides.Such setting, can effectively reduce the overall height dimension of equipment, and more compact structure is closed Reason.
Vacuum suction system is the small-sized absorption platform that inside is cavity, upper surface be equipped with it is multiple be connected to cavity it is small Hole, side or lower part are provided with the multiple through-holes being connected to cavity, and wherein at least one through-hole is connect with vacuum generator.Carry out essence When close glassware is processed, by absorption of workpieces on absorption platform, processing is completed.
For the precision for guaranteeing processing, two galvanometers in left and right are located on the axis of same X-direction, and longitudinal separation deviation is by vision Positioning system is adjusted within the scope of small deviation after carrying out contraposition detection, it is possible thereby to guarantee the glass on the vacuum suction system of left and right Glass workpiece processing quality is consistent with precision.
The double galvanometer picosecond laser galvanometer equipment of same light source of the invention, Y, X of whole equipment, Z axis mobile system from it is lower to On be successively orderly arranged under the overlay, the mobile system structural arrangement novelty of three dimensions is compact, suitable for high-precision processing request The laser processing of tiny glass artifacts is combined by Y, X-axis mobile system, forms the operation platform of two dimensions, can be arbitrarily real The processing requests such as existing curvilinear cut, bending, edging;On the basis of the operation platform of two dimensions, after increasing Z axis mobile system, The aggregate motions of three dimension motion platforms such as moves up and down, it can be achieved that the high-precision such as punching, grooving in glass-cutting is processed By the embedded processing of spacing staggered floor, the processing request of different depth different-thickness glass material can be met.
Laser, optical path be integrated simultaneously, galvanometer, telecentricity variable focus microscope group at laser light path system, installation site is solid Fixed motionless, avoiding influences because focusing caused by the installation error of mobile or vibration or mounting parts, and focusing stabilizer is lasting Property is good;Galvanometer and the high-precision concentric composite structure of telecentricity variable focus mirror, the focal beam spot of acquisition is more tiny, can satisfy High-precision processing request.(1) telecentricity variable focus mirror is cooperated to realize that picosecond stress cuts and melt the same of cutting by galvanometer Optical path is exported with cutting head laser;(2) punching of glass, grooving even edging are realized by ablation cutting;(3) by galvanometer and Stress cutting realizes that curved surface profile, cutting accuracy, processing efficiency, cutting intensity are greatly improved;(4) pass through spacing staggered floor The form of insertion realizes deep glass processing, makes glass easily separated, and crackle very little.Synthesis solves existing melt cut Precision and intensity, needed after processing edging slagging-off etc. prior art problems;Solve stress cutting can not punch, grooving and The technical problem cut on curved surface;Also solve the problems, such as that laser ablation ablation cutting equipment is inefficient simultaneously.It, can using the present invention To realize that the various material glass from 0.03mm to 20mm include high-precision curve cutting, the punching, grooving, mill of strengthened glass Side.
The double galvanometer picosecond laser galvanometer equipment of same light source of the invention, the double galvanometers for source laser of sharing the same light, power is identical, protects Product quality consistency is hindered;Marble pedestal takes integral structure, and Y, X of whole equipment, Z axis mobile system are from bottom to top It is successively orderly arranged under the overlay, galvanometer optical path is integrated to be also mounted on the footstock of marble pedestal, and intensity and steady is met in structure It qualitatively requires, cooperates the realization of telecentricity variable focus mirror to include that the high-precision of strengthened glass is write music to various material glass by galvanometer Wire cutting, punching, grooving, edging;Improve machining accuracy, product quality and production efficiency;Technological adaptability is good, is particularly suitable for The Precision Machining of electronics industry glass laser;With significant practical function.

Claims (6)

1. a kind of double galvanometer picosecond laser galvanometer equipment of same light source, including rack (11), marble pedestal (4), power distribution cabinet (1), Control system (16), display system (17), door operating mechanisms (14), cover member (15), vacuum generator (12), vacuum suction system System (13), X-axis mobile system (6), Y-axis mobile system (5), Z axis mobile system (7), it is characterised in that: further include laser (2), optical path integrates (3), galvanometer (9), telecentricity variable focus mirror (10);The left and right sides is equipped with power distribution cabinet above the rack (11) (1), centre is equipped with marble pedestal (4);The marble pedestal (4) is by pedestal (41), left and right two stands (42), footstocks (43) one composition, stand (42) setting of left and right two is in the rear end of pedestal (41) or so position, strip footstock (43) setting On the front end of left and right stand (42);
It is provided with Y-axis mobile system (5) on the pedestal (41), is equipped with the mobile system of X-axis in the top of Y-axis mobile system (5) It unites (6), is set side by side on X-axis mobile system (6) there are two Z axis mobile system (7);The top of the Z axis mobile system (7) Vacuum suction system (13) are installed;The vacuum suction system (13) is connected with vacuum generator (12);
It is to be by two optical paths that analyzing crystal is divided into same light source by the laser issued from laser that the optical path, which integrates (3), System, is mounted on footstock (43), rear end is connected with laser (2), and front end is connected with two galvanometers of arranged in parallel along the x axis (9), telecentricity variable focus mirror (10) is installed below the galvanometer (9), the telecentricity variable focus mirror (10) is with galvanometer (9) Concentric installation;The distance between two Z axis mobile system (7) centers in the distance between described two galvanometer (9) axle center one It causes;On right side on the outside of galvanometer (9), vision positioning system (8) are installed on footstock leading flank;The laser (2) is picosecond Generating device of laser.
2. the double galvanometer picosecond laser galvanometer equipment of same light source according to claim 1, it is characterised in that: the optical path is integrated It (3) include optical path bottom plate (31), optical path sealing plate (32), reflecting mirror (33), Reflector base (34), analyzing crystal (35), fission Crystal base (36), expands mirror support (38) at beam expanding lens (37);Intersection, phase in length and breadth are provided on the optical path bottom plate (31) Mutually vertical groove;The Reflector base (34) and seperated crystal base (36) are incorporated into the groove on optical path route;Institute It states reflecting mirror (33) to be mounted on Reflector base (34), the laser reflection 90 that first group of reflecting mirror (33) will issue from laser Degree projects on second group of reflecting mirror (33), reflexes to 90 degree of laser on analyzing crystal (35) on second group of reflecting mirror (33); The analyzing crystal (35) is mounted on seperated crystal base (36), and is mounted on behind one group of beam expanding lens 37;The light splitting is brilliant Laser is divided to by body (35) penetrates into two optical paths, and an optical path directly passes through the galvanometer (9) of beam expanding lens (37) to front end, another warp The third group reflecting mirror (33) for crossing setting, is reflected into another group of beam expanding lens (37) again to the galvanometer (9) of front end.
3. the double galvanometer picosecond laser galvanometer equipment of same light source according to claim 1, it is characterised in that: the Y-axis is mobile System (5), comprising: two moving guide rails (51), Y-axis mobile platform (52), Y-axis driving motor, the front and back of the pedestal (41) End is equipped with Y-axis stroke limit item (53);The X-axis mobile system (6), comprising: X-axis fixed platform (61), two X-axis are mobile Guide rail (62), X-axis driving motor, X-axis mobile platform (64), the X-axis fixed platform (61) are fixedly connected on Y-axis mobile platform (52) it on, is successively arranged above X-axis moving guide rail (62), X-axis mobile platform (64), the left and right sides is equipped with X-axis stroke limit Item (63);The Z axis mobile system (7) is mounted on X-axis mobile platform (64), including Z axis driving device, hoistable platform.
4. the double galvanometer picosecond laser galvanometer equipment of same light source according to claim 3, it is characterised in that: the Y-axis driving Motor, X-axis driving motor are arranged on the back-end location of pedestal (41).
5. the double galvanometer picosecond laser galvanometer equipment of same light source according to claim 1, it is characterised in that: the stand (42) Equipped with hollow structure, vacuum generator (12) is mounted in hollow structure.
6. the double galvanometer picosecond laser galvanometer equipment of same light source according to claim 1, it is characterised in that: the rack (11) For the hardware of projective table type construction, marble pedestal (4) is mounted on intermediate lands, and power distribution cabinet (1) setting is in left and right two At the low platform of side.
CN201910307058.3A 2019-04-17 2019-04-17 A kind of double galvanometer picosecond laser galvanometer equipment of same light source Pending CN110052723A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201910307058.3A CN110052723A (en) 2019-04-17 2019-04-17 A kind of double galvanometer picosecond laser galvanometer equipment of same light source

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201910307058.3A CN110052723A (en) 2019-04-17 2019-04-17 A kind of double galvanometer picosecond laser galvanometer equipment of same light source

Publications (1)

Publication Number Publication Date
CN110052723A true CN110052723A (en) 2019-07-26

Family

ID=67319125

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201910307058.3A Pending CN110052723A (en) 2019-04-17 2019-04-17 A kind of double galvanometer picosecond laser galvanometer equipment of same light source

Country Status (1)

Country Link
CN (1) CN110052723A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110434471A (en) * 2019-08-21 2019-11-12 南京魔迪多维数码科技有限公司 The experimental provision of integrated three kinds of laser processing technologies
CN111482718A (en) * 2020-05-18 2020-08-04 名光智能科技(佛山)有限公司 High-precision gantry laser cutting equipment
CN113618251A (en) * 2021-08-04 2021-11-09 昆山燎原自动化设备有限责任公司 Laser processing equipment for substrate scribing
CN117226280A (en) * 2023-11-13 2023-12-15 珠海市申科谱工业科技有限公司 Full-automatic laser marking equipment

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110434471A (en) * 2019-08-21 2019-11-12 南京魔迪多维数码科技有限公司 The experimental provision of integrated three kinds of laser processing technologies
CN111482718A (en) * 2020-05-18 2020-08-04 名光智能科技(佛山)有限公司 High-precision gantry laser cutting equipment
CN113618251A (en) * 2021-08-04 2021-11-09 昆山燎原自动化设备有限责任公司 Laser processing equipment for substrate scribing
CN117226280A (en) * 2023-11-13 2023-12-15 珠海市申科谱工业科技有限公司 Full-automatic laser marking equipment
CN117226280B (en) * 2023-11-13 2024-03-19 珠海市申科谱工业科技有限公司 Full-automatic laser marking equipment

Similar Documents

Publication Publication Date Title
CN110052723A (en) A kind of double galvanometer picosecond laser galvanometer equipment of same light source
CN204470781U (en) A kind of Five-axis linkage laser processing machine based on speculum leaded light
CN104071974B (en) A kind of laser equipment for glass cutting and cutting method
CN113231745B (en) Laser engraving plate-making apparatus, control system, plate-making method, and storage medium
CN205342235U (en) Laser cutting machine with interactive workstation
CN207746568U (en) A kind of five-axle linkage laser cutting machine
CN112775443A (en) Single-laser large-breadth galvanometer movable 3D printing device and method
CN203853681U (en) Ultraviolet laser-beam drilling machine
CN203960048U (en) A kind of laser equipment for glass cutting
CN111482718A (en) High-precision gantry laser cutting equipment
CN112264722A (en) Laser micropore machining equipment and machining method suitable for thin-wall parts
CN111098034A (en) Multilayer material product marking device and method
CN108393594A (en) A kind of laser cutting device and its cutting method of planar products
CN101837518A (en) External optical path aplanatic system of laser cutting machine
CN101497149A (en) Laser flying focus scanning system
CN109014610A (en) A kind of system and method for passive zoom laser processing transparent material
CN210937716U (en) Laser cutting machine for metal tube
CN105081852A (en) Portal vertical machining center
CN204735712U (en) Vibration material disk finish machining equipment of laser selectivity molten metal powder
CN107971629A (en) Laser working light path structure
CN201385185Y (en) External optical path aplanatism system of laser cutting machine
CN211554483U (en) Three-dimensional dynamic focusing galvanometer device
CN105290612A (en) Novel multifunctional cantilever laser cutting machine
CN201702508U (en) Flight light path laser processing machine tool
CN101549609A (en) Longmen broad width three-dimensional solid body laser inner carving apparatus with high speed

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination