CN103212865B - The laser processing of brittle substrate and laser processing device - Google Patents
The laser processing of brittle substrate and laser processing device Download PDFInfo
- Publication number
- CN103212865B CN103212865B CN201310013688.2A CN201310013688A CN103212865B CN 103212865 B CN103212865 B CN 103212865B CN 201310013688 A CN201310013688 A CN 201310013688A CN 103212865 B CN103212865 B CN 103212865B
- Authority
- CN
- China
- Prior art keywords
- laser
- brittle material
- material substrate
- processing
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 140
- 238000012545 processing Methods 0.000 title claims abstract description 89
- 238000000034 method Methods 0.000 claims abstract description 19
- 239000000463 material Substances 0.000 claims description 49
- 238000003672 processing method Methods 0.000 claims description 15
- 230000001678 irradiating effect Effects 0.000 claims description 11
- 238000005553 drilling Methods 0.000 claims description 9
- 230000009172 bursting Effects 0.000 abstract 1
- 239000011521 glass Substances 0.000 description 39
- 238000003754 machining Methods 0.000 description 21
- 238000010586 diagram Methods 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 230000000149 penetrating effect Effects 0.000 description 3
- 238000005336 cracking Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 239000005361 soda-lime glass Substances 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000009377 nuclear transmutation Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28B1/00—Producing shaped prefabricated articles from the material
- B28B1/48—Producing shaped prefabricated articles from the material by removing material from solid section preforms for forming hollow articles, e.g. by punching or boring
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Optics & Photonics (AREA)
- Thermal Sciences (AREA)
- Toxicology (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Health & Medical Sciences (AREA)
- Plasma & Fusion (AREA)
- Laser Beam Processing (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
A kind of laser processing of brittle substrate and laser processing device.As problem, alleviate and laser is irradiated to brittle substrate carry out perforate and add bursting apart of the particularly brittle substrate front in man-hour.As solution, this laser processing irradiates to brittle substrate the method that laser carries out perforate processing, comprises the 1st operation and the 2nd operation.In the 1st operation, from the front illuminated laser of brittle substrate, the converged position of laser is moved from the back side of brittle substrate to front and carries out perforate processing, until the position of distance substrate back prescribed depth.In the 2nd operation, from the front illuminated laser of brittle substrate, for the hole formed in the 1st operation, carry out the converged position of laser is rearwardly moved from the front of brittle substrate, and the perforate be communicated with the hole formed in the 1st operation is processed.
Description
Technical Field
The present invention relates to a laser processing method, and more particularly to a laser processing method for a brittle material substrate for drilling a brittle material substrate by irradiating the substrate with a laser beam. The present invention also relates to a laser processing apparatus for carrying out the laser processing method.
Background
As an apparatus for processing a brittle material substrate such as a glass substrate by a laser, for example, an apparatus shown in patent document 1 is known. In such a processing apparatus, a workpiece such as a glass substrate is irradiated with a green laser beam having a wavelength of about 532 nm. In general, a green laser beam transmits through a glass substrate, but when the intensity of the condensed laser beam exceeds a certain threshold, the glass substrate absorbs the laser beam. In this state, plasma is generated in the converging portion of the laser light, thereby evaporating (transmutation) the glass substrate. By using the above principle, processing such as forming a hole in a glass substrate can be performed.
Patent document 2 also discloses: the glass substrate is drilled by scanning the laser beam along the machining line while rotating the laser beam converging point at a high speed with a small radius.
Patent document
Patent document 1: japanese laid-open patent publication No. 2007-118054
Patent document 2: japanese patent laid-open publication No. 2011-11212
In the drilling process by the conventional method, defects called chipping (chipping) are generated around the processed hole on the starting surface and the ending surface of the process, that is, on the back surface and the front surface of the substrate. These cracks are considered to be caused by minute cracks generated in the processed portion, and they become a factor of reducing the strength. Therefore, it is preferable to reduce chipping as much as possible.
As described above, although the chipping occurs on the back surface and the front surface of the substrate, when the processing is started from the back surface of the substrate, the chipping tends to be larger on the front surface of the substrate, which is the processing end surface, than on the back surface, which is the processing start surface.
Disclosure of Invention
The invention aims to reduce cracking, especially the cracking of the front surface of a brittle material substrate when the brittle material substrate is irradiated with laser to carry out hole drilling processing.
The method for laser processing a brittle material substrate according to claim 1 is a method for drilling a brittle material substrate by irradiating the brittle material substrate with a laser beam, and includes the 1 st step and the 2 nd step. In the step 1, a laser beam is irradiated from the front surface of the brittle material substrate, and the laser beam is focused at a position of a predetermined depth from the back surface of the substrate to the front surface of the brittle material substrate to perform drilling. In the 2 nd step, laser light is irradiated from the front surface of the brittle material substrate, and hole forming processing is performed on the hole formed in the 1 st step so that the position of the laser light beam focused on the hole is moved from the front surface to the back surface of the brittle material substrate and communicates with the hole formed in the 1 st step.
In step 1, the substrate front surface is irradiated with laser light, and the hole is formed from the back surface side to a position at a predetermined depth from the substrate front surface. When the processing from the back side reaches a position of a predetermined depth, the processing from the back side is temporarily stopped. Next, in the 2 nd step, as in the 1 st step, the laser beam is irradiated from the front surface of the substrate, and the processing is continued from the front surface to the back surface of the substrate. Thus, a hole penetrating the substrate is formed.
Here, the processing is started from the back surface of the substrate, and the processing from the back surface is temporarily stopped at a position of a prescribed depth, and then the processing is started again from the front surface side of the substrate. In such a processing method, both the back surface and the front surface of the substrate become processing start surfaces, and the processing end surface is inside the substrate. Cracks generated in the processing portion are hard to develop in the substrate, and thus chipping is suppressed.
The brittle material substrate laser processing method according to claim 2 is the processing method according to claim 1, wherein in the step 1, the brittle material substrate is subjected to the hole drilling from the back surface thereof to a position at least 240 μm away from the front surface of the substrate.
When the substrate is irradiated with laser light from the front side and processed from the back side, the processing chips fall downward, and the processing chips do not interfere with the laser light irradiation. On the other hand, when the laser beam is irradiated from the front surface of the substrate and machining is started from the front surface side, machining chips accumulate in the recess formed by the machining, and these machining chips interfere with the machining by converging the laser beam. Therefore, the processing speed from the front side of the substrate is slower than the processing speed from the back side of the substrate.
On the other hand, when the processing is performed from the back side of the substrate to a position close to the front side of the substrate, cracks generated in the processed portion reach the front side, and the possibility of large cracks being generated in the front side of the substrate is increased.
Therefore, in the invention 2, the processing is performed from the back side of the substrate to a position 240 μm away from the front side of the substrate. This can shorten the processing time and suppress the occurrence of large chipping on the front surface of the substrate.
The method of laser processing a brittle material substrate according to claim 3 is the method of laser processing a brittle material substrate according to claim 1 or 2, wherein the laser light converging point is shifted from the central axis in the 1 st and 2 nd steps, and the laser light converging point is moved along the processing line while being rotated about the central axis.
Here, since the substrate is processed by scanning the laser beam along the processing line while rotating, the processing time can be shortened.
The brittle material substrate laser processing method according to claim 4 is the processing method according to claim 1, wherein the laser light is spirally scanned along the processing line in steps 1 and 2.
Here, the laser beam can be continuously scanned, thereby shortening the processing time.
A brittle material substrate laser processing apparatus according to claim 5 is an apparatus for performing a hole forming process by irradiating a brittle material substrate with a laser beam, and includes: a table on which a brittle material substrate is placed; a laser irradiation head for irradiating a brittle material substrate on a stage with laser light; and a moving mechanism for relatively moving the stage and the laser irradiation head in a direction along the stage mounting surface and in a direction away from the stage mounting surface. Then, the laser beam is irradiated from the front surface of the brittle material substrate, the converging position of the laser beam is moved from the back surface to the front surface of the brittle material substrate, and after the hole is drilled from the back surface of the substrate to a predetermined depth, the laser beam is irradiated from the front surface of the brittle material substrate, and the hole formed by the machining is drilled by moving the converging position of the laser beam from the front surface to the back surface of the brittle material substrate so as to communicate with the formed hole.
Effects of the invention
In the present invention as described above, when the brittle material substrate is subjected to the hole forming process by the laser beam, chipping of the front surface of the brittle material substrate can be reduced.
Drawings
Fig. 1 is an external perspective view of a glass substrate processing apparatus according to an embodiment of the present invention.
Fig. 2 is an enlarged perspective view of the workpiece table.
Fig. 3 is an enlarged perspective view showing the structure of the laser irradiation head.
Fig. 4 is a diagram schematically showing the arrangement of the 1 st hollow motor and the 1 st wedge prism.
Fig. 5 is a diagram schematically showing the arrangement of the 2 nd hollow motor, the 2 nd wedge prism, and the condensing lens.
Fig. 6 is a diagram showing a trajectory of laser light.
Fig. 7 is a schematic view showing a case where processing is performed from the back side of the glass substrate.
Fig. 8 is a schematic diagram showing a case where processing is performed from the front surface side of the glass substrate.
Fig. 9 is a graph showing a comparison of the chipping sizes of the conventional machining method and the machining method to which the present invention is applied.
Description of reference numerals:
2, a workpiece workbench; 3 laser irradiation head; 5 a worktable moving mechanism; a 21 x-axis direction moving mechanism; 22 z-axis direction moving mechanism; g a glass substrate; and (4) L processing line.
Detailed Description
[ working apparatus ]
Fig. 1 shows an overall configuration of an apparatus for carrying out a machining method according to an embodiment of the present invention. The glass substrate processing apparatus irradiates a glass substrate with laser light along a processing line to form a hole in the glass substrate. The device is provided with: a machine tool 1; a workpiece table 2 on which a glass substrate as a workpiece is placed; and a laser irradiation head 3 for irradiating the glass substrate with laser light. Here, as shown in fig. 1, mutually perpendicular axes in a plane along the upper surface of the machine tool 1 are defined as an x-axis and a y-axis, and an axis in a perpendicular direction perpendicular to these axes is defined as a z-axis. Furthermore, two directions (+ direction and-direction) along the x-axis are defined as x-axis directions, two directions (+ direction and-direction) along the y-axis are defined as y-axis directions, and two directions (+ direction and-direction) along the z-axis are defined as z-axis directions.
< work bench >
The work table 2 is formed in a rectangular shape, and a table moving mechanism 5 for moving the work table 2 in the x-axis direction and the y-axis direction is provided below the work table 2.
As shown enlarged in fig. 2, the work table 2 has a plurality of blocks 6. These blocks 6 are members for lifting and supporting the glass substrate G shown by the dashed lines from the surface of the work table 2, and can be mounted at any position of the work table 2 avoiding the processing line L (shown by the dashed lines) of the glass substrate G. Further, a plurality of suction ports 2a are formed in an array on the work table 2, and suction holes 6a penetrating in the vertical direction are formed in each block 6. The suction holes 6a of the block 6 are connected to the suction ports 2a of the work table 2, whereby the glass substrate G disposed on the block 6 can be sucked and fixed. The mechanism for sucking air is constituted by a known exhaust pump or the like, and detailed description thereof is omitted.
< moving mechanism of working table >
As shown in fig. 1, the table moving mechanism 5 has a pair of 1 st guide rails 8, a pair of 2 nd guide rails 9, and a 1 st moving table 10 and a 2 nd moving table 11. The 1 st pair of rails 8 are provided on the upper surface of the machine tool 1 and extend in the y-axis direction. The 1 st moving table 10 is provided above the 1 st guide rail 8, and has a plurality of guide portions 10a on a lower surface, and the plurality of guide portions 10a are engaged with the 1 st guide rail 8 so as to be movable. The 2 nd guide rail 9 is provided on the upper surface of the 1 st moving table 10 and extends in the x-axis direction. The 2 nd moving table 11 is provided above the 2 nd guide rail 9, and has a plurality of guide portions 11a on a lower surface thereof, and the plurality of guide portions 11a are engaged with the 2 nd guide rail 9 so as to be movable. The work table 2 is attached to an upper portion of the 2 nd movable table 11 via a fixing member 12.
The work table 2 is freely movable in the x-axis direction and the y-axis direction by the table moving mechanism 5 as described above. The 1 st stage 10 and the 2 nd moving stage 11 are driven by a known driving means such as a motor, and detailed description thereof will be omitted.
[ laser irradiation head ]
As shown in fig. 1 and 3, the laser irradiation head 3 is attached to a gantry 1a disposed on the upper surface of the machine tool 1, and includes: a laser output section 15; an optical system 16; a 1 st hollow motor 17 in which 1 pair of 1 st wedge prisms (described below) are mounted; the 2 nd hollow motor 18 has 1 pair of 2 nd wedge prisms (described below) and a condenser lens mounted therein. Further, there are provided: an x-axis direction moving mechanism 21 for moving the laser irradiation head 3 in the x-axis direction; and a z-axis direction moving mechanism 22 for moving the 1 st hollow motor 17 and the 2 nd hollow motor 18 in the z-axis direction.
< laser output part >
The laser output section 15 is constituted by a laser tube similar to a conventional laser tube. The laser output section 15 emits green laser light having a wavelength of 532nm on the side opposite to the work table 2 in the y-axis direction.
< optical System >
The optical system 16 guides the laser light from the laser output section 15 to 1-to-1-th wedge prisms mounted in the 1-th hollow motor 17. As shown in fig. 3 in an enlarged scale, the optical system 16 includes: 1 st to 4 th mirrors 25 to 28, a power monitor 29 for measuring laser output, and a beam expander 30.
The 1 st mirror 25 is disposed near the output side of the laser output section 15, and reflects the laser light emitted in the y-axis direction in the x-axis direction. The 2 nd mirror 26 is arranged in the x-axis direction in line with the 1 st mirror 25, reflects the laser light advancing in the x-axis direction toward the y-axis direction, and guides the reflected laser light toward the work table 2. The 3 rd mirror 27 and the 4 th mirror 28 are arranged above the 1 st hollow motor 17 in the x-axis direction. The 3 rd mirror 27 guides the laser light reflected by the 2 nd mirror 26 to the 4 th mirror 28 side. The 4 th mirror 28 guides the laser light reflected by the 3 rd mirror 27 to the 1 st hollow motor 17 below. The beam expander 30 is disposed between the 2 nd mirror 26 and the 3 rd mirror 27, and is provided to expand the laser light reflected by the 2 nd mirror 26 into a parallel beam of a certain magnification. The beam expander 30 can condense the laser light into a smaller spot.
< 1 st wedge prism and 1 st hollow motor >
Fig. 4 shows a schematic view of the 1 st hollow motor 17 with the 1 st wedge prisms 321, 322 arranged inside. The 1 st hollow motor 17 has a rotation axis R extending in the z-axis direction at the center, and the central portion including the rotation axis R is hollow. Further, 1 pair of 1 st wedge prisms 321 and 322 are fixed to the hollow portion. The 1 pair of wedge prisms 321, 322 have the same shape and the same specific gravity, and only the refractive indices are different. Each of the wedge prisms 321 and 322 has an inclined surface 321a and 322a inclined with respect to the rotation axis R and a vertical surface 321b and 322b perpendicular to the rotation axis R. The 1 pair of wedge prisms 321 and 322 are arranged such that the vertical surfaces 321b and 322b thereof are close to and face each other, and the 2 vertical surfaces 321b and 322b are arranged in parallel and the 2 inclined surfaces 321a and 322a are arranged in parallel.
Here, the refractive indices of the 21 st wedge prisms 321 and 322 are made different, and the laser light passing through the 1 st wedge prisms 321 and 322 is deflected by an angle θ.
Further, regarding the shape (apex angle) of the wedge prisms 321 and 322, a laser rotation radius r (= f · tan θ or f · θ) determined by a focal length f of the condenser lens and a deflection angle θ, which will be described later, is set to a desired value.
< 2 nd wedge prism, 2 nd hollow motor, converging lens >
Fig. 5 schematically shows a 2 nd hollow motor 18 with 1 pair of 2 nd wedge prisms 341, 342 arranged therein. The 2 nd hollow motor 18 has a rotation axis extending in the z-axis direction at the center. The rotation axis is coaxial with the rotation axis R of the 1 st hollow motor 17. The 2 nd hollow motor 18 has a hollow portion in a center portion including the rotation axis R. In the hollow portion, 1 pair of 2 nd wedge prisms 341 and 342 are attached. Further, these 2 nd wedge prisms 341, 342 are provided: the other wedge prism 341 is rotatable relative to the one wedge prism 342 about the rotation axis R. That is, the declination angle of the 1 nd pair of 2 nd wedge prisms 341, 342 is adjustable.
The 1 nd to 2 nd wedge prisms 341 and 342 have the same shape and the same material (the same specific gravity), and thus have the same refractive index. The 1 st pair of 2 nd wedge prisms 341 and 342 have inclined surfaces 341a and 342a inclined with respect to the rotation axis and vertical surfaces 341b and 342b perpendicular to the rotation axis, respectively. In the 2 nd wedge prisms 341 and 342, the other wedge prism 342 is disposed so as to rotate from a state in which the off-angle is "0" (a state in which the inclined surfaces of the two wedge prisms are parallel), and the inclined surfaces 341a and 342a of the 2 wedge prisms 341 and 342 are not parallel to each other. By combining the 2 nd wedge prisms 341 and 342, the 1 pair of 2 nd wedge prisms 341 and 342 have a predetermined slip angle. The off angle is larger than the off angle of the 1 st wedge prism 321, 322.
Further, a condenser lens 35 is fixed to the output side of the 1 nd pair of 2 nd wedge prisms 341 and 342 in the 2 nd hollow motor 18. In addition, the condenser lens 35 may be separately provided from the 2 nd hollow motor 18.
< support and handling System of laser irradiation head >
As described above, the laser irradiation head 3 as described above is supported by the gantry 1a of the machine tool 1. More specifically, as shown in fig. 3, 1 pair of 3 rd guide rails 36 extending in the x-axis direction are provided on the upper surface of the gate frame 1a, and the 1 pair of 3 rd guide rails 36 and a drive mechanism not shown constitute the x-axis direction moving mechanism 21. The support member 37 is movably supported by the 1 st pair of 3 rd guide rails 36. The support member 37 includes a lateral support member 38 supported by the 3 rd guide rail 36, and a vertical support member 39 extending downward from one end side of the lateral support member 38 on the workpiece table 2 side. On the side surface of the vertical support member 39, 1 pair of 4 th guide rails 40 extending in the z-axis direction are provided, and the 1 pair of 4 th guide rails 40 and a drive mechanism, not shown, constitute the z-axis direction moving mechanism 22. The 3 rd moving table 41 is supported on the 4 th guide rail 40 so as to be movable in the z-axis direction.
The laser output section 15, the 1 st to 4 th mirrors 25 to 28, the power monitor 29, and the beam expander 30 are supported by the lateral support member 38. Further, a motor support member 42 is fixed to the 3 rd moving table 41, and the 1 st hollow motor 17 and the 2 nd hollow motor 18 are supported by the motor support member 42.
[ processing method ]
A processing method in the case of forming a hole in a glass substrate by a laser using the processing apparatus described above will be described. Here, soda-lime glass having a thickness of 1.8mm is taken as an example of the glass substrate.
First, a plurality of blocks 6 are provided on the surface of the work table 2. At this time, as shown in fig. 2, the plurality of blocks 6 are arranged so as to avoid the processing line L of the glass substrate G. On the plurality of blocks 6 thus provided, a glass substrate G to be processed is placed.
Next, the laser irradiation head 3 is moved in the x-axis direction by the x-axis direction moving mechanism 21, or the work table 2 is moved in the y-axis direction by the table moving mechanism 5, whereby the converging point of the laser light emitted from the laser irradiation head 3 is positioned at the start position of the processing line L.
< step 1 >
As described above, after the laser irradiation head 3 and the glass substrate G are moved to the processing position, the glass substrate is irradiated with the laser beam to be processed. Here, the laser light emitted from the laser output section 15 is reflected by the 1 st mirror 25 and guided to the 2 nd mirror 26. In addition, with respect to the laser light incident on the 1 st mirror 25, the laser output is measured by the power monitor 29. The laser beam incident on the 2 nd mirror 26 is reflected in the y-axis direction, expanded by a beam expander 30, and guided to the 3 rd mirror 27. Then, the laser light reflected by the 3 rd mirror 27 and further reflected by the 4 th mirror 28 is input to the 1 st pair of 1 st wedge prisms 321 and 322 provided at the center portion of the 1 st hollow motor 17.
Since the 21 st wedge prisms 321 and 322 have different refractive indexes, the laser light input to the 1 st and 2 nd wedge prisms 321 and 322 is deflected and output. The 1 st wedge prisms 321 and 322 are rotated at a high speed of, for example, 15000rpm or more, and the laser beams transmitted through the 1 st wedge prisms 321 and 322 are rotated at a high speed with a small rotation radius (for example, 0.4mm to 0.8mm in diameter).
The laser light emitted from the 1 st wedge prisms 321 and 322 is input to the 2 nd wedge prisms 341 and 342. One of the 2 nd wedge prisms 341 and 342 is rotated relative to the other so as to have a larger deflection angle than the 1 st wedge prisms 321 and 322. Therefore, by rotating the 2 nd wedge prisms 341 and 342, the laser light rotating at high speed is rotationally scanned with a large rotation radius (for example, outer diameter of 5.0 mm). The 2 nd wedge prisms 341 and 342 rotate at a low speed, for example, about 400 to 800 rpm.
Fig. 6 shows the trajectory of such a laser on a glass substrate. Here, due to machining errors, mounting errors, and the like in the 1 st pair of wedge prisms 321 and 322, errors may occur in the diameter of the circle drawn by the laser light deflected and rotated by the 1 st wedge prisms 321 and 322. Due to this error, an error is generated in the finally machined hole diameter. In this case, one of the 2 nd wedge prisms 341 and 342 may be rotated with respect to the other to adjust the deflection angle and adjust the scanning locus by the laser beam passing through the 2 nd wedge prisms 341 and 342. This enables a hole having a desired diameter to be machined with high accuracy.
Here, the thickness of the glass removed by 1 laser processing was several tens μm. Therefore, when the hole is formed in the glass substrate G, it is difficult to form a hole by scanning the converging point along the processing line only 1 time, that is, it is difficult to peel off the portion inside the processing line at one time.
Therefore, first, the position of the 2 nd hollow motor 18 including the condensing lens 35 in the z-axis direction is controlled by the z-axis moving device 22 so that a condensing point (processing site) is formed on the lower surface (back surface) of the glass substrate (see fig. 7 a). In this state, after the convergence point is moved 1 cycle along the processing line, the convergence point is raised by controlling the position of the 2 nd hollow motor 18 in the z-axis direction as shown in fig. 7 (b). Similarly, after the convergence point was moved 1 week along the processing line, the convergence point was further raised.
The above operations are repeated, and the processing from the back surface of the substrate is temporarily stopped at a point of time when the convergence point reaches a position 240 μm from the front surface of the substrate G.
Further, instead of raising the convergence point every 1 cycle after the convergence point is moved along the machining line, the convergence point may be continuously raised in the z-axis direction at an appropriate speed to perform machining in a spiral shape, and thus, the hole drilling may be performed in the same manner.
Here, when the glass substrate G is processed by being irradiated with laser light from the front side and from the back side, the processing chips fall downward, and the processing chips are not accumulated in the recess formed by the processing. Therefore, the machining chips do not interfere with the laser irradiation, and the machining can be performed in a short time.
< 2 nd Process >
Next, as shown in fig. 8, the same portion as the hole formed in the previous step is processed under the same conditions as the processing from the back surface side from the front surface side to the back surface side of the glass substrate G. By the above processing, a hole penetrating the glass substrate G can be formed.
Further, when the glass substrate G is irradiated with laser light from the front surface side and processed from the front surface side, processing chips are likely to accumulate in the recess formed by the processing. These machining chips may interfere with the laser beam converging, for example, and may interfere with the machining.
However, in the case of the glass substrate G having a thickness of 1.8mm, the processing from the back side of the substrate is performed to a depth of 240 μm from the front side of the substrate in the 1 st step, and the processing from the front side of the substrate is extremely small for the whole step. Therefore, even if the machining chips accumulate in the recess, the adverse effect on the drilling can be suppressed.
[ test results ]
Experiments were conducted to compare the chipping size in the case of forming a hole by a conventional machining method and the chipping size in the case of forming a hole by a machining method according to an embodiment of the present invention. The processing conditions in this case are as follows.
Laser output: 5W
Scanning speed: 40mm/s
Substrate: soda-lime glass (thickness =1.8 mm)
Pore diameter:
fig. 9 shows a summary of the experimental results. The chip size under the condition of the existing method is 236-333 mu m, and the average size is 284 mu m. In addition, the chip size in the case of applying the present invention is 157 to 213 μm, and the average size is 180 μm. The measurement numbers n are all "10".
When the processing is performed in step 1 to a distance of less than 240 μm from the front surface, cracks develop from the processed portion to the front surface of the substrate. Therefore, it is considered that the crack causes a large chipping in the front surface of the substrate.
[ characteristics ]
(1) Both the back surface and the front surface of the glass substrate are processing start surfaces, and the processing end surfaces are inside the substrate. Thus, cracks generated in the processed portion inside the substrate are hard to develop, and thus chipping is suppressed.
(2) In the processing performed from the back side of the substrate, since the hole forming processing is performed to a position 240 μm from the front surface of the glass substrate, the processing time can be shortened, and the influence of the processing chips on the hole forming processing can be suppressed.
(3) Since the processing from the back side of the glass substrate is stopped at a position 240 μm or more from the front side of the glass substrate, cracks can be prevented from reaching the front side of the glass substrate. Therefore, the size of the crack formed on the front surface of the substrate can be reduced.
[ other embodiments ]
The present invention is not limited to the above-described embodiments, and various modifications and corrections can be made without departing from the scope of the present invention.
For example, the means for scanning the laser is not limited to the above embodiment. For example, 2 galvanometers may be provided instead of the 2 nd hollow motor and the 1 nd pair 2 nd prism to scan in an arbitrary shape.
The shape of the machining hole is not limited to a circular shape. The invention is also applicable to the processing of holes with other shapes.
Claims (5)
1. A laser processing method for a brittle material substrate, which performs a hole-forming process by irradiating a brittle material substrate with a laser beam, includes:
a step 1 of irradiating a front surface of a brittle material substrate with a laser beam, moving a converging position of the laser beam from a back surface of the brittle material substrate to the front surface, and performing a hole forming process to a position at a predetermined depth from the back surface of the substrate; and
and a 2 nd step of irradiating the front surface of the brittle material substrate with a laser beam, and performing hole forming processing in which a converging position of the laser beam is moved from the front surface to the back surface of the brittle material substrate with respect to the hole formed in the 1 st step and communicates with the hole formed in the 1 st step.
2. The brittle material substrate laser processing method according to claim 1,
in the step 1, a hole is formed from the back surface of the brittle material substrate to a position 240 μm or more from the front surface of the substrate.
3. The brittle material substrate laser processing method according to claim 1 or 2, wherein,
in the 1 st step and the 2 nd step, the laser light converging point is shifted from the central axis, and the laser light converging point is moved along the processing line while rotating around the central axis.
4. The brittle material substrate laser processing method according to claim 1,
in the 1 st step and the 2 nd step, the laser beam is scanned in a spiral shape along the processing line.
5. A brittle material substrate laser processing device for performing hole drilling processing by irradiating a brittle material substrate with a laser beam, the brittle material substrate laser processing device comprising:
a table on which a brittle material substrate is placed;
a laser irradiation head that irradiates a brittle material substrate on the stage with laser light; and
a moving mechanism that relatively moves the stage and the laser irradiation head in a direction along a mounting surface of the stage and a direction away from the mounting surface of the stage,
wherein,
the method for forming holes on a brittle material substrate includes the steps of irradiating the brittle material substrate with laser light from the front surface thereof, moving the focal point of the laser light from the back surface of the brittle material substrate to the front surface thereof to perform hole forming processing to a position at a predetermined depth from the back surface of the substrate, irradiating the brittle material substrate with laser light from the front surface thereof, moving the focal point of the laser light from the front surface to the back surface of the brittle material substrate with respect to the holes formed by the processing, and performing hole forming processing to communicate with the holes formed.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012-011090 | 2012-01-23 | ||
| JP2012011090A JP2013146780A (en) | 2012-01-23 | 2012-01-23 | Method for laser processing brittle material substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103212865A CN103212865A (en) | 2013-07-24 |
| CN103212865B true CN103212865B (en) | 2016-01-20 |
Family
ID=48811197
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310013688.2A Expired - Fee Related CN103212865B (en) | 2012-01-23 | 2013-01-15 | The laser processing of brittle substrate and laser processing device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2013146780A (en) |
| KR (1) | KR20130086166A (en) |
| CN (1) | CN103212865B (en) |
| TW (1) | TWI552823B (en) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103878496A (en) * | 2014-04-15 | 2014-06-25 | 北京理工大学 | Method for efficiently processing high-quality micro hole with large ratio of pit-depth to pit-diameter through femtosecond laser |
| WO2016121122A1 (en) * | 2015-01-30 | 2016-08-04 | 株式会社牧野フライス製作所 | Laser processing machine and laser processing method |
| US10442720B2 (en) * | 2015-10-01 | 2019-10-15 | AGC Inc. | Method of forming hole in glass substrate by using pulsed laser, and method of producing glass substrate provided with hole |
| JP6810951B2 (en) * | 2016-07-29 | 2021-01-13 | 三星ダイヤモンド工業株式会社 | Laser processing method and laser processing equipment for brittle material substrates |
| JP6920762B2 (en) * | 2016-07-29 | 2021-08-18 | 三星ダイヤモンド工業株式会社 | Laser machining equipment for brittle material substrates |
| JP2018016525A (en) * | 2016-07-29 | 2018-02-01 | 三星ダイヤモンド工業株式会社 | Laser processing method and laser processing device for brittle material substrate |
| JP6813168B2 (en) | 2016-07-29 | 2021-01-13 | 三星ダイヤモンド工業株式会社 | Laser processing method and laser processing equipment for brittle material substrates |
| JP6723532B2 (en) * | 2018-03-30 | 2020-07-15 | 坂東機工株式会社 | Glass plate punching device |
| CN110091078A (en) * | 2019-05-31 | 2019-08-06 | 华中科技大学 | A kind of three-dimensional column hole laser cutting method for glass |
| CN111112859B (en) * | 2019-12-20 | 2022-04-12 | 武汉华工激光工程有限责任公司 | Zero-taper through hole process method for transparent brittle material |
| CN114131220A (en) * | 2021-11-04 | 2022-03-04 | 江苏大学 | Method for processing small holes in transparent hard and brittle material based on laser pulse control |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101386112A (en) * | 2007-09-13 | 2009-03-18 | 张立国 | Laser cutting method based on inner carving |
| CN101935156A (en) * | 2009-06-30 | 2011-01-05 | 三星钻石工业股份有限公司 | Utilize the glass substrate processing unit (plant) of laser |
| CN102049611A (en) * | 2009-10-30 | 2011-05-11 | 技鼎股份有限公司 | Laser processing device applied to fragile material and laser processing and displacement compensating method |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0679486A (en) * | 1992-08-25 | 1994-03-22 | Rohm Co Ltd | Working method for ink jet head |
| JP2002113587A (en) * | 2000-10-10 | 2002-04-16 | Ricoh Microelectronics Co Ltd | Method and device for laser beam machining |
| JP2002283083A (en) * | 2001-03-27 | 2002-10-02 | Komatsu Ltd | Laser beam machining device |
| JP3998984B2 (en) * | 2002-01-18 | 2007-10-31 | 富士通株式会社 | Circuit board and manufacturing method thereof |
| US7259354B2 (en) * | 2004-08-04 | 2007-08-21 | Electro Scientific Industries, Inc. | Methods for processing holes by moving precisely timed laser pulses in circular and spiral trajectories |
| DE102004040068B4 (en) * | 2004-08-18 | 2018-01-04 | Via Mechanics, Ltd. | Method for laser drilling a multilayered workpiece |
| JP4645892B2 (en) * | 2005-03-29 | 2011-03-09 | アイシン精機株式会社 | Laser processing apparatus and method |
| US20090013724A1 (en) * | 2006-02-22 | 2009-01-15 | Nippon Sheet Glass Company, Limited | Glass Processing Method Using Laser and Processing Device |
| KR100769993B1 (en) * | 2006-06-05 | 2007-10-25 | 강남대학교 산학협력단 | Method for forming hole of clear material |
| JP2009190943A (en) * | 2008-02-15 | 2009-08-27 | Seiko Epson Corp | Separating device of substrate, separating method of substrate and substrate manufactured by using the method |
| US8093532B2 (en) * | 2008-03-31 | 2012-01-10 | Electro Scientific Industries, Inc. | Laser machining of fired ceramic and other hard and/or thick materials |
| JP2010024064A (en) * | 2008-07-15 | 2010-02-04 | Seiko Epson Corp | Method for manufacturing structure and droplet ejection head |
| JP5667347B2 (en) * | 2009-06-30 | 2015-02-12 | 三星ダイヤモンド工業株式会社 | Glass substrate processing equipment using laser light |
| WO2011046052A1 (en) * | 2009-10-13 | 2011-04-21 | 三菱マテリアル株式会社 | Method for forming ventilation holes in an electrode plate |
-
2012
- 2012-01-23 JP JP2012011090A patent/JP2013146780A/en active Pending
- 2012-12-25 TW TW101149715A patent/TWI552823B/en not_active IP Right Cessation
-
2013
- 2013-01-15 KR KR1020130004501A patent/KR20130086166A/en active Search and Examination
- 2013-01-15 CN CN201310013688.2A patent/CN103212865B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101386112A (en) * | 2007-09-13 | 2009-03-18 | 张立国 | Laser cutting method based on inner carving |
| CN101935156A (en) * | 2009-06-30 | 2011-01-05 | 三星钻石工业股份有限公司 | Utilize the glass substrate processing unit (plant) of laser |
| CN102049611A (en) * | 2009-10-30 | 2011-05-11 | 技鼎股份有限公司 | Laser processing device applied to fragile material and laser processing and displacement compensating method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2013146780A (en) | 2013-08-01 |
| TW201334906A (en) | 2013-09-01 |
| TWI552823B (en) | 2016-10-11 |
| CN103212865A (en) | 2013-07-24 |
| KR20130086166A (en) | 2013-07-31 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103212865B (en) | The laser processing of brittle substrate and laser processing device | |
| JP4490883B2 (en) | Laser processing apparatus and laser processing method | |
| TWI395630B (en) | Apparatus for processing glass substrate by laser beam | |
| TWI547336B (en) | Apparatus for processing work by laser beam | |
| JP5162163B2 (en) | Wafer laser processing method | |
| JP2014231071A (en) | Substrate cutting device by using laser beam | |
| JP5459484B2 (en) | Dicing apparatus and dicing method | |
| JP6281328B2 (en) | Laser dicing apparatus and laser dicing method | |
| JP6085895B2 (en) | Scribing wheel with finely structured grooves | |
| JP2016041437A (en) | Method of detecting spot shape of laser beam | |
| JP2013089714A (en) | Chip formation method | |
| TW201635358A (en) | Wafer processing method | |
| US9149886B2 (en) | Modified layer forming method | |
| JP6043421B2 (en) | Apparatus and method for manufacturing minute notch at wheel tip using ultrafast laser | |
| CN1629625A (en) | Method of checking a laser processed deteriorated layer | |
| TW201721729A (en) | Wafer processing method for preventing device damage caused by light leakage | |
| CN112296526B (en) | Comparison method and laser processing apparatus | |
| KR20160040099A (en) | Wafer processing method | |
| KR102488216B1 (en) | Wafer processing method | |
| JP2022096816A (en) | Laser processing method and laser processing device | |
| JP6576211B2 (en) | Wafer processing method | |
| KR20220126731A (en) | Laser processing apparatus and laser processing method | |
| JP2020136662A (en) | Confirmation method | |
| JP2017059688A (en) | Wafer | |
| JP6837712B2 (en) | Wafer processing method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160120 Termination date: 20200115 |