CN103878496A - Method for efficiently processing high-quality micro hole with large ratio of pit-depth to pit-diameter through femtosecond laser - Google Patents
Method for efficiently processing high-quality micro hole with large ratio of pit-depth to pit-diameter through femtosecond laser Download PDFInfo
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- CN103878496A CN103878496A CN201410151016.2A CN201410151016A CN103878496A CN 103878496 A CN103878496 A CN 103878496A CN 201410151016 A CN201410151016 A CN 201410151016A CN 103878496 A CN103878496 A CN 103878496A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/30—Organic material
- B23K2103/42—Plastics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention relates to the field of laser application, in particular to a method for efficiently processing a high-quality micro hole with a large ratio of pit-depth to pit-diameter through a femtosecond laser. According to the method, the wavelength of a near-infrared femtosecond laser monopulse is regulated by a femtosecond laser optical parameter amplifier, so that the near-infrared femtosecond laser monopulse becomes visible light. Afterwards, an optical path of a Michelson interferometer is used for modulating the visible light to be laser double impulses and the overall energy of the laser double impulses is regulated with a continuous attenuation sheet. The obtained visible light double impulses penetrate through an optical shutter and are perpendicularly focused on the upper surface of a sample to be processed through an objective lens. Finally, the optical shutter is used for controlling the exposure time of the visible light double impulses and therefore the number of laser impulses which irradiates the surface of the sample to be processed is regulated until the depth of the processed hole is saturated. According to the processing method, the ratio of pit-depth to pit-diameter and the quality in processing the micro hole can be effectively improved.
Description
Technical field
The present invention relates to laser application, a kind of method that relates in particular to femtosecond laser high efficiency and process large aspect ratio high-quality micropore.
Background technology
The large aspect ratio micropore of Laser Processing all has a wide range of applications in micro optical element, microelectronic component, microbiology and micro-chemical field.The wide-band gap materials such as glass, pottery and polymer have cheap, transparency is high and be easy to the advantages such as moulding, especially PMMA material, in visible-range, there is high light peneration, also have low ablation efficiency and glass transition temperature, be very applicable to being applied to the capillary processing in the fields such as micro-optics.
Compared to continuous laser, pulse laser can regulate and control pulse duration and repetition rate, more has advantage in capillary processing.At document S.Lazare, J.Lopez, and F.Weisbuch:Appl.Phys.A69, in S1 (1999), author, by reducing luminous exitance and the method for improving beam uniformity, uses nanosecond laser to process the micropore of large aspect ratio, but in the time that aspect ratio increases, the precision of this processing is very poor, thereby is not suitable for being applied to large aspect ratio, high accuracy manufacture field, for example: dye injection device, spinning head and atomizer etc.Than nanosecond laser, femtosecond laser can be in a short period of time by energy deposition in material, its heat affected area significantly reduces, and melting and solidification phenomenon can not occur, thereby can obtain the machining accuracy higher with respect to nanosecond laser.At document Y.Zhang, R.M.Lowe, E.Harvey, P.Hannaford, A.Endo:Appl.Surf.Sci.186, in 345 (2002), author uses the femtosecond laser pulse of 800nm wavelength on polymer, to process the micropore that aspect ratio is greater than 10, its diameter is 20-40 μ m, and the degree of depth is 300-400 μ m.But use traditional infrared wave band femtosecond laser (majority is pulse) processing mode, under given energy condition, be difficult to break through diffraction limit, process the hole that diameter is less; And under macro-energy condition, hole depth can not continue to increase along with the increase of laser energy yet, the expansion in aperture also can cause aspect ratio to reduce, and is accompanied by Hole Wall Roughness rising, the phenomenons such as hole tail end bifurcated.
Summary of the invention
The object of the invention is that efficiency is low when overcoming femtosecond laser processing micropore, aspect ratio is little, ropy deficiency, provides a kind of visible ray dipulse technology that adopts to carry out the overall method of improving femtosecond laser processing micropore.The method is by regulating the parameter such as subpulse time delay, wavelength, energy of ultrafast laser dipulse, Effective Regulation Local Instantaneous electronic Dynamic, thereby change its respective material characteristic and corresponding Reciprocity of Laser & Materials process, improve efficiency, aspect ratio and the quality of Laser microdrilling.
The object of the invention is to be achieved through the following technical solutions:
A kind of femtosecond laser high efficiency of the present invention is processed the method for large aspect ratio high-quality micropore, said method comprising the steps of:
Step 1) adopts fs-laser system to produce near-infrared femtosecond laser pulse, utilize femtosecond laser optical parametric amplifier nearly the wavelength regulation of infrared femtosecond single laser pulse be visible ray, then utilize the light path of Michelson's interferometer structure that single laser pulse is modulated to laser dipulse, recycle continuous attenuator and adjust the processing threshold value that the gross energy of laser dipulse is not less than sample to be processed;
Step 2) make the visible ray dipulse that obtains in step 1) through optical shutter, and by vertical focusing after object lens in the upper surface of sample to be processed;
Step 3) is utilized the time for exposure of optical shutter control visible ray dipulse, and then adjusts the laser pulse number that is irradiated to sample surfaces to be processed, until the degree of depth of processing micropore reaches capacity.
Described sample to be processed is broad stopband transparent material, comprises glass, crystal, pottery and polymer.
Further, in step 1), visible wavelength adjustable range is 480-780nm.
Further, in step 1), the delay time between two subpulses of dipulse is 100-300fs.
Further, step 2) in, realize the upper surface imaging of sample to be processed and focus in order to detection laser by longitudinal CCD and longitudinal white light source.
Further, in step 3), by the processing pattern of horizontal CCD and horizontal white light source Real-Time Monitoring micropore.
Further, in step 3), can use nitrogen to blow away the chip producing in process.
Beneficial effect:
The present invention is by optical maser wavelength is adjusted to visible light wave range, and generates dipulse sequence by time domain shaping, realizes high efficiency capillary processing, compared with traditional femtosecond laser manufacture method, can effectively improve aspect ratio and the quality of capillary processing.
Accompanying drawing explanation
Fig. 1 is the index path of femtosecond laser visible ray dipulse processing method of the present invention;
Wherein, 1-femto-second laser; 2-femtosecond laser optical parametric amplifier; The continuous attenuator of 3-; 4-Amici prism; 5-light-combining prism; 6-the first speculum; 7-the second speculum; 8-the 3rd speculum; 9-the 4th speculum; 10-mechanical translation platform; 11-fiber spectrometer; 12-autocorrelation function analyzer; 13-optical shutter; 14-optical shutter control system; 15-dichroscope; 16-object lens; 17-sample to be processed; 18-6 ties up precise mobile platform; 19-mobile platform control system; The longitudinal white light source of 20-; The longitudinal CCD of 21-; The horizontal CCD of the horizontal white light source 23-of 22-; 24-nitrogen device.
Fig. 2 is the pattern comparison diagram of traditional infrared wave band femtosecond laser pulse processing method and processing method of the present invention processing micropore.
The specific embodiment
Below in conjunction with drawings and Examples, content of the present invention is described further.
Embodiment
Take the micropore of processing PMMA polymer (polymethyl methacrylate) as example, adopt femtosecond laser visible ray dipulse processing method of the present invention, concrete application apparatus is as follows:
Femto-second laser 1 is the laser instrument that U.S.'s spectrum physics (Spectrum Physics) company produces, optical maser wavelength 800nm, and pulse width 50fs, repetition rate 1KHz, pulse ceiling capacity 3mJ, light distribution is Gaussian, linear polarization.
Femtosecond laser optical parametric amplifier 2 is the TOPAS-C that Light Conversion company of the U.S. produces, and the femto-second laser pulse of 800nm can be regulated continuously in 290-2600nm wave-length coverage, and degree of regulation is 0.1nm.
Michelson's interferometer structure part comprises: Amici prism 4, light-combining prism 5, the first speculums 6, the second speculum 7, the 3rd speculum 8, the 4th speculum 9, mechanical translation platform 10.Can change two time delays that son is interpulse by the displacement that regulates mechanical translation platform 10.Wherein, mechanical translation platform 10 adjustable ranges are ± 25mm, and adjustment precision is 2um, and dipulse time delay adjusting range is 0-83ps(head and the tail subpulse largest interval time), time delay degree of regulation is 6.6fs.
Attenuator 3 is the circular neutral density gradual filter of the photoelectricity GCC-3030 of Daheng continuously, can be by adjusting the anglec of rotation of eyeglass in visible ray arrives infrared light district, the ratio that changes absorption/reflection light and transmitted light changes the size of optical attenuation, and laser energy adjustable range is 1%-90%.
Optical shutter 13, for the SH05 that Thorlabs company produces, can be controlled the laser explosure time, and its switching response time is 1ms.
Concrete procedure of processing is as follows:
(1) utilize femto-second laser 1 to produce near-infrared femtosecond laser pulse, then utilize femtosecond laser optical parametric amplifier 2 to regulate optical maser wavelength for 680nm, wherein wavelength regulation precision is proofreaied and correct by fiber spectrometer 11, single laser pulse is divided into two bundle subpulse light after Amici prism 4, wherein reflect subpulse via the first speculum 6, the second speculum 7 reflects, transmission subpulse is via the 3rd speculum 8 being arranged on mechanical translation platform 10, the 4th speculum 9 reflects, two bundle subpulse light close bundle by light-combining prism 5 afterwards, be modulated to dipulse sequence, the wherein displacement of manual control machine tool translation stage 10, making two bundle subpulses is 60 μ m in the optical path difference at light-combining prism place, two interpulse delay times of son are 200fs, wherein time delay is confirmed by autocorrelation function analyzer 12 zero point, recycling continuous attenuator 3 adjusts laser dipulse to arrive the gross energy of processing place is 20 μ J,
(2) femtosecond laser visible ray dipulse is passed to optical shutter 13 and reflexed to vertical focusing in object lens 16 by dichroscope 15; Sample 17 to be processed is horizontally fixed on 6 dimension precise mobile platforms 18; By longitudinal CCD21 and white light source 20 imagings, move 6 dimension precise mobile platforms 18 by platform control system 19 and make laser spot be positioned at the upper surface of the sample to be processed 17 of horizontal positioned;
(3) utilize optical shutter control system 14 that the time for exposure of optical shutter 13 is set as to 50ms, the laser pulse number that switch is irradiated to sample to be processed 17 surfaces is 50, successively open optical shutter 13, and by the processing pattern of horizontal CCD23 and white light source 22 Real-Time Monitoring micropores, until hole depth reaches capacity; In process, can use nitrogen 24 to blow away from micropore bottom splash chip out, prevent that chip from disturbing the entrance of Laser Processing path and blocked hole.In the time that pulse number is 200, hole working depth is saturated, and hole depth is 890 μ m, and aspect ratio is 91:1, and hole wall is smooth, and aperture is even, and hole tail end is without bifurcation, and its pattern is as shown in (b) in accompanying drawing 2.
Comparative example:
Take the micropore of processing PMMA polymer (polymethyl methacrylate) as example, adopt traditional infrared band femtosecond laser pulse processing method, concrete application apparatus is as follows:
Fs-laser system 1 is the laser instrument that U.S.'s spectrum physics (Spectrum Physics) company produces, optical maser wavelength 800nm, and pulse width 50fs, repetition rate 1KHz, pulse ceiling capacity 3mJ, light distribution is Gaussian, linear polarization.
Attenuator 3 is the circular neutral density gradual filter of the photoelectricity GCC-3030 of Daheng continuously, can be by adjusting the anglec of rotation of eyeglass in visible ray arrives infrared light district, the ratio that changes absorption/reflection light and transmitted light changes the size of optical attenuation, and laser energy adjustable range is 1%-90%.
Optical shutter 13, for the SH05 that Thorlabs company produces, can be controlled the laser explosure time, and its switching response time is 1ms.
(1) utilize femto-second laser 1 to produce near-infrared femtosecond laser pulse; Close femtosecond laser optical parametric amplifier 2, optical maser wavelength is not done to any change; Use shadow shield to block any way pulsed light, the energy that recycles continuous attenuator 3 adjustment residue one way pulsed lights arrival processing place is 20 μ J;
(2) femtosecond laser pulse is passed to optical shutter 13 and reflexes to vertical focusing in object lens 16 by dichroscope 15; Sample 17 to be processed is horizontally fixed on 6 dimension precise mobile platforms 18; By longitudinal CCD21 and white light source 20 imagings, move 6 dimension precise mobile platforms 18 by platform control system 19 and make laser spot be positioned at the upper surface of the sample to be processed 17 of horizontal positioned;
(3) utilize optical shutter control system 14 that the time for exposure of optical shutter 13 is set as to 50ms, the laser pulse number that switch is irradiated to sample to be processed 17 surfaces is 50, successively open optical shutter 13, and by the processing pattern of horizontal CCD23 and white light source 22 Real-Time Monitoring micropores, until hole depth reaches capacity.In process, can use nitrogen 24 to blow away from micropore bottom splash chip out, prevent that chip from disturbing the entrance of Laser Processing path and blocked hole.In the time that pulse number is 450, hole working depth is saturated, and hole depth is 552 μ m, and aspect ratio is 26:1, and hole wall is coarse, aperture thickness inequality, and hole tail end has bifurcation, and its pattern is as shown in (a) in Fig. 2.
From embodiment and comparative example relatively:
(1) adopt traditional infrared band pulse to add man-hour, pulse number hole working depth in the time of 450 can be tending towards saturated, and in the time using visible ray dipulse, pulse number used can be reduced to 200, and its working (machining) efficiency improves 1.25 times.
(2) under the energy of 20 μ J, the degree of depth of visible ray dipulse (wavelength 680nm, two sub-pulse delay 200fs) capillary processing is 890 μ m, and aspect ratio is 91:1, is respectively 1.61 times and 3.45 times of traditional infrared wave band pulse.And the micropore hole wall that visible ray dipulse method processes is smooth, aperture is even, and hole tail end does not have bifurcation.
Claims (7)
1. femtosecond laser high efficiency is processed a method for large aspect ratio high-quality micropore, it is characterized in that said method comprising the steps of:
Step 1) adopts fs-laser system to produce near-infrared femtosecond laser pulse, utilize femtosecond laser optical parametric amplifier nearly the wavelength regulation of infrared femtosecond single laser pulse be visible ray, then utilize the light path of Michelson's interferometer structure that single laser pulse is modulated to laser dipulse, recycle continuous attenuator and adjust the processing threshold value that the gross energy of laser dipulse is not less than sample to be processed;
Step 2) make the visible ray dipulse that obtains in step 1) through optical shutter, and by vertical focusing after object lens in the upper surface of sample to be processed;
Step 3) is utilized the time for exposure of optical shutter control visible ray dipulse, and then adjusts the laser pulse number that is irradiated to sample surfaces to be processed, until the degree of depth of processing micropore reaches capacity.
2. the method that a kind of femtosecond laser high efficiency as claimed in claim 1 is processed large aspect ratio high-quality micropore, is characterized in that: described sample to be processed is broad stopband transparent material.
3. the method that a kind of femtosecond laser high efficiency as claimed in claim 1 is processed large aspect ratio high-quality micropore, is characterized in that: in step 1), visible wavelength adjustable range is 480-780nm.
4. the method that a kind of femtosecond laser high efficiency as claimed in claim 1 is processed large aspect ratio high-quality micropore, is characterized in that: in step 1), the delay time between two subpulses of dipulse is 100-300fs.
5. the method that a kind of femtosecond laser high efficiency as claimed in claim 1 is processed large aspect ratio high-quality micropore, is characterized in that: step 2) in, realize the upper surface imaging of sample and focus in order to detection laser by longitudinal CCD and longitudinal white light source.
6. the method that a kind of femtosecond laser high efficiency as claimed in claim 1 is processed large aspect ratio high-quality micropore, is characterized in that: in step 3), by the processing pattern of horizontal CCD and horizontal white light source Real-Time Monitoring micropore.
7. the method that a kind of femtosecond laser high efficiency as claimed in claim 1 is processed large aspect ratio high-quality micropore, is characterized in that: in step 3), use nitrogen to blow away the chip producing in process.
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| CN105081564A (en) * | 2015-08-31 | 2015-11-25 | 大族激光科技产业集团股份有限公司 | Processing method and device for inner hole of tempered glass |
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