TWI547336B - Apparatus for processing work by laser beam - Google Patents
Apparatus for processing work by laser beam Download PDFInfo
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- TWI547336B TWI547336B TW101119079A TW101119079A TWI547336B TW I547336 B TWI547336 B TW I547336B TW 101119079 A TW101119079 A TW 101119079A TW 101119079 A TW101119079 A TW 101119079A TW I547336 B TWI547336 B TW I547336B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/044—Seam tracking
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0652—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising prisms
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0869—Devices involving movement of the laser head in at least one axial direction
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Mechanical Optical Scanning Systems (AREA)
Description
本發明係有關一種工件加工裝置,特別是對玻璃基板等之工件照射雷射光進行加工之工件加工裝置。 The present invention relates to a workpiece processing apparatus, and more particularly to a workpiece processing apparatus that irradiates a workpiece such as a glass substrate with laser light.
就使用雷射光工件加工裝置而言,已知有例如專利文獻1所示之裝置。於此種加工裝置中,係將波長532nm左右之綠色雷射光照射在玻璃基板等工件。綠色雷射光雖一般會穿透玻璃基板,但將雷射光聚光,其強度超過某一閾值時,玻璃基板將會吸收雷射光。在此狀態下,將在雷射光之聚光部產生電漿,玻璃基板因此蒸發。利用如上之原理,即可在玻璃基板進行形成孔等之加工。 For the use of a laser light workpiece processing apparatus, for example, a device disclosed in Patent Document 1 is known. In such a processing apparatus, green laser light having a wavelength of about 532 nm is irradiated onto a workpiece such as a glass substrate. Although the green laser light generally penetrates the glass substrate, the laser light is concentrated, and when the intensity exceeds a certain threshold, the glass substrate will absorb the laser light. In this state, plasma is generated in the condensing portion of the laser light, and the glass substrate is thus evaporated. By the above principle, processing for forming a hole or the like can be performed on the glass substrate.
此外,在專利文獻2中,揭示有一種在雷射光聚光用光學系統之下方,設有偏心用光學系統及輔助氣噴嘴之雷射加工頭。偏心用光學系統為旋轉驅動自如,能使雷射光自雷射光聚光用光學系統之光軸偏心。而且,輔助氣噴嘴係在使來自偏心用光學系統之雷射光通過,同時對同軸噴射輔助氣體。此專利文獻2之偏心用光學系統係具有隔著間隙而配置之一組楔形稜鏡。而各個楔形稜鏡係分別藉由其馬達在光軸周圍旋轉自如。 Further, Patent Document 2 discloses a laser processing head in which an optical system for eccentricity and an auxiliary air nozzle are provided below the optical system for laser light collecting. The eccentric optical system is freely rotatable, and the laser light can be eccentric from the optical axis of the optical system for laser light collecting. Further, the auxiliary gas nozzle is configured to pass the laser light from the eccentric optical system while simultaneously injecting the auxiliary gas coaxially. The eccentric optical system of Patent Document 2 has a set of dovetails disposed with a gap interposed therebetween. Each of the wedge-shaped turns is freely rotatable around the optical axis by its motor.
專利文獻1:日本特開2007-118054號公報 Patent Document 1: Japanese Laid-Open Patent Publication No. 2007-118054
專利文獻2:日本特開平11-156579號公報- Patent Document 2: Japanese Laid-Open Patent Publication No. Hei 11-156579-
使用如上述之習知雷射光加工設備,而沿著圓、圓弧、S字形等曲線在玻璃基板上掃描雷射光時,必須將裝載有玻璃基板之機台朝x方向及y方向同步驅動。例如,自朝x方向延伸之直線經由圓弧狀曲線部分向沿著朝y方向延伸之直線軌跡掃描雷射光時,必須在開始時僅以x方向驅動用之馬達移動機台,在圓弧狀軌跡之開始位置驅動y方向驅動用馬達,在圓弧狀軌跡之終止位置停止x方向驅動用馬達。 When scanning laser light on a glass substrate along a curve such as a circle, an arc, or an S-shape by using a conventional laser light processing apparatus as described above, it is necessary to synchronously drive the stage on which the glass substrate is mounted in the x direction and the y direction. For example, when scanning a laser beam from a straight line extending in the x direction to a linear trajectory extending in the y direction via an arcuate curved portion, it is necessary to drive the motor in the x direction only at the beginning, in an arc shape. The y-direction drive motor is driven at the start position of the trajectory, and the x-direction drive motor is stopped at the end position of the arc-shaped trajectory.
但是,因機台具有較大之慣性,對於各馬達之驅動控制,無法立即使機台移動或停止。亦即,即使在圓弧狀軌跡之開始位置開始驅動y方向驅動用馬達時,機台之y方向之動作亦會延遲,反之在圓弧狀軌跡之終止位置停止x方向驅動用馬達時,機台也會因慣性而無法立刻停止x方向之動作。 However, since the machine has a large inertia, the machine cannot be moved or stopped immediately for the drive control of each motor. In other words, even when the y-direction driving motor is started to be driven at the start position of the arc-shaped trajectory, the operation of the y-direction of the machine is delayed, and when the x-direction driving motor is stopped at the end of the arc-shaped trajectory, the machine is stopped. The station will also be unable to stop the x-direction motion immediately due to inertia.
因此,有必要預估如上所述機台因慣性之追隨性的降低來進行控制,或降低掃描速度(機台之移動速度)來進行加工。如此,控制會變得複雜,且加工速度會降低,因而使加工效率降低。 Therefore, it is necessary to estimate that the machine is controlled by the decrease in the followability of the inertia as described above, or by reducing the scanning speed (the moving speed of the machine). In this way, the control becomes complicated, and the processing speed is lowered, thereby reducing the processing efficiency.
本發明之目的為,沿著含圓、圓弧、S字形等曲線之加工線掃描雷射光時,可抑制掃描速度之降低,而能提高加工效率。 SUMMARY OF THE INVENTION An object of the present invention is to suppress a decrease in scanning speed and to improve processing efficiency when scanning laser light along a processing line including a curve such as a circle, an arc, or an S-shape.
第1發明之使用雷射光之工件加工裝置,係為對工件照射雷射光而進行加工之加工裝置,其具備:工件機台, 裝載有要加工之工件;機台驅動手段;雷射光輸出部,用以輸出雷射光;偏向/旋轉手段;及掃描控制手段。機台驅動手段係使工件機台在與裝載面平行之面內朝互相正交之x、y方向移動。偏向/旋轉手段係將從雷射輸出部所射出之雷射光自射出軸偏向,同時使偏向之雷射光在射出軸之周圍旋轉。掃描控制手段係協調控制機台驅動手段及偏向/旋轉手段之驅動,使一面移動於上述工件機台一面在射出軸周圍旋轉之雷射光沿著加工線掃描,俾使上述偏向/旋轉手段之上述射出軸以比上述加工線之曲線部更大之半徑移動。 A workpiece processing apparatus using laser light according to a first aspect of the invention is a processing apparatus that irradiates a workpiece with laser light, and includes a workpiece machine. The workpiece to be processed is loaded; the machine driving means; the laser light output part for outputting the laser light; the deflection/rotation means; and the scanning control means. The machine driving means moves the workpiece table in the x and y directions orthogonal to each other in a plane parallel to the loading surface. The deflection/rotation means deflects the laser light emitted from the laser output unit from the emission axis while rotating the deflected laser light around the emission axis. The scanning control means coordinates the control of the machine driving means and the deflection/rotation means to scan the laser beam rotating around the injection axis while moving on the workpiece table along the processing line, thereby causing the above-mentioned deflection/rotation means The injection axis moves at a larger radius than the curved portion of the processing line.
於此裝置中,有裝載工件之工件機台係藉由機台驅動手段朝x及y方向驅動,同時自射出軸偏向之雷射光會藉由偏向/旋轉手段在射出軸周圍旋轉。因此,當加工線含曲線時,在此曲線部分中,使工件機台朝x、y方向移動之同時,使雷射光偏向/旋轉,藉此即可使工件機台移動之軌跡,有如描繪出比加工線之曲線大的半徑。 In this apparatus, the workpiece machine on which the workpiece is loaded is driven in the x and y directions by the machine driving means, and the laser light deflected from the shooting axis is rotated around the shooting axis by the biasing/rotating means. Therefore, when the processing line contains a curve, in the curve portion, the workpiece machine is moved in the x and y directions while the laser light is deflected/rotated, thereby making the path of the workpiece machine move, as depicted. A radius larger than the curve of the processing line.
在此,由於可使工件機台之掃描軌跡的半徑加大,因此即使工件機台對於驅動手段之追隨性較遲鈍,仍可加快掃描速度。因此,加工速度會變快速,且加工效率也提高。 Here, since the radius of the scanning trajectory of the workpiece machine can be increased, the scanning speed can be increased even if the follower of the workpiece machine to the driving means is slow. Therefore, the processing speed becomes faster and the processing efficiency also increases.
第2發明之使用雷射光之工件加工裝置,係在第1發明之裝置中,偏向/旋轉手段,係具有:第1楔形稜鏡與第2楔形稜鏡,配置成互相對向;旋轉手段,使第1與第2楔形稜鏡在射出軸之周圍旋轉;及聚光透鏡,使雷射光聚光在工件上。 According to a second aspect of the invention, in the apparatus of the first aspect of the invention, the deflecting/rotating means includes: the first dovetail and the second dovetail are arranged to face each other; and the rotating means The first and second dovetails are rotated about the exit axis; and the collecting lens is used to condense the laser light onto the workpiece.
在此,藉由使一對楔型稜鏡在射出軸周圍旋轉,即可使聚光在工件上之雷射光旋轉。 Here, by rotating a pair of wedge-shaped turns around the exit axis, the laser light collected on the workpiece can be rotated.
第3發明之使用雷射光之工件加工裝置,係在第2發 明之裝置中,偏向/旋轉手段之旋轉手段係具有:第1馬達,用以使第1楔形稜鏡在射出軸周圍旋轉;及第2馬達,用以使第2楔形稜鏡在射出軸周圍旋轉。 The workpiece processing apparatus using laser light according to the third invention is the second In the apparatus of the present invention, the rotation means of the deflecting/rotating means includes: a first motor for rotating the first dovetail around the injection axis; and a second motor for rotating the second dovetail about the injection axis .
在此,能個別控制各楔型稜鏡。因此可任意控制雷射光之偏向量。 Here, each wedge type can be individually controlled. Therefore, the partial vector of the laser light can be arbitrarily controlled.
第4發明之使用雷射光之工件加工裝置,係在第1發明之裝置中,偏向/旋轉手段之旋轉手段為一種中空馬達,內部配置有第1與第2楔形稜鏡。 According to a fourth aspect of the invention, in the apparatus of the first aspect of the invention, the means for rotating the deflecting/rotating means is a hollow motor in which the first and second dovetails are disposed.
第5發明之使用雷射光之工件加工裝置,係在第1發明之裝置中,掃描控制手段係在掃描直線狀之加工線時,藉由機台驅動手段,控制機台朝x方向或y方向移動。又,在掃描曲線狀之加工線時,藉由機台驅動手段,控制機台朝x方向或y方向移動,同時藉由上述偏向/旋轉手段使雷射光旋轉。 According to a fifth aspect of the invention, in the apparatus of the first aspect of the invention, the scanning control means controls the machine in the x direction or the y direction by the machine driving means when scanning the linear processing line. mobile. Further, when the curved processing line is scanned, the machine driving means controls the table to move in the x direction or the y direction, and the laser light is rotated by the above-described deflection/rotation means.
在此,如同上述,能使工件之掃描軌跡半徑更加大。因此,即使工件機台對於驅動裝置之追隨性較遲鈍,仍可加快掃描速度而能提高加工效率。 Here, as described above, the scan trajectory radius of the workpiece can be made larger. Therefore, even if the workpiece machine is less sluggish with respect to the driving device, the scanning speed can be increased and the processing efficiency can be improved.
第6發明之使用雷射光之工件加工裝置,係在第5發明之裝置中,偏向/旋轉手段係具有:第1楔形稜鏡與第2楔形稜鏡,配置成互相對向;旋轉手段,使第1與第2楔形稜鏡在射出軸周圍旋轉;及聚光透鏡,使雷射光聚光在工件上。其中,掃描控制手段係在沿着包含直線部與曲線部之加工線掃描雷射光時,在掃描加工線直線部時,係藉由機台驅動手段控制機台朝x方向或y方向移動,在掃 描加工線之曲線部時,係藉由機台驅動手段控制機台朝x方向或y方向移動,同時使第1與第2楔形稜鏡在射出軸之周圍朝相同方向旋轉。 According to a fifth aspect of the invention, in the apparatus of the fifth aspect of the invention, the deflecting/rotating means includes: the first dovetail and the second dovetail are arranged to face each other; and the rotating means is configured to The first and second dovetails rotate around the exit axis; and the concentrating lens condenses the laser light onto the workpiece. The scanning control means controls the machine table to move in the x direction or the y direction by the machine driving means when scanning the laser beam along the processing line including the straight line portion and the curved portion. sweep When the curved portion of the processing line is drawn, the machine driving means controls the movement of the machine in the x direction or the y direction, and the first and second dovetails are rotated in the same direction around the injection axis.
在此,如同上述,能使工件機台之掃描軌跡半徑更加大。 Here, as described above, the scanning track radius of the workpiece machine can be made larger.
第7發明之使用雷射光之工件加工裝置,係在第5發明之裝置中,偏向/旋轉手段係具有:第1楔形稜鏡與第2楔形稜鏡,配置成互相對向;旋轉手段,使第1與第2楔形稜鏡在光軸周圍旋轉;及聚光透鏡,使雷射光聚光在工件上。其中,掃描控制手段係在沿着包含直線部與曲線部之加工線掃描雷射光時,在掃描之加工線之直線部時,係藉由機台驅動手段控制機台朝x方向或y方向移動,在掃描加工線之曲線部時,在包含前述曲線部之前述曲線部的前後區域中,係藉由機台驅動手段控制機台朝x方向或y方向移動,同時使第1與第2楔形稜鏡在射出軸周圍朝相反方向旋轉。 According to a seventh aspect of the invention, in the apparatus of the fifth aspect of the invention, the deflecting/rotating means includes: the first dovetail and the second dovetail are disposed to face each other; and the rotating means is configured to The first and second dovetails rotate around the optical axis; and the collecting lens condenses the laser light onto the workpiece. Wherein, the scanning control means controls the movement of the machine in the x direction or the y direction by the machine driving means when scanning the laser beam along the processing line including the straight line portion and the curved portion portion, when scanning the straight portion of the processing line When scanning the curved portion of the processing line, in the front and rear regions including the curved portion including the curved portion, the machine driving means controls the movement of the machine in the x direction or the y direction, and the first and second wedge shapes are simultaneously formed.稜鏡 Rotate in the opposite direction around the exit axis.
在此,能加大工件機台之掃描半徑,更可提高加工效率。 Here, the scanning radius of the workpiece machine can be increased, and the machining efficiency can be improved.
第8發明之使用雷射光之工件加工裝置,係在自第1至第7發明中任一項之裝置中,復具備聚光點旋轉機構,用以使雷射光之聚光點旋轉者,係配置在雷射光輸出部與偏向/旋轉手段之間,且包括一對楔型稜鏡及內部配置有一對楔型稜鏡之中空馬達。 A workpiece processing apparatus using laser light according to any one of the first to seventh aspects of the present invention, further comprising a condensing point rotating mechanism for rotating a condensing point of the laser light It is disposed between the laser light output portion and the deflection/rotation means, and includes a pair of wedge-shaped turns and a hollow motor in which a pair of wedge-shaped turns are disposed.
在此,通過一對楔型稜鏡而偏向之雷射光,係在照射 光軸周圍旋轉。此被偏向且旋轉之雷射光將聚光在工件上而描繪圓形。此圓形之整體軌跡將沿著加工線掃描。 Here, the laser light deflected by a pair of wedge-shaped turns is illuminated Rotate around the optical axis. This deflected and rotated laser light will converge on the workpiece to draw a circle. The overall trajectory of this circle will be scanned along the processing line.
依據如上之本發明,在使用雷射光之工件加工中,當沿著包含曲線狀軌跡之掃描線進行雷射加工時,可抑制掃描速度之降低,而能提高加工效率。 According to the invention as described above, in the processing of the workpiece using the laser light, when the laser processing is performed along the scanning line including the curved track, the reduction in the scanning speed can be suppressed, and the processing efficiency can be improved.
第1圖為顯示本發明之一實施形態之工件加工裝置之整體構成。此工件加工裝置係對玻璃基板等之工件沿著加工線照射雷射光,進行鑽孔等之加工的裝置。此裝置係具備:底座1;工件機台2,裝載有作為工件之玻璃基板;及雷射光照射頭3,對玻璃基板照射雷射光。如第1圖所示,在沿著底座1上表面之平面上,將互相正交之軸設為x軸與y軸,將與此等軸正交之鉛直方向之軸設為z軸。並且,將沿x軸之雙向(+方向與-方向)設為x軸方向,將沿y軸之雙向設為y軸方向,將沿z軸之雙向設為z軸方向。 Fig. 1 is a view showing the overall configuration of a workpiece processing apparatus according to an embodiment of the present invention. This workpiece processing apparatus is a device that irradiates laser light onto a workpiece such as a glass substrate along a processing line to perform processing such as drilling. This apparatus includes a base 1, a workpiece machine 2 on which a glass substrate as a workpiece is mounted, and a laser light irradiation head 3 that irradiates the glass substrate with laser light. As shown in Fig. 1, on the plane along the upper surface of the base 1, the axes orthogonal to each other are defined as the x-axis and the y-axis, and the axis in the vertical direction orthogonal to the axes is defined as the z-axis. Further, the bidirectional (+ direction and - direction) along the x-axis is set to the x-axis direction, the bidirectional direction along the y-axis is set to the y-axis direction, and the bidirectional direction along the z-axis is set to the z-axis direction.
工件機台2係形成為矩形狀,在工件機台2之下方設有機台移動機構5,用以使工件機台2朝x軸方向與y軸方向移動。 The workpiece table 2 is formed in a rectangular shape, and a machine moving mechanism 5 is provided below the workpiece machine 2 for moving the workpiece table 2 in the x-axis direction and the y-axis direction.
放大第2圖所示之工件機台2,具有複數個方塊6。此複數方塊6係將圖中一點鏈線所示之玻璃基板G,自工件 機台2之表面抬提而支撑之構件,為了避開玻璃基板G之加工線L(以虛線所示),而可裝設在工件機台2之任何位置。再者,在工件機台2以格柵狀形成有複數個吸氣孔2a,同時在各方塊6形成有貫穿上下方向之吸氣孔6a。而且,藉由連接方塊6之吸氣孔6a與工件機台2之吸氣孔2a,即可吸附固定配置在方塊6上之玻璃基板G。此外,吸氣用之機構為由眾所皆知之排氣泵等所構成,在此省略其說明。 The workpiece table 2 shown in Fig. 2 is enlarged, and has a plurality of blocks 6. The plural block 6 is a glass substrate G shown by a chain line in the figure, from the workpiece The member supported by the surface of the machine table 2 can be mounted at any position of the workpiece machine 2 in order to avoid the processing line L (shown by a broken line) of the glass substrate G. Further, a plurality of intake holes 2a are formed in the grid shape on the workpiece table 2, and the intake holes 6a penetrating in the vertical direction are formed in each of the blocks 6. Further, the glass substrate G disposed on the square 6 can be adsorbed and fixed by connecting the air suction holes 6a of the block 6 and the air suction holes 2a of the workpiece machine 2. Further, the mechanism for inhaling is constituted by a well-known exhaust pump or the like, and the description thereof is omitted here.
機台移動機構5為如第1圖所示,具有:分別為一對之第1及第2導軌8、9;第1與第2移動機台10、11;及驅動各移動機台10、11之y軸馬達5a與x軸馬達5b(參照第7圖)。一對第1導軌8係在底座1之上表面設成朝y軸方向延伸。第1移動機台10係設在第1導軌8之上部,在其下表面具有與第1導軌8卡合而移動自如之複數個導引部10a。第2導軌9係設在第1移動機台10之上表面而朝x軸方向延伸。第2移動機台11係設在第2導軌9之上部,在其下表面具有與第2導軌9卡合而移動自如之複數個導引部11a。在第2移動機台11之上表面,透過固定構件12裝設工件機台2。 As shown in Fig. 1, the machine moving mechanism 5 includes: a pair of first and second guide rails 8 and 9; first and second mobile stations 10 and 11; and each mobile station 10; 11 y-axis motor 5a and x-axis motor 5b (refer to Fig. 7). The pair of first guide rails 8 are provided on the upper surface of the base 1 so as to extend in the y-axis direction. The first moving machine table 10 is provided on the upper portion of the first rail 8, and has a plurality of guide portions 10a that are movably engaged with the first rail 8 on the lower surface thereof. The second guide rail 9 is provided on the upper surface of the first moving machine table 10 and extends in the x-axis direction. The second moving machine table 11 is provided on the upper portion of the second guide rail 9, and has a plurality of guide portions 11a that are movably engaged with the second guide rail 9 on the lower surface thereof. On the upper surface of the second moving machine table 11, the workpiece machine 2 is mounted through the fixing member 12.
藉由如上之機台移動機構5,工件機台2即可朝x軸方向及y軸方向移動自如。 With the above-described machine moving mechanism 5, the workpiece table 2 can be moved in the x-axis direction and the y-axis direction.
雷射光照射頭3係如第1圖與第3圖所示,裝設在配 置於底座1上表面之門型框架1a,且具有:雷射光輸出部15;光學系統16;高速中空馬達17,其內部安裝有一對高速旋轉用楔型稜鏡(後述);及旋轉/偏向機構18,其內部組裝有一對低速旋轉用楔型稜鏡(後述)與聚光透鏡。另設有:x軸方向移動機構21,使雷射光照射頭3向x軸方向移動;及z軸方向移動機構22,使高速中空馬達17及偏向/旋轉機構18朝z軸方向移動。而z軸方向移動機構22具有z軸馬達22a(參照第7圖)等。 The laser light irradiation head 3 is mounted as shown in Figs. 1 and 3 a gantry frame 1a placed on the upper surface of the base 1, and having: a laser light output portion 15; an optical system 16; a high-speed hollow motor 17 having a pair of high-speed rotating wedges (described later); and a rotation/biasing The mechanism 18 is internally provided with a pair of low-speed rotation wedges (described later) and a collecting lens. Further, an x-axis direction moving mechanism 21 is provided to move the laser light irradiation head 3 in the x-axis direction, and a z-axis direction moving mechanism 22 moves the high-speed hollow motor 17 and the deflection/rotation mechanism 18 in the z-axis direction. The z-axis direction moving mechanism 22 has a z-axis motor 22a (see FIG. 7) and the like.
雷射光輸出部15係由與習知相同之雷射管所構成。藉由此雷射光輸出部15,波長532nm之綠色雷射光會沿著y軸朝工件機台2之相反側射出。 The laser light output unit 15 is constituted by a laser tube similar to the conventional one. With this laser light output portion 15, green laser light having a wavelength of 532 nm is emitted toward the opposite side of the workpiece stage 2 along the y-axis.
光學系統16係將來自雷射光輸出部15之雷射光導引至組裝在高速中空馬達17之一對高速旋轉用楔型稜鏡。此光學系統16係如第3圖之放大圖所示,具有:第1至第4反射鏡25至28;動力監視器29,用以測量雷射光輸出;及光束擴展器30。 The optical system 16 guides the laser light from the laser light output unit 15 to one of the high speed hollow motors 17 and the high speed rotating wedge type. The optical system 16 is shown in an enlarged view of FIG. 3, and has: first to fourth reflecting mirrors 25 to 28; a power monitor 29 for measuring laser light output; and a beam expander 30.
第1反射鏡25係配置在雷射光輸出部15之輸出側附近,將射出至y軸方向之雷射光反射至x軸方向。第2反射鏡26係配置在x軸方向與第1反射鏡25排列,將朝x軸方向行進之雷射光反射至y軸方向至導引至工件機台2側。第3反射鏡27及第4反射鏡28係配置在高速中空馬達17之上方排列在x軸方向。第3反射鏡27係將由第2 反射鏡所反射而來之雷射光導入至第4反射鏡28。第4反射鏡28係將由第3反射鏡27所反射而來之雷射光導入至下方之高速中空馬達17。光束擴展器30係配置在第2反射鏡26與第3反射鏡27之間,且用以將由第2反射鏡26所反射而來之雷射光擴展為固定倍率的平行光束而設者。藉由此光束擴展器30,可將雷射光聚光為更小之光點。 The first mirror 25 is disposed in the vicinity of the output side of the laser light output unit 15, and reflects the laser light emitted to the y-axis direction in the x-axis direction. The second mirror 26 is arranged in the x-axis direction and arranged in the first mirror 25, and reflects the laser light traveling in the x-axis direction in the y-axis direction to the workpiece table 2 side. The third mirror 27 and the fourth mirror 28 are arranged above the high speed hollow motor 17 in the x-axis direction. The third mirror 27 will be the second The laser light reflected from the mirror is introduced to the fourth mirror 28. The fourth mirror 28 introduces the laser light reflected by the third mirror 27 to the high-speed hollow motor 17 below. The beam expander 30 is disposed between the second mirror 26 and the third mirror 27, and is configured to expand the laser light reflected by the second mirror 26 into a parallel beam of a fixed magnification. By means of the beam expander 30, the laser light can be concentrated into smaller spots.
第4圖為在內部配置有高速旋轉用楔型稜鏡321、322之高速中空馬達17的示意圖。高速中空馬達17係在中心具有朝z軸方向延伸之旋轉軸R,包含此旋轉軸R之中央部係成為中空狀。而在此中空部固定有一對高速旋轉用楔型稜鏡321、322。一對楔型稜鏡321、322為同形狀、同比重,僅折射率不同。各楔型稜鏡321、322係分別具有相對於旋轉軸R傾斜之斜面321a、322a,及與旋轉軸R垂直之垂直面321b、322b。而且,一對楔型稜鏡321、322係配置成互相之垂直面321b、322b彼此靠近而相對向,2個垂直面321b、322b成平行,且2個斜面321a、322a成平行。 Fig. 4 is a schematic view showing a high-speed hollow motor 17 in which high-speed rotating wedge-shaped jaws 321 and 322 are disposed inside. The high-speed hollow motor 17 has a rotation axis R extending in the z-axis direction at the center, and the central portion including the rotation axis R is hollow. A pair of high-speed rotating wedges 321 and 322 are fixed to the hollow portion. The pair of wedge-shaped jaws 321 and 322 have the same shape and are heavier than the year-on-year, and have only different refractive indices. Each of the wedge-shaped jaws 321 and 322 has inclined faces 321a and 322a inclined with respect to the rotation axis R, and vertical faces 321b and 322b perpendicular to the rotation axis R. Further, the pair of wedge-shaped jaws 321 and 322 are disposed such that the mutually perpendicular surfaces 321b and 322b are opposed to each other, and the two vertical faces 321b and 322b are parallel, and the two inclined faces 321a and 322a are parallel.
將同形狀、同比重之2個高速旋轉用楔型稜鏡321、322配置成如上,則2個高速旋轉用楔型稜鏡321、322之整體重心將位於旋轉軸R上。因此,即使以高速旋轉此楔型稜鏡321、322,也可大幅地減少其動態不平衡量。 When the two high-speed rotation wedge-shaped jaws 321 and 322 having the same shape and the same weight are arranged as described above, the entire center of gravity of the two high-speed rotation wedge-shaped jaws 321 and 322 is located on the rotation axis R. Therefore, even if the wedge-shaped jaws 321 and 322 are rotated at a high speed, the amount of dynamic unbalance can be greatly reduced.
參照第5圖,將稜鏡之頂角設為δ,將折射率設為n 時,此稜鏡之偏角θ係在δ小時,(n-1)‧δ Referring to Figure 5, the apex angle of the crucible is set to δ, and the refractive index is set to n. At this time, the deviation angle θ of this 系 is δ hours, (n-1)‧δ
再者,上式為SIN δ=δ(單位為radian),是δ微小達近似程度時之近似式。於本實施形態所用之稜鏡,頂角δ最大也不過是約5°,因此Sin δ=δ之近似也無妨。因此同形狀(頂角相同)而折射率分別為n1、n2之2個楔型稜鏡之偏角分別為θ 1、θ 2 θ 1=(n1-1)‧δ Furthermore, the above formula is SIN δ=δ (unit is radian), which is an approximate expression when δ is slightly approximated. In the case of the present embodiment, the maximum apex angle δ is only about 5°, so the approximation of Sin δ = δ is also possible. Therefore, the angles of the two wedge-shaped turns of the same shape (the same apex angle) and the refractive indices of n1 and n2 are respectively θ 1 and θ 2 θ 1 = (n1-1) ‧ δ
θ 2=(n2-1)‧δ於是,如將2個楔型稜鏡組裝配置成斜面為平行時之偏角θ為 θ=(n1-1)‧δ-(n2-1)‧δ=(n1-n2)‧δ如上可知,只要是頂角δ相同且材質相同之楔型稜鏡之組合,則n1=n2時,合計偏角是「0」。 θ 2 = (n2-1) ‧ δ Then, if the two wedge-shaped 稜鏡 are assembled and arranged, the angling angle θ is θ=(n1-1)‧δ-(n2-1)‧δ=(n1-n2)‧δ As can be seen, as long as it is a combination of wedge-shaped turns of the same apex angle δ and the same material, then n1=n2 The total declination is "0".
但是n1≠n2時,合計偏角非為「0」,而是成為與2個楔型稜鏡之折射率之差成正比。 However, when n1≠n2, the total declination is not "0", but is proportional to the difference between the refractive indices of the two wedge-shaped turns.
於是,在此使2個高速旋轉用楔型稜鏡321、322之折射率設為不同,以使通過2個楔型稜鏡321、322之雷射光偏向。亦即,藉由使用如此楔型稜鏡321、322,即可實現用以使旋轉平衡良好之雷射光偏向之機構。 Therefore, the refractive indices of the two high-speed rotation wedge-shaped jaws 321 and 322 are made different here so that the laser light passing through the two wedge-shaped jaws 321 and 322 is deflected. That is, by using such a wedge-shaped crucible 321, 322, a mechanism for deflecting the laser light with a good balance of rotation can be realized.
就比重相同而折射率不同之楔型稜鏡之例而言,可有如下之組合可考慮。 In the case of wedge-shaped crucibles having the same specific gravity and different refractive indices, the following combinations are conceivable.
此組合時之偏角(°)是,相對於頂角1°為「0.169」。 The angling angle (°) at the time of this combination is "0.169" with respect to the apex angle of 1°.
此組合時之偏角(°)是,相對於頂角1°為「0.232」。 The angling angle (°) at this combination is "0.232" with respect to the apex angle of 1°.
此組合時之偏角(°)是,相對於頂角1°為「0.170」。 The angling angle (°) at the time of this combination is "0.170" with respect to the apex angle of 1°.
再者,有關兩楔型稜鏡321、322之形狀(頂角),將如後述之由聚光透鏡之焦距距離f與偏角θ所決定之雷射光的旋轉半徑r(=f/tan θ或是f/θ)設定成所希望之值。 Further, regarding the shape (vertex angle) of the two wedge-shaped jaws 321 and 322, the radius of rotation r of the laser light (=f/tan θ) determined by the focal length distance f and the off-angle θ of the collecting lens as will be described later. Or f/θ) is set to the desired value.
第6圖為在內部配置有1對低速旋轉用楔型稜鏡341、342之偏向/旋轉機構18之示意圖。偏向/旋轉機構18係在中心具有朝z軸方向延伸之旋轉軸。此旋轉軸與高速中空馬達17之旋轉軸R為同軸。此偏向/旋轉機構18具有:一對低速旋轉用楔型稜鏡341、342,設在包含旋轉軸R之中心部;及低速旋轉用第1低速馬達345與第2低速馬達346,分別設成與此等楔型稜鏡對應。第1低速馬達345與第2低速馬達346均為中空馬達,在中空之旋轉軸內部安裝有楔型稜鏡341、342。此等楔型稜鏡341、342係分別藉由所對應裝設之低速旋轉用第1低速馬達345與第2低速馬達346個別地旋轉,且可維持固定之旋轉角度。 Fig. 6 is a schematic view showing a deflection/rotation mechanism 18 in which a pair of low-speed rotation wedge-shaped jaws 341 and 342 are disposed inside. The deflecting/rotating mechanism 18 has a rotating shaft extending in the z-axis direction at the center. This rotating shaft is coaxial with the rotating shaft R of the high speed hollow motor 17. The deflection/rotation mechanism 18 includes a pair of low-speed rotation wedge-shaped jaws 341 and 342 provided at a center portion including the rotation axis R, and a low-speed rotation first low-speed motor 345 and a second low-speed motor 346, respectively. Corresponds to these wedge types. The first low speed motor 345 and the second low speed motor 346 are both hollow motors, and wedge-shaped turns 341 and 342 are attached to the inside of the hollow rotating shaft. The wedge-shaped turns 341 and 342 are individually rotated by the first low-speed motor 345 for low-speed rotation and the second low-speed motor 346, respectively, and the fixed rotation angle can be maintained.
一對低速用楔型稜鏡341、342為同形狀、同材質(同比重),所以折射率也相同。又,一對低速用楔型稜鏡341、 342具有分別相對於旋轉軸傾斜之斜面341a、342a,及與旋轉軸垂直之垂直面341b、342b。藉由如此2個楔型稜鏡341、342之組合,一對低速用楔型稜鏡341、342能有預定之偏角。 The pair of low-speed wedge-shaped jaws 341 and 342 have the same shape and the same material (year-old weight), so the refractive index is also the same. Also, a pair of low-speed wedge type 稜鏡341, The 342 has inclined faces 341a and 342a that are inclined with respect to the rotation axis, and vertical faces 341b and 342b that are perpendicular to the rotation axis. By the combination of the two wedge-shaped jaws 341, 342, the pair of low-speed wedge-shaped jaws 341, 342 can have a predetermined off-angle.
再者,在偏向/旋轉機構18之一對低速用楔型稜鏡341、342之輸出側,固定有聚光透鏡35。惟聚光透鏡35亦可與偏向/旋轉機構18另外單獨配置。 Further, a condenser lens 35 is fixed to the output side of one of the deflecting/rotating mechanisms 18 for the low-speed wedge-shaped jaws 341 and 342. The condenser lens 35 can also be separately disposed separately from the deflection/rotation mechanism 18.
如上之雷射光照射頭3,係如上述由底座1之門型框架1a所支撑。更詳細而言,如第3圖所示,在門型框架1a之上表面設有朝x軸方向延伸之一對第3導軌36,由此第3導軌36及無圖示之驅動機構來構成x軸方向移動機構21。於是在一對第3導軌36,以移動自如之方式支撐有支撑構件37。支撑構件37具有由第3導軌36所支撑之横支撑構件38、及自横支撑構件38之工件機台2側之一端側向下延伸之縱支撑構件39。在縱支撑構件39之側面,設有朝z軸方向延伸之一對第4導軌40,由此一對第4導軌40與未圖示之驅動機構構成z軸方向移動機構22。在第4導軌40以能朝z軸方向移動自如之方式支撑有第3移動機台41。 The above-described laser light irradiation head 3 is supported by the door type frame 1a of the base 1 as described above. More specifically, as shown in FIG. 3, one of the upper rails 36 extending in the x-axis direction is provided on the upper surface of the portal frame 1a, whereby the third rail 36 and a driving mechanism (not shown) are formed. The x-axis direction moving mechanism 21. Then, the support member 37 is movably supported by the pair of third guide rails 36. The support member 37 has a lateral support member 38 supported by the third guide rail 36, and a vertical support member 39 extending downward from one end side of the workpiece support 2 side of the lateral support member 38. The pair of fourth guide rails 40 are provided on the side surface of the vertical support member 39 so as to extend in the z-axis direction, whereby the pair of fourth guide rails 40 and the drive mechanism (not shown) constitute the z-axis direction movement mechanism 22. The third moving stage 41 is supported by the fourth rail 40 so as to be movable in the z-axis direction.
於是,雷射光輸出部15、第1至第4反射鏡25至28、動力監視器29、及光束擴展器30等,係由横支撑構件38所支撑。在第3移動機台41固定有馬達支撑構件42,在此馬達支撑構件42支撑有高速中空馬達17及偏向/旋轉 機構18。 Then, the laser light output unit 15, the first to fourth mirrors 25 to 28, the power monitor 29, the beam expander 30, and the like are supported by the lateral support members 38. A motor support member 42 is fixed to the third moving machine table 41, and the motor support member 42 supports the high speed hollow motor 17 and the deflection/rotation Agency 18.
如第7圖所示,此玻璃基板加工裝置具有控制器50。在控制器50連接有雷射光輸出部15,及用以驅動各移動機台10、11之y軸馬達5a、x軸馬達5b、z軸馬達22a、高速中空馬達17、第1及第2低速馬達345、346。於是,控制器50係控制來自雷射光輸出部15之雷射輸出,同時控制各馬達之旋轉,藉此控制雷射光之掃描軌跡等。 As shown in Fig. 7, the glass substrate processing apparatus has a controller 50. The controller 50 is connected to the laser light output unit 15 and the y-axis motor 5a for driving the respective moving machines 10 and 11, the x-axis motor 5b, the z-axis motor 22a, the high-speed hollow motor 17, and the first and second low speeds. Motors 345, 346. Thus, the controller 50 controls the laser output from the laser light output portion 15 while controlling the rotation of each motor, thereby controlling the scanning trajectory of the laser light and the like.
以下說明使用雷射光之玻璃基板之加工動作。 The processing operation of the glass substrate using laser light will be described below.
首先,在工件機台2之表面裝設複數個方塊6。此時複數個方塊6係如第2圖所示,配置成避開玻璃基板G之加工線L。在如上方式裝設之複數個方塊6上裝載要加工之玻璃基板G。 First, a plurality of blocks 6 are mounted on the surface of the workpiece table 2. At this time, a plurality of blocks 6 are arranged to avoid the processing line L of the glass substrate G as shown in FIG. The glass substrate G to be processed is loaded on a plurality of squares 6 mounted as described above.
其次,藉由x軸方向移動機構21將雷射照射頭3朝x軸方向移動,且藉由機台移動機構5使工件機台2朝y軸方向移動,使雷射照射頭3之雷射光聚光點位於加工線L之開始位置。 Next, the laser irradiation head 3 is moved in the x-axis direction by the x-axis direction moving mechanism 21, and the workpiece table 2 is moved in the y-axis direction by the machine moving mechanism 5, so that the laser light of the laser irradiation head 3 is made. The spotlight is located at the beginning of the processing line L.
如上方式將雷射照射頭3及玻璃基板G移動到加工位置後,將雷射光照射到玻璃基板G進行加工。在此,自雷射光輸出部15射出之雷射光係經第1反射鏡25反射而導入至第2反射鏡26。再者,射入至第1反射鏡25之雷射光係藉由動力監視器29測量雷射輸出。射入至第2反射鏡 26之雷射光係反射到y軸方向,藉由光束擴展器30使光束擴展而導入第3反射鏡27。於是在第3反射鏡27反射,且在第4反射鏡28反射之雷射光,係輸入至設在高速中空馬達17之中心部之一對高速旋轉用楔型稜鏡321、322。 After the laser irradiation head 3 and the glass substrate G are moved to the processing position as described above, the laser light is irradiated onto the glass substrate G for processing. Here, the laser light emitted from the laser light output unit 15 is reflected by the first mirror 25 and introduced into the second mirror 26 . Further, the laser light incident on the first mirror 25 is measured by the power monitor 29 to measure the laser output. Injection into the second mirror The laser light of 26 is reflected in the y-axis direction, and the beam expander 30 expands the light beam to be introduced into the third mirror 27. Then, the laser beam reflected by the third mirror 27 and reflected by the fourth mirror 28 is input to one of the center portions of the high-speed hollow motor 17 and the pair of high-speed rotating wedges 321 and 322.
輸入至一對高速旋轉用楔型稜鏡321、322之雷射光,係藉由不同折射率之2個楔型稜鏡321、322而偏向輸出。又,高速旋轉用楔型稜鏡321、322係例如以15000rpm以上之高速旋轉,因此穿透此等楔型稜鏡321、322之雷射光,係以極小旋轉半徑(例如直徑0.4mm至0.8mm)進行高速旋轉。 The laser light input to the pair of high-speed rotation wedge-shaped crucibles 321 and 322 is biased toward the output by two wedge-shaped crucibles 321 and 322 having different refractive indexes. Further, the high-speed rotation wedge-shaped jaws 321 and 322 are rotated at a high speed of, for example, 15,000 rpm or more, so that the laser light penetrating the wedge-shaped jaws 321 and 322 has a very small radius of rotation (for example, a diameter of 0.4 mm to 0.8 mm). ) Perform high speed rotation.
自高速旋轉用楔型稜鏡321、322射出之雷射光,係被輸入至低速旋轉用楔型稜鏡341、342。此低速旋轉用楔型稜鏡341、342,有一方相對於另一方旋轉,比高速旋轉用楔型稜鏡321、322有較大之偏角。因此,藉由旋轉低速旋轉用楔型稜鏡341、342,使高速旋轉之雷射光能以較大之旋轉半徑(例如外側直徑5.0mm)旋轉掃描。此外,低速旋轉用楔型稜鏡341、342之旋轉數較小,例如為400至800rpm左右。 The laser light emitted from the high-speed rotation wedge-shaped crucibles 321 and 322 is input to the low-speed rotation wedge-shaped crucibles 341 and 342. One of the low-speed rotation wedge-shaped jaws 341 and 342 rotates relative to the other, and has a larger off-angle than the high-speed rotation wedge-shaped jaws 321 and 322. Therefore, by rotating the low-speed rotation wedge-shaped jaws 341, 342, the high-speed rotating laser light can be rotated and scanned with a large radius of rotation (for example, an outer diameter of 5.0 mm). Further, the number of rotations of the low-speed rotation wedge-shaped jaws 341 and 342 is small, for example, about 400 to 800 rpm.
第8圖為顯示上述之雷射光在玻璃基板上之軌跡。在此,因一對高速旋轉用楔型稜鏡321、322之加工誤差或安裝誤差等,藉由高速旋轉用楔型稜鏡321、322而偏向/旋轉之雷射光所繪出之圓徑會產生誤差。因該誤差而會使最後加工成之孔徑有誤差。此時,使低速旋轉用楔型稜鏡341、342之一方相對於另一方旋轉而調整偏角,得以調整 通過低速旋轉用楔型稜鏡341、342之雷射光之掃描軌跡即可。藉由此能以高精密度加工所所希望之直徑的孔。 Figure 8 is a view showing the trajectory of the above-described laser light on a glass substrate. Here, the circular path drawn by the laser light deflected/rotated by the high-speed rotating wedge-shaped jaws 321 and 322 due to machining errors or mounting errors of the pair of high-speed rotating wedge-shaped jaws 321 and 322 An error has occurred. Due to this error, there is an error in the aperture that is finally processed. At this time, one of the low-speed rotation wedge-shaped jaws 341 and 342 is rotated relative to the other to adjust the off-angle to be adjusted. The scanning trajectory of the laser light of the wedge-shaped crucibles 341 and 342 for low-speed rotation can be used. Thereby, the hole of the desired diameter can be processed with high precision.
在此,由雷射光進行一次加工所去除之高度為數十μm。因此對玻璃基板G進行鑽孔加工時,即使沿著加工線對聚光點僅作一次掃描,亦難以形成孔,亦即難以去除加工線之內側部分。 Here, the height removed by one processing by the laser light is several tens of μm. Therefore, when the glass substrate G is drilled, it is difficult to form a hole even if the light collecting point is scanned only once along the processing line, that is, it is difficult to remove the inner portion of the processing line.
所以,通常是為了在玻璃基板之下表面形成聚光點(加工部位),由z軸方向移動裝置22控制包含聚光透鏡35之偏向/旋轉機構18之z軸方向之位置(參照第9圖(a))。 以此狀態使聚光點沿著加工線繞一周後,控制偏向/旋轉機構18之z軸方向之位置,即如第9圖(b)所示使聚光點上升。於是,同樣地使聚光點沿著加工線繞一周後再使聚光點上升。反覆進行上述動作即可去除加工線之內側部分而形成孔。 Therefore, in order to form a condensed spot (processed portion) on the lower surface of the glass substrate, the z-axis direction moving device 22 controls the position of the deflection/rotation mechanism 18 including the condensing lens 35 in the z-axis direction (refer to Fig. 9). (a)). In this state, after the light collecting point is wound around the processing line, the position of the deflection/rotation mechanism 18 in the z-axis direction is controlled, that is, the light collecting point is raised as shown in Fig. 9(b). Then, similarly, the light collecting point is wound around the processing line, and then the light collecting point is raised. By repeating the above operation, the inner portion of the processing line can be removed to form a hole.
或者,不使聚光點沿著加工線毎繞一周而使之上升,而以適當速度連續地朝z軸方向上升,即使藉由加工成螺旋狀亦可同樣地進行鑽孔加工。 Alternatively, the condensed spot may be raised in the z-axis direction without being caused to wrap around the processing line, and may be drilled in the same manner even if it is processed into a spiral shape.
其次如第10圖所示,說明沿著具有朝x軸方向及y軸方向延伸之2個直線部、及位在2直線部之間之圓弧狀曲線部的加工線照射雷射光而進行加工時之協調控制。於第10圖所示之例中,係在加工線之曲線部的前後,分別使低速旋轉用楔型稜鏡341、342反方向旋轉,同時移動控制移動機台10、11。於第10圖中,實線為加工線,一點鏈線 為工件機台2(雷射光照射頭3之光學系統的中心:雷射光輸出部15之射出軸)之移動軌跡。又,於第10圖之「90°」「0°」為分別雷射光位置相對於雷射光照射頭3之光學系統中心之射出軸的角度。 Next, as shown in FIG. 10, processing is performed by irradiating laser light along a processing line having two straight portions extending in the x-axis direction and the y-axis direction and an arc-shaped curved portion positioned between the two straight portions. Coordinated control of time. In the example shown in Fig. 10, the low-speed rotation wedge-shaped jaws 341, 342 are rotated in the opposite directions before and after the curve portion of the processing line, and the mobile stations 10, 11 are moved and controlled. In Figure 10, the solid line is the processing line, a little chain line It is a movement locus of the workpiece machine 2 (the center of the optical system of the laser light irradiation head 3: the emission axis of the laser light output portion 15). Further, "90°" and "0°" in Fig. 10 are angles of the respective laser light positions with respect to the exit axis of the center of the optical system of the laser light irradiation head 3.
第11圖為進行第10圖所示之加工時,各馬達之速度控制的時序圖。 Fig. 11 is a timing chart showing the speed control of each motor when the machining shown in Fig. 10 is performed.
利用第12圖之流程圖說明,要進行上述加工時移動機台10、11與驅動低速馬達時之協調控制。 The coordinated control of the moving machines 10, 11 and the driving of the low speed motor at the time of the above processing will be described using the flowchart of Fig. 12.
於步驟S1中為進行直線部分之加工。在此,藉由x軸馬達5b以定速使工件機台2朝-x軸方向移動。於步驟S2中,取得工件機台2之位置資訊。而於步驟S3中,由步驟S2取得之位置資訊,判斷是否為圓弧開始位置。所謂圓弧開始位置,係指在第10圖之一點鏈線所示之工件機台2之掃描軌跡中,直線部分終止而曲線部分開始之位置。 In step S1, the processing of the straight line portion is performed. Here, the workpiece table 2 is moved in the -x-axis direction by the x-axis motor 5b at a constant speed. In step S2, the position information of the workpiece machine 2 is obtained. In step S3, the position information obtained in step S2 is used to determine whether it is an arc start position. The arc start position is a position at which the straight portion is terminated and the curved portion is started in the scanning trajectory of the workpiece machine 2 shown by the one-dot chain line in Fig. 10.
在到達圓弧開始位置之前,反覆進行步驟S2與步驟S3。到達圓弧開始位置時,自步驟S3移往步驟S4及步驟S5。 Steps S2 and S3 are repeatedly performed before reaching the arc start position. When the arc start position is reached, the process proceeds from step S3 to step S4 and step S5.
於步驟S4中實行圓弧內插動作。亦即如第11圖所示,逐漸降低x軸馬達5b之旋轉,降低x軸方向之速度,同時自「0」逐漸提升y軸馬達5a之旋轉,而提升y軸方向之速度。 The arc interpolation operation is performed in step S4. That is, as shown in Fig. 11, the rotation of the x-axis motor 5b is gradually lowered to lower the speed in the x-axis direction, and the rotation of the y-axis motor 5a is gradually increased from "0" to increase the speed in the y-axis direction.
此外,於步驟S5中,如第11圖所示,使第2低速馬達346以速度VH朝順時鐘方向旋轉,同時使第1低速馬達345以速度VL朝反時鐘方向旋轉。惟VH之速度係設定為VL 之3倍左右。 Further, in step S5, as shown in FIG. 11, the second low-speed motor 346 at a speed V H toward clockwise rotation, while the first low speed motor 345 at a speed V L is rotated in a counterclockwise direction. However, the speed of V H is set to about 3 times that of V L .
在步驟S6中,判斷是否為圓弧終止位置。在到達圓弧終止位置之前,繼續反覆進行步驟S4與步驟S5。 In step S6, it is judged whether or not it is the arc end position. Steps S4 and S5 are continued to be repeated until the arc end position is reached.
到達圓弧終止位置時,自步驟S6移行至步驟S7。在步驟S7中,進行y軸方向直線部分之加工。亦即如第11圖所示,停止x軸馬達5b、第1與第2低速馬達345、346之旋轉,僅旋轉y軸馬達5a而以定速使工件機台2朝y軸方向移動。 When the arc end position is reached, the process proceeds from step S6 to step S7. In step S7, the processing of the straight line portion in the y-axis direction is performed. That is, as shown in Fig. 11, the rotation of the x-axis motor 5b and the first and second low speed motors 345, 346 is stopped, and only the y-axis motor 5a is rotated to move the workpiece table 2 in the y-axis direction at a constant speed.
藉由如上之協調控制,對於實線之加工線,控制移動移動機台10、11,俾使偏向/旋轉機構18之旋轉中心在一點鏈線上移動。亦即,可使工件機台2之掃描半徑,比加工線之曲線部之半徑更大,而使工件機台2之掃描控制變容易。 By the coordinated control as described above, the moving moving machine tables 10, 11 are controlled for the solid line processing line, and the center of rotation of the deflecting/rotating mechanism 18 is moved on the one-point chain line. That is, the scanning radius of the workpiece machine 2 can be made larger than the radius of the curved portion of the processing line, and the scanning control of the workpiece machine 2 can be facilitated.
第13圖與第14圖為顯示對於與第1加工例相同之形狀之加工線,由另一控制處理進行加工時之第2加工例。於第13圖與第14圖所示之例中,係在加工線之曲線部以同方向旋轉低速旋轉用楔型稜鏡341、342,同時移動控制移動機台10、11。於第13圖中,實線為加工線,一點鏈線為工件機台2之移動軌跡。第14圖為進行第13圖所示之加工時之各馬達之速度控制之時序圖。 Fig. 13 and Fig. 14 are views showing a second processing example in the case where the processing line having the same shape as that of the first processing example is processed by another control process. In the example shown in Fig. 13 and Fig. 14, the low-speed rotation wedge-shaped jaws 341 and 342 are rotated in the same direction in the curved portion of the processing line, and the mobile stations 10 and 11 are moved and controlled. In Fig. 13, the solid line is the processing line, and the one-point chain line is the movement locus of the workpiece machine 2. Fig. 14 is a timing chart showing the speed control of each motor during the processing shown in Fig. 13.
由第15圖之流程圖說明,進行上述加工時之移動機台之移動與低速馬達之驅動的協調控制。 The coordinated control of the movement of the moving machine and the driving of the low speed motor during the above processing will be described by the flowchart of Fig. 15.
在步驟P1進行直線部分之加工。在此,係藉由x軸馬 達5b以定速使工件機台2朝-x軸方向移動。於步驟P2中取得工件機台2之位置資訊。而於步驟P3中,由步驟P2取得之位置資訊,判斷是否為圓弧開始位置。由此第2加工例,圓弧開始位置係指在加工線之直線部分終止,而圓弧部分開始之位置。 The processing of the straight line portion is performed in step P1. Here, by the x-axis horse Up to 5b, the workpiece table 2 is moved in the -x axis direction at a constant speed. The position information of the workpiece machine 2 is obtained in step P2. In step P3, the position information obtained in step P2 is used to determine whether it is the arc start position. Thus, in the second processing example, the arc start position is a position at which the straight portion of the machining line is terminated and the arc portion is started.
在到達圓弧開始位置為止,係反覆進行步驟P2與步驟P3。到達圓弧開始位置時,自步驟P3移行至步驟P4及步驟P5。 Steps P2 and P3 are repeated until the arc start position is reached. When the arc start position is reached, the process proceeds from step P3 to step P4 and step P5.
於步驟P4中實行圓弧內插動作。亦即如第14圖所示,逐漸降低x軸馬達5b之旋轉,降低x軸方向之速度,同時自「0」逐漸提高y軸馬達5a之旋轉,而提高y軸方向之速度。 The arc interpolation operation is performed in step P4. That is, as shown in Fig. 14, the rotation of the x-axis motor 5b is gradually lowered to lower the speed in the x-axis direction, and the rotation of the y-axis motor 5a is gradually increased from "0" to increase the speed in the y-axis direction.
此外,於步驟P5中,如第14圖所示,使第1低速馬達345及第2低速馬達346以規定速度朝順時鐘方向旋轉。 Further, in step P5, as shown in Fig. 14, the first low speed motor 345 and the second low speed motor 346 are rotated in the clockwise direction at a predetermined speed.
在步驟P6中,判斷是否為圓弧終止位置。在到達圓弧終止位置為止,繼續反覆進行步驟P4與步驟P5。 In step P6, it is judged whether or not it is the arc end position. Steps P4 and P5 are continuously repeated until the arc end position is reached.
到達圓弧終止位置時,自步驟P6移行至步驟P7。在步驟P7中,進行y軸方向之直線部分加工。亦即如第14圖所示,停止x軸馬達5b、第1與第2低速馬達345、346之旋轉,僅旋轉y軸馬達5a,以低速使工件機台2朝y軸方向移動。 When the arc end position is reached, the process proceeds from step P6 to step P7. In step P7, the straight line portion processing in the y-axis direction is performed. That is, as shown in Fig. 14, the rotation of the x-axis motor 5b and the first and second low speed motors 345, 346 is stopped, and only the y-axis motor 5a is rotated, and the workpiece table 2 is moved in the y-axis direction at a low speed.
藉由如上之協調控制,對於實線之加工線,移動控制移動機台10、11,俾使偏向/旋轉機構18之旋轉中心在一點鏈線上移動。亦即,可使工件機台2之掃描半徑,比 加工線之曲線部之半徑更大,而使工件機台2之掃描控制變容易。 By the coordinated control as described above, the moving control moving machines 10, 11 are moved to the machining line of the solid line, and the rotation center of the deflecting/rotating mechanism 18 is moved on the one-point chain line. That is, the scanning radius of the workpiece machine 2 can be made The radius of the curved portion of the processing line is larger, and the scanning control of the workpiece machine 2 is facilitated.
再者,如加工第2例,以相同速度使低速旋轉用楔型稜鏡341、342朝同方向旋轉時,亦能以1台馬達一體旋轉低速旋轉用楔型稜鏡341、342。 In the second example, when the low-speed rotation wedge-shaped jaws 341 and 342 are rotated in the same direction at the same speed, the low-speed rotation wedge-shaped jaws 341 and 342 can be integrally rotated by one motor.
由如上之本實施形態中,藉由使工件機台2朝x、y方向移動之同時使雷射光偏向/旋轉,而在加工加工線之曲線部分時,能如描繪半徑比加工線為大之軌跡來移動工件機台2。因此即使工件機台對於各馬達之追隨性較差,仍可加快掃描速度而提高加工效率。 According to the above embodiment, the laser beam is deflected/rotated while moving the workpiece table 2 in the x and y directions, and when the curved portion of the processing line is processed, the drawing radius can be made larger than the processing line. The trajectory moves the workpiece table 2. Therefore, even if the workpiece machine has poor followability to each motor, the scanning speed can be increased to improve the processing efficiency.
又,能分別旋轉控制一對之第2楔型稜鏡,因而可任意控制雷射光自光軸之偏向量。 Further, since the pair of second wedge type cymbals can be separately rotated, the deflection vector of the laser light from the optical axis can be arbitrarily controlled.
本發明並不限定於上述實施形態,在不脫離本發明之範圍下,可進行種種變形或修正。 The present invention is not limited to the above embodiments, and various modifications and changes can be made without departing from the scope of the invention.
在上述實施形態中,係設置一對高速旋轉用楔型稜鏡,以高速旋轉雷射光同時進行掃描,但是亦可省略高速旋轉用楔型稜鏡。 In the above-described embodiment, a pair of high-speed rotation wedges are provided, and the laser beam is simultaneously scanned at a high speed, but the high-speed rotation wedge type may be omitted.
又,在上述實施形態中,就使聚光點朝z軸方向移動之機構而言,係藉由z軸方向移動裝置22使包含聚光透鏡35之偏向/旋轉機構18移動,但也可預先固定包含聚光透鏡之偏向/旋轉機構18,而使工件機台2朝z軸方向移動。 Further, in the above-described embodiment, the mechanism for moving the condensed spot in the z-axis direction is caused by the z-axis direction moving device 22 moving the deflecting/rotating mechanism 18 including the condensing lens 35, but it is also possible to advance The deflection/rotation mechanism 18 including the condensing lens is fixed to move the workpiece table 2 in the z-axis direction.
在上述實施形態中,係以玻璃基板作為工件之例說明,但裁切加工樹脂薄膜時亦可同樣地適用本發明。此外,將本發明應用在樹脂薄膜時,則無需高速旋轉用之光學系統及z軸方向移動機構。 In the above embodiment, a glass substrate is used as an example of a workpiece. However, the present invention can be applied similarly to the case of cutting a resin film. Further, when the present invention is applied to a resin film, an optical system for high-speed rotation and a z-axis direction moving mechanism are not required.
第10圖及第13圖所示之加工例僅為一例,對於其他包含各種曲線部分之加工線,當然可適用本發明。 The processing examples shown in Figs. 10 and 13 are only examples, and the present invention can of course be applied to other processing lines including various curved portions.
1a‧‧‧門型框架 1a‧‧‧Door frame
2‧‧‧工件機台 2‧‧‧Working machine
2a、6a‧‧‧吸氣孔 2a, 6a‧‧‧ suction holes
3‧‧‧雷射光照射頭 3‧‧‧Laser light head
5‧‧‧機台移動機構 5‧‧‧Machine moving mechanism
5a‧‧‧y軸馬達 5a‧‧‧y-axis motor
5b‧‧‧x軸馬達 5b‧‧‧x shaft motor
6‧‧‧方塊 6‧‧‧ square
8‧‧‧第1導軌 8‧‧‧1st rail
9‧‧‧第2導軌 9‧‧‧2nd rail
10‧‧‧第1移動機台 10‧‧‧1st mobile station
11‧‧‧第2移動機台 11‧‧‧2nd mobile station
11a‧‧‧導引部 11a‧‧‧Guidance
15‧‧‧雷射光輸出部 15‧‧‧Laser light output
16‧‧‧光學系統 16‧‧‧Optical system
17‧‧‧高速中空馬達 17‧‧‧High speed hollow motor
18‧‧‧偏向/旋轉機構 18‧‧‧Direction/rotation mechanism
21、22‧‧‧z軸方向移動機構 21, 22‧‧‧z axis direction moving mechanism
22a‧‧‧z軸馬達 22a‧‧‧z shaft motor
25至28‧‧‧第1至第4反射鏡 25 to 28‧‧1st to 4th mirrors
29‧‧‧動力監視器 29‧‧‧Power monitor
30‧‧‧光束擴展器 30‧‧‧beam expander
36‧‧‧第3導軌 36‧‧‧3rd rail
37‧‧‧支撐構件 37‧‧‧Support members
38‧‧‧橫支撐構件 38‧‧‧Horizontal support members
39‧‧‧縱支撐構件 39‧‧‧Vertical support members
40‧‧‧第4導軌 40‧‧‧4th rail
41‧‧‧第3移動機台 41‧‧‧3rd mobile machine
42‧‧‧馬達支撐構件 42‧‧‧Motor support members
35‧‧‧聚光透鏡 35‧‧‧ Concentrating lens
50‧‧‧控制器 50‧‧‧ Controller
321、322‧‧‧高速旋轉用楔形稜鏡 321, 322‧‧‧ wedges for high-speed rotation
341、342‧‧‧低速旋轉用楔形稜鏡 341, 342‧‧‧ Low-speed rotating wedge
345、346‧‧‧第1、第2低速馬達 345, 346‧‧‧1st and 2nd low speed motors
321a、322a、341a、342a‧‧‧斜面 321a, 322a, 341a, 342a‧‧‧ bevel
321b、322b、3413、342b‧‧‧垂直面 321b, 322b, 3413, 342b‧‧‧ vertical faces
G‧‧‧玻璃基板 G‧‧‧glass substrate
第1圖係本發明之一實施形態之工件加工裝置之外觀立體圖。 Fig. 1 is a perspective view showing the appearance of a workpiece processing apparatus according to an embodiment of the present invention.
第2圖係工件機台之放大立體圖。 Figure 2 is an enlarged perspective view of the workpiece machine.
第3圖係顯示雷射照射光頭之構成的放大立體圖。 Fig. 3 is an enlarged perspective view showing the configuration of a laser irradiation head.
第4圖係配置高速中空馬達及高速旋轉用楔形稜鏡之示意圖。 Fig. 4 is a schematic view showing a configuration of a high-speed hollow motor and a wedge for high-speed rotation.
第5圖係稜鏡之頂角與偏角之關係的示意圖。 Figure 5 is a schematic diagram showing the relationship between the apex angle and the yaw angle of the crucible.
第6圖係顯示第1及第2低速馬達、第1及第2楔形稜鏡、以及聚光透鏡之配置的示意圖。 Fig. 6 is a schematic view showing the arrangement of the first and second low speed motors, the first and second wedge-shaped turns, and the collecting lens.
第7圖係本裝置之控制方塊圖。 Figure 7 is a control block diagram of the device.
第8圖係雷射光之軌跡圖。 Figure 8 is a trajectory diagram of laser light.
第9圖(a)及(b)係說明將聚光點控制在z軸方向之作用之示意圖。 Fig. 9 (a) and (b) are views showing the action of controlling the condensed spot in the z-axis direction.
第10圖係本裝置之第1加工例之加工線及掃描軌跡之示意圖。 Fig. 10 is a view showing a processing line and a scanning trajectory of the first processing example of the apparatus.
第11圖係第1加工例之各馬達之速度控制之時序圖。 Fig. 11 is a timing chart showing the speed control of each of the motors of the first processing example.
第12圖係第1加工例之控制流程圖。 Fig. 12 is a control flow chart of the first processing example.
第13圖係本裝置之第2加工例之加工線及掃描軌跡之示意圖。 Fig. 13 is a view showing a processing line and a scanning trajectory of the second processing example of the apparatus.
第14圖係顯示第2加工例之各馬達之速度控制之時序圖。 Fig. 14 is a timing chart showing the speed control of each of the motors of the second processing example.
第15圖係第2加工例之控制流程圖。 Fig. 15 is a control flow chart of the second processing example.
Claims (8)
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JP2011143754A JP5409711B2 (en) | 2011-06-29 | 2011-06-29 | Laser beam workpiece processing equipment |
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JP6071640B2 (en) * | 2013-02-27 | 2017-02-01 | 三菱重工業株式会社 | Processing device, processing method |
JP2014231071A (en) * | 2013-05-29 | 2014-12-11 | 三星ダイヤモンド工業株式会社 | Substrate cutting device by using laser beam |
CN104071974B (en) * | 2014-06-20 | 2016-04-13 | 武汉先河激光技术有限公司 | A kind of laser equipment for glass cutting and cutting method |
JP2017056489A (en) * | 2015-08-31 | 2017-03-23 | 株式会社リコー | Optical processing device and method for producing optical workpiece |
WO2019065533A1 (en) * | 2017-09-27 | 2019-04-04 | 三星ダイヤモンド工業株式会社 | Cutting device for glass substrate, cutting method, program, and storage medium |
CN108196433A (en) * | 2018-02-14 | 2018-06-22 | 温培彬 | Laser drawing machine |
JP6740267B2 (en) * | 2018-02-19 | 2020-08-12 | ファナック株式会社 | Laser processing equipment |
CN109332886B (en) * | 2018-10-26 | 2019-10-08 | 华中科技大学 | A kind of laser processing and device of unlimited breadth |
WO2020174582A1 (en) * | 2019-02-26 | 2020-09-03 | ギガフォトン株式会社 | Band-narrowing module, gas laser device, and method for manufacturing electronic device |
KR20210009720A (en) * | 2019-07-17 | 2021-01-27 | 주식회사 레이저모션테크 | Laser beam drilling device |
CN110756950A (en) * | 2019-11-26 | 2020-02-07 | 中国航发沈阳黎明航空发动机有限责任公司 | Method for designing welding parameters of automatic welding equal-wall-thickness complex-profile part |
CN112130264A (en) * | 2020-10-16 | 2020-12-25 | 博创科技股份有限公司 | Low-cost compact coupling assembly for photoelectric integrated chip |
CN113134663A (en) * | 2021-03-19 | 2021-07-20 | 桂林理工大学 | Laser imaging binary image preprocessing weld joint tracking method |
CN115466047B (en) * | 2021-07-16 | 2024-07-19 | 重庆大学 | Integral screen glass cutting and fixing working platform |
CN115365648A (en) * | 2022-08-22 | 2022-11-22 | 中国科学院西安光学精密机械研究所 | Precise regulation and control method for laser spiral scanning track |
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JP5409711B2 (en) | 2014-02-05 |
CN102848076A (en) | 2013-01-02 |
TW201304894A (en) | 2013-02-01 |
JP2013010113A (en) | 2013-01-17 |
CN102848076B (en) | 2015-07-15 |
KR20130002935A (en) | 2013-01-08 |
KR101362738B1 (en) | 2014-02-14 |
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