JP6071640B2 - Processing device, processing method - Google Patents

Description

  The present invention relates to a processing apparatus and a processing method for performing processing by irradiating a member to be processed with a laser.

  As a processing apparatus that performs processing such as cutting and drilling on a workpiece, there is a processing apparatus that uses a laser (see, for example, Patent Document 1 and Patent Document 2). The processing apparatuses described in Patent Literature 1 and Patent Literature 2 perform cutting and drilling on a workpiece by irradiating the workpiece with a laser. Further, Patent Document 1 discloses a laser processing method for performing hole processing by irradiating a workpiece with laser beams having at least two types of wavelengths, and a first laser beam having a spot diameter smaller than the diameter of the hole. A step of irradiating and processing along the inner periphery of the hole, and a second laser beam having a spot diameter smaller than the diameter of the hole and having a wavelength longer than that of the first laser beam inside the inner periphery of the hole And a step of irradiating, and a laser processing method is described in which a portion remaining without being processed in the previous step is processed in a later step. Patent Document 1 describes an apparatus for shifting the irradiation position of the first laser beam by combining galvanometer mirrors. Patent Document 2 describes a structure in which a coil is provided on a structure that holds a lens, a permanent magnet is provided on a base, and the lens is rotated by driving the coil to rotate a condensing point. ing.

Patent Document 3 previously filed by the present applicant includes a CO ₂ laser oscillator and an excimer laser oscillator, and uses a CO ₂ laser beam and an excimer laser beam as _two lasers, and irradiates the CO ₂ laser beam. After the cutting or drilling of the plastic member or the FRP member, the processing apparatus for subsequently removing the carbonized layer or the heat-affected layer generated on the cut surface by irradiating the excimer laser beam on and near the cut surface Have been described. The processing apparatus described in Patent Document 3 uses an excimer laser beam as a laser beam having a ring-shaped cross section, and inserts a CO ₂ laser beam into the hollow portion of the laser beam so that the optical axes of both laser beams are the same. Thereafter, it is described that both laser beams are transmitted through the same transmission path, guided to the vicinity of a cutting or drilling portion of the plastic member or FRP member, and the laser beams are separated again in the vicinity.

JP 2011-110598 A Japanese Patent No. 2828871 Japanese Patent No. 283215

  However, in the processing apparatuses described in Patent Document 1 and Patent Document 2, it is necessary to make the opening diameter of the nozzle one time larger than the turning diameter of the laser. In order to maintain the processing quality, it is necessary to maintain the flow rate of the gas blown from the nozzle to the workpiece, and for this purpose, it is desirable to make the pressure of the gas applied to the nozzle constant regardless of the opening diameter. For this reason, the increase in the opening area of the nozzle has a problem that the consumption of gas blown from the nozzle to the workpiece is increased in area ratio. For this reason, enlarging the opening diameter of the nozzle has a problem that the gas cost increases. Moreover, the processing apparatuses described in Patent Document 1 to Patent Document 3 have a problem that the apparatus configuration needs to be complicated in order to increase the processing accuracy.

  The present invention has been made in view of the above, and it is an object of the present invention to provide a processing apparatus and a processing method capable of performing processing with higher accuracy while suppressing gas consumption with a simple configuration. And

  In order to solve the above-described problems and achieve the object, a processing apparatus of the present invention is a processing apparatus that performs processing by irradiating a workpiece with a laser, and the laser is applied to the workpiece. A laser rotating unit that rotates, a condensing optical system that condenses the laser rotated by the laser rotating unit, and a nozzle that irradiates the workpiece with the laser. An irradiation head; and a control device that controls the operation of the irradiation head, wherein the nozzle is disposed around the first nozzle portion and a first nozzle portion through which a laser beam irradiated to the workpiece is passed. And a second nozzle part through which an assist gas blown against the workpiece passes, and the laser swivel part is a first prism that refracts the laser, and a position facing the first prism. Arranged A second prism that refracts the laser output from the first prism, a first rotation mechanism that rotates the first prism, and a second rotation mechanism that rotates the second prism, and the control The apparatus controls the first rotation mechanism and the second rotation mechanism based on a relationship between at least an allowable thickness of the heat-affected layer of the workpiece and the number of rotations of the laser irradiated on the workpiece. The rotational speed and phase angle difference of the first prism and the second prism are adjusted.

  Moreover, in the said processing apparatus, it is preferable that shield gas is supplied to the said 1st nozzle part.

  In the processing apparatus, the assist gas and the shield gas may be different in gas type.

  In the processing apparatus, it is preferable that the processing includes at least one of cutting processing, drilling processing, welding processing, cladding processing, surface modification processing, surface finishing processing, and laser additive manufacturing.

  In the processing apparatus, the heat-affected layer preferably includes at least one of a remelted layer, an oxide layer, a crack, and dross.

  In the processing apparatus, the workpiece is made of Inconel (registered trademark), Hastelloy (registered trademark), stainless steel, ceramic, steel, carbon steel, heat resistant steel, ceramics, silicon, titanium, tungsten, resin, plastics, It is preferably made of any material of fiber reinforced plastic, composite material, and Ni-base heat-resistant alloy.

  Further, in the above processing apparatus, the control device has a relationship between at least the allowable thickness of the heat-affected layer of the workpiece, the number of revolutions of the laser to be irradiated on the workpiece, and the revolution diameter of the laser. Based on this, it is preferable to control the first rotation mechanism and the second rotation mechanism to adjust the rotation speed and the phase angle difference between the first prism and the second prism.

  In order to solve the above-described problems and achieve the object, the processing method of the present invention is a processing method for performing processing by irradiating a workpiece with a laser using the above processing apparatus, and outputting the laser Based on the relationship between the output step, the allowable thickness of the heat-affected layer of the workpiece, and the number of rotations of the laser irradiated to the workpiece. A determination step for determining a difference between a rotation speed and a phase angle, a rotation step for rotating the first rotation mechanism and the second rotation mechanism with a determined difference between the rotation speed and the phase angle, and the workpiece And irradiating the laser while rotating the laser.

  Further, in the above processing method, the thickness of the heat-affected layer of the workpiece, the scattering amount or the scattering length of the melt on the front and back surfaces of the workpiece, the pressure of the gas blown to the workpiece, Controlling the pressure and flow rate of the gas within a range satisfying the allowable thickness of the heat-affected layer of the workpiece and the scattering amount or scattering length based on the relationship with the gas flow rate. preferable.

  In the above processing method, the member to be processed may be processed in multiple stages.

  Further, in the above processing method, the determining step includes a relationship between at least the allowable thickness of the heat-affected layer of the workpiece, the number of revolutions of the laser irradiated on the workpiece, and the radius of the laser. It is preferable to determine the rotation speed and the phase angle difference between the first prism and the second prism based on the above.

  According to the processing apparatus and the processing method of the present invention, the gas is blown from the second nozzle portion to the workpiece, so that the gas consumption can be reduced even if the opening diameter of the first nozzle portion is increased with a simple configuration. There is an effect that it can be suppressed. Further, since the gas consumption can be suppressed even if the opening diameter of the first nozzle portion is increased, the opening diameter of the first nozzle portion is increased and the turning diameter of the laser irradiated to the workpiece is increased. There is an effect that can be. In addition, since the turning diameter of the laser irradiated onto the workpiece can be changed only by changing the phase angle difference between the first prism and the second prism, there is an effect that a simple configuration can be achieved. In addition, by controlling the difference in phase angle between the first prism and the second prism and making the turning diameter of the laser irradiated to the workpiece variable, it is possible to perform processing with a turning diameter suitable for the processing conditions. become able to. As a result, the required processing quality can be satisfied, and it is possible to perform processing with higher accuracy at high speed.

FIG. 1 is a schematic diagram illustrating a configuration example of a processing apparatus according to the first embodiment. FIG. 2 is an explanatory diagram showing a schematic configuration of the irradiation head according to the first embodiment. FIG. 3 is an enlarged schematic diagram showing an enlarged view from the laser turning portion to the nozzle of the irradiation head according to the first embodiment. FIG. 4 is a schematic diagram illustrating a configuration example of a nozzle. FIG. 5 is a schematic diagram illustrating a configuration example of a nozzle. FIG. 6 is an explanatory diagram of the irradiation position of the laser irradiated on the workpiece. FIG. 7 is an explanatory view of a cross section of a workpiece to be drilled. FIG. 8 is a flowchart showing an example of the control operation of the machining apparatus. FIG. 9 is an explanatory diagram of a laser irradiation operation performed by the processing apparatus. FIG. 10 is a schematic diagram illustrating an example of a locus of a laser irradiated by the processing apparatus. FIG. 11 is a schematic diagram illustrating an example of a locus of a laser irradiated by the processing apparatus. FIG. 12 is a schematic diagram illustrating an example of a locus of a laser irradiated by the processing apparatus. FIG. 13 is a schematic diagram showing an example of a laser trajectory when drilling in multiple times. FIG. 14 is an explanatory diagram of an operation when drilling obliquely. FIG. 15 is an explanatory diagram of the operation of the laser turning unit. FIG. 16 is an explanatory diagram of the pressure of the assist gas ejected by the nozzle. FIG. 17 is an explanatory diagram of an operation of cutting by the processing apparatus. FIG. 18 is an explanatory diagram of a heat-affected layer of a workpiece to be cut. FIG. 19 is an explanatory diagram of a welding operation performed by the processing apparatus. FIG. 20 is an explanatory diagram of a heat-affected layer of a workpiece processed by welding. FIG. 21 is an explanatory diagram of the operation of the cladding process by the processing apparatus. FIG. 22 is an explanatory diagram of the heat-affected layer of the workpiece processed by the cladding process. FIG. 23 is an explanatory diagram of the operation of surface modification processing by the processing apparatus. FIG. 24 is an explanatory diagram of a heat-affected layer of a workpiece subjected to surface modification processing. FIG. 25 is an explanatory diagram showing a schematic configuration of an irradiation head according to the second embodiment. FIG. 26 is a diagram illustrating a processing example of a member to be processed by the processing apparatus. FIG. 27 is a view of the workpiece shown in FIG. 26 as viewed from the opposite side.

  DESCRIPTION OF EMBODIMENTS Embodiments (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited by the contents described in the following embodiments. The constituent elements described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Furthermore, the structures described below can be combined as appropriate. In addition, various omissions, substitutions, or changes in the configuration can be made without departing from the scope of the present invention.

[First Embodiment]
FIG. 1 is a schematic diagram illustrating a configuration example of a processing apparatus according to the first embodiment.

  As shown in FIG. 1, the processing apparatus 10 includes a laser oscillator 12, a guide optical system 14, an irradiation head 16, a processing stage 20, an X-axis moving mechanism 22, a C-axis rotating mechanism 24, and a Y-axis moving. A mechanism 26, a Z-axis moving mechanism 28, and a control device 30 are included. The processing apparatus 10 includes a portal bridge 32 that surrounds the processing stage 20. The processing apparatus 10 processes the workpiece W by irradiating the workpiece W held on the processing stage 20 with a laser. Here, in the present embodiment, the horizontal plane of the processing stage 20 is the XY plane, and the direction orthogonal to the horizontal plane of the processing stage 20 is the Z-axis direction. In this embodiment, the rotation direction around the Z axis is the C axis direction.

  Here, the workpiece W is, for example, a plate-like member. As the workpiece W, various materials such as Inconel (registered trademark), Hastelloy (registered trademark), stainless steel, ceramic, steel, carbon steel, heat resistant steel, ceramics, silicon, titanium, tungsten, resin, plastics, A member made of a Ni-base heat-resistant alloy or the like can be used. In addition, as the workpiece W, carbon fiber reinforced plastics (CFRP), glass fiber reinforced plastics (GFRP), glass-mat reinforced plastics (GMT), etc. Members made of fiber reinforced plastic, iron alloys other than steel plates, various metals such as aluminum alloys, various composite materials, and the like can also be used. In the present embodiment, the processing is any one of cutting, drilling, welding, cladding, surface modification, surface finishing, and laser additive manufacturing, and these processes can be combined. .

  The laser oscillator 12 is a device that outputs a laser, and is attached to the portal bridge 32 of the processing device 10. As the laser oscillator 12, for example, a fiber laser output device that outputs a laser using an optical fiber as a medium, or a short pulse laser output device that outputs a short pulse laser is used. As the fiber laser output device, for example, a Fabry-Perot type fiber laser output device or a ring type fiber laser output device can be used, and the laser is oscillated when these output devices are excited. As the fiber of the fiber laser output device, for example, silica glass to which a rare earth element such as erbium (Er), neodymium (Nd), ytterbium (Yb) is added can be used. As the short pulse laser output device, for example, a titanium sapphire laser can be used as a laser oscillation source, and a pulse having a pulse width of 100 picoseconds or less can be oscillated. Further, a laser that oscillates in nanosecond order pulses, such as a YAG laser or a YVO4 laser, can also be used.

  The guide optical system 14 is an optical system that guides the laser output from the laser oscillator 12 to the irradiation head 16. In this embodiment, the guide optical system 14 is an optical fiber, for example. The guide optical system 14 has one end connected to the laser emission port of the laser oscillator 12 and the other end connected to the laser incident end of the irradiation head 16. The guide optical system 14 guides the laser from the laser emission port of the laser oscillator 12 to the incident end of the irradiation head 16.

  The irradiation head 16 irradiates the workpiece W while turning the laser guided by the guide optical system 14. Further, the irradiation head 16 offsets the laser light path before refraction and the laser light path irradiated to the workpiece W by refracting the laser with a prism. Further, the irradiation head 16 focuses the laser and irradiates the workpiece W. The irradiation head 16 is covered with an irradiation head cover 16a. The structure of the irradiation head 16 will be described later.

  The processing stage 20 is a mechanism that holds the workpiece W placed on the surface. In the processing stage 20, the surface holding the workpiece W is a horizontal plane (XY plane) with respect to a reference plane (for example, an installation surface of the processing apparatus 10).

  The X-axis moving mechanism 22 is an X-axis stage that supports the processing stage 20, and moves the workpiece W to a predetermined position in the X-axis direction by moving the processing stage 20 in the X-axis direction.

  The C-axis rotation mechanism 24 is disposed between the X-axis movement mechanism 22 and the processing stage 20. That is, the C-axis rotating mechanism 24 is supported by the X-axis moving mechanism 22 and supports the processing stage 20. The C-axis rotating mechanism 24 rotates the workpiece W to a predetermined position in the C-axis direction by rotationally driving the processing stage 20 in the C-axis direction.

  The Y-axis moving mechanism 26 moves the irradiation head 16 in the Y-axis direction while supporting the Z-axis moving mechanism 28. Thereby, the Y-axis moving mechanism 26 moves the irradiation head 16 to a predetermined position in the Y-axis direction.

  The Z-axis moving mechanism 28 moves the irradiation head 16 to a predetermined position in the Z-axis direction while supporting the irradiation head 16.

  The processing apparatus 10 uses an X-axis movement mechanism 22, a C-axis rotation mechanism 24, a Y-axis movement mechanism 26, and a Z-axis movement mechanism 28, and uses an X-axis direction, a Y-axis direction, a Z-axis direction, By relatively moving the processing stage 20 and the irradiation head 16 in the four axial directions of the axial direction, the relative positional relationship between the workpiece W and the laser is moved in the four axial directions.

  The control device 30 is connected to the laser oscillator 12, the irradiation head 16, the X-axis moving mechanism 22, the C-axis rotating mechanism 24, the Y-axis moving mechanism 26, and the Z-axis moving mechanism 28, and controls the operation of each part. For example, the control device 30 adjusts various conditions of the laser output from the laser oscillator 12 or uses an X-axis moving mechanism 22, a C-axis rotating mechanism 24, a Y-axis moving mechanism 26, and a Z-axis moving mechanism 28 to irradiate the irradiation head. 16 and the processing stage 20 are moved to adjust the position of the irradiation head 16 with respect to the workpiece W, and the allowable thickness of the heat-affected layer is detected from the conditions (material, thickness, etc.) of the workpiece W and the processing conditions. Or the number of turns and the turning radius R, which will be described later, of the laser irradiated to the workpiece W from the irradiation head 16 are controlled.

  Next, the irradiation head 16 will be described with reference to FIGS. FIG. 2 is an explanatory diagram showing a schematic configuration of the irradiation head according to the first embodiment. FIG. 3 is an enlarged schematic diagram showing an enlarged view from the laser turning portion to the nozzle of the irradiation head according to the first embodiment. FIG. 4 is a schematic diagram illustrating a configuration example of a nozzle. FIG. 5 is a schematic diagram illustrating a configuration example of a nozzle. FIG. 6 is an explanatory diagram of the irradiation position of the laser irradiated on the workpiece.

  2 and 3, the irradiation head 16 includes a collimating optical system 34, a laser swivel unit 35, a reflection optical system 36, a condensing optical system 37, a nozzle 38, an indexing mechanism 39, The imaging means 40, the gap detection means 41, and the support member 42 are included. The irradiation head 16 includes a collimating optical system 34, a laser turning unit 35, a reflecting optical system 36, a condensing optical system 37, and a nozzle from the upstream side toward the downstream side in the optical path of the laser L output from the guide optical system 14. They are arranged in the order of 38. The irradiation head 16 irradiates the laser beam L output from the guide optical system 14 toward the workpiece W facing the nozzle 38. The irradiation head 16 includes a collimating optical system 34, a laser turning unit 35, a reflecting optical system 36, a condensing optical system 37, and a nozzle from the upstream side toward the downstream side in the optical path of the laser L output from the guide optical system 14. They are arranged in the order of 38. The irradiation head 16 can be divided into a collimating optical system 34, a laser turning unit 35, a reflection optical system 36, and a condensing optical system 37, respectively. The irradiation head 16 irradiates the laser beam L output from the guide optical system 14 toward the workpiece W facing the nozzle 38.

  The collimating optical system 34 is disposed so as to face the end face from which the laser L of the guide optical system 14 is emitted. That is, the collimating optical system 34 is disposed between the guide optical system 14 and the laser turning unit 35. The collimating optical system 34 includes a collimator lens or the like, and uses the laser L output from the guide optical system 14 as collimated light and emits the laser L toward the laser turning unit 35.

  The laser turning unit 35 rotates the laser L around the center P of the optical path, and turns the irradiated laser beam, that is, the irradiation position IP of the laser L, to the workpiece W. The laser turning unit 35 includes a first prism 51, a second prism 52, a first rotation mechanism 53, and a second rotation mechanism 54. The laser turning unit 35 can change the phase angle difference between the first prism 51 and the second prism 52.

  The first prism 51 refracts the laser L and tilts it with respect to the optical axis OA. The second prism 52 controls the position where the laser L refracted by the first prism 51 is refracted again and condensed. As a result, the laser L that has passed through the laser swivel unit 35 is output in an optical path that is deviated from the optical path of the laser L before passing through.

  The first prism 51 has an incident surface 51a on which the laser L is incident and an output surface 51b on which the laser L is emitted.

  The incident surface 51a is a flat surface that is slightly inclined with respect to the optical axis OA. The incident surface 51a has an inclination with respect to the optical axis OA of less than 1 °. That is, the incident surface 51a can shift the laser reflected by the incident surface 51a from the optical axis OA when the laser L output from the guide optical system 14 is incident. Thus, the first prism 51 can suppress the amount of laser reflected from the incident surface 51a toward the guide optical system 14, and can suppress the amount of laser reflected toward the exit of the laser oscillator 12.

  The emission surface 51b is a flat surface with a slope that refracts the emitted laser L. Accordingly, the first prism 51 refracts the laser L output from the guide optical system 14 and tilts it with respect to the optical axis OA.

  The second prism 52 has an incident surface 52a on which the laser L is incident and an emission surface 52b on which the laser L is emitted.

  The incident surface 52a is a flat surface having an inclination for refracting the laser L output from the first prism 51. Accordingly, the second prism 52 controls the position where the laser L refracted by the first prism 51 is refracted again and condensed. That is, the second prism 52 outputs the optical path of the laser L that has passed through the laser swivel unit 35 by shifting the optical path of the laser L before passing through the laser swivel unit 35.

  The exit surface 52b is a flat surface that is slightly inclined with respect to the optical axis of the laser L refracted by the entrance surface 52a. The exit surface 52b has an inclination of less than 1 ° with respect to the optical axis of the laser L refracted by the entrance surface 52a. That is, when the laser L output from the first prism 51 is emitted, the emission surface 52b can shift the laser L reflected by the emission surface 52b from the optical axis of the laser L refracted by the incidence surface 52a. Thereby, the second prism 52 suppresses the reflection amount of the laser L reflected from the emission surface 52b toward the guide optical system 14, and suppresses the amount of the laser L reflected toward the emission port of the laser oscillator 12. it can.

  As shown in FIG. 3, the first rotation mechanism 53 includes a first spindle 55 that holds the first prism 51, a first hollow motor 56 that is inserted into the first spindle 55 and rotates the first spindle 55, Have. The second rotation mechanism 54 includes a second spindle 57 that holds the second prism 52, and a second hollow motor 58 that is inserted into the second spindle 57 and rotates the second spindle 57. The first rotation mechanism 53 and the second rotation mechanism 54 can be synchronously rotated and relatively rotated with each other.

  The first spindle 55 and the second spindle 57 are cylindrical members whose optical path portion of the laser L is hollow. A first prism 51 is fixed to the first spindle 55 on the front side in the traveling direction of the laser L. A second prism 52 is fixed to the second spindle 57 on the rear side in the traveling direction of the laser L. The first spindle 55 and the second spindle 57 are supported via a bearing 59 and a bearing 60. The bearing 59 and the bearing 60 are rolling bearings such as rolling ball bearings, for example.

  The first hollow motor 56 includes a hollow rotor 61 fixed to the outer peripheral surface of the first spindle 55, and a stator 62 disposed to face the hollow rotor 61. The first hollow motor 56 rotates the first prism 51 together with the first spindle 55. The second hollow motor 58 includes a hollow rotor 63 fixed to the outer peripheral surface of the second spindle 57 and a stator 64 disposed so as to face the hollow rotor 63. The second hollow motor 58 rotates the second prism 52 together with the second spindle 57. The first prism 51 and the second prism 52 are capable of synchronous rotation and relative rotation.

  The first rotating mechanism 53 and the second rotating mechanism 54 are respectively composed of a rotating part (first spindle 55 and hollow rotor 61, second spindle 57 and hollow rotor 63) and a fixing part (stator 62, stator 64). An encoder 65 for detecting the relative position and the rotational speed is provided. The encoder 65 includes an identifier 66 that is fixed to the rotating unit side, and a detection unit 67 that is fixed to the fixed unit side and detects the identifier 66. The encoder 65 can detect the relative position of the rotating unit by detecting the identifier 66 by the detecting unit 67. The encoder 65 outputs the detected information on the rotational speed and rotational position (phase angle) of the rotating unit to the control device 30. As the encoder 65, for example, it is preferable to use a detection device that detects the rotational position (phase angle) with a resolution of several thousandths (0.001 degrees or less).

  The first rotation mechanism 53 and the second rotation mechanism 54 can change the phase angle difference between the first prism 51 and the second prism 52. Thereby, as shown in FIG. 6, the laser irradiation point is irradiated from the center P of the optical path of the rotation axis by a distance corresponding to the phase angle difference between the first prism 51 and the second prism 52 (turning radius R). Eccentricity can be achieved up to the position IP. When the first rotation mechanism 53 and the second rotation mechanism 54 are synchronously rotated at the same rotation period while maintaining the difference in phase angle between the first prism 51 and the second prism 52, the laser irradiation point is the turning diameter. Draw a circular orbit of R. Further, when the first prism 51 and the second prism 52 are asynchronously rotated (rotated at different rotation cycles), the laser irradiation point can be rotated while increasing or decreasing the turning diameter of the laser irradiation point. It is also possible to draw a curved trajectory.

  In the present embodiment, the difference in phase angle between the first hollow motor 56 and the second hollow motor 58 is the relative rotational position (phase angle) between the first hollow motor 56 and the second hollow motor 58. This is the angle of deviation. The error in the phase angle difference between the first hollow motor 56 and the second hollow motor 58 refers to an error in the phase shift angle between the first hollow motor 56 and the second hollow motor 58.

  Further, as shown in FIG. 2 and FIG. 4, the turning radius R means a distance from the center P of the optical path to the irradiation position IP of the laser L irradiated to the workpiece W. This is the radius at which the irradiated laser L turns around the center P. The turning radius R is variable because the turning radius R of the laser L irradiated to the workpiece W is changed by changing the phase angle difference between the first prism 51 and the second prism 52. The number of turns refers to the number of times per unit time that the irradiation position IP of the laser L irradiated to the workpiece W turns around the center P.

  As shown in FIGS. 2 and 3, the reflection optical system 36 includes a first reflection mirror 71 that reflects the laser L that has passed through the laser turning section 35, and a first reflection mirror 71 that reflects the laser L reflected by the first reflection mirror 71 again. It has a two-reflection mirror 72, a cylinder part 73, and a nozzle mounting part 74. The reflection optical system 36 reflects the laser L output from the laser turning unit 35 toward the condensing optical system 37 by the first reflection mirror 71 and the second reflection mirror 72. That is, the reflection optical system 36 offsets the optical path of the laser of the laser turning unit 35 and the optical path of the laser of the condensing optical system 37. The second reflection mirror 72 is a half mirror, and allows the imaging unit 40 to image the processed part of the workpiece W. The cylinder part 73 and the nozzle mounting part 74 are connected by a joint part 75.

  The condensing optical system 37 has a plurality of lenses, and the laser L reflected by the second reflecting mirror 72 is collected by the plurality of lenses, and the laser L having a predetermined focal length and focal depth is collected. Form. The condensing optical system 37 irradiates the workpiece W with a laser L having a predetermined spot diameter.

  The nozzle 38 is mounted on the nozzle mounting portion 74 via the condensing optical system 37. The nozzle 38 has a translucent member 76 for preventing the condensing optical system 37 from being contaminated by sputtering or the like generated at a processing point of the workpiece W. Moreover, the nozzle 38 has the main-body part 38a, the 1st nozzle part 77, and the 2nd nozzle part 78, as shown in FIG.4 and FIG.5. The main body portion 38a has a hollow conical shape whose diameter gradually decreases toward the front side in the traveling direction of the laser L.

  In the first nozzle portion 77, the opening diameter K on the front side in the traveling direction of the laser L is slightly larger than the turning diameter R of the laser L. The first nozzle portion 77 has a supply port 77a for the shielding gas G1 on the opposite side of the traveling direction of the laser L. In the first nozzle portion 77, the shield gas G <b> 1 is supplied to the supply port 77 a through the shield gas supply pipe 80 a of the gas supply source 80. That is, the first nozzle portion 77 can pass the laser L irradiated to the workpiece W and, at the same time, the shield gas G <b> 1 for suppressing adhesion of spatter to the translucent member 76. The gas supply source 80 includes adjustment means (not shown) that adjusts the gas pressure, flow rate, and the like of the shield gas G1 supplied to the first nozzle portion 77. As the adjusting means, for example, an adjusting valve or the like can be used.

  The second nozzle portion 78 is formed between the outer peripheral surface and the inner peripheral surface of the main body portion 38a. The second nozzle part 78 is arranged around the first nozzle part 77 at a regular interval in a concentric manner with the center P as the center. The second nozzle portion 78 has an assist gas G2 supply port 78a on the opposite side of the laser L traveling direction. In the second nozzle portion 78, the assist gas G2 is supplied to the supply port 78a via the assist gas supply pipe 80b of the gas supply source 80. That is, the second nozzle portion 78 can pass the assist gas G2 as a gas for blowing on the workpiece W. The gas supply source 80 includes an adjusting unit (not shown) that adjusts the gas pressure, flow rate, and the like of the assist gas G <b> 2 supplied to the second nozzle unit 78. As the adjusting means, for example, an adjusting valve or the like can be used.

  Further, the second nozzle part 78 has a smaller hole diameter than the first nozzle part 77. Here, the fact that the second nozzle portion 78 has a smaller hole diameter than the first nozzle portion 77 means that the consumption amount of the assist gas G2 is suppressed as compared with the case where the assist gas G2 is injected from the first nozzle portion 77. And the hole diameter can increase the flow velocity and pressure of the assist gas G2 injected toward the workpiece W. Thereby, the 2nd nozzle part 78 can inject the assist gas G2 of the pressure suitable for a process, and flow volume, suppressing the consumption of the assist gas G2.

  In the present embodiment, for example, air, nitrogen gas, oxygen gas, argon gas, xenon gas, helium gas, or a mixed gas thereof can be used as the shield gas G1 or the assist gas G2. When oxygen gas capable of utilizing oxidation reaction heat for processing is used as the shielding gas G1 or the assist gas G2, the processing speed for the workpiece W such as metal can be further improved. Moreover, when nitrogen gas, argon gas, etc. which suppress the production | generation of the oxide film as a heat influence layer are used as shielding gas G1 or assist gas G2, the processing precision with respect to to-be-processed members W, such as a metal, can be improved more. . Further, the gas type, the mixing ratio, the ejection amount (pressure) from the nozzle 38 and the like of the shield gas G1 or the assist gas G2 can be changed according to the processing conditions such as the type of the workpiece W and the processing mode. .

  As shown in FIGS. 2 and 3, the indexing mechanism 39 includes an indexing shaft 81, a hollow motor 82, and an indexing angle detection unit 83. The index shaft 81 is connected to the nozzle mounting portion 74 and rotates integrally with the nozzle mounting portion 74. The index shaft 81 is supported by a bearing 84 so as to be rotatable around the Y axis. The bearing 84 is, for example, a static pressure bearing (fluid bearing). The hollow motor 82 includes a hollow rotor 85 fixed to the outer peripheral surface of the indexing shaft 81 and a stator 86 disposed to face the hollow rotor 85.

  The hollow motor 82 drives the nozzle 38 mounted on the nozzle mounting portion 74 around the indexing shaft 81 (in the direction of the arrow d) so as to swing around the indexing shaft 81 as a rotation center. That is, the hollow motor 82 drives the nozzle 38 so as to be able to swing around the Y axis. As a result, the indexing mechanism 39 rotates the nozzle mounting portion 74 of the reflective optical system 36 around the indexing shaft 81 as the center of rotation, and the second reflection disposed coaxially with the indexing shaft 81 with this rotation. Since the mirror 72 can be rotated, the laser L reflected by the second reflecting mirror 72 can be emitted from the nozzle 38 even if the indexing angle is changed. Further, since the indexing mechanism 39 swings the nozzle mounting portion 74 and the nozzle 38 integrally, the enlargement of the swinging portion can be suppressed.

  The index angle detection means 83 includes an encoder that detects a relative position (index angle) between the rotating portion (index shaft 81 and hollow rotor 85) and the fixed portion (stator 86). The encoder outputs information of the detected index angle of the rotating unit to the control device 30. Thus, when using the indexing mechanism 39, the processing apparatus 10 uses the X-axis moving mechanism 22, the C-axis rotating mechanism 24, the Y-axis moving mechanism 26, the Z-axis moving mechanism 28, and the indexing mechanism 39, Laser that irradiates the workpiece W by relatively moving the processing stage 20 and the irradiation head 16 in the five-axis direction including the X-axis direction, the Y-axis direction, the Z-axis direction, the C-axis direction, and the swinging direction. The relative positional relationship with L can be moved in the 5-axis direction.

  The imaging means 40 is a camera having, for example, a CCD (Charge Coupled Device) image sensor. The imaging unit 40 images the irradiation position IP of the laser L, the turning radius R, and the like, generates image data from the captured image, and outputs the image data to the control device 30. The imaging means 40 is mounted on the nozzle mounting portion 74 at a position facing the nozzle 38 with the nozzle mounting portion 74 interposed therebetween. The imaging means 40 is arranged coaxially with the center P of the optical path.

  The gap detecting means 41 is a gap measuring device using laser light. The gap detector 41 detects a gap between the focal point of the laser L irradiated to the workpiece W and the workpiece W. The gap detection unit 41 outputs the detected gap to the control device 30. The gap detection means 41 is connected to the imaging means 40 and is arranged coaxially with the center P of the optical path.

  The support member 42 is supported by the Y-axis movement mechanism 26. The support member 42 supports the laser turning unit 35 and the index mechanism 39.

  Next, the processing performed by the processing apparatus 10 will be described with reference to FIGS. FIG. 7 is an explanatory view of a cross section of a workpiece to be drilled. FIG. 8 is a flowchart showing an example of the control operation of the machining apparatus.

  First, the processing apparatus 10 (control apparatus 30) determines a processing mode as shown in FIG. 8 (step ST1). For example, the processing device 10 (the control device 30) performs any of cutting, drilling, welding, cladding, surface modification, surface finishing, and laser additive manufacturing, which are input by an operator or other operator. An operation indicating whether to execute is confirmed, and a processing mode is determined based on the confirmed operation.

  Next, the processing apparatus 10 (control apparatus 30) determines the material and thickness of the workpiece W (step ST2). For example, the processing device 10 (the control device 30) confirms an operation of inputting the material and thickness of the workpiece W input by the worker, and based on the confirmed operation, the material and thickness of the workpiece W To decide.

  Next, the processing apparatus 10 (control apparatus 30) determines a processing condition (step ST3). For example, the processing device 10 (the control device 30) inputs the processing conditions such as the position, shape, and depth of processing performed on the workpiece W in the processing mode determined in step ST1 input by the worker. Then, based on the confirmed operation, processing conditions such as the position, shape, and depth of the processing performed on the workpiece W are determined.

  Next, the processing apparatus 10 (control apparatus 30) determines the allowable thickness of the heat affected layer Wa (see FIG. 7) (step ST4). For example, the processing device 10 (the control device 30) acquires the processing mode determined in step ST1, the material and thickness of the workpiece W determined in step ST2, and the processing conditions determined in step ST3, respectively. The allowable thickness of the heat-affected layer Wa is determined with reference to a control map (processing condition control map) that defines the correlation between the material and thickness of the workpiece W, the processing conditions, and the allowable thickness of the heat-affected layer Wa.

  Next, the processing apparatus 10 (control apparatus 30) determines the allowable number of turns and the allowable turn diameter of the laser L (step ST5). For example, the processing device 10 (the control device 30) determines the correlation between the thickness of the heat-affected layer Wa, the number of revolutions of the laser L, and the turning diameter R based on the allowable thickness of the heat-affected layer Wa determined in step ST4. With reference to the control map (turning condition control map), the allowable turning number range and the allowable turning diameter range of the laser L in which the thickness TH (see FIG. 5) of the heat-affected layer Wa does not exceed the allowable thickness are determined. In step ST5, when the machining mode determined in step ST1 is drilling, the turning radius R is not essential, so only the number of turns may be determined.

  Next, the processing apparatus 10 (control apparatus 30) determines the difference between the rotational speeds and phase angles of the first prism 51 and the second prism 52 (step ST6). For example, the processing device 10 (the control device 30) determines the number of turns included in the allowable number of turns of the laser L determined in step ST5 as the number of rotations of the first prism 51 and the second prism 52, and turns the laser L. Referring to a control map (phase angle control map) that defines the correlation between the diameter R and the difference in phase angle between the first prism 51 and the second prism 52, it is included in the allowable turning radius range of the laser L determined in step ST5. The phase angle difference to be determined is determined as the phase angle difference between the first prism 51 and the second prism 52.

  Next, the processing apparatus 10 (control apparatus 30) determines a laser output (step ST7). For example, the processing device 10 (the control device 30) acquires the allowable thickness of the heat-affected layer Wa determined in step ST4, and determines a correlation between the thickness of the heat-affected layer Wa and the output of the laser L (laser). With reference to the output control map), the peak output and pulse width of the laser L are selected, and the laser output is determined.

  Next, the processing apparatus 10 (control apparatus 30) determines assist gas injection conditions (step ST8). For example, the processing device 10 (the control device 30) determines the material and thickness of the workpiece W determined in step ST2, the processing conditions determined in step ST3, the allowable number of revolutions of the laser L determined in step ST5, the allowable rotational diameter, Based on the laser output determined in step ST7, the pressure and flow rate of the assist gas G2 are determined. At the same time, the processing device 10 (control device 30) determines the material and thickness of the workpiece W determined in step ST2, the processing conditions determined in step ST3, the allowable number of revolutions of the laser L determined in step ST5, and the allowable number of turns. Based on the diameter and the laser output determined in step ST7, the pressure and flow rate of the shield gas G1 are determined. Note that, in step ST8, the thickness of the heat-affected layer Wa of the workpiece W, the amount of splash or the length of the melt on the front and back surfaces of the workpiece W, and the assist gas G2 sprayed on the workpiece W Based on the relationship between the pressure and the flow rate of the assist gas G2 blown to the workpiece W, a range that satisfies the allowable thickness of the heat-affected layer Wa of the workpiece W and the scattering amount or the scattering length Alternatively, the pressure and flow rate of the assist gas G2 may be determined, and the pressure and flow rate of the assist gas G2 may be controlled.

  Next, the processing apparatus 10 (control apparatus 30) performs processing on the workpiece W (step ST9). For example, the processing device 10 (the control device 30) supplies the assist gas G2 from the gas supply source 80 based on the assist gas injection conditions determined in step ST8, and injects it from the nozzle 38 (second nozzle portion 78). Based on the injection condition of the shield gas G1 determined simultaneously with the assist gas injection condition in ST8, the shield gas G1 is supplied from the gas supply source 80 and injected from the nozzle 38 (first nozzle portion 77), and the laser determined in step ST7 Based on the output, the laser oscillator 12 is oscillated to emit the laser L, and at the same time, the rotations of the first hollow motor 56 and the second hollow motor 58 are adjusted based on the rotational speed and the phase angle difference determined in step ST6. Then, the workpiece L is irradiated with a laser L to execute processing. The processing apparatus 10 (control apparatus 30) performs the processing on the workpiece W through the above-described steps ST1 to ST9.

  Here, when the machining mode determined in step ST1 is drilling, in step ST9, the laser L emitted from the laser oscillator 12 is incident on the incident end of the irradiation head 16 via the guide optical system 14, and FIG. 4 and FIG. 6, the first prism 51 and the second prism 52 that rotate in the direction of the arrow a are refracted by the rotational speed determined in step ST6 and the difference in phase angle, and the laser L before refraction is refracted. Irradiation is performed at a position eccentric from the center P of the optical path coaxial with the optical axis OA. When the first prism 51 and the second prism 52 are rotated at the same rotation period in this state, the laser irradiation point turns around the optical path center P of the rotation axis that is coaxial with the optical axis OA of the laser L before refraction. The irradiation position IP of the laser L moves on the virtual circle IC with the center P as the turning center, and a hole Wb is made in the workpiece W. When the machining mode determined in step ST1 is drilling, the hole diameter is almost determined by the set value. On the other hand, in the welding process, the cladding process, and the like, it is possible to use the turning radius R in addition to the number of turnings to control the amount of scattered matter on the heat-affected layer Wa and the front and back surfaces.

  Next, the laser L irradiation operation by the processing apparatus 10 will be described with reference to FIGS. FIG. 9 is an explanatory diagram of a laser irradiation operation performed by the processing apparatus. FIG. 10 is a schematic diagram illustrating an example of a locus of a laser irradiated by the processing apparatus. FIG. 11 is a schematic diagram illustrating an example of a locus of a laser irradiated by the processing apparatus. FIG. 12 is a schematic diagram illustrating an example of a locus of a laser irradiated by the processing apparatus. FIG. 13 is a schematic diagram showing an example of a laser trajectory when drilling in multiple times. FIG. 14 is an explanatory diagram of an operation when drilling obliquely. FIG. 15 is an explanatory diagram of the operation of the laser turning unit. FIG. 16 is an explanatory diagram of the pressure of the assist gas ejected by the nozzle.

  When irradiating the workpiece L with the laser L by turning it ON / OFF at a constant cycle, as shown in FIG. 9, the processing apparatus 10 sets the ON / OFF cycle of the laser L to the non-rotation cycle of the irradiation position IP. An integer multiple is preferable. That is, the processing apparatus 10 irradiates the irradiation position IPa with the laser L in the first round and the laser L in the second round by shifting the ON / OFF period of the laser L and the turning period of the irradiation position IP. The position IPb can be irradiated. That is, the processing apparatus 10 can sequentially shift the irradiation position by repeating ON / OFF of the laser L swaying after the third round. Thereby, the processing apparatus 10 can irradiate the laser L efficiently to the region to be processed of the workpiece W by shifting the irradiation position of the laser L in each round.

  Further, when the first prism 51 and the second prism 52 are rotated while continuously changing the phase angle difference between the first prism 51 and the second prism 52, as shown in FIG. The workpiece L can be irradiated with the laser L along a spiral trajectory TR that gradually moves away from the center P. Thereby, the processing apparatus 10 can process with high precision also to the to-be-processed member W which has the thickness which becomes difficult for the laser L to enter by irradiating the laser L in a spiral shape.

  Similarly, as shown in FIGS. 11 and 12, the processing apparatus 10 can also irradiate the workpiece W with a laser L along an elliptical or heart-shaped trajectory TR. That is, the processing apparatus 10 continuously changes the phase angle difference between the first prism 51 and the second prism 52 while rotating the first prism 51 and the second prism 52, thereby changing the turning radius R of the laser L. In other words, the workpiece W can be irradiated with the laser L along various trajectories TR. In other words, the processing apparatus 10 can irradiate the workpiece W with the laser L along the trajectory TR having various shapes by controlling the rotation and the phase angle difference between the first prism 51 and the second prism 52. .

  In addition, when the turning radius R of the laser L suitable for the processing performed on the workpiece W is calculated from a theoretical optical value, the turning radius R is corrected in consideration of the heat affected layer Wa. As shown in FIG. 13, the processing apparatus 10 irradiates the workpiece W with the laser L with a circular trajectory TRa smaller than the hole diameter of the target hole to be drilled in the first round, and the target to drill in the second round. The workpiece W is irradiated with the laser L along a circular trajectory TRb having the same size as the hole diameter. In this case, the turning radius Ra of the laser L in the first round is set to be smaller than the target hole, and the turning radius Rb of the laser L in the second round is calculated from a theoretical optical value for turning the target hole. It is preferable that the turning diameter is corrected so that the thickness TH of the heat-affected layer Wa is within the allowable thickness range in the target hole later. As a result, the heat spread is increased in the first round when the laser beam L is first irradiated to the workpiece W, but the processing apparatus 10 suppresses the heat spread by making a hole smaller than the target hole in the first round. In the second round, the target hole can be drilled. That is, since the processing apparatus 10 can perform rough processing in the first round and finish processing in the second round, processing can be performed with high accuracy.

  In addition, when an oblique hole Wc is formed in the workpiece W having a plurality of layers of different materials, for example, the inclination angle α is 20 with respect to the thin plate-like workpiece W having the ceramic layer W1 and the metal layer W2. When making an oblique hole Wc of from 40 ° to 40 °, as shown in FIGS. 14 to 16, the processing apparatus 10 sets the indexing angle of the nozzle 38 to 20 ° to 40 ° by the indexing mechanism 39, and the ceramic layer W1. Then, the number of revolutions of the laser L to be irradiated is relatively slowed to increase the energy per unit time at the irradiation position IP, and at the same time, the pressure and flow rate of the assist gas G2 are relatively lowered to perform drilling. Further, in the metal layer W2, the processing apparatus 10 relatively reduces the energy per unit time at the irradiation position IP by relatively increasing the number of revolutions of the laser L to be irradiated, and at the same time, relatively compares the pressure and flow rate of the assist gas G2. To make it higher.

  Thereby, the processing apparatus 10 can make a hole with high accuracy in the ceramic layer W1 having a relatively low thermal conductivity while suppressing the thickness TH of the heat-affected layer Wa, while suppressing the thickness TH of the heat-affected layer Wa. It is possible to make a hole in the metal layer W2 having a relatively high thermal conductivity with high accuracy. Furthermore, the processing apparatus 10 can shorten the time required for drilling each of the ceramic layer W1 and the metal layer W2. That is, since the processing apparatus 10 can perform multi-step processing that is performed under processing conditions suitable for the ceramic layer W1 and the metal layer W2, the processing quality is high so as to penetrate the ceramic layer W1 and the metal layer W2 in a straight line. An oblique hole Wc can be formed.

  Further, in the processing apparatus 10, near the boundary between the ceramic layer W <b> 1 and the metal layer W <b> 2, the trajectory TR of the laser L irradiating the metal layer W <b> 2 side is relative to the trajectory TR of the laser L irradiating the ceramic layer W <b> 1 side. The non-circular shape becomes smaller. Thereby, the processing apparatus 10 can suppress the thickness TH of the heat-affected layer Wa of the metal layer W2, and can suppress the drilling speed of the metal layer W2, which is relatively faster than the ceramic layer W1. it can. That is, the processing apparatus 10 can similarly drill the ceramic layer W1 and the metal layer W2. That is, the processing apparatus 10 can perform multi-stage processing that is processed under processing conditions suitable for the ceramic layer W1 and the metal layer W2, and has a high processing quality straight through the ceramic layer W1 and the metal layer W2. A hole can be drilled.

  Further, the processing apparatus 10 can perform processing on the workpiece W under more suitable processing conditions by using the assist gas G2 of the gas type suitable for each step in the multi-step processing.

  Further, the processing apparatus 10 supplies a shielding gas G1 and an assist gas G2 of different gas types to the nozzle 38, and mixes the shielding gas G1 and the assist gas G2 at a processing site of the workpiece W to generate a mixed gas. The workpiece W can be processed under the atmosphere of the prepared mixed gas. Thereby, the processing apparatus 10 can obtain a mixed gas easily, and can also change a gas ratio, a gas kind, a pressure, a flow volume, etc. easily. That is, the processing apparatus 10 can perform processing using a mixed gas suitable for processing.

  Further, since the amount of spatter generated varies depending on the material of the workpiece W and the processing mode, the processing apparatus 10 can adjust the pressure and flow rate of the shield gas G1 according to the amount of spatter generated. Thereby, the processing apparatus 10 can suppress the adhesion of spatter to the translucent member 76 and can extend a maintenance interval such as replacement of the translucent member 76.

  Further, the processing apparatus 10 performs processing by detecting the gap between the focal point of the laser L to be irradiated and the processing target member W while observing the processing site on the processing target member W by the imaging unit 40. Therefore, processing adjustment work and the like can be easily performed.

  In the processing apparatus 10, the first rotation mechanism 53 is driven by the first hollow motor 56, the second rotation mechanism 54 is driven by the second hollow motor 58, and the indexing mechanism 39 is driven by the hollow motor 82. Therefore, each of the first rotation mechanism 53, the second rotation mechanism 54, and the indexing mechanism 39 has no backlash, so that the first prism 51 and the second prism 52 by the first rotation mechanism 53 and the second rotation mechanism 54 Therefore, the index angle of the nozzle 38 by the index mechanism 39 can be controlled with high accuracy. Thereby, the processing apparatus 10 can control the turning diameter R of the laser L irradiated to the workpiece W with high accuracy, and can control the index angle of the laser L applied to the workpiece W with high accuracy. be able to.

  Moreover, it is preferable that the processing apparatus 10 modulates the power of the laser L turning with respect to the workpiece W for each turn. For example, the processing apparatus 10 modulates the power (output) of the laser L with respect to the processing portion of the workpiece W for each turn in order to suppress the spread of the heat-affected layer Wa. The processing apparatus 10 outputs a laser L suitable for processing performed on the workpiece W by using, for example, pulse modulation, linear modulation, high-frequency superposition modulation, or the like as the modulation of the output of the laser L. Thereby, the processing apparatus 10 can stabilize the processing quality with respect to the workpiece W.

  Moreover, it is preferable that the processing apparatus 10 sets the difference in phase angle between the first hollow motor 56 and the second hollow motor 58 within 0.1 °. That is, it is preferable that the processing apparatus 10 sets the error of the phase angle difference between the first prism 51 and the second prism 52 to be within 0.1 °. In this case, the control device 30 includes the first prism 51 determined in step ST6 described above based on the rotation speed and rotation position (phase angle) of the first spindle 55 and the second spindle 57 output from the encoder 65. The error of the phase angle difference from the second prism 52 is set to within 0.1 °. Thereby, although the processing apparatus 10 is based on the optical characteristic of the 1st prism 51 and the 2nd prism 52, the shift | offset | difference of turning radius R can be made into several dozen micrometer, and it is accurately with respect to the to-be-processed member W. The laser L can be irradiated for processing.

  The processing apparatus 10 preferably rotates the first prism 51 and the second prism 52 at 20 rpm or more when the output frequency of the laser L is less than 1 kHz, and the first prism 51 when the output frequency of the laser L is 1 kHz or more. It is preferable to rotate the second prism 52 at 200 rpm or more. That is, the processing apparatus 10 preferably sets the number of revolutions of the laser L irradiated to the workpiece W to 20 rpm or more when the output frequency of the laser L is less than 1 kHz, and 200 rpm or more when the output frequency of the laser L is 1 kHz or more. It is preferable to do.

  The processing apparatus 10 can perform the processing at a higher speed by adjusting the rotational speeds of the first prism 51 and the second prism 52 in accordance with the output frequency of the laser L, and further improve the processing accuracy. it can. That is, when the output frequency of the laser L is relatively high, the processing apparatus 10 relatively rotates the laser L at a high speed because the energy of the laser L applied to the workpiece W is relatively high. When the output frequency of the laser L is relatively low, the energy of the laser L applied to the workpiece W is relatively low, so that the laser L is rotated relatively slowly. In addition, by rotating the laser L irradiated to the workpiece W at a relatively high speed, it is possible to irradiate the laser L uniformly in a certain range, and to suppress the output of the laser L from being concentrated on a part. . As a result, the processing apparatus 10 can easily control the thickness TH of the heat-affected layer Wa, and the processing accuracy can be increased. Further, by rotating the laser L irradiated to the workpiece W at a relatively high speed, even if the laser L is output at a relatively high power, the thermal influence (the influence of thermal damage) is suppressed, and the heat affected layer Wa The processing speed can be increased while suppressing the thickness TH and maintaining the processing quality.

  Further, the processing apparatus 10 uses a metal material such as a steel plate as the workpiece W, so that cutting, drilling, welding, cladding, surface modification, surface finishing, or laser lamination modeling is preferably performed. And the cut surface can be made into a more suitable shape. Thereby, the processing apparatus 10 can make processing precision high. Further, since the processing apparatus 10 can suppress the output of the laser L from being concentrated on a part by irradiating the laser L while turning, the high-power laser L can be used. Therefore, it can be suitably used for welding and cladding, and can also be suitably used for materials having high heat resistance.

  Further, since the processing apparatus 10 rotates the first rotation mechanism 53 with the first hollow motor 56 and rotates the second rotation mechanism 54 with the second hollow motor 58, the first hollow motor 56 and the second hollow motor 56 are driven. Since the radial direction of the motor 58 can be reduced, the irradiation head 16 can be reduced in size. That is, the enlargement of the processing apparatus 10 can be suppressed.

  Further, in the processing apparatus 10, the control device 30 determines the number of rotations of the first rotation mechanism 53 and the second rotation mechanism 54, thereby processing the workpiece W while setting the thickness TH of the heat-affected layer Wa to an allowable thickness or less. can do.

  Next, another example of processing by the processing apparatus 10 will be described with reference to FIGS. FIG. 17 is an explanatory diagram of an operation of cutting by the processing apparatus. FIG. 18 is an explanatory diagram of a heat-affected layer of a workpiece to be cut. FIG. 19 is an explanatory diagram of a welding operation performed by the processing apparatus. FIG. 20 is an explanatory diagram of a heat-affected layer of a workpiece processed by welding. FIG. 21 is an explanatory diagram of the operation of the cladding process by the processing apparatus. FIG. 22 is an explanatory diagram of the heat-affected layer of the workpiece processed by the cladding process. FIG. 23 is an explanatory diagram of the operation of surface modification processing by the processing apparatus. FIG. 24 is an explanatory diagram of a heat-affected layer of a workpiece subjected to surface modification processing.

  When the processing mode is cutting, the processing apparatus 10 scans the irradiation head 16 in the direction of the arrow b, which is an arbitrary direction in the XY plane (horizontal plane), as shown in FIGS. 17 and 18. It is possible to irradiate in the direction of the arrow b while turning the laser L like TR, and to suppress the thickness TH of the heat-affected layer Wa to an allowable thickness or less. Thereby, the processing apparatus 10 can irradiate the workpiece W with the irradiation width D with the laser L and cut the workpiece W with the irradiation width D. Further, the processing apparatus 10 controls the number of revolutions of the laser L applied to the workpiece W by controlling the number of rotations of the first prism 51 and the second prism 52, and the thickness TH of the heat affected layer Wa is controlled. The allowable thickness can be controlled.

  Further, when the processing mode is welding, the processing apparatus 10 irradiates the laser L while scanning the irradiation head 16 in the arrow b direction (any direction on the XY plane) as shown in FIGS. 19 and 20. By supplying the welding wire 91 or the like to the position IP, irradiation is performed in the direction of the arrow b while turning the laser L as shown by the trajectory TR. Thereby, the processing apparatus 10 can weld one processed member W3 which is groove shape, such as I shape, and the other processed member W4 by the welding part Wd, for example. Further, the processing apparatus 10 controls the rotational speed of the first prism 51 and the second prism 52, thereby turning the laser L irradiated to the groove between one processed member W3 and the other processed member W4. By controlling the number, the thickness TH of the heat-affected layer Wa can be controlled.

  In addition, when the processing mode is the cladding processing, the processing apparatus 10 performs scanning of the irradiation head 16 in the arrow b direction (any direction in the XY plane) as shown in FIGS. 21 and 22. By supplying the build-up material wire 92 or the like to the irradiation position IP, the laser beam L is irradiated in the direction of the arrow b while turning the laser L as shown by the trajectory TR. Thereby, the processing apparatus 10 can form the build-up portion We on the workpiece W. Further, the processing apparatus 10 controls the number of revolutions of the laser L applied to the workpiece W by controlling the number of rotations of the first prism 51 and the second prism 52, and the thickness TH of the heat affected layer Wa is controlled. The allowable thickness can be controlled.

  Further, when the processing mode is surface modification processing, the processing apparatus 10 scans the irradiation head 16 in the arrow b direction (any direction in the XY plane) as shown in FIGS. 23 and 24, Irradiate in the direction of arrow b while turning the laser L as shown by the trajectory TR. Thereby, the processing apparatus 10 irradiates the workpiece W with the irradiation width Da, for example, to smooth the surface of the workpiece W or to refine the material particles on the surface of the workpiece W. In other words, the surface modified portion Wf obtained by modifying the surface of the workpiece W can be formed. Further, the processing apparatus 10 controls the number of revolutions of the laser L applied to the workpiece W by controlling the number of rotations of the first prism 51 and the second prism 52, and the thickness TH of the heat affected layer Wa is controlled. The allowable thickness can be controlled.

  In the present embodiment, the heat-affected layer Wa of the workpiece W includes at least one of a remelted layer, an oxide layer, a crack, and dross formed by the laser L irradiated to the workpiece W. The remelted layer is a layer in which the solid of the workpiece W is liquefied by the irradiation of the laser L during processing and is solidified again. Although the remelted layer differs depending on the processing mode, in the case of drilling or cutting, the remelted layer is not a layer formed at the tip of the laser L irradiation direction (traveling direction), but is orthogonal to the laser L irradiation direction (traveling direction). It is a layer formed in the direction, and is formed on the inner peripheral surface of the hole Wb formed by irradiating the laser L and the cut surface of the cut workpiece W. The remelted layer has a direction orthogonal to the irradiation direction (traveling direction) of the laser L when the processing mode is welding, cladding, surface modification, surface finishing, or laser additive manufacturing. Formed on the periphery of the welded portion Wd formed by irradiating the laser L, the periphery of the welded portion Wd, the periphery of the welded portion Wed and the surface of the surface modified portion Wf. It is what is done.

  When the workpiece W is a metal or the like, the oxide layer is an oxide film formed on the inner peripheral surface or the cut surface of the hole Wb of the workpiece W when oxygen is used as the assist gas G2. The crack is a fine crack (micro crack) generated on the inner peripheral surface or the cut surface of the hole Wb of the workpiece W during the rapid heating of the workpiece W by the laser L irradiation. The dross is a deposit that is solidified by adhering to the inner peripheral surface or the cut surface of the hole Wb of the workpiece W as a molten material that has been liquefied when drilling or cutting the workpiece W. is there. The thickness of the heat-affected layer Wa of the workpiece W includes the thickness of the remelted layer, the thickness of the oxide film, the depth of cracks, and the thickness of deposits.

  The permissible thickness is determined when the workpiece W is subjected to processing including at least one of cutting processing, drilling processing, welding processing, cladding processing, surface modification processing, surface finishing processing, and laser additive manufacturing. The thickness TH of the heat-affected layer Wa of the inner peripheral surface, the cut portion and the welded portion Wd, the thickness TH of the heat-affected layer Wa of the built-up portion We and the surface modified portion Wf, and the like as a processed product The thickness is within a range that is acceptable for the workpiece W.

  The allowable thickness differs depending on the processing mode, but in the case of drilling or cutting, the allowable thickness is a length in a direction orthogonal to the irradiation direction (traveling direction) of the laser L. The allowable thickness is the length in the irradiation direction (traveling direction) of the laser L and the irradiation of the laser L when the processing mode is welding, cladding, surface modification, surface finishing, or laser additive manufacturing. It is the length in the direction orthogonal to the direction.

[Second Embodiment]
Next, the irradiation head 16 according to the second embodiment will be described. FIG. 25 is an explanatory diagram showing a schematic configuration of an irradiation head according to the second embodiment. Since the basic configuration of the irradiation head 16 according to the second embodiment is the same as that of the irradiation head 16 of the processing apparatus 10 according to the first embodiment, description of the configuration of the same portion is omitted. In the irradiation head 16 according to the second embodiment, the optical paths of the lasers L of the collimating optical system 34, the laser swivel unit 35, and the condensing optical system 37 are integrally connected in a straight line (coaxial).

  As shown in FIG. 25, the irradiation head 16 includes a collimating optical system 34, a laser turning unit 35, a condensing optical system 37, and a nozzle 38. The irradiation head 16 is arranged in the order of the collimating optical system 34, the laser turning portion 35, the condensing optical system 37, and the nozzle 38 from the upstream side to the downstream side in the optical path of the laser L output from the guide optical system 14. Is done. The irradiation head 16 irradiates the workpiece L disposed at a position facing the nozzle 38 with the laser L output from the guide optical system 14.

  The laser turning unit 35 is rotationally driven by the first rotating mechanism 53 and is driven by the hollow cylindrical first spindle 55 that supports the first prism 51 and the second rotating mechanism 54 to support the second prism 52. And a hollow cylindrical second spindle 57. Thereby, the irradiation head 16 rotates the laser L around the center P of the optical path to rotate the irradiation position IP of the laser L irradiated to the workpiece W.

  Further, the irradiation head 16 irradiates the workpiece W by controlling the number of rotations of the first rotation mechanism 53 and the second rotation mechanism 54 and the phase angle difference between the first prism 51 and the second prism 52. The turning diameter R, the number of turns, the trajectory TR, etc. of the laser L can be changed in accordance with the machining mode.

  The irradiation head 16 includes an imaging unit 40, a gap detection unit 41, and the like, and controls the difference in rotation speed and phase angle between the first prism 51 and the second prism 52, thereby achieving the first embodiment. The same processing as that of the irradiation head 16 can be performed.

[Experimental example]
Here, an experimental example of drilling performed on the workpiece W using the processing apparatus 10 will be described. FIG. 26 is a diagram illustrating a processing example of a member to be processed by the processing apparatus. FIG. 27 is a view of the workpiece shown in FIG. 26 as viewed from the opposite side.

  The laser L irradiating the workpiece W has a laser peak power of 100 W to 20 kW, a frequency of 5 Hz to 10 kHz, a pulse width of 1 μs to 100 ms, an irradiation time of 10 ms to 10 seconds, a focal length of 40 to 400 mm, and the number of turns. The speed was 20 to 5000 rpm. As the assist gas, oxygen having a pressure of 0.1 to 1 MPa is used. However, air or nitrogen may be used, or a rare gas such as argon gas (Ar) or xenon gas (Xe) may be used. In addition, as the workpiece W, Inconel (registered trademark) having a thickness of 0.5 to 10 mm was used.

  The result of processing under the above conditions by the processing apparatus 10 is shown in FIGS. Here, FIG. 26 shows the front surface (laser incident side) of the workpiece W, and FIG. 27 shows the back surface of the workpiece W. In this experimental example, as shown in FIGS. 26 and 27, a hole Wb was formed in the workpiece W. It was found that the processing apparatus 10 was processed with high accuracy by performing the processing under the above conditions, even when the laser irradiation time was 0.2 seconds, with little distortion and unevenness around the hole Wb. .

  As described above, according to the processing apparatus 10 according to the embodiment, the assist gas G2 is blown from the second nozzle portion 78 to the workpiece W. Therefore, the processing apparatus 10, that is, the laser processing apparatus is configured simply and with a small size. Thus, even if the opening diameter K of the first nozzle portion 77 is increased, the consumption amount of the assist gas G2 can be suppressed. Further, since the consumption amount of the assist gas G2 can be suppressed even when the opening diameter K of the first nozzle portion 77 is increased, the laser that irradiates the workpiece W with the opening diameter K of the first nozzle portion 77 being increased. There is an effect that the turning radius R of L can be increased. Further, since the turning radius R of the laser L irradiated to the workpiece W can be changed simply by changing the phase angle difference between the first prism 51 and the second prism 52, the machining apparatus 10 can be simply configured. There is an effect that can be made. Further, by controlling the difference in phase angle between the first prism 51 and the second prism 52 and changing the turning radius R of the laser L irradiated to the workpiece W, the turning radius suitable for the processing mode and processing conditions is changed. Processing can be performed with R. As a result, the required processing quality can be satisfied, and it is possible to perform processing with higher accuracy at high speed.

  In the above embodiment, the processing device 10 uses a fiber laser output device or a short pulse laser output device. However, the processing device 10 is not limited to this, and the laser L capable of processing the workpiece W is processed. Any laser output device may be used. Thereby, the processing apparatus 10 can utilize various laser output apparatuses, and can use a laser output apparatus suitable for the processing application.

  Further, the fiber laser output device may be a laser output device that uses either continuous wave operation or pulsed operation. The fiber laser output device can easily be used for cutting and welding because it is easy to obtain a high output in the case of continuous wave oscillation. In the case of pulse oscillation, it is easy to suppress the thermal influence. It can be suitably used for processing and the like.

  In the fiber laser output device, the light intensity distribution of the cross section of the laser L irradiated to the workpiece W may be Gaussian mode (single mode) or multimode. The fiber laser output device can be suitably used for welding processing, cutting processing, and extremely fine drilling because it is easy to narrow down the spot diameter at the irradiation position IP and easily obtain a high output in the case of the Gaussian mode. In the case of the multi-mode, it is easy to suppress the thermal influence on the base material, so that it can be suitably used for surface modification processing, surface finishing processing, brazing processing, and the like.

  Moreover, in the said embodiment, although the processing apparatus 10 processes the plate-shaped to-be-processed member W, the shape of the to-be-processed member W is not specifically limited, It can be set as various shapes. Further, the processing apparatus 10 may perform processing on the workpiece W by combining cutting processing, drilling processing, welding processing, cladding processing, surface modification processing, surface finishing processing, and laser additive manufacturing. Further, the processing apparatus 10 can irradiate with a trajectory TR having a bending point or irradiate with a trajectory TR having a curved shape by controlling the irradiation position IP of the laser L. Thereby, the processing apparatus 10 can perform various types of processing for irradiating the workpiece W while turning the laser L.

  In addition, since the processing apparatus 10 can increase the processing accuracy, it is preferable to use a metal material such as a steel plate as the workpiece W. However, the processing device 10 is not limited to this, and Inconel (registered trademark) is used as the workpiece W. ), Hastelloy (registered trademark), stainless steel, ceramic, steel, carbon steel, ceramics, silicon, titanium, tungsten, resin, plastics, fiber reinforced plastic, composite material, Ni-base heat-resistant alloy It only has to be done. Moreover, since the processing apparatus 10 can reduce or remove the thermal influence (the influence of thermal damage), it can be used for various materials and composites that need to be processed by reducing or removing the thermal influence. Thereby, the processing apparatus 10 can process a various material.

  Further, the processing apparatus 10 may move the workpiece W or the irradiation head 16 in order to move the relative position between the irradiation position IP of the laser L and the workpiece W. The processing member W and the irradiation head 16 may be moved. Thereby, the processing apparatus 10 can process the workpiece W at a higher speed.

  Moreover, in the said embodiment, although the processing apparatus 10 which changes the turning diameter R of the said laser while turning the laser L on the to-be-processed member W was demonstrated, the processing apparatus 10 is the turning diameter R of the laser L irradiated. If the rotation speed of the first prism 51 and the second prism 52 is controlled so that the moving speed of the irradiation position IP of the turning laser (for example, the linear speed on the virtual circle IC) is constant, Good. Thereby, the processing apparatus 10 can make the energy per unit time constant at the irradiation position IP of the laser L irradiated to the workpiece W.

  Moreover, the processing apparatus 10 images the pilot hole drilled in the workpiece W with the imaging means 40, measures the hole diameter from the image data of the captured pilot hole, and the conditions of the measured hole diameter and the irradiated laser L ( The thickness TH of the heat-affected layer Wa is estimated from the peak output, pulse width, swirling number, swirling diameter R, etc.), and the laser falls within the allowable thickness range of the heat-affected layer Wa from the estimated thickness TH of the heat-affected layer Wa. The turning number of L and the turning diameter R are determined, and the controller 30 determines the rotational speed and phase angle difference between the first hollow motor 56 and the second hollow motor 58 based on the determined turning number of the laser L and the turning diameter R. It is also possible to control and to make a main hole. Thereby, the processing apparatus 10 can control more accurately so that the thickness TH of the heat-affected layer Wa of the workpiece W is within the allowable thickness range.

  Further, the processing apparatus 10 may cool the collimating optical system 34, the laser turning unit 35, the reflection optical system 36, the condensing optical system 37, and the like by a cooling mechanism such as a cooling jacket. Thereby, since the processing apparatus 10 can suppress the temperature rise of a lens, a mirror, etc. by the laser L, the optical characteristic of the irradiation head 16 can be stabilized and the irradiation position IP of the laser L can be controlled with high accuracy. .

  Moreover, in the said embodiment, although the processing apparatus 10 is arrange | positioned in the position (just behind) where the gap detection means 41 opposes the condensing lens of the condensing optical system 37, the focus of the laser L, the to-be-processed member W, and As long as it is a position that can detect the gap, it may be arranged at another position of the irradiation head 16. Thereby, the processing apparatus 10 can change the attachment position of the gap detection means 41 according to the form of an apparatus.

  In the above embodiment, the processing apparatus 10 sets the inclination of the incident surface 51a of the first prism 51 to less than 1 ° and the inclination of the output surface 52b of the second prism 52 to less than 1 °. It is sufficient that the laser beam reflected by the incident surface 51 a and the laser beam reflected by the emission surface 52 b of the second prism 52 do not reach the emission port of the laser oscillator 12. Thereby, the processing apparatus 10 can change the inclination of the entrance surface 51a and the exit surface 52b according to the length of the guide optical system 14. In addition, the first prism 51 may be attached to the prism holder so that the incident surface 51a has the inclination, and the second prism 52 may be attached to the prism holder so that the emission surface 52b has the inclination.

  Moreover, although the method to process by changing conditions in two steps with respect to the workpiece W having the ceramic layer W1 and the metal layer W2 has been described, the present invention is not limited to this. In the case of multiple layers, it can be processed in multiple stages with different conditions (multi-stage processing). In addition to the ceramic layer W1 and the metal layer W2, various materials can be used. Thus, the processing apparatus 10 can perform processing on the workpiece W in multiple stages, and can perform processing under processing conditions suitable for the material of the workpiece W.

  Further, at least one of the first hollow motor 56 and the second hollow motor 58 may be an ultrasonic motor. Thereby, the processing apparatus 10 can easily improve the positioning accuracy of the phase angle (rotational position) of the first hollow motor 56 and the second hollow motor 58.

  Further, the number of revolutions of the laser L irradiated to the workpiece W may be increased, or the pulse width of the laser L may be shortened. Thereby, the processing apparatus 10 can make the thickness TH of the heat affected layer Wa thinner.

  Further, referring to a control map (a scattered matter control map) that defines the correlation between the amount of scattered matter from the irradiation position IP of the laser L on the workpiece W and the number of rotations of the laser L, the first prism 51 and The rotational speed of the second prism 52 and the phase angle difference between the first prism 51 and the second prism 52 are determined, and the first hollow motor 56 and the second hollow motor 58 are controlled by the determined rotational speed and the phase angle difference. It may be rotated. Thereby, the processing apparatus 10 can suppress the thickness TH of the heat-affected layer Wa and the amount of scattered matter.

  Moreover, in the said embodiment, although shield gas G1 and assist gas G2 are made into the same gas kind, mutually different gas kinds may be sufficient. Thereby, the processing apparatus 10 can process using the shielding gas G1 and the assist gas G2 suitable for the processing mode, processing conditions, the material of the workpiece W, and the like.

  In the above embodiment, the guide optical system 14 is an optical fiber. However, the guide optical system 14 is not limited thereto, and may be guided to the irradiation head 16 by combining a mirror or a lens and reflecting or condensing the laser L. . Thereby, the irradiation head 16 can be utilized with various processing apparatuses.

  In the above-described embodiment, the processing stage 20 that is relatively moved by the X-axis moving mechanism 22 has been described. However, the processing stage 20 may be an XY stage or an XYZ stage. Further, the irradiation head 16 may be relatively moved in three directions of XYZ, or the irradiation head 16 may be supported by an arm and moved in the C-axis direction in addition to the three axes of XYZ. Thereby, the irradiation head 16 can be used for various types of processing apparatuses.

DESCRIPTION OF SYMBOLS 10 Processing apparatus 12 Laser oscillator 14 Guide optical system 16 Irradiation head 16a Irradiation head cover 20 Processing stage 22 X-axis moving mechanism 24 C-axis rotating mechanism 26 Y-axis moving mechanism 28 Z-axis moving mechanism 30 Controller 32 Portal bridge 34 Collimating optical system 35 Laser turning portion 36 Reflecting optical system 37 Condensing optical system 38 Nozzle 39 Indexing mechanism 40 Imaging means 41 Gap detecting means 42 Support member 50 Cooling mechanism 51 First prism 52 Second prism 53 First rotating mechanism 54 Second rotating mechanism 55 First spindle 56 First hollow motor 57 Second spindle 58 Second hollow motor 59, 60 Bearing 61, 63 Hollow rotor 62, 64 Stator 65 Encoder 66 Identifier 67 Detector 67 First reflection mirror 72 Second reflection mirror 73 Tube Part 74 Nozzle mounting part 7 Joint part 76 Translucent member 77 First nozzle part 77a, 78a Supply port 78 Second nozzle part 80 Gas supply source 80a Shield gas supply pipe 80b Assist gas supply pipe 81 Indexing shaft 82 Hollow motor 83 Indexing angle detection means 84 Bearing 85 Hollow rotor 86 Stator 91 Welding wire 92 Overlay wire a, b, d Arrow IC Virtual circle D, Da Width G1 Shield gas G2 Assist gas IP, IPa, IPb Irradiation position K Aperture diameter L Laser OA Optical axis P Center R , Ra, Rb Swivel diameter TH thickness TR, TRa, TRb Trajectory W Work piece W1 Ceramic layer W2 Metal layer W3 One work piece W4 Other work piece Wa Heat affected layer Wb Hole Wc Diagonal hole Wd Welded part We Overlaying part Wf Surface modification part

Claims (11)

A processing apparatus for performing processing by irradiating a workpiece with a laser,
A laser swivel unit that swivels the laser with respect to the workpiece; a condensing optical system that focuses the laser swung by the laser swivel unit; and a nozzle that irradiates the workpiece with the laser. An irradiation head for irradiating the workpiece with a laser;
A control device for controlling the operation of the irradiation head,
The nozzle includes a first nozzle portion through which a laser irradiated to the workpiece member passes, and a second nozzle portion that is disposed around the first nozzle portion and through which an assist gas blown to the workpiece member passes. And having
The laser swivel unit rotates a first prism that refracts the laser, a second prism that is disposed at a position facing the first prism and that refracts the laser output from the first prism, and rotates the first prism. A first rotating mechanism for rotating and a second rotating mechanism for rotating the second prism;
The control device includes the first rotation mechanism and the second rotation mechanism based on a relationship between at least an allowable thickness of the heat-affected layer of the workpiece and the number of rotations of the laser irradiated on the workpiece. To adjust the rotational speed and phase angle difference of the first prism and the second prism.   The processing apparatus according to claim 1, wherein a shielding gas is supplied to the first nozzle portion.   The processing apparatus according to claim 2, wherein the assist gas and the shield gas have different gas types.   4. The method according to claim 1, wherein the processing includes at least one of cutting, drilling, welding, cladding, surface modification, surface finishing, and laser additive manufacturing. The processing apparatus according to claim 1.   The processing apparatus according to claim 1, wherein the heat-affected layer includes at least one of a remelted layer, an oxide layer, a crack, and dross.   The workpiece is Inconel (registered trademark), Hastelloy (registered trademark), stainless steel, ceramic, steel, carbon steel, heat-resistant steel, ceramics, silicon, titanium, tungsten, resin, plastics, fiber reinforced plastic, composite material, The processing apparatus according to any one of claims 1 to 5, wherein the processing apparatus is made of any material of a Ni-base heat-resistant alloy.   The control device performs the first rotation based on a relationship between at least the allowable thickness of the heat-affected layer of the workpiece, the number of revolutions of the laser irradiated on the workpiece, and the radius of revolution of the laser. The mechanism and the second rotation mechanism are controlled to adjust the rotation speed and the difference in phase angle between the first prism and the second prism. The processing apparatus as described. A processing method for performing processing by irradiating a workpiece with a laser using the processing apparatus according to claim 1,
An output step of outputting a laser;
Based on the relationship between at least the allowable thickness of the heat-affected layer of the workpiece and the number of rotations of the laser irradiated to the workpiece, the rotation speed and phase angle of the first prism and the second prism A decision step to determine the difference between
A rotation step of rotating the first rotation mechanism and the second rotation mechanism with a determined rotation speed and a phase angle difference;
An irradiation step of irradiating the workpiece while rotating the laser. The thickness of the heat-affected layer of the workpiece, the amount or length of splash of the melt on the front and back surfaces of the workpiece, the pressure of the gas blown onto the workpiece, and the flow rate of the gas Based on the relationship
The processing method according to claim 8, wherein the pressure and flow rate of the gas are controlled within a range satisfying an allowable thickness of the heat-affected layer of the workpiece and the scattering amount or scattering length.   The processing method according to claim 8 or 9, wherein the workpiece is processed in multiple stages.   The determining step is based on the relationship between at least the allowable thickness of the heat-affected layer of the workpiece, the number of revolutions of the laser irradiated to the workpiece, and the radius of revolution of the laser. The processing method according to any one of claims 8 to 10, wherein a rotational speed and a phase angle difference between the prism and the second prism are determined.