CN103212865A - Laser processing method for brittle material substrate and laser processing device for brittle material substrate - Google Patents
Laser processing method for brittle material substrate and laser processing device for brittle material substrate Download PDFInfo
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- CN103212865A CN103212865A CN2013100136882A CN201310013688A CN103212865A CN 103212865 A CN103212865 A CN 103212865A CN 2013100136882 A CN2013100136882 A CN 2013100136882A CN 201310013688 A CN201310013688 A CN 201310013688A CN 103212865 A CN103212865 A CN 103212865A
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- laser
- processing
- brittle substrate
- substrate
- brittle
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28B1/00—Producing shaped prefabricated articles from the material
- B28B1/48—Producing shaped prefabricated articles from the material by removing material from solid section preforms for forming hollow articles, e.g. by punching or boring
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
Abstract
Disclosed are a laser processing method for brittle material substrate and laser processing device for brittle material substrate. Cracking of front of a brittle material substrate during boring of the brittle material substrate by irradiating laser is minimized. The laser processing method is a method for boring of the brittle material substrate by irradiating laser and comprises a first step where laser irradiates on the back of the brittle material substrate so that the laser focus moves from the back of the brittle material substrate to the front for boring until the preset depth to the back of the brittle material substrate is reached, and a second step where laser irradiates on the front of the brittle material substrate so that the laser focus moves from the front of the brittle material substrate to the front corresponding to the hole formed in the first step to form a hole communicating with the hole formed in the first step.
Description
Technical field
The present invention relates to laser processing, particularly relate to the brittle substrate laser processing that the brittle substrate irradiating laser is carried out perforate processing.In addition, also relate to the laser processing device that is used to implement this laser processing.
Background technology
As the device of brittle substrates such as glass substrate being processed by laser, known have a for example device shown in the patent documentation 1.In this processing unit (plant), to the green laser about workpiece illumination wavelength 532nm such as glass substrate.Usually, green laser can see through glass substrate, and when still making its intensity surpass a certain threshold value at convergent laser, glass substrate can absorb laser.Under such state, can produce plasma in the convergent portion of laser, make glass substrate evaporate (transpiration) thus.Utilize above principle, can carry out on glass substrate forming the processing in hole etc.
In addition, having shown in the patent documentation 2: along the processing line scan laser, process when rotating at a high speed with minor radius and glass substrate is carried out perforate by the convergent point that makes laser.
Patent documentation
Patent documentation 1: TOHKEMY 2007-118054 communique
Patent documentation 2: TOHKEMY 2011-11212 communique
In perforate processing,, be called as the damaged of (chipping) of bursting apart on every side producing of machining hole at the beginning face and the end face of processing, promptly in the back side and the front of substrate based on existing method.These burst apart and are considered to result from the small be full of cracks that the place, processing part produces, and they can become the factor that intensity reduces.Therefore, preferably reduce as much as possible to burst apart.
As mentioned above, more than such bursting apart result from the back side and the front of substrate, but under the situation that begins to process at the back side, there be bursting apart as substrate front side one side of process finishing face greater than the tendency of bursting apart as the back side one side of processing beginning face from substrate.
Summary of the invention
Problem of the present invention is to add to alleviate man-hour and burst apart the brittle substrate irradiating laser being carried out perforate, alleviates the bursting apart of front of brittle substrate especially.
The related brittle substrate laser processing of the 1st invention is that the brittle substrate irradiating laser is carried out the perforate method for processing, comprises the 1st operation and the 2nd operation.In the 1st operation, from the front illuminated laser of brittle substrate, the converged position that makes laser moves and carries out perforate processing from the back side of brittle substrate to the front, up to the position of distance substrate back prescribed depth.In the 2nd operation, from the front illuminated laser of brittle substrate, the hole at forming in the 1st operation makes the converged position of laser move to the back side from the front of brittle substrate, and the perforate that is communicated with the hole that in the 1st operation, forms processing.
In the 1st operation,, carry out the position of perforate processing herein, up to distance substrate front side prescribed depth from rear side from substrate front side side irradiating laser.Then, when the processing of carrying out from rear side arrives the position of prescribed depth, temporarily stop the processing of carrying out from rear side.Next, same with the 1st operation in the 2nd operation, from the substrate front side irradiating laser, continue processing to the back side from substrate front side.Thus, form the hole that connects substrate.
, begin processing from the back side of substrate herein, and temporarily stop the processing to carry out from the back side in the position of prescribed depth, begin processing from the face side of substrate again then.In such processing method, the back side of substrate and the positive beginning face that all becomes processing, the process finishing face is in substrate inside.Be difficult in the substrate in-house development by the be full of cracks that adds Ministry of worker's generation, thereby suppressed to burst apart.
The related brittle substrate laser processing of the 2nd invention is in the processing method of the 1st invention, in the 1st operation, implements perforate processing, the position more than distance substrate front side 240 μ m from the back side of brittle substrate.
From the front illuminated laser of substrate, begin to add man-hour from rear side, the processing bits fall downwards, and the processing bits can not hinder the laser irradiation.On the other hand, from the substrate front side irradiating laser, begin to add man-hour from face side, the processing bits can be accumulated in the formed recess of processing, and these processing bits can become obstruction etc. when convergent laser, thereby disturb processing.Therefore, the process velocity that carries out from the substrate front side side is slower than the process velocity that carries out from the substrate back side.
On the other hand, when processing the position that is performed until near substrate front side from the substrate back side, add be full of cracks that the Ministry of worker produces and arrive positively, produce the possibility of bursting apart more greatly in substrate front side and increase.
Therefore, in the 2nd invention, begin processing, be performed until position apart from substrate front side 240 μ m from the substrate back side.Thus, can shorten process time, and can be suppressed at bigger the bursting apart of substrate front side generation.
The related brittle substrate laser processing of the 3rd invention is in the processing method of the 1st or the 2nd invention, in the 1st and the 2nd operation, make the laser convergence point depart from central shaft, and this laser convergence point is moved along processing line when with the central shaft being the center rotation.
, laser is processed herein in rotation along processing line scanning to substrate, therefore can be shortened process time.
The related brittle substrate laser processing of the 4th invention is in the processing method of the 1st invention, in the 1st and the 2nd operation, laser is scanned with helical form along processing line.
, laser is scanned continuously herein, thereby shorten process time.
The related brittle substrate laser processing device of the 5th invention is the device that the brittle substrate irradiating laser is carried out perforate processing, possesses: workbench, its mounting brittle substrate; Laser irradiating head is to the brittle substrate irradiating laser on the workbench; Travel mechanism, it makes workbench and laser irradiating head along workbench mounting surface direction and leave on the direction of workbench mounting surface and relatively move.And, front illuminated laser from brittle substrate, the converged position of laser is moved to the front from the back side of brittle substrate, beginning to carry out perforate processing behind the position of prescribed depth from substrate back, front illuminated laser from brittle substrate, at the formed hole of processing, the converged position of laser is moved to the back side from the front of brittle substrate, and the perforate that is communicated with established hole processing.
The invention effect
In above such the present invention, add man-hour brittle substrate being carried out perforate by laser, can reduce bursting apart of brittle substrate front.
Description of drawings
Fig. 1 is based on the stereoscopic figure of the glass substrate processing unit (plant) of an embodiment of the invention.
Fig. 2 is the amplification stereogram of workpiece workbench.
Fig. 3 is the stereogram that amplifies the structure that laser irradiating head is shown.
Fig. 4 is the figure that the configuration of the 1st hollow motor and the 1st prism wedge schematically is shown.
Fig. 5 is the figure that the configuration of the 2nd hollow motor, the 2nd prism wedge and convergent lens schematically is shown.
Fig. 6 is the figure that the track of laser is shown.
Fig. 7 is the schematic diagram that the situation of processing from the glass substrate rear side is shown.
Fig. 8 is the schematic diagram that the situation of processing from the glass substrate face side is shown.
Fig. 9 illustrates existing processing method and figure that the size of bursting apart of the processing method after using the present invention compares.
Label declaration:
2 workpiece workbench; 3 laser irradiating heads; 5 movable workbench mechanisms; 21 x direction of principal axis travel mechanisms; 22 z direction of principal axis travel mechanisms; The G glass substrate; The L processing line.
The specific embodiment
［ processing unit (plant) ］
Fig. 1 shows the overall structure that is used to implement based on the device of the processing method of an embodiment of the invention.This glass substrate processing unit (plant) is to be used for along processing line the glass substrate irradiating laser, thereby forms the device in hole on glass substrate.This device possesses: lathe 1; Workpiece workbench 2, its mounting is as the glass substrate of workpiece; Laser irradiating head 3, it is used for the glass substrate irradiating laser.As shown in Figure 1, will be defined as x axle, y axle along the orthogonal axle in the plane of the upper surface of lathe 1, and the axle of vertical direction that will be vertical with these is defined as the z axle herein.In addition, to be defined as the x direction of principal axis along the both direction (+direction and ﹣ direction) of x axle, to be defined as the y direction of principal axis along the both direction (+direction and ﹣ direction) of y axle, will be defined as the z direction of principal axis along the both direction (+direction and ﹣ direction) of z axle.
＜workpiece workbench＞
Workpiece workbench 2 forms rectangle, is provided with movable workbench mechanism 5 below workpiece workbench 2, is used to make workpiece workbench 2 to move on x direction of principal axis and y direction of principal axis.
Shown in Fig. 2 amplified, workpiece workbench 2 had a plurality of 6.These a plurality of 6 is to be used for parts that the glass substrate G shown in the figure chain-dotted line is lifted and supports from the surface of workpiece workbench 2, can be installed in shown in the processing line L(dotted line of avoiding glass substrate G of workpiece workbench 2) the optional position.In addition, array-like ground is formed with a plurality of air entry 2a on workpiece workbench 2, and is formed with the suction hole 6a that connects on above-below direction in each piece 6.And, be connected with the air entry 2a of workpiece workbench 2 by the suction hole 6a that makes piece 6, can adsorb fixing to the glass substrate G that is configured on the piece 6.In addition, be used for air-breathing mechanism and constitute, omit its detailed description by known exhaust pump etc.
＜movable workbench mechanism＞
As shown in Figure 1, movable workbench mechanism 5 has a pair of the 1st guide rail 8, a pair of the 2nd guide rail 9 and the 1st travelling table 10 and the 2nd travelling table 11.1 pair the 1st guide rail 8 is arranged on the upper surface of lathe 1, extends on the y direction of principal axis.The 1st travelling table 10 is arranged on the top of the 1st guide rail 8, has a plurality of guide part 10a at lower surface, and these a plurality of guide part 10a engage in the mode that can move freely with the 1st guide rail 8.The 2nd guide rail 9 is arranged on the upper surface of the 1st travelling table 10, extends on the x direction of principal axis.The 2nd travelling table 11 is arranged on the top of the 2nd guide rail 9, has a plurality of guide part 11a at its lower surface, and these a plurality of guide part 11a engage in the mode that can move freely with the 2nd guide rail 9.On the top of the 2nd travelling table 11, workpiece workbench 2 is installed across fixed part 12.
By above such movable workbench mechanism 5, workpiece workbench 2 moves freely on x direction of principal axis and y direction of principal axis.In addition, the 1st workbench 10 and the 2nd travelling table 11 drive by driving means such as known motor, omit its detailed description.
［ laser irradiating head ］
As Fig. 1 and shown in Figure 3, laser irradiating head 3 is installed on the door type framework 1a of the upper surface that is configured in lathe 1, has: laser efferent 15; Optical system 16; The 1st hollow motor 17, portion is equipped with 1 pair the 1st prism wedge (following) within it; The 2nd hollow motor 18, portion is equipped with 1 pair the 2nd prism wedge (following) and convergent lens within it.In addition, also be provided with: x direction of principal axis travel mechanism 21, it is used to make laser irradiating head 3 to move on the x direction of principal axis; Z direction of principal axis travel mechanism 22, it is used to make the 1st hollow motor 17 and the 2nd hollow motor 18 to move on the z direction of principal axis.
＜laser efferent＞
Laser efferent 15 is made of the laser tube identical with existing laser tube.By this laser efferent 15, along the axial green laser of the side ejaculation wavelength 532nm opposite of y with workpiece workbench 2.
＜optical system＞
1 couple 1st prism wedge of laser aiming in being installed in the 1st hollow motor 17 of optical system 16 light output parts of self-excitation in the future 15.Shown in Fig. 3 amplified, this optical system 16 had: the 1st mirror 25～the 4th mirror 28, output is measured to laser power monitor 29 and optical beam expander 30.
The 1st mirror 25 is configured near the outlet side of laser efferent 15, and the laser that will penetrate on the y direction of principal axis reflects to the x direction of principal axis.The 2nd mirror 26 on the x direction of principal axis with the 1st mirror 25 alignment arrangements, the laser that will advance on the x direction of principal axis is to y direction of principal axis reflection, guiding is to workpiece workbench 2 one sides.The 3rd mirror 27 and the 4th mirror 28 above the 1st hollow motor 17 along x direction of principal axis alignment arrangements.The 3rd mirror 27 will reflect next laser aiming to the 4th mirror 28 1 sides by the 2nd mirror 26.The 4th mirror 28 will be by next laser aiming the 1st hollow motor 17 downwards of the 3rd mirror 27 reflections.Optical beam expander 30 is configured between the 2nd mirror 26 and the 3rd mirror 27, and it is set to be used for to be expanded to the collimated light beam of certain multiplying power by the next laser of the 2nd mirror 26 reflections.By this optical beam expander 30, can make the luminous point of laser convergence Cheng Gengxiao.
＜the 1 prism wedge and the 1st hollow motor＞
Fig. 4 shows the schematic diagram that internal configurations has the 1st hollow motor 17 of the 1st prism wedge 321,322.The 1st hollow motor 17 has the rotating shaft R that extends on the z direction of principal axis at the center, the central portion that comprises this rotating shaft R is a hollow.And, in this hollow bulb, be fixed with 1 pair the 1st prism wedge 321,322.1 pair of prism wedge 321,322 has identical shaped and identical proportion, only refractive index difference.Each prism wedge 321,322 has respectively with respect to inclined-plane 321a, the 322a of rotating shaft R inclination and vertical plane 321b, the 322b vertical with rotating shaft R.And, vertical plane 321b, the 322b that the 1 pair of prism wedge 321,322 is configured to make both sides near and opposed, 2 vertical plane 321b, 322b are configured to parallel and make 2 inclined- plane 321a, 322a parallel.
, make the refractive index difference of 2 the 1st prism wedges 321,322 herein, make laser deflection bias angle theta by the 1st prism wedge 321,322.
In addition, about the shape (drift angle) of two prism wedges 321,322, with following by the focal length f of convergent lens and the laser radius of turn r(=ftan θ or the f θ of bias angle theta decision) be set at the value of expectation.
＜the 2 prism wedge, the 2nd hollow motor, convergent lens＞
Fig. 5 schematically shows the 2nd hollow motor 18 that internal configurations has 1 pair the 2nd prism wedge 341,342.The 2nd hollow motor 18 has the rotating shaft that extends on the z direction of principal axis at the center.This rotating shaft is coaxial with the rotating shaft R of the 1st hollow motor 17.The 2nd hollow motor 18 has hollow bulb at the central part that comprises rotating shaft R.In this hollow bulb, 1 pair the 2nd prism wedge 341,342 is installed.In addition, these the 2nd prism wedges 341,342 are set to: the opposing party's prism wedge 341 can rotate freely around rotating shaft R relatively with respect to a side prism wedge 342.That is, the drift angle of 1 pair the 2nd prism wedge 341,342 is adjustable.
1 pair the 2nd prism wedge 341,342 has identical shaped and identical material (identical proportion), so refractive index is also identical.In addition, 1 pair the 2nd prism wedge 341,342 has respectively with respect to inclined-plane 341a, the 342a of rotating shaft inclination and vertical plane 341b, the 342b vertical with respect to rotating shaft.And in the 2nd prism wedge 341,342, for the state of " 0 " (state that inclined-plane each other is parallel) rotation is configured, inclined-plane 341a, the 342a of 2 prism wedges 341,342 are not parallel from the drift angle for the opposing party's prism wedge 342.By the combination of such 2 the 2nd prism wedges 341,342, the drift angle that 1 pair the 2nd prism wedge 341,342 has regulation.This drift angle is greater than the drift angle of the 1st prism wedge 321,322.
In addition, in the inside of the 2nd hollow motor 18, the outlet side at 1 pair the 2nd prism wedge 341,342 is fixed with convergent lens 35.In addition, convergent lens 35 can separate with the 2nd hollow motor 18 and configuration individually.
The support of＜laser irradiating head and handling system＞
As mentioned above, such laser irradiating head 3 is supported on the door type framework 1a of lathe 1 more than.More particularly, as shown in Figure 3, at the upper surface of door type framework 1a, be provided with 1 pair of the 3rd guide rail 36 that extends on the x direction of principal axis, this 1 couple the 3rd guide rail 36 and unshowned driving mechanism constitute x direction of principal axis travel mechanism 21.And support component 37 is supported on this 1 couple the 3rd guide rail 36 in the mode that can move freely.Support component 37 has the horizontal support component 38 that is supported on the 3rd guide rail 36 and from a distolateral vertical support component 39 that extends of close workpiece workbench 2 sides of horizontal support component 38 downwards.Side at vertical support component 39 is provided with 1 pair of the 4th guide rail 40 that extends on the z direction of principal axis, this 1 couple the 4th guide rail 40 and unshowned driving mechanism constitute z direction of principal axis travel mechanism 22.The 3rd travelling table 41 is being supported on the 4th guide rail 40 in the mode that moves freely on the z direction of principal axis.
And laser efferent the 15, the 1st mirror 25～the 4th mirror 28, power monitor 29 and optical beam expander 30 are supported on the horizontal support component 38.In addition, motor support component 42 is fixed on the 3rd travelling table 41, and the 1st hollow motor 17 and the 2nd hollow motor 18 are supported on this motor support component 42.
［ processing method ］
Use above processing unit (plant), to describing by the processing method of laser under the situation that forms the hole on the glass substrate.Herein, as glass substrate, be that the soda-lime glass of 1.8mm is an example with thickness.
At first, be provided with a plurality of 6 on the surface of workpiece workbench 2.At this moment, as shown in Figure 2, a plurality of 6 processing line L that are configured to avoid glass substrate G.On a plurality of 6 of above such setting, mounting has glass substrate G to be processed.
Next, by x direction of principal axis travel mechanism 21 laser irradiating head 3 is moved on the x direction of principal axis, perhaps workpiece workbench 2 is moved on the y direction of principal axis, make the convergent point of the laser that laser irradiating head 3 penetrates be positioned at the place, starting position of processing line L thus by movable workbench mechanism 5.
＜the 1 operation＞
Below like this, after making laser irradiating head 3 and glass substrate G move to Working position, the glass substrate irradiating laser is processed.Herein, the laser that penetrates from laser efferent 15 is reflected by the 1st mirror 25, and guiding is to the 2nd mirror 26.In addition, for the laser that incides the 1st mirror 25, measure laser output by power monitor 29.Make the laser that incides the 2nd mirror 26 to the reflection of y direction of principal axis, carry out beam spread by optical beam expander 30, and guiding is to the 3rd mirror 27.Then, make 1 couple the 1st prism wedge 321,322 that is reflected and be input to the central part that is arranged on the 1st hollow motor 17 by the 3rd mirror 27 by the 4th mirror 28 further laser light reflected.
Because the refractive index difference of 2 the 1st prism wedges 321,322, the laser that is input to 1 pair the 1st and the 2nd prism wedge 321,322 deflects and exports.In addition, the 1st prism wedge 321,322 is rotated with for example speed more than the 15000rpm at a high speed, make the laser that sees through the 1st prism wedge 321,322 with (for example diameter 0.4mm～0.8mm) rotation at a high speed of little radius of turn.
Make the laser that penetrates from the 1st prism wedge 321,322 be input to the 2nd prism wedge 341,342.A side who makes the 2nd prism wedge 341,342 is with respect to the opposing party's rotation, makes it have drift angle greater than the 1st prism wedge 321,322.Therefore, by making 341,342 rotations of the 2nd prism wedge, the laser of rotation is with bigger radius of turn (for example outside diameter 5.0mm) rotation sweep at a high speed.In addition, the rotating speed of the 2nd prism wedge 341,342 is lower, for example is about 400～800rpm.
Fig. 6 shows the above such track of laser on glass substrate.Because mismachining tolerance in 1 pair the 1st prism wedge 321,322 and alignment error etc.,, can produce error herein, by in the diameter of a circle that 321,322 deflections of the 1st prism wedge and postrotational laser are described.Because this error can produce error in the aperture that finally processes.In this case, a side who makes the 2nd prism wedge 341,342 adjusts the drift angle with respect to the opposing party's rotation, and the track while scan of adjusting by the 2nd prism wedge 341,342 that laser produced gets final product.Thus, can process the hole of desired diameter accurately.
Herein, the thickness of glass of removing by 1 Laser Processing is tens of μ m.Therefore, under the situation of glass substrate G being carried out perforate processing, be difficult to make convergent point only to scan 1 time along processing line and just form the hole, the part of processing line inboard comes off even promptly be difficult to once.
Therefore, at first, control the 2nd position of hollow motor 18 on the z direction of principal axis that comprises convergent lens 35, make convergent point (working position) be formed on the lower surface (back side) of glass substrate (with reference to Fig. 7 (a)) by z shaft moving device 22.Under this state, make convergent point walk for 1 week along processing line after, by controlling the 2nd position of hollow motor 18 on the z direction of principal axis, shown in Fig. 7 (b), convergent point is raise.And, same, after making convergent point walk for 1 week, convergent point is raise along processing line.
Carry out above action repeatedly, the time point making convergent point arrival apart from the position of the front 240 μ m of substrate G temporarily stops the processing of carrying out from substrate back.
In addition, also can not the convergent point that whenever convergent point walked for 1 week along processing line after, just raises, but convergent point be raise continuously that helically is processed, and so equally also can carry out perforate processing on the z direction of principal axis with suitable speed.
, add man-hour at the front illuminated laser from glass substrate G from rear side herein, the processing bits fall downwards, and the processing bits can not be accumulated in the formed recess of processing.Therefore, the processing bits can not hinder the laser irradiation, can process within a short period of time.
＜the 2 operation＞
Next, as shown in Figure 8, to rear side,, the position identical with the hole that forms in formerly the operation processed with the condition identical with the processing that begins from rear side from the face side of glass substrate G.By above such processing, can form the hole that connects glass substrate G.
In addition, from the front illuminated laser of glass substrate G, begin to add man-hour from face side, the processing bits are likely to accumulate in the formed recess of processing.These processing bits can become obstruction etc. when convergent laser, thereby disturb processing.
But, herein, be the glass substrate G of 1.8mm for thickness, in the 1st operation, the processing that begins from the substrate back side proceeds to the position apart from the substrate front side 240 μ m degree of depth, and is with respect to whole operation, extremely small from the processing that the substrate front side side is carried out.Therefore, even processing bits are accumulated in the recess, also can inhibition zone to the harmful effect of perforate processing.
［ experimental result ］
To under the situation that forms the hole based on existing processing method burst apart size and based on the processing method of an embodiment of the invention and the size of bursting apart that forms under the situation in hole compare and test.Processing conditions under this situation is as follows.
Laser output: 5W
Sweep speed: 40mm/s
Substrate: soda-lime glass (thickness=1.8mm)
The aperture:
Fig. 9 illustrates gathering of experimental result.Chip size under the situation of existing method is 236～333 μ m, and average-size is 284 μ m.In addition, be 157～213 μ m at the chip size of using under the situation of the present invention, average-size is 180 μ m.In addition, measure number n and be " 10 ".
In addition, when being worked into the positive less than 240 μ m of distance in the 1st operation, be full of cracks develops to substrate front side from processing.Therefore think, because this be full of cracks can produce bigger bursting apart in substrate front side.
［ feature ］
(1) back side of glass substrate and front are processing beginning face, and the process finishing face is in substrate inside.So, owing to be difficult to development by the be full of cracks that adds Ministry of worker's generation in substrate inside, so suppressed to burst apart.
(2) the processing of carrying out from the substrate back side, because perforate processing proceeds to the position apart from the front 240 μ m of glass substrate, thus can shorten process time, and can suppress to process the influence that bits bring perforate processing.
(3), arrive the front of glass substrate so can avoid chapping because position more than the 240 μ m of the front of distance glass substrate stops the processing to begin from the substrate back side.Therefore, can reduce the size of bursting apart that forms in substrate front side.
［ other embodiment ］
The present invention is defined in above such embodiment, in not departing from the scope of the present invention, can make various modifications or amendments.
For example, the means that are used for scan laser are not limited to described embodiment.For example, 2 galvanometers can be set substitute the 2nd hollow motor and 1 pair the 2nd prism, thereby scan with shape arbitrarily.
In addition, the shape of machining hole is not limited to circle.For the perforate processing of other shape, the present invention is suitable for too.
Claims (5)
1. a brittle substrate laser processing carries out perforate processing to the brittle substrate irradiating laser, and this laser processing comprises:
The 1st operation, from the front illuminated laser of brittle substrate, the converged position that makes laser moves and carries out perforate processing from the back side of brittle substrate to the front, up to the position of distance substrate back prescribed depth; And
The 2nd operation from the front illuminated laser of brittle substrate, at the hole that forms in described the 1st operation, makes the converged position of laser move to the back side from the front of brittle substrate, and the perforate that is communicated with the hole that in described the 1st operation, forms processing.
2. brittle substrate laser processing according to claim 1, wherein,
In described the 1st operation, implement perforate processing, the position more than distance substrate front side 240 μ m from the back side of brittle substrate.
3. according to claim 1 or 2 described brittle substrate laser processings, wherein,
In described the 1st operation and described the 2nd operation, make the laser convergence point depart from central shaft, and this laser convergence point is moved along processing line when with described central shaft being the center rotation.
4. brittle substrate laser processing according to claim 1, wherein,
In described the 1st operation and described the 2nd operation, laser is scanned with helical form along processing line.
5. brittle substrate laser processing device, it carries out perforate processing to the brittle substrate irradiating laser, and described brittle substrate laser processing device possesses:
Workbench, its mounting brittle substrate;
Laser irradiating head, it is to the brittle substrate irradiating laser on the described workbench; And
Travel mechanism, it makes described workbench and described laser irradiating head along the direction of the mounting surface of described workbench and leave on the direction of mounting surface of workbench and relatively move,
Wherein,
Front illuminated laser from brittle substrate, the converged position that makes laser moves and carries out perforate processing from the back side of brittle substrate to the front, position up to distance substrate back prescribed depth, then from the front illuminated laser of brittle substrate, at by the described hole that is processed to form, the converged position of laser is moved to the back side from the front of brittle substrate, and the perforate processing that is communicated with the described hole that forms.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012-011090 | 2012-01-23 | ||
| JP2012011090A JP2013146780A (en) | 2012-01-23 | 2012-01-23 | Method for laser processing brittle material substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103212865A true CN103212865A (en) | 2013-07-24 |
| CN103212865B CN103212865B (en) | 2016-01-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310013688.2A Expired - Fee Related CN103212865B (en) | 2012-01-23 | 2013-01-15 | The laser processing of brittle substrate and laser processing device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2013146780A (en) |
| KR (1) | KR20130086166A (en) |
| CN (1) | CN103212865B (en) |
| TW (1) | TWI552823B (en) |
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| CN107107264A (en) * | 2015-01-30 | 2017-08-29 | 株式会社牧野铣床制作所 | Laser machine and laser processing |
| CN107662054A (en) * | 2016-07-29 | 2018-02-06 | 三星钻石工业株式会社 | The laser processing and laser processing device of brittle substrate |
| CN107662053A (en) * | 2016-07-29 | 2018-02-06 | 三星钻石工业株式会社 | The laser processing and laser processing device of brittle substrate |
| CN110091078A (en) * | 2019-05-31 | 2019-08-06 | 华中科技大学 | A kind of three-dimensional column hole laser cutting method for glass |
| CN110582469A (en) * | 2018-03-30 | 2019-12-17 | 坂东机工株式会社 | Glass plate perforating device |
| CN111112859A (en) * | 2019-12-20 | 2020-05-08 | 武汉华工激光工程有限责任公司 | Zero-taper through hole process method for transparent brittle material |
| CN114131220A (en) * | 2021-11-04 | 2022-03-04 | 江苏大学 | Method for processing small holes in transparent hard and brittle material based on laser pulse control |
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| CN103878496A (en) * | 2014-04-15 | 2014-06-25 | 北京理工大学 | Method for efficiently processing high-quality micro hole with large ratio of pit-depth to pit-diameter through femtosecond laser |
| US10442720B2 (en) * | 2015-10-01 | 2019-10-15 | AGC Inc. | Method of forming hole in glass substrate by using pulsed laser, and method of producing glass substrate provided with hole |
| JP6813168B2 (en) | 2016-07-29 | 2021-01-13 | 三星ダイヤモンド工業株式会社 | Laser processing method and laser processing equipment for brittle material substrates |
| JP6920762B2 (en) * | 2016-07-29 | 2021-08-18 | 三星ダイヤモンド工業株式会社 | Laser machining equipment for brittle material substrates |
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| CN110091078A (en) * | 2019-05-31 | 2019-08-06 | 华中科技大学 | A kind of three-dimensional column hole laser cutting method for glass |
| CN111112859A (en) * | 2019-12-20 | 2020-05-08 | 武汉华工激光工程有限责任公司 | Zero-taper through hole process method for transparent brittle material |
| CN114131220A (en) * | 2021-11-04 | 2022-03-04 | 江苏大学 | Method for processing small holes in transparent hard and brittle material based on laser pulse control |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20130086166A (en) | 2013-07-31 |
| JP2013146780A (en) | 2013-08-01 |
| TW201334906A (en) | 2013-09-01 |
| TWI552823B (en) | 2016-10-11 |
| CN103212865B (en) | 2016-01-20 |
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