CN201143596Y - ITO thin film laser etching machine - Google Patents
ITO thin film laser etching machine Download PDFInfo
- Publication number
- CN201143596Y CN201143596Y CN 200720171149 CN200720171149U CN201143596Y CN 201143596 Y CN201143596 Y CN 201143596Y CN 200720171149 CN200720171149 CN 200720171149 CN 200720171149 U CN200720171149 U CN 200720171149U CN 201143596 Y CN201143596 Y CN 201143596Y
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- Prior art keywords
- thin film
- ito thin
- laser
- etching machine
- kinematic system
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Abstract
The utility model discloses an ITO film laser etcher, comprising a frame, a industrial control machine, a display system, a laser generator, a cutting head, a absorbing disc, an X-shaft moving system, a Y-shaft moving system and a Z-shaft moving system; wherein, the frame is equipped with the industrial control machine, the laser generator, the display system and the X-shaft moving system; the cutting head is arranged on the Z-shaft moving system; the absorbing disc is fixed on the X-shaft moving system above the Y-shaft moving system; the X-shaft moving system is arranged on the Y-shaft moving system, the X-shaft and the Y-shaft moving systems are cross arranged in a cross shape; the Y-shaft moving system is fixedly arranged on the frame. The ITO film laser etcher of the utility model has high efficiency and good linearity for the reticle of the ITO film.
Description
[technical field]
The utility model relates to the laser cutting technique field, relates in particular to a kind of ito thin film laser-induced thermal etching machine.
[background technology]
Ito thin film is an indium tin oxide transparent conductive semiconductor film, and this film is plated on the film or the glass substrate.Form by upper strata and lower floor's circuit after being coated with the base material groove of ito thin film, the X-axis that connects up separately and Y-axis, support as interlayer by minimum insulating point in the middle of the two-layer circuit, can accomplish that at present minimum insulating point is Φ 0.035mm, after assembling is fitted, change certain point voltage value and generation signal on its face, calculate via controller, control relative coordinate position specified point state or take signal, can realize being used on the products such as touch-screen, LCDs.
Continuous development along with touch-screen and LCDs industry, to improving constantly of ito thin film substrate performance demand, change has also appearred in the processing mode to ito thin film, in the prior art because process equipment topology layout problem, cause the working (machining) efficiency of ito thin film low, adopt traditional motor to carry out platform and move, can't guarantee the linearity of processing.
[utility model content]
The technical problems to be solved in the utility model provides the ito thin film laser-induced thermal etching machine of a kind of groove efficient height, good linearity.
The technical scheme that the utility model adopted is:
A kind of ito thin film laser-induced thermal etching machine, comprise frame, industrial computer, display system, laser generator, cutting head, suction tray, X-axis kinematic system, Y-axis kinematic system and Z axis motion system, described industrial computer, laser generator, display system and Z axis motion system all are installed on the frame, described cutting head is installed on the Z axis motion system, described suction tray is fixed on the X-axis kinematic system, be positioned at the top of Y-axis kinematic system, described X-axis kinematic system is installed on the Y-axis kinematic system, and intersect and to be crosswise, the Y-axis kinematic system is fixedly mounted on the frame.
Described a kind of ito thin film laser-induced thermal etching machine also comprises the first optics grid chi and first reader that are installed in X-axis kinematic system side, and the second optics grid chi and second reader that are installed in Y-axis kinematic system side.
Described a kind of ito thin film laser-induced thermal etching machine also comprises first linear electric motors that are installed in the X-axis kinematic system, and is installed in second linear electric motors in the Y-axis kinematic system.
The inside of described suction tray is cavity, and its card is provided with array a plurality of apertures that are communicated with cavity.
The side of described suction tray has a plurality of through holes, and wherein, at least one through hole communicates with described cavity as adsorption orifice, and connects vacuum plant or extractor fan; At least one through hole communicates with cavity as air inlet, and connects blowning installation.
Described as adsorption orifice through hole and be equipped with one as the through hole of air inlet and make air-breathing and the air inlet valving of action that staggers.
Described cutting head comprises makes laser be focused into the little luminous point of concentration of energy, to act on laser condensing lens group on the ito thin film, connect the air blowing parts of Compressed Gas and to connect suction system dust suction parts, described focus lamp group, air blowing parts and dust suction element coaxial are provided with.
Described a kind of ito thin film laser-induced thermal etching machine also comprises the blower fan filtering unit that is installed in the frame top, and the intersection of suction tray and cutting head is aimed in its air port.
Described laser generator is that wavelength is solid (YAG) laser generator of 1064nm, 532nm or 355nm.
Described a kind of ito thin film laser-induced thermal etching machine comprises also being installed in automatically-controlled door and protective device on the frame that it is positioned at suction tray the place ahead, is arranged side by side with described frame front apron.
The beneficial effects of the utility model are:
The utility model adopts linear electric machine and optics grid chi reading, thereby has guaranteed the graduating accuracy and the speed of ito thin film; X-axis kinematic system and Y-axis kinematic system adopt cross structure to install, and make workbench can move quickly into the precalculated position, raise the efficiency; Workbench adopts suction tray, ito thin film is adsorbed on the suction tray all the time in the groove process, also be provided with the air blowing float-up device on the suction tray, when groove finishes, close air-breathing blow simultaneously ito thin film advertised float, ito thin film is taken off from suction tray easily; Laser generator adopts solid (YAG) laser instrument, and used laser is almost only to the ito thin film effect, and effectively the protective substrate material does not influence the base material transparency; Automatically-controlled door is installed on the frame, and automatically-controlled door is closed in the time of in working order, thereby has guaranteed operator's safety; Based on such scheme, the utility model has improved ito thin film groove efficient, raising life-span, cost reduction, better, the viewing area increasing of linearity, does not use chemical reagent, compliance with environmental protection requirements.
[description of drawings]
The utility model will be further described in conjunction with the embodiments with reference to the accompanying drawings.
Fig. 1 is the structural representation of the utility model etching machine.
Fig. 2 is the side schematic view of the utility model etching machine.
Fig. 3 is the enlarged diagram of A part among Fig. 1.
[specific embodiment]
As shown in Figure 1 to Figure 3, laser-induced thermal etching machine of the present utility model comprises that lower margin supports adjustment bolt 1, industrial computer 2, keyboard and mouse drawing box 3, display system 4, frame 5, laser generator 6, blower fan filtering unit (FFU) 7, Z axis motion system 8, cutting head 9, suction tray 10, X-axis kinematic system 11, Y-axis kinematic system 12, dust cover 13, electrical control cabinet 14, linear electric machine 15, shockproof parallels 16, movable pulley 17, ruddiness inductance device 18, automatically-controlled door protective device 19, cylinder axis 20, castor 21;
Described industrial computer 2, laser generator 6, Z axis motion system 8, display system 4, blower fan filtering unit (FFU) 7, automatically-controlled door protective device 19 all are installed on the frame 5; described cutting head 9 is installed on the Z axis motion system 8; be positioned at the top of suction tray 10; described suction tray 10 is contained on the X-axis kinematic system 11 with Dingan County; be positioned at the top of Y-axis kinematic system 12; described X-axis kinematic system is installed on the Y-axis kinematic system, and intersects and to be crosswise, and the Y-axis kinematic system is fixedly mounted on the frame.The cross formula platform that suction tray 10, X-axis kinematic system 11 and Y-axis kinematic system 12 are combined into, this cross formula platform can be fixed together by connecting plate and frame.The intersection of suction tray and cutting head is aimed in the air port of blower fan filtering unit (FFU) 7, can be blown into clean dry air toward the ito thin film machined surface, effectively protects the ito thin film performance.
Laser-induced thermal etching machine of the present utility model also comprises the first optics grid chi and first reader that are installed in X-axis kinematic system 11 sides, and the second optics grid chi and second reader that are installed in Y-axis kinematic system 12 sides; Optics grid chi and reader all do not illustrate in the drawings.Described X-axis kinematic system 11 and Y-axis kinematic system 12 are formed cross table, X-axis and Y-axis kinematic system are used linear electric machine and optics grid chi, can realize positioning trip and more high accuracy figure operation faster, described optics grid chi is joined reader and is installed in X, Y-axis side, the convenient adjusting and better grease proofing preventing dust guarantees the precision of kinematic system.
In the utility model, the first linear electric motors (not shown) is installed also in X-axis kinematic system 11, second linear electric motors also is installed, i.e. linear electric machine among the figure 15 in the Y-axis kinematic system.
The utility model also comprises and is installed in automatically-controlled door and protective device 19 on the frame 5; it is positioned at suction tray 10 the place aheads; be arranged side by side with described frame 5 front aprons; it is equipped with movable pulley 17 can make the automatically-controlled door switch freely; adopt cylinder axis 20 to connect Compressed Gas; and, adopt ruddiness inductance device 18 to realize the switch safety of automatically-controlled doors by the gate control of magnetic valve realization automatic switch.
Adopt dust cover 13 that the linear electric machine 15 in X-axis kinematic system 11 and the Y-axis kinematic system 12 and optics grid chi and reader are sealed fully, effectively protection optics grid chi and the bright and clean normal use of linear electric machine, industrial computer 2 is equipped with motion control card, via the motion control of electrical control cabinet 14 interior each devices realization to linear electric machine 15.
The inside of described suction tray 10 is cavity, and its card is provided with array a plurality of apertures that are communicated with cavity.The side of suction tray 10 has a plurality of through holes, and wherein, at least one through hole communicates with described cavity as adsorption orifice, and connects vacuum plant or extractor fan; At least one through hole communicates with cavity as air inlet, and connects blowning installation.As the through hole of adsorption orifice and be equipped with one as the through hole of air inlet and make air-breathing and the air inlet valving of action that staggers; Be implemented in like this that ito thin film is adsorbed on the suction tray 10 all the time in the groove process, also be provided with the air blowing float-up device on the suction tray 10, when groove finishes air-breathing close to blow simultaneously ito thin film advertised float, ito thin film is taken off from suction tray 10 easily.
Described laser generator 6 is installed on the frame 5, uses solid (YAG) laser generator, can be that wavelength is 1064nm, 532nm or 355nm laser generator, and laser substantially only acts on ito thin film, can not influence baseplate material, and influences the sheet material light transmission; Described cutting head 9 is connected on the Z axis motion system 8, described cutting head comprises focus lamp group, air blowing parts and dust suction parts, described focus lamp group, air blowing parts and dust suction element coaxial are provided with, focus lamp group wherein makes laser be focused into the little luminous point of concentration of energy, to act on the ito thin film, conductive film layer is carved by demand graph line road; The air blowing parts that are installed on the cutting head 9 connect Compressed Gas, blow off groove rear film face in the groove process, and the dust suction parts on it connect suction system, the dust siphon away groove in the groove process after.
Wherein, keyboard and mouse drawing box 3 is installed on the frame 5, and castor 21 and lower margin support adjusts the lower bottom part that bolt 1 all is installed in frame, makes things convenient for the frame adjustment to move, and shockproof parallels 16 is positioned under the cross formula platform of 11 one-tenth of X-axis kinematic systems, effectively damping.
During material loading, workpiece places after button control becomes adsorbed state, is not shifted when being convenient to work piece cut; During blanking, the work top suction tray switches to the compressed gas blowback by vacuum suction and floats workpiece, and gets back to the material loading position, is convenient to the workpiece blanking.
In the utility model, the groove track can be linear fashion, at first top substrate layer or following laminar substrate are positioned on the suction tray 10, X-axis kinematic system 11 and 12 aggregate motions of Y-axis kinematic system, driving suction tray moves by the demand figure, laser is focused into little luminous point via laser generator 6 by cutting head 9, act on the ito thin film, ito thin film on the substrate is delineated into the conducting film of X-axis or Y-axis array arrangement, and on substrate, depict two corresponding contraposition target spots, so that fit with following laminar substrate contraposition assembling in the upper strata that groove goes out; The utility model groove track also can be realized the non-rectilinear mode, and according to the graphics track operation, X, the mobile simultaneously combination forming of Y direction are operated by demand.
The utility model has been simplified the technological process of ito thin film groove, has reduced production equipment, enhances productivity largely, and the rate that manufactures a finished product has simultaneously also improved, and product quality has also improved.
Claims (10)
1. ito thin film laser-induced thermal etching machine, comprise frame, industrial computer, display system, laser generator, cutting head, suction tray, X-axis kinematic system, Y-axis kinematic system and Z axis motion system, described industrial computer, laser generator, display system and Z axis motion system all are installed on the frame, described cutting head is installed on the Z axis motion system, it is characterized in that:
Described suction tray is fixed on the X-axis kinematic system, is positioned at the top of Y-axis kinematic system, and described X-axis kinematic system is installed on the Y-axis kinematic system, and intersects and to be crosswise, and the Y-axis kinematic system is fixedly mounted on the frame.
2. a kind of ito thin film laser-induced thermal etching machine according to claim 1, it is characterized in that: also comprise the first optics grid chi and first reader that are installed in X-axis kinematic system side, and the second optics grid chi and second reader that are installed in Y-axis kinematic system side.
3. a kind of ito thin film laser-induced thermal etching machine according to claim 1 is characterized in that: also comprise first linear electric motors that are installed in the X-axis kinematic system, and be installed in second linear electric motors in the Y-axis kinematic system.
4. a kind of ito thin film laser-induced thermal etching machine according to claim 1, it is characterized in that: the inside of described suction tray is cavity, its card is provided with array a plurality of apertures that are communicated with cavity.
5. a kind of ito thin film laser-induced thermal etching machine according to claim 4, it is characterized in that: the side of described suction tray has a plurality of through holes, and wherein, at least one through hole communicates with described cavity as adsorption orifice, and connects vacuum plant or extractor fan; At least one through hole communicates with cavity as air inlet, and connects blowning installation.
6. a kind of ito thin film laser-induced thermal etching machine according to claim 5 is characterized in that: described as adsorption orifice through hole and be equipped with one as the through hole of air inlet and make air-breathing and the air inlet valving of action that staggers.
7. a kind of ito thin film laser-induced thermal etching machine according to claim 1, it is characterized in that: described cutting head comprises makes laser be focused into the little luminous point of concentration of energy, to act on laser condensing lens group on the ito thin film, connect the air blowing parts of Compressed Gas and to connect suction system dust suction parts, described focus lamp group, air blowing parts and dust suction element coaxial are provided with.
8, a kind of ito thin film laser-induced thermal etching machine according to claim 1 is characterized in that: also comprise the blower fan filtering unit that is installed in the frame top, the intersection of suction tray and cutting head is aimed in its air port.
9, a kind of ito thin film laser-induced thermal etching machine according to claim 1 is characterized in that: described laser generator is that wavelength is solid (YAG) laser generator of 1064nm, 532nm or 355nm.
10, a kind of ito thin film laser-induced thermal etching machine according to claim 1, it is characterized in that: also comprise being installed in automatically-controlled door and protective device on the frame, it is positioned at suction tray the place ahead, is arranged side by side with described frame front apron.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN 200720171149 CN201143596Y (en) | 2007-11-30 | 2007-11-30 | ITO thin film laser etching machine |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200720171149 CN201143596Y (en) | 2007-11-30 | 2007-11-30 | ITO thin film laser etching machine |
Publications (1)
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CN201143596Y true CN201143596Y (en) | 2008-11-05 |
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CN 200720171149 Expired - Lifetime CN201143596Y (en) | 2007-11-30 | 2007-11-30 | ITO thin film laser etching machine |
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
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CN101417370B (en) * | 2008-11-19 | 2011-05-25 | 深圳市大族激光科技股份有限公司 | Solar energy film battery laser engraving device and method |
CN101450419B (en) * | 2007-11-30 | 2011-09-28 | 深圳市大族激光科技股份有限公司 | ITO film laser engraving device and method |
CN103212867A (en) * | 2012-01-19 | 2013-07-24 | 昆山思拓机器有限公司 | High-precision flattening and shock absorbing mechanism for thin steel sheet |
CN104925287A (en) * | 2015-06-18 | 2015-09-23 | 浙江海洋学院 | Sealing machine for disk-loaded food |
CN106541214A (en) * | 2016-09-30 | 2017-03-29 | 广东正业科技股份有限公司 | A kind of laser cutting device and its cut-sytle pollination method and system |
CN108213742A (en) * | 2018-03-26 | 2018-06-29 | 苏州市宏石激光技术有限公司 | A kind of coiled strip hi-precision cutting equipment |
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2007
- 2007-11-30 CN CN 200720171149 patent/CN201143596Y/en not_active Expired - Lifetime
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101450419B (en) * | 2007-11-30 | 2011-09-28 | 深圳市大族激光科技股份有限公司 | ITO film laser engraving device and method |
CN101417370B (en) * | 2008-11-19 | 2011-05-25 | 深圳市大族激光科技股份有限公司 | Solar energy film battery laser engraving device and method |
CN103212867A (en) * | 2012-01-19 | 2013-07-24 | 昆山思拓机器有限公司 | High-precision flattening and shock absorbing mechanism for thin steel sheet |
CN103212867B (en) * | 2012-01-19 | 2016-08-31 | 昆山思拓机器有限公司 | One stalloy Zhang Ping shock absorbing mechanism in high precision |
CN104925287A (en) * | 2015-06-18 | 2015-09-23 | 浙江海洋学院 | Sealing machine for disk-loaded food |
CN106541214A (en) * | 2016-09-30 | 2017-03-29 | 广东正业科技股份有限公司 | A kind of laser cutting device and its cut-sytle pollination method and system |
CN108213742A (en) * | 2018-03-26 | 2018-06-29 | 苏州市宏石激光技术有限公司 | A kind of coiled strip hi-precision cutting equipment |
CN108213742B (en) * | 2018-03-26 | 2023-12-12 | 苏州市宏石激光技术有限公司 | Coil stock high accuracy cutting equipment |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Shenzhen Han's Photovoltaic Technology Co.,Ltd. Assignor: Dazu Laser Sci. & Tech. Co., Ltd., Shenzhen Contract record no.: 2011440020004 Denomination of utility model: ITO thin film laser etching machine Granted publication date: 20081105 License type: Exclusive License Record date: 20110114 |
|
CX01 | Expiry of patent term |
Granted publication date: 20081105 |