CN108093570A - A kind of processing technology using laser-induced thermal etching removal circuit board local securing layer - Google Patents
A kind of processing technology using laser-induced thermal etching removal circuit board local securing layer Download PDFInfo
- Publication number
- CN108093570A CN108093570A CN201711380917.9A CN201711380917A CN108093570A CN 108093570 A CN108093570 A CN 108093570A CN 201711380917 A CN201711380917 A CN 201711380917A CN 108093570 A CN108093570 A CN 108093570A
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- China
- Prior art keywords
- circuit board
- laser
- processing technology
- induced thermal
- thermal etching
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/288—Removal of non-metallic coatings, e.g. for repairing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The present invention provides a kind of processing technology using laser-induced thermal etching removal circuit board local securing layer; comprise the following steps, preparation FPC circuit boards, PCB circuit board, ceramic integrated circuit plate, polymeric liquid crystal copolymer circuit board or polytetrafluoroethylene (PTFE) circuit board to be processed；The laser emitted laser carries out Shape correction, forms flat-top light and Gauss light；Processing is etched circuit board using laser, remove the PI protective films on corresponding circuits plate, Soldermask ink layers and glue line, this technique is very beneficial for subsequent circuit densification processing, and the direct laser windowings of laser, the flatness on PI surfaces for+/ (0.25 micron 20 microns), surfacing, the value of thrust of weldability and element can be significantly improved, reduce the use of Underfill, so as to improve the thermal diffusivity of device, the excessive glue that pressing when traditional FPC makes generates is not had, bonding area is caused to become smaller, the problem of less reliable, the effective short circuit phenomenon prevented between thin space.
Description
[technical field]
It is close to be beneficial to follow-up circuit the present invention relates to laser-induced thermal etching circuit board protective layer processing technique field more particularly to one kind
Collectionization, precision are high, positional precision can control and remove adding for circuit board local securing layer using laser-induced thermal etching in below 50um
Work technique.
[background technology]
In FPC/PCB and the IC package integrated circuits such as PCB support plates (IC Substrate), metallic copper substrate circuit,
Metal aluminum substrate circuit, the circuit substrate of polymeric liquid crystal copolymer (Liquid Crystal Polymer) base material, Yi Jihan
There is the removal minor insulation ink of polytetrafluoroethylene (PTFE) (Poly tetra fluoroethylene, be abbreviated as PTFE) circuit substrate
With protective film glue line, expose in welding copper packing (SMT Pad/BGA Pad) technical process, since the mode of punching is different,
More different effect can be brought.
Such as mold die-cut openings (FPC coverlayer), since opening area must be bigger than Pad, not effective package
Pad, the element pulling force ability to bear after welding decline, and the diameter of die-cut openings may only accomplish below 0.8MM, and product holds
Easily there is excessive glue phenomenon, reducing bonding area prevents pad design from being miniaturized, and the glue height of spilling is inconsistent, and planarization is not
Height causes the strength reduction of welding, and precision controlling during fitting is poor.Since Pad is rare, spacing is excessive, lacks the protection of top layer
The base material of bottom is easy to cause out-of-flatness, influences the reliability of welding, and FPC is easily damaged, large area after original paper attachment
Opening, the element value of thrust after PAD welding is too small, easily Pad is caused to come off.
For PCB solder windowings, it is necessary to which whole windowing, does not have welding resistance dike, the risk pole of product short circuit between Pad and Pad
Height, and in the big windowing-process of PCB Solder, Han Dian Copper Bo are easier Bi More to tear apart Come by external force, because weld pad is smaller, institute
Also relatively small with the power of the attached to PCB of weld pad, the design of BGA weld pads is it is generally necessary to which adjoint make Underfill Come add Strong
The ability that (drop test) Time BGA bear external force is fallen, increases cost, is unfavorable for product heat dissipation, and the printing height of ink
Error is +/- 15um, and the out-of-flatness of surface pole influences the weldability and value of thrust of product.Also such as small windowings of PCB Solder
Turn on window, A：Solderability can be affected because [Solder Mask] (green paint) can be influenced be subject to reflow oven high temperature it is swollen
It is swollen, become smaller so as to cause the tin area of eating of welding, and flatness has an impact, B:Ding Wei Bi Copper paper tinsels Come and obtain in the position of the printing of green paint
Difference, also Jiu Shi Green lacquer print brushes departure Bi Copper paper tinsels Come it is much older, it is possible to influence whether the size and relative position of weld pad,
C:Because the area of copper foil increases, opposite also can just be become smaller with the region of cabling, and cabling is more difficult from.
The above problem restricts the better progress of processing clicking technique always, especially in removal localised protection film, oil
In the processing procedure of layer of ink, it is more difficult to get a desired effect, based on this, those skilled in the art carried out it is substantial amounts of research and development and
Experiment, and achieve preferable achievement.
[content of the invention]
To overcome the problems of prior art, the present invention provides a kind of beneficial to follow-up circuit densification, precision height, position
Processing technology in below 50um using laser-induced thermal etching removal circuit board local securing layer can be controlled by putting precision.
The present invention solve technical problem scheme be to provide it is a kind of using laser-induced thermal etching removal circuit board local securing layer
Processing technology comprises the following steps,
S1：Preparation FPC circuit boards to be processed, PCB circuit board, ceramic integrated circuit plate, polymeric liquid crystal copolymer electricity
Road plate or polytetrafluoroethylene (PTFE) circuit board；
S2：To the FPC circuit boards of step S1 preparations, PCB circuit board, ceramic integrated circuit plate, polymeric liquid crystal copolymer
Circuit board and polytetrafluoroethylene (PTFE) circuit board carry out cleaning treatment, and prepare to be etched processing picosecond, nanosecond, femtosecond
Or excimer laser；
S3：The laser emitted the laser in step S2 carries out Shape correction, forms flat-top light and Gauss light；
S4：Using the laser after the completion of being handled in step S3 to FPC circuit boards, PCB circuit board, ceramic integrated circuit
Plate, polymeric liquid crystal copolymer circuit board or polytetrafluoroethylene (PTFE) circuit board are etched processing, remove the PI on corresponding circuits plate
Protective film, Soldermask ink layers and glue line expose metal Pad；And resistance is formed between metal Pad and metal Pad
Dike is welded, retains welding resistance dike in some situations, welding resistance dike can not be retained in some cases)；
S5：FPC circuit boards, PCB circuit board, ceramic integrated circuit plate, the liquid crystal polymer machined to step S4 gathers
It closes object circuit board or polytetrafluoroethylene (PTFE) circuit board carries out cleaning treatment again.
Preferably, the laser that the step S2 to step S4 is used includes the green light that wave-length coverage is 480nm-580nm
UV purple lights light source laser that light source laser, wave-length coverage are 280nm-410nm, wave-length coverage are 750nm-2500nm's
CO2 light source lasers and the dark purple radiant lasers of UV that wave-length coverage is 218nm--299nm.
Preferably, the welding resistance dike layer in the step S4 be PI protective films, pet layer, PPS layers, PEN layers, on PCB/FPC
Soldermask ink material layers or ONELAY cover layers.
Preferably, the bonding pad opening size arrived in the step S4 used in process is more than 0.02mm.
Preferably, the Soldermask ink layers in the step S4 are Soldermask of the thickness range at 1-50 microns
Ink layer；And the species of ink includes common coating heat curing type, liquid photosensitive and LDI exposure ink.
Preferably, the PI protective films in the step S4 are PI protective film of the thickness range at 1-200 microns.
Preferably, the ONELAY cover layers are Kapton, including PI protective films and release paper；And
Between the thickness of ONELAY cover layers is 1um-18 microns.
Preferably, thickness range PEN layers described is 1-200 microns.
Preferably, thickness range PPS layers described is 1-200 microns.
Preferably, the thickness range of the glue line in the step S4 is 2-200 microns.
Compared with prior art, a kind of processing technology using laser-induced thermal etching removal circuit board local securing layer of the present invention is led to
The laser beam using laser transmitting is crossed directly to FPC circuit boards, PCB circuit board, ceramic integrated circuit plate, liquid crystal polymer
Polymer circuit plate or polytetrafluoroethylene (PTFE) circuit board are etched working process, and in actual mechanical process, pad can minimize,
Accomplish 0.02mm, and do not limit largest pads opening size, be very beneficial for subsequent circuit densification processing, and laser is direct
Laser opens a window, and surfacing can significantly improve the value of thrust of weldability and element, reduce the use of Underfill, so as to
The thermal diffusivity of device is improved, the excessive glue that pressing when traditional FPC makes generates is not had, bonding area is caused to become smaller, reliability
The problem of variation, effectively prevents the short circuit phenomenon between thin space.
[description of the drawings]
Fig. 1 is that a kind of flow of processing technology using laser-induced thermal etching removal circuit board local securing layer of the present invention is illustrated
Figure.
[specific embodiment]
To make the purpose of the present invention, technical solution and advantage are more clearly understood, with reference to the accompanying drawings and embodiments, to this
Invention is further elaborated.It should be appreciated that specific embodiment described herein is used only for explaining the present invention, not
For limiting the invention.
Referring to Fig. 1, a kind of processing technology 1 using laser-induced thermal etching removal circuit board local securing layer of the present invention, including
Following steps,
S1：Preparation FPC circuit boards to be processed, PCB circuit board, ceramic integrated circuit plate, polymeric liquid crystal copolymer electricity
Road plate or polytetrafluoroethylene (PTFE) circuit board；
S2：To the FPC circuit boards of step S1 preparations, PCB circuit board, ceramic integrated circuit plate, polymeric liquid crystal copolymer
Circuit board and polytetrafluoroethylene (PTFE) circuit board carry out cleaning treatment, and prepare to be etched processing picosecond, nanosecond, femtosecond
Or excimer laser；
S3：The laser emitted the laser in step S2 carries out Shape correction, forms flat-top light and Gauss light；
S4：Using the laser after the completion of being handled in step S3 to FPC circuit boards, PCB circuit board, ceramic integrated circuit
Plate, polymeric liquid crystal copolymer circuit board or polytetrafluoroethylene (PTFE) circuit board are etched processing, remove the PI on corresponding circuits plate
Protective film, Soldermask ink layers and glue line expose metal Pad, can be between superfine metal Pad and metal Pad
Form welding resistance dike；Be conducive to subsequent device to be welded on Pad.
S5：FPC circuit boards, PCB circuit board, ceramic integrated circuit plate, the liquid crystal polymer machined to step S4 gathers
It closes object circuit board or polytetrafluoroethylene (PTFE) circuit board carries out cleaning treatment again.
By using laser transmitting laser beam directly to FPC circuit boards, PCB circuit board, ceramic integrated circuit plate,
Polymeric liquid crystal copolymer circuit board or polytetrafluoroethylene (PTFE) circuit board are etched working process, in actual mechanical process, pad
It can minimize, accomplish below 0.1mm, be very beneficial for subsequent circuit densification processing, and the direct laser windowings of laser,
Surfacing can significantly improve the value of thrust of weldability and element, reduce the use of Underfill, so as to improve device
Not the problem of thermal diffusivity does not have the excessive glue that pressing when traditional FPC makes generates, bonding area is caused to become smaller, less reliable,
The effective short circuit phenomenon prevented between thin space.
Preferably, the laser that the step S2 to step S4 is used includes the green light that wave-length coverage is 480nm-580nm
UV purple lights light source laser that light source laser, wave-length coverage are 280nm-410nm, wave-length coverage are 750nm-2500nm's
CO2 light source lasers and the dark purple radiant lasers of UV that wave-length coverage is 218nm--299nm.
Preferably, the welding resistance dike layer in the step S4 be PI protective films, pet layer, PPS layers, PEN layers, on PCB/FPC
Soldermask ink material layers or ONELAY cover layers.
Preferably, used in the step S4 process to bonding pad opening size can reach minimum 0.02mm,
And do not limit largest pads opening size.Significantly improving traditional handicraft needs the situation of larger pad.
Preferably, the Soldermask ink layers in the step S4 are Soldermask of the thickness range at 1-50 microns
Ink layer；And the species of ink includes common coating heat curing type, liquid photosensitive and LDI exposure ink.
Preferably, the PI protective films in the step S4 are PI protective film of the thickness range at 1-200 microns.
Preferably, the ONELAY cover layers are Kapton, including PI protective films and release paper；And
Between the thickness of ONELAY cover layers is 1um-18 microns.
Preferably, thickness range PEN layers described is 1-200 microns.
Preferably, thickness range PPS layers described is 1-200 microns.
Preferably, the thickness range of the glue line in the step S4 is 2-200 microns.
Compared with prior art, a kind of processing technology 1 using laser-induced thermal etching removal circuit board local securing layer of the present invention
By using the laser beam of laser transmitting directly to FPC circuit boards, PCB circuit board, ceramic integrated circuit plate, liquid crystal high score
Sub- polymer circuit plate or polytetrafluoroethylene (PTFE) circuit board are etched working process, and in actual mechanical process, pad can be small-sized
Change, accomplish 0.02mm, and do not limit largest pads opening size, be very beneficial for subsequent circuit densification processing, and laser
Direct laser windowings, surfacing can significantly improve the value of thrust of weldability and element, reduce the use of Underfill,
So as to improve the thermal diffusivity of device, the excessive glue that pressing when traditional FPC makes generates is not had, bonding area is caused to become smaller, it can
The problem of being deteriorated by property, effectively prevents the short circuit phenomenon between thin space.
The embodiments of the present invention described above are not intended to limit the scope of the present invention.It is any in the present invention
Spirit and principle within the modifications, equivalent substitutions and improvements made etc., should be included in the claim protection model of the present invention
Within enclosing.
Claims (10)
1. a kind of processing technology using laser-induced thermal etching removal circuit board local securing layer, it is characterised in that：Comprise the following steps,
S1：Preparation FPC circuit boards to be processed, PCB circuit board, ceramic integrated circuit plate, polymeric liquid crystal copolymer circuit board
Or polytetrafluoroethylene (PTFE) circuit board；
S2：To the FPC circuit boards of step S1 preparations, PCB circuit board, ceramic integrated circuit plate, polymeric liquid crystal copolymer circuit
Plate and polytetrafluoroethylene (PTFE) circuit board carry out cleaning treatment, and prepare to be etched processing picosecond, nanosecond, femtosecond or standard
Molecular laser；
S3：The laser emitted the laser in step S2 carries out Shape correction, forms flat-top light and Gauss light；
S4：Using the laser after the completion of being handled in step S3 to FPC circuit boards, PCB circuit board, ceramic integrated circuit plate, liquid
Polycrystalline macromolecule polymer circuit plate or polytetrafluoroethylene (PTFE) circuit board are etched processing, remove the PI protections on corresponding circuits plate
Film, Soldermask ink layers and glue line expose metal Pad；And welding resistance dike is formed between metal Pad and metal Pad；
S5：FPC circuit boards, PCB circuit board, ceramic integrated circuit plate, the polymeric liquid crystal copolymer machined to step S4
Circuit board or polytetrafluoroethylene (PTFE) circuit board carry out cleaning treatment again.
2. a kind of processing technology using laser-induced thermal etching removal circuit board local securing layer as described in claim 1, feature
It is：The laser that the step S2 is used into step S4 includes the green-light source laser that wave-length coverage is 480nm-580nm
The CO2 light sources that UV purple lights light source laser that device, wave-length coverage are 280nm-410nm, wave-length coverage are 750nm-2500nm swash
Light device and the dark purple radiant lasers of UV that wave-length coverage is 218nm--299nm.
3. a kind of processing technology using laser-induced thermal etching removal circuit board local securing layer as described in claim 1, feature
It is：Welding resistance dike layer in the step S4 is PI protective films, pet layer, PPS layers, PEN layers, the Soldermask on PCB/FPC
Ink material layers or ONELAY cover layers.
4. a kind of processing technology using laser-induced thermal etching removal circuit board local securing layer as described in claim 1, feature
It is：The bonding pad opening size arrived used in the step S4 process is more than 0.02mm.
5. a kind of processing technology using laser-induced thermal etching removal circuit board local securing layer as described in claim 1, feature
It is：Soldermask ink layers in the step S4 are Soldermask ink layer of the thickness range at 1-50 microns；And
The species of ink includes common coating heat curing type, liquid photosensitive and LDI exposure ink.
6. a kind of processing technology using laser-induced thermal etching removal circuit board local securing layer as described in claim 1, feature
It is：PI protective films in the step S4 are PI protective film of the thickness range at 1-200 microns.
7. a kind of processing technology using laser-induced thermal etching removal circuit board local securing layer as claimed in claim 3, feature
It is：The ONELAY cover layers are Kapton, including PI protective films and release paper；And ONELAY cover layers
Thickness between 1um-18 microns.
8. a kind of processing technology using laser-induced thermal etching removal circuit board local securing layer as claimed in claim 3, feature
It is：Thickness range PEN layers described is 1-200 microns.
9. a kind of processing technology using laser-induced thermal etching removal circuit board local securing layer as claimed in claim 3, feature
It is：Thickness range PPS layers described is 1-200 microns.
10. a kind of processing technology using laser-induced thermal etching removal circuit board local securing layer as described in claim 1 or 5,
It is characterized in that：The thickness range of glue line in the step S4 is 2-200 microns.
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| CN201711380917.9A CN108093570A (en) | 2017-12-20 | 2017-12-20 | A kind of processing technology using laser-induced thermal etching removal circuit board local securing layer |
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| CN201711380917.9A CN108093570A (en) | 2017-12-20 | 2017-12-20 | A kind of processing technology using laser-induced thermal etching removal circuit board local securing layer |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109526147A (en) * | 2018-12-11 | 2019-03-26 | 江门崇达电路技术有限公司 | A kind of method of taping of PCB production board |
| CN109548319A (en) * | 2018-12-28 | 2019-03-29 | 广州兴森快捷电路科技有限公司 | Fingerprint recognition support plate and the production method for improving fingerprint recognition support plate flatness |
| CN111065210A (en) * | 2019-12-25 | 2020-04-24 | 上海嘉捷通电路科技股份有限公司 | Method for replacing manual PCB (printed circuit board) process lead wire picking |
| CN112467059A (en) * | 2020-11-12 | 2021-03-09 | 安徽熙泰智能科技有限公司 | Method for opening Pad of Mirco OLED, Mirco OLED and manufacturing method of Mirco OLED |
| CN112804828A (en) * | 2020-12-30 | 2021-05-14 | 武汉先河激光技术有限公司 | System for processing multichannel FPC flexible circuit board |
| CN112846486A (en) * | 2020-12-30 | 2021-05-28 | 武汉先河激光技术有限公司 | Processing method and system of FPC (Flexible printed Circuit) |
| CN113573503A (en) * | 2021-07-28 | 2021-10-29 | 深圳市安元达电子有限公司 | Novel FPC precision bonding pad manufacturing method |
| CN113727526A (en) * | 2021-08-31 | 2021-11-30 | 深圳市大族数控科技股份有限公司 | Windowing method for protective layer of circuit board |
| CN114071885A (en) * | 2021-12-02 | 2022-02-18 | 广州源康精密电子股份有限公司 | Processing method of flexible circuit board for new energy automobile battery |
| CN114143976A (en) * | 2021-11-26 | 2022-03-04 | 南京农业大学 | Wearable flexible circuit based on laser induction and preparation method thereof |
| CN114698252A (en) * | 2022-03-18 | 2022-07-01 | 信丰迅捷兴电路科技有限公司 | Flexible circuit board pad windowing manufacturing process utilizing flexible ink |
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| CN107466163A (en) * | 2017-08-18 | 2017-12-12 | 深圳光韵达激光应用技术有限公司 | A kind of high-reliability new pattern laser etch process |
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Patent Citations (1)
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| CN107466163A (en) * | 2017-08-18 | 2017-12-12 | 深圳光韵达激光应用技术有限公司 | A kind of high-reliability new pattern laser etch process |
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| CN109526147A (en) * | 2018-12-11 | 2019-03-26 | 江门崇达电路技术有限公司 | A kind of method of taping of PCB production board |
| CN109548319B (en) * | 2018-12-28 | 2021-06-25 | 广州兴森快捷电路科技有限公司 | Fingerprint identification carrier plate and manufacturing method for improving flatness of fingerprint identification carrier plate |
| CN109548319A (en) * | 2018-12-28 | 2019-03-29 | 广州兴森快捷电路科技有限公司 | Fingerprint recognition support plate and the production method for improving fingerprint recognition support plate flatness |
| CN111065210A (en) * | 2019-12-25 | 2020-04-24 | 上海嘉捷通电路科技股份有限公司 | Method for replacing manual PCB (printed circuit board) process lead wire picking |
| CN112467059A (en) * | 2020-11-12 | 2021-03-09 | 安徽熙泰智能科技有限公司 | Method for opening Pad of Mirco OLED, Mirco OLED and manufacturing method of Mirco OLED |
| CN112846486A (en) * | 2020-12-30 | 2021-05-28 | 武汉先河激光技术有限公司 | Processing method and system of FPC (Flexible printed Circuit) |
| CN112804828A (en) * | 2020-12-30 | 2021-05-14 | 武汉先河激光技术有限公司 | System for processing multichannel FPC flexible circuit board |
| CN113573503A (en) * | 2021-07-28 | 2021-10-29 | 深圳市安元达电子有限公司 | Novel FPC precision bonding pad manufacturing method |
| CN113727526A (en) * | 2021-08-31 | 2021-11-30 | 深圳市大族数控科技股份有限公司 | Windowing method for protective layer of circuit board |
| CN114143976A (en) * | 2021-11-26 | 2022-03-04 | 南京农业大学 | Wearable flexible circuit based on laser induction and preparation method thereof |
| CN114143976B (en) * | 2021-11-26 | 2024-03-22 | 南京农业大学 | Wearable flexible circuit based on laser induction and preparation method thereof |
| CN114071885A (en) * | 2021-12-02 | 2022-02-18 | 广州源康精密电子股份有限公司 | Processing method of flexible circuit board for new energy automobile battery |
| CN114698252A (en) * | 2022-03-18 | 2022-07-01 | 信丰迅捷兴电路科技有限公司 | Flexible circuit board pad windowing manufacturing process utilizing flexible ink |
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Application publication date: 20180529 |
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