CN111065210A - Method for replacing manual PCB (printed circuit board) process lead wire picking - Google Patents
Method for replacing manual PCB (printed circuit board) process lead wire picking Download PDFInfo
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- CN111065210A CN111065210A CN201911352233.7A CN201911352233A CN111065210A CN 111065210 A CN111065210 A CN 111065210A CN 201911352233 A CN201911352233 A CN 201911352233A CN 111065210 A CN111065210 A CN 111065210A
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- wire
- protective film
- pcb
- picking
- lead
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
Abstract
The invention discloses a method for replacing manual picking of a PCB process lead, belonging to the technical field of PCB process leads, and comprising the following steps: the method comprises the following steps: processing a process wire during circuit engineering manufacturing; step two: after the circuit is etched, a special protective film is pasted on the process lead, and redundant parts are removed by laser; step three: after gold electroplating, removing the special protective film by a special method; step four: the process wire is etched away by an etching method to obtain an effective pattern. The method is simple in process operation method, can be automatically operated by using the existing machine, simultaneously saves the step of manually removing the process lead, saves a large amount of time, removes the process lead by using an etching method, avoids the circuit from being damaged and scrapped due to manual operation, and saves the cost.
Description
Technical Field
The invention relates to the technical field of PCB (printed circuit board) process leads, in particular to a method for replacing manual PCB process leads.
Background
With the rapid development of military industry in China, the requirement on military printed boards is higher and higher, and the gold plating thickness of printed boards bonded by gold wires is required to be more than 2.5 micrometers. This is not satisfactory for use with conventional processes. Therefore, the gold plating process needs to process the process wire, and the process wire needs to be manually removed after the gold plating is finished. When the process lead is removed, the printed board is easily scrapped due to scratch of the lines. The cost is wasted, and therefore, it is necessary to develop a method for replacing manual PCB process wire picking.
Disclosure of Invention
This section is for the purpose of summarizing some aspects of embodiments of the invention and to briefly introduce some preferred embodiments. In this section, as well as in the abstract and the title of the invention of this application, simplifications or omissions may be made to avoid obscuring the purpose of the section, the abstract and the title, and such simplifications or omissions are not intended to limit the scope of the invention.
The present invention has been made in view of the above and/or other problems occurring in the prior art methods of replacing manual picking of PCB process leads.
Therefore, the invention aims to provide a method for replacing manual selection of a PCB process lead, the process operation method is simple, the existing machine can be used for automatic operation, the step of manually removing the process lead is omitted, a large amount of time is saved, the process lead is removed by using an etching method, the circuit damage and the scrapping caused by manual operation are avoided, and the cost is saved.
To solve the above technical problem, according to an aspect of the present invention, the present invention provides the following technical solutions:
a method for replacing manual picking of PCB process leads comprises the following steps:
the method comprises the following steps: processing a process wire during circuit engineering manufacturing;
step two: after the circuit is etched, a special protective film is pasted on the process lead, and redundant parts are removed by laser;
step three: after gold electroplating, removing the special protective film by a special method;
step four: the process wire is etched away by an etching method to obtain an effective pattern.
As a preferred scheme of the method for replacing the manual PCB technological lead picking, which is disclosed by the invention, the method comprises the following steps: the gold plating process wire is manufactured in advance during the manufacturing of the engineering data, and the process wire is reserved after the circuit is etched.
As a preferred scheme of the method for replacing the manual PCB technological lead picking, which is disclosed by the invention, the method comprises the following steps: and (3) attaching a special protective film to the process wire, and removing the protective film except the process wire by using laser.
As a preferred scheme of the method for replacing the manual PCB technological lead picking, which is disclosed by the invention, the method comprises the following steps: when electroplating gold, the process wire is protected from being plated with gold by the protective film on the process wire.
As a preferred scheme of the method for replacing the manual PCB technological lead picking, which is disclosed by the invention, the method comprises the following steps: after the gold plating is finished, the protective film on the process conducting wire is removed by using a special process, and then the process conducting wire is etched by using an etching method, so that an effective graph is obtained.
Compared with the prior art: the method for picking the PCB process lead by hand is simple in process operation method, can be automatically operated by using the existing machine, simultaneously saves the step of manually removing the process lead, saves a large amount of time, and then removes the process lead by using an etching method, thereby avoiding the circuit from being damaged and scrapped due to manual operation and saving the cost.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the present invention will be described in detail below with reference to the accompanying drawings and detailed embodiments, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without inventive exercise. Wherein:
FIG. 1 is a schematic view of a process line after etching of a circuit according to the present invention;
FIG. 2 is a schematic diagram of a special protective film;
FIG. 3 is a schematic diagram of a laser-removed redundant protective film;
FIG. 4 is a schematic diagram of the process after removing the special protective film and etching away the process wires.
In the figure: 1 circuit needing gold plating, 2 process wires, 3 large copper surface in the board and 4 special protective film.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, but the present invention may be practiced in other ways than those specifically described herein, and it will be apparent to those of ordinary skill in the art that the present invention may be practiced without departing from the spirit and scope of the present invention, and therefore the present invention is not limited to the specific embodiments disclosed below.
Next, the present invention will be described in detail with reference to the drawings, wherein for convenience of illustration, the cross-sectional view of the device structure is not enlarged partially according to the general scale, and the drawings are only examples, which should not limit the scope of the present invention. In addition, the three-dimensional dimensions of length, width and depth should be included in the actual fabrication.
In order to make the objects, technical solutions and advantages of the present invention more apparent, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
The invention provides a method for replacing manual picking of a PCB process lead, which comprises the following steps:
the method comprises the following steps: processing a process wire during circuit engineering manufacturing;
step two: after the circuit is etched, a special protective film is pasted on the process lead, and redundant parts are removed by laser;
step three: after gold electroplating, removing a special protective film by a special method;
step four: the process wire is etched away by an etching method to obtain an effective pattern.
Wherein, the gold plating process wire is made in advance when the engineering data is made, and the process wire is reserved after the circuit etching.
Wherein, use special protection film to paste in technology wire department, adopt laser to get rid of the protection film beyond the technology wire.
And when the gold is electroplated, the process conducting wire is protected from being plated with gold by utilizing the protective film on the process conducting wire.
After the gold plating is finished, a protective film on the process conducting wire is removed by using a special process, and then the process conducting wire is etched by using an etching method, so that an effective graph is obtained.
The method for picking the PCB process lead by hand is simple in process operation method, can be automatically operated by using the existing machine, simultaneously saves the step of manually removing the process lead, saves a large amount of time, and then removes the process lead by using an etching method, thereby avoiding the line damage and the scrapping caused by manual operation, saving the cost and having good economic benefit.
While the invention has been described above with reference to an embodiment, various modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention. In particular, the various features of the disclosed embodiments of the invention may be used in any combination, provided that no structural conflict exists, and the combinations are not exhaustively described in this specification merely for the sake of brevity and resource conservation. Therefore, it is intended that the invention not be limited to the particular embodiments disclosed, but that the invention will include all embodiments falling within the scope of the appended claims.
Claims (5)
1. A method for replacing manual PCB process lead picking is characterized in that: the method for picking the PCB process lead wire instead of manual work comprises the following steps:
the method comprises the following steps: processing a process wire during circuit engineering manufacturing;
step two: after the circuit is etched, a special protective film is pasted on the process lead, and redundant parts are removed by laser;
step three: after gold electroplating, removing the special protective film by a special method;
step four: the process wire is etched away by an etching method to obtain an effective pattern.
2. The method for picking up the PCB process lead instead of the manual work according to claim 1, wherein: the gold plating process wire is manufactured in advance during the manufacturing of the engineering data, and the process wire is reserved after the circuit is etched.
3. The method for picking up the PCB process lead instead of the manual work according to claim 1, wherein: and (3) attaching a special protective film to the process wire, and removing the protective film except the process wire by using laser.
4. The method for picking up the PCB process lead instead of the manual work according to claim 1, wherein: when electroplating gold, the process wire is protected from being plated with gold by the protective film on the process wire.
5. The method for picking up the PCB process lead instead of the manual work according to claim 1, wherein: after the gold plating is finished, the protective film on the process conducting wire is removed by using a special process, and then the process conducting wire is etched by using an etching method, so that an effective graph is obtained.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911352233.7A CN111065210A (en) | 2019-12-25 | 2019-12-25 | Method for replacing manual PCB (printed circuit board) process lead wire picking |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911352233.7A CN111065210A (en) | 2019-12-25 | 2019-12-25 | Method for replacing manual PCB (printed circuit board) process lead wire picking |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111065210A true CN111065210A (en) | 2020-04-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911352233.7A Pending CN111065210A (en) | 2019-12-25 | 2019-12-25 | Method for replacing manual PCB (printed circuit board) process lead wire picking |
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Citations (16)
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| CN107708321A (en) * | 2017-09-20 | 2018-02-16 | 东莞康源电子有限公司 | A kind of minimizing technology of PCB electroplate lead wires |
| CN108093570A (en) * | 2017-12-20 | 2018-05-29 | 深圳光韵达激光应用技术有限公司 | A kind of processing technology using laser-induced thermal etching removal circuit board local securing layer |
| CN108723598A (en) * | 2018-05-16 | 2018-11-02 | 深圳市泽华永盛技术有限公司 | A kind of automated production surface treatment process method |
| CN109005645A (en) * | 2018-08-30 | 2018-12-14 | 广合科技（广州）有限公司 | A kind of production method of the double electric thick gold finger of PCB |
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2019
- 2019-12-25 CN CN201911352233.7A patent/CN111065210A/en active Pending
Patent Citations (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05337661A (en) * | 1992-06-11 | 1993-12-21 | Hitachi Ltd | Method for removing metallic film by laser |
| WO1999031302A1 (en) * | 1997-12-18 | 1999-06-24 | Circuit Research Corporation | Printed circuit manufacturing process using tin-nickel plating |
| US6312614B1 (en) * | 1999-06-10 | 2001-11-06 | Sony Chemicals Corporation | Method for production of interposer for mounting semiconductor element |
| EP1248503A1 (en) * | 1999-12-22 | 2002-10-09 | Toyo Kohan Co., Ltd. | Multilayer printed wiring board and method of manufacturing the same |
| CN1770017A (en) * | 2004-11-05 | 2006-05-10 | Lg.菲利浦Lcd株式会社 | Thin film etching method and method of fabricating liquid crystal display device using the same |
| CN101114620A (en) * | 2007-09-06 | 2008-01-30 | 友达光电股份有限公司 | Method for fabricating pixel structure |
| CN102076175A (en) * | 2010-11-24 | 2011-05-25 | 深南电路有限公司 | Full gold-plated board manufacturing technology |
| CN103311395A (en) * | 2013-05-08 | 2013-09-18 | 北京大学 | Laser stripping film LED (Light-Emitting Diode) and preparation method thereof |
| CN103747636A (en) * | 2013-12-24 | 2014-04-23 | 广州兴森快捷电路科技有限公司 | Gold-plated circuit-board lead etch-back method |
| CN104767096A (en) * | 2015-03-27 | 2015-07-08 | 华为技术有限公司 | Preparation method for back plate |
| CN105764270A (en) * | 2016-04-22 | 2016-07-13 | 深圳崇达多层线路板有限公司 | Manufacturing method of PCB possessing entire board electrolytic gold and golden finger surface processing |
| CN105826172A (en) * | 2016-05-13 | 2016-08-03 | 上海微世半导体有限公司 | Passivation protection method capable of increasing reliability and yield rate of semiconductor chip |
| CN107708321A (en) * | 2017-09-20 | 2018-02-16 | 东莞康源电子有限公司 | A kind of minimizing technology of PCB electroplate lead wires |
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Application publication date: 20200424 |