CN104767096A - Preparation method for back plate - Google Patents
Preparation method for back plate Download PDFInfo
- Publication number
- CN104767096A CN104767096A CN201510141838.7A CN201510141838A CN104767096A CN 104767096 A CN104767096 A CN 104767096A CN 201510141838 A CN201510141838 A CN 201510141838A CN 104767096 A CN104767096 A CN 104767096A
- Authority
- CN
- China
- Prior art keywords
- protective layer
- preparation
- blind hole
- tack coat
- motherboard
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention relates to the technical field of communication, and discloses a preparation method for a back plate. The preparation method for the back plate comprises the steps that two or more daughter boards are pressed to form a mother board, and crimping blind holes are formed in the two sides of the mother board in the thickness direction of the mother board. Bonding layers are arranged on the two side faces, provided with openings of the crimping blind holes, of the mother board respectively. Protecting layers covering the two side faces of the mother board are formed in the bonding layers. Through holes are formed in the mother board. Windowing treatment is conducted on the protecting layers by laser burning technology and the protecting layers are removed. According to the preparation method for the back plate, when removing the protecting layers is needed, the windowing treatment is conducted on the protecting layers through the laser burning technology, etching liquid and medical liquid are not utilized, and thereby considering the windowing position, the bonding size between the protecting layers and the bonding layers and the size and standard of windowing and the like are not needed, so that the preparation method for the back plate is convenient to achieve the high-density arrangement of the crimping blind holes in the back plate conveniently, damage on the crimping blind holes during preparing of the back plate can be reduced, and the product quality of the back plate is improved.
Description
Technical field
The present invention relates to communication technical field, particularly a kind of preparation method of backboard.
Background technology
At communication technical field, along with the high speed development of network class product, the requirement of networking products to backplane channel capacity is more and more higher.
At present, in order to improve the channel capacity of backboard, those skilled in the art form highly dense two-sided crimping backboard when preparing backboard by the two-sided technique arranging crimping blind hole of employing backboard, at the bilateral of backboard, crimping blind hole is set simultaneously, and then crimp connector can be crimped in the both sides of backboard, thus improve the channel capacity of backboard.
As shown in Figure 1, above-mentioned backboard comprises the first daughter board 01, second daughter board 02 and the intermediate layer 03 between the first daughter board 01 and the second daughter board 02; Above-mentioned backboard is provided with multiple through hole 04 and multiple crimping blind hole 05 for crimping.In the operation at the above-mentioned backboard of preparation, (operation as etching through hole 04) liquid such as etching liquid or liquid medicine enters into the crimping blind hole 05 that backboard has set; adopt in prior art the mode of tack coat (Low flow PP) 06+ protective layer (Copper Foil) 07 realize to crimping blind hole 05 protection; wherein tack coat 06 will be windowed process in advance, the tack coat 06 of windowing is realized the protection of crimping blind hole 05 in subsequent technique together with protective layer 07 pressing.After subsequent handling completes, windowing 071 by being etched in formation on protective layer 07, then protective layer 07 being torn, crimping blind hole 05 to be exposed from the place of windowing.
But; in the above-mentioned preparation method of backboard; need when windowing to protective layer 07 accurately to ensure following size, as crimping blind hole 05 outer hole ring size a, tack coat 06 gummosis width b, the bonding size c between protective layer 07 and tack coat 06, protective layer 07 etch window 071 size d, through hole 04 outer hole ring size e.Wherein, protective layer 07 window 071 position protective layer 07 and tack coat 06 between bonding size c can not be too little, with prevent protective layer 07 is carried out etching window the moment erosion liquid and liquid by penetrate into crimping blind hole 05 in; The offset error that the size d that simultaneously protective layer 07 etching windows 071 needs when considering Manual-alignment, therefore, accuracy is inadequate.
It is the backboard of 1.9mm that above-mentioned preparation method is used for the spacing prepared between crimping hole, but along with the aperture in crimping hole corresponding to backboard high speed connector is more and more less, and spacing between crimping hole is also more and more less, and (as the minimum-value aperture in the crimping hole in the backboard that industry generally uses, closely 0.40mm is even less, and it is even less that the minimum spacing crimped between hole reaches 1.2mm), above-mentioned preparation method cannot evade the seepage of etching liquid or liquid medicine in windowing-process when preparing the less backboard of spacing between crimping hole, thus cause the damage to crimping blind hole, cause the product quality of backboard poor, be unfavorable for that the high density realizing crimping blind hole in backboard is arranged.
Summary of the invention
The invention provides a kind of preparation method of backboard, this preparation method can reduce the damage to crimping blind hole in backboard preparation process, and the high density being convenient to realize crimping blind hole in backboard is arranged, thus channel capacity that is further and then raising backboard.
First aspect, provides a kind of preparation method of backboard, comprising:
At least two pieces of daughter boards are stacked pressing and form motherboard, and along the thickness direction of described motherboard, the both sides of described motherboard are provided with crimping blind hole;
Be provided with at motherboard on two sides crimping blind hole opening and tack coat is set respectively;
Described tack coat is formed the protective layer covering motherboard two sides;
Motherboard forms through hole;
Adopt laser burn technique to window to protective layer process and remove described protective layer.
In conjunction with above-mentioned first aspect, in the implementation that the first is possible, described protective layer is the protective layer that electric conducting material is formed.
In conjunction with the first possible implementation of above-mentioned first aspect, in the implementation that the second is possible, described protective layer is the protective layer that metallic copper material is formed.
In conjunction with above-mentioned first aspect, in the implementation that the third is possible, described tack coat is the tack coat with the formation of close-burning insulating material.
In conjunction with above-mentioned first aspect, in the 4th kind of possible implementation, described tack coat is provided with the opening of windowing to dodge described crimping blind hole.
In conjunction with above-mentioned first aspect, in the 5th kind of possible implementation, adopt laser burn technique to window to protective layer and process and remove described protective layer, specifically comprise:
Adopt laser burn technique to window process to described protective layer and tack coat simultaneously;
Then start to remove described protective layer from the place of windowing.
In conjunction with the 4th kind of possible implementation of above-mentioned first aspect, in the 6th kind of possible implementation, described employing laser burn technique is windowed to protective layer and is processed and remove described protective layer, specifically comprises:
The protective layer covering crimping blind hole region is directly ablated off by laser burn technique.
In conjunction with above-mentioned first aspect, in the 7th kind of possible implementation, adopt laser burn technique to protective layer window process time, specifically adopt at least one laser in CO2 laser, UV laser or PICO laser to window process to protective layer.
In conjunction with the possible implementation of above-mentioned first aspect, the first possible implementation, the second, the third possible implementation, the 4th kind of possible implementation, the 5th kind of possible implementation, the 6th kind of possible implementation, the 7th kind of possible implementation, in the 8th kind of possible implementation, described daughter board is two pieces, and daughter board described in each block is equipped with described crimping blind hole.
In conjunction with the preparation method of the backboard that above-mentioned first aspect provides, in above-mentioned preparation method, after at least two pieces of daughter board pressings formation both sides are equipped with the motherboard of crimping blind hole, be provided with at motherboard on two sides crimping blind hole and tack coat is set, then on tack coat, form the protective layer covering motherboard two sides, and then protective layer can be protected to crimping blind hole in subsequent handling; Then; when protective layer is removed by needs; by laser burn technique, protective layer is windowed process; now; the liquid such as etching liquid and liquid is not adopted when protective layer being windowed and processed owing to adopting laser burn technique; and then need not consider to window position and the bonding size between protective layer and tack coat, the dimensions etc. of windowing; as long as the part that protective layer can be covered crimping blind hole region is removed; therefore, it is very little that the aperture of crimping blind hole backboard arranged and the spacing crimped between blind hole can be done.So the high density that the preparation method of above-mentioned backboard is convenient to realize crimping blind hole in backboard is arranged, and can reduce the damage to crimping blind hole time prepared by backboard, improves the product quality of backboard.
Accompanying drawing explanation
In order to be illustrated more clearly in the technical scheme in the embodiment of the present invention, be briefly described to the accompanying drawing used required in embodiment below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is structural representation when preparing backboard in prior art after protective layer is windowed;
The schematic flow sheet of the preparation method of the backboard that Fig. 2 provides for an embodiment of the present invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, be clearly and completely described the technical scheme in the embodiment of the present invention, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.
Please refer to Fig. 2, the preparation method of the backboard that the present embodiment provides, comprising:
Step S201: at least two pieces of daughter boards are stacked pressing and form motherboard, and along the thickness direction of motherboard, the both sides of motherboard are provided with crimping blind hole;
Step S202: be provided with at motherboard on two sides crimping blind hole opening and tack coat is set respectively;
Step S203: form the protective layer covering motherboard two sides on tack coat; Protective layer is covered on two sides of motherboard by tack coat, can prevent the etching liquid in subsequent technique, medicine company and glue etc. from entering into crimping blind hole;
Step S204: form through hole on motherboard;
Step S205: adopt laser burn technique to window to protective layer and process and remove protective layer.
In above-mentioned backboard preparation method, after at least two pieces of daughter board pressings formation both sides are equipped with the motherboard of crimping blind hole, be provided with at motherboard on two sides crimping blind hole and tack coat is set, then on tack coat, form the protective layer covering motherboard two sides, and then protective layer can be protected to crimping blind hole in subsequent handling; Then; when protective layer is removed by needs; by laser burn technique, protective layer is windowed process; now; the liquid such as etching liquid and liquid is not adopted when protective layer being windowed and processed owing to adopting laser burn technique; and then need not consider to window position and the bonding size between protective layer and tack coat, the dimensions etc. of windowing; as long as the part that protective layer can be covered crimping blind hole region is removed; therefore, it is very little that the aperture of crimping blind hole backboard arranged and the spacing crimped between blind hole can be done.So the high density that the preparation method of above-mentioned backboard is convenient to realize crimping blind hole in backboard is arranged, and can reduce the damage to crimping blind hole time prepared by backboard, improves the product quality of backboard.
In a kind of preferred implementation, the protective layer that the protective layer formed on tack coat in step S203 can be formed for electric conducting material.
Particularly, above-mentioned protective layer is the protective layer that metallic copper material is formed.Conductivity and the corrosion resistance of metallic copper are higher, improve the stability of protective layer performance.
In a kind of preferred implementation, the tack coat formed in above-mentioned steps S202 is the tack coat with the formation of close-burning insulating material.
Preferably, above-mentioned bonding layer material is lazy flow material.
Particularly, the material in order to mode tack coat flows in crimping blind hole, and tack coat is provided with the opening of windowing to dodge crimping blind hole.
In a kind of embodiment, step S205 adopts laser burn technique to window to protective layer and processes and remove protective layer, can specifically comprise:
Adopt laser burn technique to window process to protective layer and tack coat simultaneously;
Then start to remove protective layer from the place of windowing.
Certainly, above-mentioned steps S205 adopts laser burn technique to window to protective layer and processes and remove protective layer, can also specifically comprise:
The protective layer covering crimping blind hole region is directly ablated off by laser burn technique.Namely directly removing by laser burn technique the part covering crimping blind hole region in protective layer, the damage to master surface structure when removing protective layer can being prevented.
On the basis of the respective embodiments described above, adopt in above-mentioned steps S205 laser burn technique to protective layer window process time, at least one laser in CO2 laser, UV laser or PICO laser specifically can be adopted to window process to protective layer.
Particularly, above-mentioned motherboard stacks pressing by two pieces of daughter boards and forms, and each block daughter board is equipped with crimping blind hole.
Obviously, those skilled in the art can carry out various change and modification to the embodiment of the present invention and not depart from the spirit and scope of the present invention.Like this, if these amendments of the present invention and modification belong within the scope of the claims in the present invention and equivalent technologies thereof, then the present invention is also intended to comprise these change and modification.
Claims (9)
1. a preparation method for backboard, is characterized in that, comprising:
At least two pieces of daughter boards are stacked pressing and form motherboard, and along the thickness direction of described motherboard, the both sides of described motherboard are provided with crimping blind hole;
Be provided with at motherboard on two sides crimping blind hole opening and tack coat is set respectively;
Described tack coat is formed the protective layer covering motherboard two sides;
Motherboard forms through hole;
Adopt laser burn technique to window to protective layer process and remove described protective layer.
2. preparation method according to claim 1, is characterized in that, described protective layer is the protective layer that electric conducting material is formed.
3. preparation method according to claim 2, is characterized in that, described protective layer is the protective layer that metallic copper material is formed.
4. preparation method according to claim 1, is characterized in that, described tack coat is the tack coat with the formation of close-burning insulating material.
5. preparation method according to claim 1, is characterized in that, described tack coat is provided with the opening of windowing to dodge described crimping blind hole.
6. preparation method according to claim 1, is characterized in that, adopts laser burn technique to window to protective layer and processes and remove described protective layer, specifically comprise:
Adopt laser burn technique to window process to described protective layer and tack coat simultaneously;
Then start to remove described protective layer from the place of windowing.
7. preparation method according to claim 1, is characterized in that, described employing laser burn technique is windowed to protective layer and processed and remove described protective layer, specifically comprises:
The protective layer covering crimping blind hole region is directly ablated off by laser burn technique.
8. preparation method according to claim 1, is characterized in that, adopt laser burn technique to protective layer window process time, specifically adopt at least one laser in CO2 laser, UV laser or PICO laser to window process to protective layer.
9. the preparation method according to any one of claim 1-8, is characterized in that, described daughter board is two pieces, and daughter board described in each block is equipped with described crimping blind hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510141838.7A CN104767096A (en) | 2015-03-27 | 2015-03-27 | Preparation method for back plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510141838.7A CN104767096A (en) | 2015-03-27 | 2015-03-27 | Preparation method for back plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104767096A true CN104767096A (en) | 2015-07-08 |
Family
ID=53648797
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510141838.7A Pending CN104767096A (en) | 2015-03-27 | 2015-03-27 | Preparation method for back plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104767096A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106126379A (en) * | 2016-06-22 | 2016-11-16 | 浪潮电子信息产业股份有限公司 | Automatic method for detecting hard disk backboard in memory under linux |
| CN107343358A (en) * | 2016-12-06 | 2017-11-10 | 华为机器有限公司 | The processing method and circuit board of a kind of circuit board |
| CN111065210A (en) * | 2019-12-25 | 2020-04-24 | 上海嘉捷通电路科技股份有限公司 | Method for replacing manual PCB (printed circuit board) process lead wire picking |
-
2015
- 2015-03-27 CN CN201510141838.7A patent/CN104767096A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106126379A (en) * | 2016-06-22 | 2016-11-16 | 浪潮电子信息产业股份有限公司 | Automatic method for detecting hard disk backboard in memory under linux |
| CN107343358A (en) * | 2016-12-06 | 2017-11-10 | 华为机器有限公司 | The processing method and circuit board of a kind of circuit board |
| CN107343358B (en) * | 2016-12-06 | 2019-10-25 | 华为机器有限公司 | A kind of processing method and circuit board of circuit board |
| CN111065210A (en) * | 2019-12-25 | 2020-04-24 | 上海嘉捷通电路科技股份有限公司 | Method for replacing manual PCB (printed circuit board) process lead wire picking |
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| C06 | Publication | ||
| PB01 | Publication | ||
| EXSB | Decision made by sipo to initiate substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150708 |