CN101605430B - Method for pressing layer gasket of rigid-flexible product - Google Patents
Method for pressing layer gasket of rigid-flexible product Download PDFInfo
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- CN101605430B CN101605430B CN2009101086988A CN200910108698A CN101605430B CN 101605430 B CN101605430 B CN 101605430B CN 2009101086988 A CN2009101086988 A CN 2009101086988A CN 200910108698 A CN200910108698 A CN 200910108698A CN 101605430 B CN101605430 B CN 101605430B
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Abstract
The invention relates to a method for pressing a layer gasket of a rigid-flexible product, which comprises the following: step 1, providing a combination of a rigid plate and a flexible plate, wherein the rigid plate is provided with an internal groove; step 2, providing a prepreg gasket; step 3, preliminarily processing and pre-curing the prepreg gasket; step 4, processing the appearance of the pressed and pre-cured gasket; step 5, filling the gasket into the internal groove of the rigid plate; and step 6, pressing the combination of the rigid plate filled with the gasket and the flexible plate. The method for pressing the layer gasket of the rigid-flexible product can protect a flexible part of the product from being wrinkled and bent at high pressure and high temperature of a pressure plate, protect the flexible plate from the corrosion of liquid medicine during wet flows, simultaneously keep the plate surface flat, and reduce the processing difficulty of processes such as drilling, D/F and the like.
Description
Technical field
The present invention relates to a kind of compression method of pad, relate in particular to a kind of compression method with layer gasket of rigid-flexible product.
Background technology
Generally use pad technology to carry out processing and manufacturing in the flex-rigid wiring board manufacturing now; But there are a lot of shortcoming and defect parts in the making of pad and use technology itself; Common pad adopts the FR4 material, mainly has following problem in its processing and the use technology, like the problem of pad and rigid plate poor fit; Be that shim is less than normal, size is bigger than normal or the turning is too many; The area ratio that pad accounts for plate is too big, and the perhaps turning of pad, radian and rigid plate poor fit occur easily that flex plate weighs wounded, wrinkling, problem such as drop easily; Other has, and in wet flow processs such as plating, produces the problem that internal layer oozes liquid medicine; Have, it is uneven the plate face in the outer course of processing, to occur, causes problems such as can't processing of photochemistry image transfer operations such as (D/F) again.
Summary of the invention
The objective of the invention is to, a kind of compression method of layer gasket of rigid-flexible product is provided, its can protect the flex section of product wrinkle resistant under the high pressure of pressing plate, high temperature, do not bend; The protection flex plate does not receive the erosion of liquid medicine in some wet flowchart process; Simultaneously, this method is can also the holding plate face smooth, reduces the difficulty of processing of operations such as boring, D/F.
To achieve these goals, the present invention proposes a kind of compression method of layer gasket of rigid-flexible product, it is characterized in that, comprising:
In step 1.1, on the flex plate overbending direction, the rigid plate inside groove is 1: 1 to 1: 1.05 with the appearance profile ratio, keeps the distance feed with rigid plate 0.30-0.60mm at slitter edge, and the flex plate zone is linked together.
In step 1, not window when the flex plate internal layer circuit, the thickness of the rigid plate in the step 1.1 is less than 0.25mm; When the flex plate internal layer circuit is windowed, the rigid plate thickness in the step 1.1 is less than 0.5mm.
In the step 3, the temperature of curing is at 165-180 degree centigrade, and pressure is 2.06844-2.41318MPa.
In this step 4, on the flex plate overbending direction, pad and rigid plate inside groove dimension scale are 1: 1 to 1: 0.95; On slitter edge, the monolateral distance of inwardly shrinking 0.25-0.05mm than the rigid plate inside groove of pad.
Beneficial effect of the present invention: adopt the compression method of layer gasket of rigid-flexible product provided by the invention, can protect the flex section of product wrinkle resistant under the high pressure of pressing plate, high temperature, do not bend; Simultaneously, it can protect flex plate in wet flowchart process such as de-smear, heavy copper, plating, when especially internal layer circuit being windowed design, does not receive the attack of external force and liquid medicine; In addition, this method is can also the holding plate face smooth, reduces the difficulty of processing of operations such as boring, D/F.
In order further to understand the characteristic and the technology contents of the utility model, see also following detailed description and accompanying drawing, yet accompanying drawing only provides reference and explanation usefulness, is not to be used for the utility model is limited about the utility model.
Description of drawings
Below in conjunction with accompanying drawing, describe in detail through specific embodiments of the invention, will make technical scheme of the present invention and other beneficial effects obvious.
Fig. 1 is the schematic flow sheet of the compression method of layer gasket of rigid-flexible product of the present invention.
Embodiment
For further setting forth technological means and the effect that the present invention takes for the predetermined purpose of realization; See also following about detailed description of the present invention and accompanying drawing; Believe the object of the invention, characteristic and characteristics; Should obtain thus going deep into and concrete understanding, yet accompanying drawing only provides reference and explanation usefulness, is not to be used for the present invention is limited.
As shown in Figure 1, the compression method of layer gasket of rigid-flexible product of the present invention comprises:
In sum, adopt the compression method of layer gasket of rigid-flexible product provided by the invention, can protect the flex section of product wrinkle resistant under the high pressure of pressing plate, high temperature, do not bend; Simultaneously, it can protect flex plate in wet flowchart process such as de-smear, heavy copper, plating, when especially the flex plate internal layer circuit being windowed design, does not receive the attack of external force and liquid medicine; In addition, this method is can also the holding plate face smooth, reduces the difficulty of processing of operations such as boring, D/F.
The above; Be merely preferred embodiment of the present invention; For the person of ordinary skill of the art, can make other various corresponding changes and distortion, and all these changes and distortion all should belong to the protection range of claim of the present invention according to the technical scheme and the technical conceive of this aspect.
Claims (3)
1. the compression method of a layer gasket of rigid-flexible product is characterized in that, comprising:
Step 1 provides firm, flex plate combination, and this rigid plate is provided with inside groove; Step 1 comprises step 1.1, the semi-finished product of processing rigid plate part; On the flex plate overbending direction, the rigid plate inside groove is 1: 1 to 1: 1.05 with the appearance profile ratio, keeps the distance feed with rigid plate 0.30-0.60mm at slitter edge, and the flex plate zone is linked together; Step 1.2, the semi-finished product of processing flex plate part; Step 1.3 is fitted to firm, flex plate semi-finished product in advance;
Step 2 provides the prepreg pad;
Step 3 is carried out preliminary pressing precuring to this prepreg pad;
Step 4 is carried out sharp processing to the pad after the pressing precuring; On the flex plate overbending direction, pad and rigid plate inside groove dimension scale are 1: 1 to 1: 0.95; On slitter edge, the monolateral distance of inwardly shrinking 0.25-0.05mm than the rigid plate inside groove of pad;
Step 5 is filled out pad in the rigid plate inside groove;
Step 6, with fill out behind the pad just, flex plate combination carrying out pressing handles.
2. the compression method of layer gasket of rigid-flexible product as claimed in claim 1 is characterized in that, in step 1, does not window when the flex plate internal layer circuit, and the thickness of the rigid plate in the step 1.1 is less than 0.25mm; When the flex plate internal layer circuit is windowed, the rigid plate thickness in the step 1.1 is less than 0.5mm.
3. the compression method of layer gasket of rigid-flexible product as claimed in claim 1 is characterized in that, in the step 3, the temperature of curing is at 165-180 degree centigrade, and pressure is 2.06844-2.41318MPa.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101086988A CN101605430B (en) | 2009-07-16 | 2009-07-16 | Method for pressing layer gasket of rigid-flexible product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101086988A CN101605430B (en) | 2009-07-16 | 2009-07-16 | Method for pressing layer gasket of rigid-flexible product |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101605430A CN101605430A (en) | 2009-12-16 |
| CN101605430B true CN101605430B (en) | 2012-01-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2009101086988A Active CN101605430B (en) | 2009-07-16 | 2009-07-16 | Method for pressing layer gasket of rigid-flexible product |
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| CN (1) | CN101605430B (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101998769A (en) * | 2010-11-25 | 2011-03-30 | 深南电路有限公司 | Rigid-flex board and step board and processing method of rigid-flex board and step board |
| CN102858097A (en) * | 2012-09-04 | 2013-01-02 | 深圳市华星光电技术有限公司 | PCB (printed circuit board), laminating method for PCB and COF (chip on FPC (flexible printed circuit)), as well as liquid crystal display device |
| CN102917547B (en) * | 2012-11-13 | 2015-07-08 | 无锡江南计算技术研究所 | Method for balancing stress on soft board area of rigid-flexible board |
| CN108882570A (en) * | 2018-09-28 | 2018-11-23 | 广州兴森快捷电路科技有限公司 | Rigid-flex circuit board and preparation method thereof |
| CN109743840B (en) * | 2018-12-28 | 2021-05-25 | 广州兴森快捷电路科技有限公司 | Coreless substrate and packaging method thereof |
| CN110290641A (en) * | 2019-06-14 | 2019-09-27 | 广合科技（广州）有限公司 | A kind of high thickness to diameter ratio ladder method for manufacturing gold finger and preparation method thereof |
| CN113301736A (en) * | 2021-05-21 | 2021-08-24 | 山东英信计算机技术有限公司 | Rigid-flex board, manufacturing method thereof and electronic product |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0255607A2 (en) * | 1986-07-22 | 1988-02-10 | Schoeller & Co. Elektronik GmbH | Laminate for rigid-flexible printed circuit boards |
| CN1347276A (en) * | 2000-10-09 | 2002-05-01 | 耀华电子股份有限公司 | Method for making multi-layer PCB composed of flexible and rigid layers |
| US6844050B2 (en) * | 2000-06-29 | 2005-01-18 | P.W.F. Group | Precut plate for obtaining a volume, in particular a package, method for making same and resulting package |
| KR20050029904A (en) * | 2003-09-24 | 2005-03-29 | (주)엑큐리스 | Manufacturing method of rigid-flex pcb |
-
2009
- 2009-07-16 CN CN2009101086988A patent/CN101605430B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0255607A2 (en) * | 1986-07-22 | 1988-02-10 | Schoeller & Co. Elektronik GmbH | Laminate for rigid-flexible printed circuit boards |
| US6844050B2 (en) * | 2000-06-29 | 2005-01-18 | P.W.F. Group | Precut plate for obtaining a volume, in particular a package, method for making same and resulting package |
| CN1347276A (en) * | 2000-10-09 | 2002-05-01 | 耀华电子股份有限公司 | Method for making multi-layer PCB composed of flexible and rigid layers |
| KR20050029904A (en) * | 2003-09-24 | 2005-03-29 | (주)엑큐리스 | Manufacturing method of rigid-flex pcb |
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| CN101605430A (en) | 2009-12-16 |
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