CN208050629U - A kind of LED display wiring board leveling mold - Google Patents
A kind of LED display wiring board leveling mold Download PDFInfo
- Publication number
- CN208050629U CN208050629U CN201820417399.7U CN201820417399U CN208050629U CN 208050629 U CN208050629 U CN 208050629U CN 201820417399 U CN201820417399 U CN 201820417399U CN 208050629 U CN208050629 U CN 208050629U
- Authority
- CN
- China
- Prior art keywords
- wiring board
- led display
- lower die
- mold
- upper mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a kind of LED display wiring board leveling molds, including upper mold and lower die, the upper mold with cavity identical with LED display circuit plate shape is provided in lower die, it is provided with heating mechanism in the upper mold and lower die, pass through above-mentioned setting, the semi-finished product of wiring board are processed using leveling mold, the remote high precision manually tapped of the dimensional accuracy of mold, mold is placed in hydraulic press, pass through the high pressure of hydraulic press, and the heating effect of heating mechanism, by the wiring board leveling after drilling and milling, it is good to flatten effect, flatness numerical value is smaller；It is both provided with heating mechanism in upper mold and lower die, ensures that wiring board is integrally heated evenly, wiring board is heated to occur certain softening, and the residual stress after pressed shape variation is smaller, can improve the service life of wiring board；Cavity in leveling mold can ensure the accurate pressing to wiring board, avoid causing to damage to structure on wiring board.
Description
Technical field
The utility model is related to LED display accessory manufacture field, more particularly to a kind of LED display wiring board flattens mould
Tool.
Background technology
Currently, the Chinese patent of Publication No. CN103280164B discloses a kind of LED display module, it is intended to solve existing
The problems such as having the flatness, water resistance of LED display module in technology and effectively radiating.LED display provided by the invention
Module includes pedestal, wiring board, LED luminescence units and power module, and pedestal includes body part and is surrounded on around body part
Side wall, body part and side wall form the accommodating cavity of accommodating wiring board, and LED display module further includes being cast on wiring board simultaneously
The casting glue of accommodating cavity is filled up, the sealant that the side wall of formation outer surface and pedestal is flush after casting glue is cured.The present invention
Additionally provide a kind of LED display.The present invention LED display module use adhesive layer by wiring board be sealed in accommodating cavity with
The side wall of the outer surface and pedestal that make adhesive layer is flush, and ensures the water resistance and flatness of the LED display module, to protect
The display quality of card LED display module meets quality standard.
This LED display module is controlled display screen in same level degree using adhesive layer, but LED display circuit
The flatness of plate itself influences whether the dense degree of the installation of the installation unit of installation in the circuit board, and flatness is higher, can
Smaller with the size of the installation unit of receiving, wiring board is generally typically after processing is completed manually tapped whole using aluminium at present
Flat, flatness is unable to control the range of very little.
Utility model content
The purpose of this utility model is to provide a kind of LED display wiring board leveling mold, with small excellent of flatness
Point.
The above-mentioned technical purpose of the utility model technical scheme is that：
A kind of LED display wiring board leveling mold, including upper mold and lower die, are provided in the upper mold and lower die and LED
It is provided with heating mechanism in the identical cavity of display screen circuit plate shape, the upper mold and lower die.
By using above-mentioned technical proposal, the semi-finished product of wiring board are processed using leveling mold, the size of mold
The remote high precision manually tapped of precision, mold is placed in hydraulic press, the heating of the high pressure and heating mechanism of hydraulic press is passed through
Effect flattens the wiring board after drilling and milling, and leveling effect is good, and flatness numerical value is smaller；In upper mold and lower die all
It is provided with heating mechanism, ensures that wiring board is integrally heated evenly, wiring board is heated to occur certain softening, after pressed shape variation
Residual stress is smaller, can improve the service life of wiring board；Cavity in leveling mold can ensure to the accurate of wiring board
It flattens, avoids that structure on wiring board is caused to damage.
Further setting：The heating mechanism includes being opened in the bottoming hole of leveling mold side, is worn in the bottoming hole
Equipped with heating rod.
By using above-mentioned technical proposal, heating rod is heated, passes through bottoming hole heat transfer to entire mold, heating
Mode is simple, and according to the variation of wiring board material, can replace the heating rod of different heat amount, applied widely.
Further setting：There are three bottoming hole uniform parallel distributions along its length, the axis point of the bottoming hole
The edge and symmetry axis of other face LED display wiring board.
It by using above-mentioned technical proposal, is heated using multiple heating rods, the efficiency of heating surface is high, and heating rod is uniform
Distribution, is conducive to integrally heat mold, and the efficiency of heating surface is high, and high pressure-temperature is kept for stage, the maintenance that can stablize whole
The temperature of flat-die tool, good practical effect
Further setting：The diameter of the bottoming hole is less than 1 with lower die thickness ratio：2.
By using above-mentioned technical proposal, the size of bottoming hole is smaller, avoids the surface distance bottoming hole of mold excessively close, leads
It causes different location heating speed gap excessive, causes the waste of the energy in heating process.
Further setting：It is provided with fixing threaded hole by the bottoming hole, fixinig plate is threaded at the fixing threaded hole,
Before the fixinig plate is blocked in bottoming hole.
By using above-mentioned technical proposal, heating rod is stopped using fixinig plate, avoids heating rod in hydraulic press liter
Deviate from mold during drop, ensures leveling mold thermal-stable in use.
Further setting：The upper mold is provided with detection notch, the upper mold with lower die on the side for be parallel to bottoming hole
With lower die in molding, detection notch forms the detect tank for detecting flatness.
By using above-mentioned technical proposal width gage is utilized in leveling mold before use, upper mold and lower die are molded
Equal detection devices are detected detect tank, if detection slot structure deforms, illustrate that upper mold does not flatten completely with lower die, to whole
Flat-die tool is adjusted, and can easily be flattened in advance to leveling mold, improve the leveling precision of leveling mold.
Further setting：The shape of the detect tank is strip.
By using above-mentioned technical proposal, the detect tank of strip when being detected, may be used and measure detection respectively
The mode of the width at the both ends of slot, to judge whether the flatness between upper mold and lower die meets the requirements.
Further setting：The shape of the detect tank is curved, and leveling mold further includes inspection identical with detection groove shape
Survey block.
By using above-mentioned technical proposal, when being detected to leveling mold, if detection block can be embedded in detect tank, explanation
Upper mold is accurate smooth molding with lower die, thereby may be ensured that the flatness of leveling mold；And it is not necessarily in leveling mold
Upper mold and lower die are locked in use, detection block can also be used as locking structure, facilitate the movement and transport of leveling mold.
It is further arranged to：The heating mechanism is to be set to upper mold and the runner in lower die, the runner and hot water machine
Or hot oil machine is connected.
By using above-mentioned technical proposal, the design of runner is relatively free, can design runner in mold according to calculating
Layout, improve the efficiency of transmission and the efficiency of heating surface of heat, accelerate the preheating of mold, improve processing efficiency
In conclusion the utility model has the advantages that：
1, leveling processing is carried out to the LED display wiring board of aluminum in the case of high temperature and pressure, treated circuit
Plate stress is eliminated, and structure keeps good, is unlikely to deform；
2, the setting of detect tank is convenient is detected leveling mold before leveling is processed, and ensures the accurate of leveling.
Description of the drawings
Fig. 1 is 1 structural schematic diagram of embodiment；
Fig. 2 is 2 structural schematic diagram of embodiment；
Fig. 3 is A enlarged drawings in Fig. 2；
Fig. 4 is 3 structural schematic diagram of embodiment；
Fig. 5 is 4 structural schematic diagram of embodiment.
In figure, 1, upper mold；2, lower die；3, cavity；4, bottoming hole；5, heating rod；6, fixinig plate；7, detect tank.
Specific implementation mode
The utility model is described in further detail below in conjunction with attached drawing.
Embodiment 1：A kind of LED display wiring board leveling mold, as shown in Figure 1, including upper mold 1 and lower die 2, upper mold 1
Center forms cavity identical with LED display circuit plate shape 3 when merging with lower die 2.The side of upper mold 1 and lower die 2 is all opened
Have bottoming hole 4, heating rod 5 be installed in bottoming hole 4, bottoming hole 4 be respectively aligned to the edge of LED display wiring board with it is symmetrical
Axis.The diameter of bottoming hole 4 is equal to the 1/3 of 2 thickness of lower die.
When in use, first leveling mold is molded, carries out flatness detection；After flatness detection, to heating rod 5 into
Row electrified regulation 5min makes upper mold 1 be heated to 300 DEG C -350 DEG C with lower die 2, LED display wiring board to be flattened is put into
Lower die 2 starts hydraulic press so that and upper mold 1 is molded with lower die 2, keeps pressure 3min, then shielding fixture is utilized to take out product,
It carries out subsequently cooling and is surface-treated.
Embodiment 2, as shown in Figures 2 and 3, the present embodiment 2 is with embodiment 1 the difference is that on 4 place side of bottoming hole
It is provided with fixing threaded hole, fixing bolt is screwed at fixing threaded hole, fixinig plate 6 is pressed in the side of mold, fixinig plate 6 by fixing bolt
Divide and block before bottoming hole 4, avoids the abjection of heating rod 5.
Embodiment 3：As described in Figure 4, the present embodiment 3 and embodiment 1 the difference is that, opened in upper mold 1 and the side of lower die 2
There is a detection notch, upper mold 1 and lower die 2 form the detect tank 7 of strip when merging, when molding, measure the both ends of detect tank 7 respectively
Width, be compared to judge whether the flatness between upper mold 1 and lower die 2 meets the requirements.
Embodiment 4：As described in Figure 5, the present embodiment 4 and embodiment 3 the difference is that, upper mold 1 and 2 side of lower die
It is curved to detect the detect tank 7 that notch is formed, and utilizes curved detection block identical with 7 shape of detect tank（It is not shown in figure）It carries out
Leveling detection, if detection block can be embedded in detect tank 7, illustrates that upper mold 1 with lower die 2 is accurate when being detected to leveling mold
Smooth molding, it thereby may be ensured that the flatness of leveling mold；And leveling mold without using when, detection block also may be used
To be locked as locking structure to upper mold 1 and lower die 2, facilitate the movement and transport of leveling mold.
The above embodiments are only the explanation to the utility model, are not limitations of the present invention, ability
Field technique personnel can as needed make the present embodiment the modification of not creative contribution after reading this specification, but
As long as all being protected by Patent Law in the right of the utility model.
Claims (9)
1. a kind of LED display wiring board leveling mold, including upper mold (1) and lower die (2), it is characterised in that：The upper mold (1)
Be provided with cavity (3) identical with LED display circuit plate shape in lower die (2), the upper mold (1) and setting in lower die (2)
There is heating mechanism.
2. a kind of LED display wiring board leveling mold according to claim 1, it is characterised in that：The heating mechanism
Bottoming hole (4) including being opened in leveling mold side, the bottoming hole (4) is interior to be equipped with heating rod (5).
3. a kind of LED display wiring board leveling mold according to claim 2, it is characterised in that：The bottoming hole (4)
There are three uniform parallel distributions along its length, the edge of the axis difference face LED display wiring board of the bottoming hole (4)
With symmetry axis.
4. a kind of LED display wiring board leveling mold according to claim 2, it is characterised in that：The bottoming hole (4)
Diameter and lower die (2) thickness ratio be less than 1：2.
5. a kind of LED display wiring board leveling mold according to claim 2, it is characterised in that：The bottoming hole (4)
Side is provided with fixing threaded hole, and fixinig plate (6) is threaded at the fixing threaded hole, and the fixinig plate (6) is blocked in bottoming hole
(4) before.
6. a kind of LED display wiring board leveling mold according to claim 1, it is characterised in that：The upper mold (1) with
Detection notch is provided on the side of the lower die (2), with the lower die (2) in molding, two detections lack the upper mold (1)
Mouth forms the detect tank (7) for detecting flatness.
7. a kind of LED display wiring board leveling mold according to claim 6, it is characterised in that：The detect tank (7)
Shape be strip.
8. a kind of LED display wiring board leveling mold according to claim 6, it is characterised in that：The detect tank (7)
Shape be it is curved, leveling mold further includes detection block identical with detect tank (7) shape.
9. a kind of LED display wiring board leveling mold according to claim 1, it is characterised in that：The heating mechanism
To be set to upper mold (1) and the runner in lower die (2), the runner is connected with hot water machine or hot oil machine.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820417399.7U CN208050629U (en) | 2018-03-26 | 2018-03-26 | A kind of LED display wiring board leveling mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820417399.7U CN208050629U (en) | 2018-03-26 | 2018-03-26 | A kind of LED display wiring board leveling mold |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208050629U true CN208050629U (en) | 2018-11-06 |
Family
ID=63990230
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820417399.7U Expired - Fee Related CN208050629U (en) | 2018-03-26 | 2018-03-26 | A kind of LED display wiring board leveling mold |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208050629U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021103547A1 (en) * | 2019-11-27 | 2021-06-03 | 深圳市洲明科技股份有限公司 | Positioning clamp, and assembly method for led display module |
| CN114042782A (en) * | 2021-10-15 | 2022-02-15 | 东莞领益精密制造科技有限公司 | Vapor chamber leveling device and method |
-
2018
- 2018-03-26 CN CN201820417399.7U patent/CN208050629U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021103547A1 (en) * | 2019-11-27 | 2021-06-03 | 深圳市洲明科技股份有限公司 | Positioning clamp, and assembly method for led display module |
| CN114042782A (en) * | 2021-10-15 | 2022-02-15 | 东莞领益精密制造科技有限公司 | Vapor chamber leveling device and method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181106 Termination date: 20200326 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |