CN101631431B - Soft-hard plate structure and manufacturing method thereof - Google Patents
Soft-hard plate structure and manufacturing method thereof Download PDFInfo
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- CN101631431B CN101631431B CN2008101377688A CN200810137768A CN101631431B CN 101631431 B CN101631431 B CN 101631431B CN 2008101377688 A CN2008101377688 A CN 2008101377688A CN 200810137768 A CN200810137768 A CN 200810137768A CN 101631431 B CN101631431 B CN 101631431B
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Abstract
The invention relates to a method for manufacturing a soft-hard plate structure, which comprises the following steps: firstly, providing a core plate, a rubber sheet and a second conductive layer, wherein the core plate is provided with a soft base plate and a first conductive layer arranged on a flexible part of the soft base plate, and the rubber sheet is arranged between the core plate and the second conductive layer and is provided with a first opening corresponding to the flexible part; secondly, laminating the core plate, the rubber sheet and the second conductive layer and solidifying the rubber sheet, wherein the first opening exposes the flexible part and the inner wall of the first opening is an inclined plane; thirdly, forming a third conductive layer on the inclined plane for connecting the first conductive layer and the second conductive layer; and finally, patterning the first conductive layer, the second conductive layer and the third conductive layer so as to form a first circuitry layer, a second circuitry layer and a third circuitry layer respectively.
Description
Technical field
The invention relates to a kind of circuit board structure and preparation method thereof, and particularly relevant for a kind of soft-hard plate structure and preparation method thereof.
Background technology
Rigid-flex is the printed circuit board (PCB) that is combined by soft circuit board and rigid circuit board, and it is with the pliability of soft circuit board and the intensity of rigid circuit board.Therefore, rigid-flex helps to promote part and links and the design flexibility of assembling, and can promote yield and saving space that part links.
On manufacture method, rigid-flex is that the soft circuit board with existing line is a core layer, and the circuit of making rigid circuit board with the circuit technique thereof of similar Layer increasing method or overlay technique is on soft circuit board.Fig. 1 is the profile of known soft-hard plate structure.Please refer to Fig. 1, known soft-hard plate structure 100 is the both sides up and down 112,114 that two rigid circuit boards 120 are configured in soft circuit board 110 respectively, and rigid circuit board 120 has opening 122 to expose a flexible pars convoluta F of soft circuit board 110.And, on rigid circuit board 120, form blind hole V (via), and in blind hole V, form electric conducting material C to electrically connect rigid circuit board 120 and soft circuit board 110.
Summary of the invention
The present invention proposes a kind of manufacture method of soft-hard plate structure, it is by when the pressing substrate is to the soft circuit board, make the opening inwall of substrate become an inclined plane, and on the inclined plane, forming the tertiary circuit layer to electrically connect substrate and soft circuit board, rigid-flex generally needs the extra blind hole that forms and do not need as is known.
The present invention proposes a kind of soft-hard plate structure in addition, and the opening inwall of its substrate is an inclined plane, so the present invention is disposed on the inclined plane tertiary circuit layer to electrically connect substrate and soft circuit board with the known blind hole of opening replacement.
For specifically describing content of the present invention, as described below in this manufacture method that proposes a kind of soft-hard plate structure.At first, provide a core board, a film and one second conductive layer, core board has a soft substrate and one first conductive layer, and soft substrate has a flexible pars convoluta, and first conductive layer is disposed on the flexible pars convoluta.Film is disposed between the core board and second conductive layer, and film has one first opening corresponding to the flexible pars convoluta, and second conductive layer has one second opening corresponding to first opening.Then, pressing core board, film and second conductive layer also solidify film, and first opening exposes the flexible pars convoluta, and the inwall of first opening is an inclined plane.Then, on the inclined plane, form one the 3rd conductive layer, to connect first conductive layer and second conductive layer.Afterwards, patterning first conductive layer, second conductive layer and the 3rd conductive layer are to form one first line layer, one second line layer and tertiary circuit layer respectively.
In one embodiment of this invention, after forming first line layer and second line layer, also comprise forming a protective layer on film and flexible pars convoluta, to cover first line layer, tertiary circuit layer and part second line layer.
In one embodiment of this invention, the method for curing film comprises the heating film.
In one embodiment of this invention, the method that forms the 3rd conductive layer comprises physical vapour deposition (PVD) or plating.
In one embodiment of this invention, the method for patterning first conductive layer, second conductive layer and the 3rd conductive layer comprises the photoetching etching.
For specifically describing content of the present invention, propose a kind of soft-hard plate structure at this and comprise a core board, a film, one second line layer and a tertiary circuit layer.Core board comprises a soft substrate and one first line layer, and soft substrate has a flexible pars convoluta, and first line layer is disposed on the flexible pars convoluta.Film is disposed on the core board, and film exposes the flexible pars convoluta, and the film sidewall adjacent with the flexible pars convoluta is an inclined plane.Second line layer is disposed on the film.The tertiary circuit layer is disposed on the inclined plane, to connect first line layer and second line layer.
In one embodiment of this invention, soft-hard plate structure also comprises a protective layer, and it is disposed on film and the flexible pars convoluta, to cover first line layer, tertiary circuit layer and part second line layer.
In one embodiment of this invention, the material of protective layer comprises polyimide resin (polyimideresin) or epoxy resin (epoxy resin).
In one embodiment of this invention, the material of soft substrate is the polyimide resin.
In one embodiment of this invention, core board also comprises a rigid substrate, two side engagement of rigid substrate and soft substrate.
From the above, tertiary circuit layer of the present invention is formed on the inclined plane, so the present invention does not need the extra known blind hole that forms.By as can be known aforementioned, technology of the present invention is comparatively simplified.In addition, also because the present invention need not form known blind hole, therefore the overlapping part of soft substrate and film accounts for the ratio reduction of soft substrate, and the flexible pars convoluta accounts for the ratio lifting of soft substrate.Thus, the pliability of soft-hard plate structure of the present invention is preferable.
Description of drawings
For above and other objects of the present invention, feature and advantage can be become apparent, embodiment cited below particularly, and conjunction with figs. are described in detail below, wherein:
Fig. 1 is the profile of known soft-hard plate structure.
Fig. 2 is the profile of the soft-hard plate structure of one embodiment of the invention.
Fig. 3 A～Fig. 3 G is the flow process profile of manufacture method of the soft-hard plate structure of one embodiment of the invention.
Embodiment
Fig. 2 is the profile of the soft-hard plate structure of one embodiment of the invention.Please refer to Fig. 2, the soft-hard plate structure 200 of present embodiment comprises a core board 210, two film 220a and second line layer 230 and tertiary circuit layer 240.Core board 210 comprises first line layer 212 and a soft substrate 214, and soft substrate 214 has a flexible pars convoluta F, and these first line layers 212 are disposed at respectively on the F1 of both sides up and down, the F2 of flexible pars convoluta F.The material of soft substrate 214 can be the polyimide resin.
In present embodiment, core board 210 also comprises a rigid substrate 216, and rigid substrate 216 engages with left and right sides 214a, the 214b of soft substrate 214.The material of rigid substrate 216 comprises glass fibre and resin.In addition, core board 210 also can comprise the 4th line layer 218, and these the 4th line layers 218 are disposed at respectively on the 216a of both sides up and down, the 216b of rigid substrate 216.
Two film 220a are disposed at respectively on the S1 of both sides up and down, the S2 of core board 210, and these films 220a exposes flexible pars convoluta F respectively, and these films 220a sidewall adjacent with flexible pars convoluta F is inclined plane 222.In present embodiment, film 220a is cure states.It should be noted that in present embodiment film 220a covers the part that rigid substrate 216 and soft substrate 214 join, to promote the reliability that rigid substrate 216 engages with soft substrate 214.Second line layer 230 is disposed on the film 220a.Tertiary circuit layer 240 is disposed on the inclined plane 222 of film 220a, to connect first line layer 212 and second line layer 230.
It should be noted that to be different from knownly that the soft-hard plate structure 200 of present embodiment is to connect first line layer 212 and second line layers 230 by the tertiary circuit layer on the inclined plane 222 that is disposed at film 220a 240.By as can be known aforementioned, present embodiment need not form known blind hole, the ratio that the overlapping part of therefore soft substrate 214 and film 220a accounts for soft substrate 214 reduces, and then can increase the pliability that flexible pars convoluta F accounts for the ratio of soft substrate and can promote soft-hard plate structure 200.
In addition, in present embodiment, soft-hard plate structure 200 also comprises at least one protective layer 250, and protective layer 250 is disposed on film 220a and the flexible pars convoluta F, to cover first line layer 212, tertiary circuit layer 240 and part second line layer 230.The material of protective layer 250 comprises polyimide resin or epoxy resin, to avoid the line layer oxidation.
In addition, the soft-hard plate structure 200 of present embodiment can be a rigid-flex finished product of having been carried out external form processing (routing) by the cutting forming machine, also can be the rigid-flex semi-finished product of not processing through external form as yet.
Below will introduce wherein a kind of manufacture method of soft-hard plate structure 200 in detail.
Fig. 3 A～Fig. 3 G is the flow process profile of manufacture method of the soft-hard plate structure of one embodiment of the invention.
At first, please refer to Fig. 3 A, a soft substrate 214 and a rigid substrate 216 are provided, and make rigid substrate 216 be engaged to left and right sides 214a, the 214b of soft substrate 214 to form a core board 210.The method that engages rigid substrate 216 and soft substrate 214 for example is to form an adhesion coating (not illustrating) between rigid substrate 216 and soft substrate 214, so that rigid substrate 216 is engaged by aforementioned adhesion coating with soft substrate 214.In addition, in other embodiment, core board 210 also can be to have only soft substrate 214.
Please refer to Fig. 3 B, core board 210, two films 220 and second conductive layer 310 are provided.Core board 210 has a soft substrate 214 and first conductive layer 320, and soft substrate 214 has at least one flexible pars convoluta F, and these first conductive layers 320 are disposed at respectively on the F1 of both sides up and down, the F2 of flexible pars convoluta F.Film 220 is disposed between the core board 210 and second conductive layer 310, and film 220 has one first opening OP1 corresponding to flexible pars convoluta F, second conductive layer 310 has one second opening OP2 corresponding to the first opening OP1, or the second opening OP2 also can be greater than the first opening OP1.
Film 220 for example is a semi-solid preparation film, and the material of semi-solid preparation film can be polyimide or epoxy resin, and its polymer is uncrosslinked to be the shape that can flow as the time spent, then has the deformation behavior of fluid and the particle coacervation characteristic of solid at normal temperatures simultaneously.When the semi-solid preparation film is heated, then no longer include the deformation behavior of fluid, but thermoset forming becomes the film of cure states.Please referring again to Fig. 3 B, in present embodiment, core board 210 also can comprise the 4th line layer 218, and these the 4th line layers 218 are disposed at respectively on the 216a of both sides up and down, the 216b of rigid substrate 216.
Then, please refer to Fig. 3 C, pressing core board 210, film 220 and second conductive layer 310, and solidify film 220 so that it is transformed into the film 220a of cure states by semi-solid preparation attitude originally.The first opening OP1 exposes flexible pars convoluta F, and the inwall of the first opening OP1 is an inclined plane 222.The method that forms inclined plane 222 for example is that the film 220 by the semi-solid preparation attitude has the deformation behavior of fluid and the particle coacervation characteristic of solid at normal temperatures simultaneously, the film 220 of double cure states exert pressure so that the film 220 of semi-solid preparation attitude to the side overflow.It should be noted that in present embodiment the film 220 of semi-solid preparation attitude can be transformed into the film 220a of cure states by semi-solid preparation attitude originally through heating.
Then, please refer to Fig. 3 D, form the 3rd conductive layer 330 on the inclined plane 222 of film 220a, to connect second conductive layer 310 and first conductive layer 320.In addition, form for example physical vapour deposition (PVD) or the plating of method of the 3rd conductive layer 330.
It should be noted that present embodiment is to form the 3rd conductive layer 330 on the inclined plane 222 of flexible pars convoluta F and film 220a.Compared to known conductive channel C (please refer to Fig. 1) is to be formed among the blind hole V of high-aspect-ratio, and the 3rd conductive layer 330 of present embodiment is formed on the inclined plane 222, so the technology of present embodiment is more or less freely.And because present embodiment need not form known blind hole V (please refer to Fig. 1), so present embodiment can avoid because of forming the glue slag that blind hole V is produced, and then the electrical quality of the soft-hard plate structure that forms after helping to promote.
Afterwards, please refer to Fig. 3 E, patterning second conductive layer 310 and first conductive layer 320 and the 3rd conductive layer 330, forming the second line layer 310a, the first line layer 320a and tertiary circuit layer 330a respectively, and for example photoetching etching of method of patterning second conductive layer 310, first conductive layer 320 and the 3rd conductive layer 330.
In addition; please refer to Fig. 3 F, in present embodiment, after forming the second line layer 310a and the first line layer 320a; also comprise and form at least one protective layer 250 on film 220a and flexible pars convoluta F, to cover the first line layer 320a, tertiary circuit layer 330a and the part second line layer 310a.
In addition, please refer to Fig. 3 G, in present embodiment, can also on the film 220a and the second line layer 310a, pile up in regular turn and other the film 220b and the second line layer 310b of pressing, and the number of times that piles up can be decided according to actual demand.
In sum, owing to tertiary circuit layer of the present invention is formed on the inclined plane of base openings, so the present invention does not need the extra known blind hole that forms.By as can be known aforementioned, technology of the present invention is comparatively simplified.In addition, also because the present invention need not form known blind hole, therefore the overlapping part of soft substrate and film accounts for the ratio reduction of soft substrate, and the flexible pars convoluta accounts for the ratio lifting of soft substrate.Thus, the pliability of soft-hard plate structure of the present invention is preferable.Moreover because the present invention need not form known blind hole, so the present invention can avoid because of forming the glue slag that blind hole produced, and then the electrical quality of the soft-hard plate structure that forms after helping to promote.In addition, be to be formed in the blind hole of high-aspect-ratio compared to known conductive channel, tertiary circuit layer of the present invention is formed on the inclined plane, and therefore technology of the present invention is more or less freely.
Though the present invention discloses as above with embodiment; right its is not in order to limit the present invention; any person with usual knowledge in their respective areas; without departing from the spirit and scope of the present invention; when can doing a little change and retouching, so protection scope of the present invention is when looking being as the criterion that the accompanying Claim scope defined.
Claims (11)
1. the manufacture method of a soft-hard plate structure is characterized in that, comprising:
One core board, a film and one second conductive layer are provided, this core board has a soft substrate and one first conductive layer, this soft substrate has a flexible pars convoluta, and this first conductive layer is disposed on this flexible pars convoluta, this film is disposed between this core board and this second conductive layer, and this film has one first opening corresponding to this flexible pars convoluta;
This core board of pressing, this film and this second conductive layer, and solidify this film, this first opening exposes this flexible pars convoluta, and the inwall of this first opening is an inclined plane;
On this inclined plane, form one the 3rd conductive layer to connect this second conductive layer and this first conductive layer; And
This first conductive layer of patterning, this second conductive layer and the 3rd conductive layer are to form one first line layer, one second line layer and a tertiary circuit layer respectively.
2. the manufacture method of soft-hard plate structure as claimed in claim 1; it is characterized in that; wherein after forming this first line layer and this second line layer; also comprise forming a protective layer on this film and this flexible pars convoluta, to cover this first line layer, this tertiary circuit layer and this second line layer of part.
3. the manufacture method of soft-hard plate structure as claimed in claim 1 is characterized in that, wherein this film is a semi-solid preparation film, the material polyimide resin or the epoxy resin of this semi-solid preparation film.
4. the manufacture method of soft-hard plate structure as claimed in claim 3 is characterized in that, the method for wherein solidifying this film comprises this film of heating semi-solid preparation attitude.
5. the manufacture method of soft-hard plate structure as claimed in claim 1 is characterized in that, the method that wherein forms the 3rd conductive layer comprises physical vapour deposition (PVD) or plating.
6. the manufacture method of soft-hard plate structure as claimed in claim 1 is characterized in that, wherein the method for this first conductive layer of patterning, this second conductive layer and the 3rd conductive layer comprises the photoetching etching.
7. a soft-hard plate structure is characterized in that, comprising:
One core board, it comprises a soft substrate and one first line layer, this soft substrate has a flexible pars convoluta, and this first line layer is disposed on this flexible pars convoluta;
One film is disposed on this core board, and this film exposes this flexible pars convoluta, and this film sidewall adjacent with this flexible pars convoluta is an inclined plane;
One second line layer is disposed on this film; And
One tertiary circuit layer is disposed at this inclined plane to connect this first line layer and this second line layer.
8. soft-hard plate structure as claimed in claim 7 is characterized in that, also comprises a protective layer, and it is disposed on this film and this flexible pars convoluta, to cover this first line layer, this tertiary circuit layer and this second line layer of part.
9. soft-hard plate structure as claimed in claim 8 is characterized in that wherein the material of this protective layer comprises polyimide resin or epoxy resin.
10. soft-hard plate structure as claimed in claim 7 is characterized in that, wherein the material of this soft substrate is the polyimide resin.
11. soft-hard plate structure as claimed in claim 7 is characterized in that, wherein this core board also comprises a rigid substrate, and this rigid substrate engages with the left and right sides of this soft substrate.
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| Application Number | Priority Date | Filing Date | Title |
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| CN2008101377688A CN101631431B (en) | 2008-07-18 | 2008-07-18 | Soft-hard plate structure and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2008101377688A CN101631431B (en) | 2008-07-18 | 2008-07-18 | Soft-hard plate structure and manufacturing method thereof |
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| CN101631431A CN101631431A (en) | 2010-01-20 |
| CN101631431B true CN101631431B (en) | 2011-05-04 |
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| CN2008101377688A Active CN101631431B (en) | 2008-07-18 | 2008-07-18 | Soft-hard plate structure and manufacturing method thereof |
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| CN113498249B (en) * | 2020-04-07 | 2023-11-10 | 庆鼎精密电子（淮安）有限公司 | Soft-hard combined circuit board and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1347276A (en) * | 2000-10-09 | 2002-05-01 | 耀华电子股份有限公司 | Method for making multi-layer PCB composed of flexible and rigid layers |
| CN101150111A (en) * | 2006-09-20 | 2008-03-26 | 欣兴电子股份有限公司 | Encapsulation base plate |
| CN101170877A (en) * | 2007-11-21 | 2008-04-30 | 健鼎（无锡）电子有限公司 | Combination method of soft and hard printed circuit board |
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2008
- 2008-07-18 CN CN2008101377688A patent/CN101631431B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1347276A (en) * | 2000-10-09 | 2002-05-01 | 耀华电子股份有限公司 | Method for making multi-layer PCB composed of flexible and rigid layers |
| CN101150111A (en) * | 2006-09-20 | 2008-03-26 | 欣兴电子股份有限公司 | Encapsulation base plate |
| CN101170877A (en) * | 2007-11-21 | 2008-04-30 | 健鼎（无锡）电子有限公司 | Combination method of soft and hard printed circuit board |
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| CN101631431A (en) | 2010-01-20 |
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Owner name: UNIFLEX TECHNOLOGY (KUNSHAN) INC. Free format text: FORMER OWNER: XINXING ELECTRONICS CO., LTD. Effective date: 20120216 |
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Effective date of registration: 20120216 Address after: Kunshan City, Jiangsu province Hanpu road 215316 No. 999 Patentee after: UNIMICRON-FPC TECHNOLOGY (KUNSHAN) CORP. Address before: Chinese Taiwan Taoyuan City Patentee before: Xinxing Electronics Co., Ltd. |