CN111836469A - Circuit substrate preparation method and circuit substrate - Google Patents
Circuit substrate preparation method and circuit substrate Download PDFInfo
- Publication number
- CN111836469A CN111836469A CN202010514391.4A CN202010514391A CN111836469A CN 111836469 A CN111836469 A CN 111836469A CN 202010514391 A CN202010514391 A CN 202010514391A CN 111836469 A CN111836469 A CN 111836469A
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- China
- Prior art keywords
- copper foil
- release film
- circuit substrate
- substrate
- circuit
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
- H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention provides a circuit substrate preparation method, which comprises the following steps of S1, etching a copper foil layer of a copper foil substrate to obtain a copper foil circuit; step S2, attaching and fixing a release film on one side, far away from the copper foil layer, of the insulating medium layer of the copper foil substrate; step S3, laser is conducted on the copper foil substrate to form blind holes which penetrate through the release film and the insulating medium layer in sequence; step S4, filling a conductive paste into the blind hole of the copper foil substrate and enabling the conductive paste to be flush with the release film; step S5, removing the release film; step S6, stacking and stitching the plurality of copper foil substrates processed in steps S1 to S5 in sequence to obtain the circuit substrate. The invention provides a circuit substrate manufactured by using a circuit substrate manufacturing method. Compared with the prior art, the preparation method of the circuit substrate and the circuit substrate have simple process and high reliability.
Description
Technical Field
The invention relates to the field of circuit substrates, in particular to a circuit substrate preparation method and a circuit substrate.
Background
With the rapid development of electronic technology in recent years, electronic products are being developed in the directions of being small, light and thin, and printed circuit boards are also being developed in the directions of being small, light and high in density. One key process for achieving layer-to-layer interconnection of circuit substrates for higher density circuit boards is microporation, i.e., microporation between layers connecting the circuit substrates. The conductive paste has good processability and conductive effect, and is introduced into the micropores of the circuit substrate to form a conductive paste plug micropore structure, so that the flexibility of the interconnection design of the holes of the printed circuit board can be improved, and the support is provided for realizing a printed circuit product with complex functions.
At present, the conductive paste micropore process of the related art specifically comprises: after the blind holes of the circuit substrate are radiussed, glue residues at the bottom of the blind holes are removed through plasma treatment, the blind holes are filled with printed copper paste, and the circuit substrate after the blind holes are filled is pressed to achieve conduction between layers.
However, at present, because the conductive paste technology is immature, the prior art cannot accurately control the amount of the copper paste, specifically: and if the amount of the copper paste is too thin, the risk that the electrical conduction between layers is difficult to realize is caused. In addition, if the copper paste is too thick, more copper paste residues are generated, and the bonding force of a multi-layer board of the circuit substrate is easily unqualified, so that the reliability of the circuit substrate is caused, and the quality defect of a product is caused.
Therefore, it is necessary to provide a new circuit substrate preparation method and a circuit substrate to solve the above problems.
Disclosure of Invention
The invention aims to provide a circuit substrate preparation method and a circuit substrate, which are simple in process and high in reliability.
In order to solve the technical problem, the invention provides a circuit substrate preparation method, wherein the circuit substrate comprises a multilayer copper foil substrate, the copper foil substrate comprises an insulating medium layer and a copper foil layer coated on one side surface of the insulating medium layer, and the method comprises the following steps of S1, etching the copper foil layer of the copper foil substrate to obtain a copper foil circuit; step S2, attaching and fixing a release film to one side, far away from the copper foil layer, of the insulating medium layer of the copper foil substrate; step S3, laser is conducted on the copper foil substrate to form blind holes which penetrate through the release film and the insulating medium layer in sequence; the blind hole is connected with the copper foil layer; step S4, filling conductive paste into the blind holes of the copper foil substrate and enabling the conductive paste to be flush with the release film; step S5, removing the release film; step S6, sequentially stacking and laminating the plurality of copper foil substrates processed in the steps S1 to S5 to obtain the circuit substrate; and the copper foil circuits of two adjacent copper foil layers are electrically connected through the conductive paste respectively connected with the same blind hole or two superposed blind holes.
Preferably, the step S4 is preceded by: and step S40, treating the release film and the blind holes by plasma to clean the copper foil substrate.
More preferably, the thickness of the release film is 25 micrometers.
Preferably, in step S2, the release film and the insulating medium layer are bonded and fixed by a glue layer with a thickness of 3 microns.
Preferably, the release film and the insulating medium layer are pressed and fixed by a laminator at 100 ℃ and 7 kg.
Preferably, the conductive paste is copper paste.
Preferably, in step S6, the circuit board is obtained by pressing the plurality of copper foil substrates at one time.
The invention also provides a circuit substrate, and the circuit substrate is prepared by the circuit substrate preparation method.
Compared with the prior art, the circuit substrate preparation method and the circuit substrate provided by the invention have the advantages that the copper foil layer of the copper foil substrate is etched to obtain the copper foil circuit through the step S1; step S2, attaching and fixing a release film on one side, far away from the copper foil layer, of the insulating medium layer of the copper foil substrate; step S3, laser is conducted on the copper foil substrate to form blind holes which penetrate through the release film and the insulating medium layer in sequence; step S4, filling a conductive paste into the blind hole of the copper foil substrate and enabling the conductive paste to be flush with the release film; step S5, removing the release film; step S6, stacking and stitching the plurality of copper foil substrates processed in steps S1 to S5 in sequence to obtain the circuit substrate. The process adopts the conductive paste to fill the blind holes, so that the manufacturing flow can be simplified, the process is simple, the interconnection among any number of layers is realized, the physical space of wiring is increased, and the support is provided for realizing more complex-function printed circuit products. In addition, the release film is matched with the filling hole of the conductive paste, so that the content of the conductive paste can be effectively controlled, the product quality is improved, and the reliability is improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without inventive efforts, wherein:
FIG. 1 is a block flow diagram of a method for fabricating a circuit substrate according to the present invention;
FIG. 2 is a schematic view of step S1 of the method for manufacturing a circuit substrate according to the present invention;
FIG. 3 is a schematic view of step S2 of the method for manufacturing a circuit substrate according to the present invention;
FIG. 4 is a schematic view of step S3 of the method for manufacturing a circuit substrate according to the present invention;
FIG. 5 is a schematic view of step S40 of the method for manufacturing a circuit substrate according to the present invention;
FIG. 6 is a schematic view of step S4 of the method for manufacturing a circuit substrate according to the present invention;
FIG. 7 is a schematic view of step S5 of the method for manufacturing a circuit substrate according to the present invention;
FIG. 8 is a schematic view showing the pressing of two copper foil substrates in step S6 of the method for manufacturing a circuit board according to the present invention;
FIG. 9 is a schematic view of the circuit substrate in step S6 of the method for manufacturing a circuit substrate according to the present invention;
fig. 10 is a flowchart of step S40 of the method for manufacturing a circuit substrate according to the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-10, the present invention provides a method for manufacturing a circuit substrate. The method is used to prepare the circuit substrate 100. The circuit substrate 100 includes a multilayer copper foil substrate 10.
In the present embodiment, the copper foil substrate 10 is made of a liquid crystal polymer. The Liquid Crystal POLYMER (LCP) is a novel high POLYMER material, can withstand gas phase welding and infrared welding used in surface assembly technology, and can be used in electronics and electrics, because the surface assembly welding technology of electronics and electrics has high requirements on the dimensional stability and heat resistance of the material. Particularly for printed circuit boards.
Specifically, the copper foil substrate 10 comprises a copper foil layer 1 and an insulating medium layer 2. And the copper foil layer 1 is covered on the surface of one side of the insulating medium layer 2.
The preparation method of the circuit substrate comprises the following steps:
step S1, etching the copper foil layer 1 of the copper foil substrate 10 to obtain a copper foil circuit 12 and a copper foil circuit gap 11.
Step S2, attaching and fixing a release film 3 to one side, far away from the copper foil layer 1, of the insulating medium layer 2 of the copper foil substrate 10.
In step S2, the release film 3 and the insulating medium layer 2 are fixed by a glue layer 6 with a thickness of 3 μm. The thickness of the glue layer 6 is small, so that the thickness of the copper paste plug hole is not influenced while the adhesive force is ensured.
In this embodiment, the release film 3 and the insulating medium layer 2 are pressed and fixed by a laminator at 100 ℃ and 7 kg. Wherein, the laminator can select manual laminator. The pressfitting through this condition is fixed, avoid producing the bubble at the press mold in-process from type membrane 3, be favorable to improving the reliability.
And step S3, radiusing the copper foil substrate 10 to form blind holes 4 which sequentially penetrate through the release film 3 and the insulating medium layer 2. The blind holes 4 are used for realizing the conduction of the copper foil circuits 12 of two adjacent layers.
Wherein, the blind hole 4 is connected with the copper foil layer 1.
In this embodiment, in order to better implement the subsequent processes, the copper foil substrate 10 needs to be cleaned. Specifically, the method for manufacturing a circuit substrate further includes: step S40, the release film 3 and the blind via 4 are treated by plasma to clean the copper foil substrate 10.
In step S3, the laser processing leaves impurities 7 such as a paste lump on the surface of the release film 3 and in the blind hole 4. Because the aperture of the blind hole 4 is small, the small impurities 7 can be removed completely by adopting plasma treatment, and the subsequent filling of the blind hole 4 with conductive substances is facilitated.
Step S4, filling the blind via 4 of the copper foil substrate 10 with a conductive paste 5 and making the conductive paste flush with the release film.
In this embodiment, the conductive paste 5 is a copper paste. The copper paste has good conductivity. And filling the conductive paste 5 into the blind holes 4 by adopting a copper paste printing mode. The conductive paste 5 is adopted to replace electroplating for hole filling, so that the manufacturing process can be simplified, and the process is simple.
And step S5, removing the release film 3.
In this embodiment, the thickness of the release film 3 is 25 μm. The thickness of the release film 3 is increased by one more layer, so that the allowance of the conductive paste 5 is satisfied that the layer-to-layer open circuit caused by the fact that the paste amount of the conductive paste 5 is reduced after pressing does not occur, and in addition, the quality defect of a product caused by the fact that the conductive paste 5 is remained thick due to the fact that the thickness of the release film 3 is small does not occur. By adopting the release film 3 to match with the hole filling of the conductive paste 5, the content of the conductive paste 5 can be effectively controlled, the product quality is improved, and the reliability is improved.
Step S6, sequentially stacking and pressing the plurality of copper foil substrates 10 processed in the steps S1 to S5 to obtain the circuit substrate 100.
The copper foil circuits 12 of two adjacent copper foil layers 1 are electrically connected through the conductive paste 5 respectively connected with the same blind hole 4 or two superposed blind holes 4. In the process, the conductive paste 5 is adopted to fill the blind holes 4, so that the manufacturing process can be simplified, the process is simple, the interconnection among any layers is realized, the physical space of wiring is increased, and the support is provided for realizing more complex-function printed circuit products.
In this embodiment, the circuit board 100 is obtained by pressing a plurality of copper foil substrates 10 at one time. The processing technology of one-time pressing after lamination is adopted, which is beneficial to the mechanical stability of the product, thereby improving the reliability.
The invention also provides a circuit substrate 100, and the circuit substrate 100 is prepared by the circuit substrate preparation method.
Compared with the prior art, the circuit substrate preparation method and the circuit substrate provided by the invention have the advantages that the copper foil layer of the copper foil substrate is etched to obtain the copper foil circuit through the step S1; step S2, attaching and fixing a release film on one side, far away from the copper foil layer, of the insulating medium layer of the copper foil substrate; step S3, laser is conducted on the copper foil substrate to form blind holes which penetrate through the release film and the insulating medium layer in sequence; step S4, filling a conductive paste into the blind hole of the copper foil substrate and enabling the conductive paste to be flush with the release film; step S5, removing the release film; step S6, stacking and stitching the plurality of copper foil substrates processed in steps S1 to S5 in sequence to obtain the circuit substrate. The process adopts the conductive paste to fill the blind holes, so that the manufacturing flow can be simplified, the process is simple, the interconnection among any number of layers is realized, the physical space of wiring is increased, and the support is provided for realizing more complex-function printed circuit products. In addition, the release film is matched with the filling hole of the conductive paste, so that the content of the conductive paste can be effectively controlled, the product quality is improved, and the reliability is improved.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by using the contents of the present specification and the accompanying drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (8)
1. A circuit substrate preparation method is characterized by comprising the following steps of:
step S1, etching the copper foil layer of the copper foil substrate to obtain a copper foil circuit;
step S2, attaching and fixing a release film to one side, far away from the copper foil layer, of the insulating medium layer of the copper foil substrate;
step S3, laser is conducted on the copper foil substrate to form blind holes which penetrate through the release film and the insulating medium layer in sequence; the blind hole is connected with the copper foil layer;
step S4, filling conductive paste into the blind holes of the copper foil substrate and enabling the conductive paste to be flush with the release film;
step S5, removing the release film;
step S6, sequentially stacking and laminating the plurality of copper foil substrates processed in the steps S1 to S5 to obtain the circuit substrate; and the copper foil circuits of two adjacent copper foil layers are electrically connected through the conductive paste respectively connected with the same blind hole or two superposed blind holes.
2. The method for manufacturing a circuit board according to claim 1, wherein the step S4 is preceded by: and step S40, treating the release film and the blind holes by plasma to clean the copper foil substrate.
3. The method for manufacturing a circuit substrate according to claim 1, wherein the release film has a thickness of 25 μm.
4. The method for manufacturing a circuit board according to claim 3, wherein in the step S2, the release film and the insulating medium layer are bonded and fixed by a glue layer with a thickness of 3 μm.
5. The method for manufacturing a circuit board according to claim 4, wherein the release film and the insulating medium layer are pressed and fixed by a laminator at a temperature of 100 ℃ and a pressure of 7 kg.
6. The method of manufacturing a circuit substrate according to claim 1, wherein the conductive paste is a copper paste.
7. The method for manufacturing a circuit board according to claim 1, wherein in the step S6, the circuit board is obtained by pressing a plurality of the copper foil substrates at one time.
8. A circuit substrate produced by the method for producing a circuit substrate according to any one of claims 1 to 7.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010514391.4A CN111836469A (en) | 2020-06-08 | 2020-06-08 | Circuit substrate preparation method and circuit substrate |
| PCT/CN2020/101272 WO2021248612A1 (en) | 2020-06-08 | 2020-07-10 | Circuit substrate preparation method and circuit substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010514391.4A CN111836469A (en) | 2020-06-08 | 2020-06-08 | Circuit substrate preparation method and circuit substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111836469A true CN111836469A (en) | 2020-10-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010514391.4A Pending CN111836469A (en) | 2020-06-08 | 2020-06-08 | Circuit substrate preparation method and circuit substrate |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN111836469A (en) |
| WO (1) | WO2021248612A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114554681B (en) * | 2022-03-28 | 2024-04-12 | 黄石永兴隆电子有限公司 | Circuit board with stepped blind holes |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011077488A (en) * | 2009-10-01 | 2011-04-14 | Samsung Electro-Mechanics Co Ltd | Method of manufacturing printed circuit board |
| CN102595799A (en) * | 2011-12-30 | 2012-07-18 | 柏承科技(昆山)股份有限公司 | Manufacturing method of high-density interconnected printed circuit board |
| CN103582321A (en) * | 2012-07-19 | 2014-02-12 | 富葵精密组件(深圳)有限公司 | Multilayer circuit board and manufacturing method thereof |
| CN103717013A (en) * | 2012-09-29 | 2014-04-09 | 上海美维科技有限公司 | Manufacturing method for printed circuit board |
| CN103841771A (en) * | 2012-11-26 | 2014-06-04 | 北大方正集团有限公司 | Combined printed circuit board manufacturing method and printed circuit board |
| CN104349610A (en) * | 2013-07-24 | 2015-02-11 | 北大方正集团有限公司 | Manufacturing methods of printed circuit board daughter board and printed circuit board, and printed circuit board |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2937933B2 (en) * | 1997-03-24 | 1999-08-23 | 富山日本電気株式会社 | Manufacturing method of multilayer printed wiring board |
| CN1237855C (en) * | 2002-06-24 | 2006-01-18 | 威盛电子股份有限公司 | Method for making base plate conducting hole and wiring of circuit using printing mode |
| CN103281878A (en) * | 2013-06-13 | 2013-09-04 | 汕头超声印制板（二厂）有限公司 | Manufacturing method for printed circuit board with penetrating-through holes |
-
2020
- 2020-06-08 CN CN202010514391.4A patent/CN111836469A/en active Pending
- 2020-07-10 WO PCT/CN2020/101272 patent/WO2021248612A1/en active Application Filing
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011077488A (en) * | 2009-10-01 | 2011-04-14 | Samsung Electro-Mechanics Co Ltd | Method of manufacturing printed circuit board |
| CN102595799A (en) * | 2011-12-30 | 2012-07-18 | 柏承科技(昆山)股份有限公司 | Manufacturing method of high-density interconnected printed circuit board |
| CN103582321A (en) * | 2012-07-19 | 2014-02-12 | 富葵精密组件(深圳)有限公司 | Multilayer circuit board and manufacturing method thereof |
| CN103717013A (en) * | 2012-09-29 | 2014-04-09 | 上海美维科技有限公司 | Manufacturing method for printed circuit board |
| CN103841771A (en) * | 2012-11-26 | 2014-06-04 | 北大方正集团有限公司 | Combined printed circuit board manufacturing method and printed circuit board |
| CN104349610A (en) * | 2013-07-24 | 2015-02-11 | 北大方正集团有限公司 | Manufacturing methods of printed circuit board daughter board and printed circuit board, and printed circuit board |
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| Publication number | Publication date |
|---|---|
| WO2021248612A1 (en) | 2021-12-16 |
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Application publication date: 20201027 |