CN114554681B - Circuit board with stepped blind holes - Google Patents
Circuit board with stepped blind holes Download PDFInfo
- Publication number
- CN114554681B CN114554681B CN202210313476.5A CN202210313476A CN114554681B CN 114554681 B CN114554681 B CN 114554681B CN 202210313476 A CN202210313476 A CN 202210313476A CN 114554681 B CN114554681 B CN 114554681B
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- circuit board
- blind hole
- holes
- blind
- stepped
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- 239000000758 substrate Substances 0.000 claims abstract description 27
- 239000007788 liquid Substances 0.000 claims abstract description 26
- 239000011148 porous material Substances 0.000 claims abstract description 15
- 239000003292 glue Substances 0.000 claims abstract description 14
- 239000000084 colloidal system Substances 0.000 claims abstract description 12
- 238000009713 electroplating Methods 0.000 claims abstract description 10
- 238000002347 injection Methods 0.000 claims abstract description 10
- 239000007924 injection Substances 0.000 claims abstract description 10
- 238000004891 communication Methods 0.000 claims abstract description 7
- 230000017525 heat dissipation Effects 0.000 claims abstract description 7
- 230000007246 mechanism Effects 0.000 claims description 26
- 239000010410 layer Substances 0.000 claims description 25
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 17
- 229910021389 graphene Inorganic materials 0.000 claims description 17
- 239000004964 aerogel Substances 0.000 claims description 16
- 239000003973 paint Substances 0.000 claims description 13
- 238000004080 punching Methods 0.000 claims description 13
- 238000007789 sealing Methods 0.000 claims description 10
- 239000011248 coating agent Substances 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 8
- 238000012545 processing Methods 0.000 claims description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- 230000001680 brushing effect Effects 0.000 claims description 6
- 239000002356 single layer Substances 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 5
- 238000002360 preparation method Methods 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000000945 filler Substances 0.000 claims description 3
- 238000011049 filling Methods 0.000 claims description 3
- 238000002955 isolation Methods 0.000 claims description 3
- 238000001459 lithography Methods 0.000 claims description 3
- 238000011068 loading method Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 239000002994 raw material Substances 0.000 claims description 3
- 229920001971 elastomer Polymers 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 239000000565 sealant Substances 0.000 claims 2
- 239000004816 latex Substances 0.000 claims 1
- 229920000126 latex Polymers 0.000 claims 1
- 230000006978 adaptation Effects 0.000 abstract description 6
- 210000000416 exudates and transudate Anatomy 0.000 abstract description 4
- 238000010521 absorption reaction Methods 0.000 abstract description 3
- 239000000243 solution Substances 0.000 description 10
- 238000010586 diagram Methods 0.000 description 4
- 230000035939 shock Effects 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 1
- 238000007743 anodising Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a circuit board with stepped blind holes, which belongs to the technical field of circuit boards and comprises a circuit board main body and a movably connected fixing frame, wherein a plurality of stepped blind holes are formed in the top of the circuit board main body through laser, liquid draining pore canals are formed in stepped blind inner cavities, and conical grooves are formed in the stepped blind inner cavities. According to the invention, stepped energy absorption arrangement of an electroplated layer is realized through the plurality of stepped cavities in the blind hole seat, heat dissipation and overflow of electroplating liquid and blind holes can be realized through the branch holes and the liquid discharge holes, the permeation of exudates to the outside of the substrate is avoided through the stepped cavities, the relative physical strength of the blind hole seat is improved through the permeation of the exudates, the communication precision between inner and outer circuits is improved, the bonding tightness of two-side circuit board main bodies is realized through bonding colloid, precise glue injection is realized through two-side glue injection holes, the mounting adaptation capability of the circuit board substrate is ensured, and the adaptability to external impact is ensured.
Description
Technical Field
The invention belongs to the technical field of circuit boards, and particularly relates to a circuit board with stepped blind holes.
Background
The circuit board is an integrated circuit base member miniaturized by a circuit, and the circuit board is fully utilized by cushion layout, so that in order to communicate a multi-layer circuit, an electroplating process is generally required to connect an inner layer with an outer layer to perform conductive plating.
The blind holes are called blind vias because the outermost layer circuit in the printed circuit board is connected with the adjacent inner layer by electroplating holes, the blind vias are mostly simple via pile structures, the smooth surface of the circuit layer after electroplating has insufficient impact resistance, the surface of the blind vias is easy to crack due to external impact, the conductive circuit is affected, and then the communication precision between the inner layer circuit and the outer layer circuit is caused, meanwhile, the mounting adaptation capability to the circuit board substrate is lacked, the whole working heat of the circuit board is easily piled at the cross-linking position of the blind hole, meanwhile, the certain shock resistance capability is lacked, and the use requirement cannot be well met.
Disclosure of Invention
The invention aims at: in order to solve the problem that most of circuit hole blind holes are of simple hole pile structures, the smooth surface of a circuit layer after electroplating is insufficient in impact resistance, the surface of the circuit layer is easy to crack due to external impact, a conductive circuit is influenced, and then communication precision between inner and outer layers of circuits is caused, meanwhile, the circuit board is lack of installation adaptation capability to a circuit board substrate, the whole working heat of the circuit board is easy to pile at a blind hole crosslinking position, and the working precision of a final product is influenced.
In order to achieve the above purpose, the present invention adopts the following technical scheme:
the circuit board comprises a circuit board main body and a movably connected fixing frame, wherein a plurality of stepped blind hole mechanisms are arranged at the top of the circuit board main body through laser, liquid draining pore canals are arranged in inner cavities of the stepped blind hole mechanisms, conical grooves are formed in the inner cavities of the stepped blind hole mechanisms, modified paint is coated in the conical grooves, a plurality of assembly sets are embedded in the top of the circuit board main body, and an assembly mechanism is connected at the bottom of the fixing frame in a sliding mode;
the assembly devices includes the slide, the laminating mutually with mount one side of slide one side, the spout has been seted up to slide one side, sliding connection has the slider in the spout, and fixedly connected with slide between the slider of both sides, slide top and mount bottom and circuit board main part bottom laminate mutually, and fixedly connected with bottom plate between the slide of both sides, bottom plate top fixedly connected with a plurality of elastic washers, elastic washer top and slide bottom fixed connection, the cross section shape of slider and spout is the T shape, elastic washer inner chamber fixed mounting has a plurality of supporting shoe, spacing hole has all been seted up at supporting shoe one side both ends, and is connected with the inserted bar in the spacing hole, and the both sides inserted bar passes elastic washer downside and extend to the elastic washer outside, and fixedly connected with insulating block between the both sides inserted bar is terminal, elastic washer inner chamber top inlays and is equipped with a plurality of inserted holes, and the supporting shoe passes through top inserted block and inserts to be connected in the inserted hole, supporting shoe cross section shape is the arc.
As a further description of the above technical solution:
the assembly devices includes the slide, slide one side is laminated mutually with mount one side, the spout has been seted up to slide one side, sliding connection has the slider in the spout, and fixedly connected with slide between the both sides slider, the slide top is laminated mutually with mount bottom and circuit board main part bottom, and fixedly connected with bottom plate between the both sides slide, a plurality of elasticity washers of bottom plate top fixedly connected with, elasticity washer top and slide bottom fixed connection, the cross section shape of slider and spout is the T shape.
As a further description of the above technical solution:
the locating device is characterized in that locating columns are fixedly connected to four corners of the top of the sliding plate, locating holes are punched in positions, corresponding to the locating columns, of the four corners of the bottom of the fixing frame, the cross section of each locating hole and each locating column is circular, and a buffer rubber cushion is fixedly connected to the outer side wall of the bottom end of each locating column.
As a further description of the above technical solution:
the circuit board main body is double-layer spliced, the double-layer circuit board main bodies are bonded through bonding colloid, and the fixing frame and the bonding colloid are provided with glue injection holes at corresponding positions.
As a further description of the above technical solution:
the cross section of the inner cavity of the liquid discharge duct is L-shaped, and the liquid discharge duct extends to the top of the fixing frame.
As a further description of the above technical solution:
and sealing glue is filled between the fixing frame and the circuit board main body, and the sealing glue is sealing emulsion.
As a further description of the above technical solution:
the inner cavity of the assembly sleeve is circumferentially provided with a plurality of radiating blocks, and the assembly sleeve is an anodized insulating aluminum heat-conducting sleeve.
As a further description of the above technical solution:
the blind hole mechanism comprises a blind hole seat, wherein the blind hole seat is cast on the top of the circuit board main body, three stepped cavities are punched in the inner cavity of the blind hole seat, the stepped cavities of the blind hole seat are conical grooves, the diameters of the three stepped blind hole inner cavities are sequentially reduced from top to bottom, liquid draining pore canals are formed in two sides of the top of the blind hole seat, the liquid draining pore canals are communicated with the stepped cavities through branch holes, and modified paint is coated in the conical grooves.
As a further description of the above technical solution:
the blind hole mechanism comprises a blind hole seat, wherein the inner cavity of the blind hole seat is sequentially sleeved with three hole cavity sleeves from top to bottom, both sides of the top of the blind hole seat are respectively provided with a liquid draining hole, the liquid draining hole is communicated with the hole cavity sleeves at the corresponding positions through branch holes, the diameters of the inner parts of the hole cavity sleeves are sequentially reduced from top to bottom, and the inner cavities of the hole cavity sleeves are coated with modified paint.
A preparation process of a circuit board with stepped blind holes comprises the following steps: in particular comprising the following steps of the method,
s1, pre-burying a blind hole seat raw material in a position corresponding to a circuit substrate with the corresponding layer number through a die when the circuit board is injection molded, wherein the blind hole seat is preferably a foamed aluminum material with multiple airtight holes;
s2, after the circuit substrate is etched and processed, performing light-isolation setting outside the opening position of the blind hole, and brushing and filling the blind hole with paint, wherein the paint is graphene aerogel and covers the corresponding position at the top of the blind hole through brushing means;
s3, punching lithography equipment with three stations and different diameters by using micro laser beams, and sequentially punching blind holes with different diameters by using laser beams with different diameters, wherein the blind holes are in a step structure after the processing is finished;
s4, curing and adsorbing the graphene aerogel filler in the blind hole step structure after laser punching, loading the graphene aerogel in the airtight holes of the blind hole seat, and curing and plugging the redundant graphene aerogel in the liquid discharge pore channel through larger branch holes;
s5, after the processing of the single-layer circuit substrate is completed, merging the punched single-layer circuit substrate into a circuit board main body, and electroplating through blind holes among different circuit substrates to realize the electrical communication among the multi-layer circuit substrates;
s6, after the circuit substrate is combined and prepared into the circuit board main body, the circuit board main bodies on two sides are adhered into a multi-layer circuit board main body through adhesive colloid, and the circuit board main body is prepared.
In summary, due to the adoption of the technical scheme, the beneficial effects of the invention are as follows:
1. according to the invention, through the designed sliding seat and sliding plate, the sliding plate can extrude the bottom elastic gasket, the elastic gasket can support the top circuit board main body through self strength, shaking deflection of the circuit board main body is avoided, the elastic gasket can extrude the bottom insulating block when receiving impact, the insulating block can isolate static electricity at the edge of the circuit board, the assembly safety is improved, meanwhile, the arc-shaped supporting block can ensure the arc-shaped energy absorption effect, the assembly activity is improved through modular assembly of the supporting block in the elastic gasket, the integral durable use requirement is met, the positioning column is quickly assembled and positioned through the positioning hole at the bottom, meanwhile, the axial limit of the positioning column is realized, shaking deflection of the fixing frame is avoided, the heat dissipation package requirement of the fixing bolt is realized through the assembly sleeve, and meanwhile, the heat dissipation block arranged in the assembly sleeve in a surrounding manner can meet the heat dissipation requirement while the support stress is improved.
2. According to the invention, stepped energy absorption arrangement of an electroplated layer is realized through the plurality of stepped cavities in the blind hole seat, heat dissipation and overflow of electroplating liquid and blind holes can be realized through the branch holes and the liquid discharge holes, the permeation of exudates to the outside of the substrate is avoided through the stepped cavities, the relative physical strength of the blind hole seat is improved through the permeation of the exudates, the communication precision between inner and outer circuits is improved, the bonding tightness of two-side circuit board main bodies is realized through bonding colloid, precise glue injection is realized through two-side glue injection holes, the mounting adaptation capability of the circuit board substrate is ensured, and the adaptability to external impact is ensured.
3. According to the invention, through the coating of the graphene aerogel on the blind hole during processing, the density of the graphene aerogel is lower, the graphene aerogel can enter the micropores in the blind hole seat through impact energy during laser punching, the influence of the graphene aerogel accumulated in the stepped hole cavity on the subsequent electroplating operation is avoided, and the conductive graphene enters the micropores in the blind hole seat, so that the modification enhancement of the blind hole seat and the electroplated layer is realized, the processing precision reinforcement of the blind hole is realized, and the requirement of large-scale production is met.
Drawings
Fig. 1 is a schematic perspective view of a circuit board with stepped blind holes according to the present invention;
fig. 2 is a schematic diagram of a front cross-sectional structure of a circuit board with stepped blind holes according to the present invention;
fig. 3 is a schematic cross-sectional front view of a circuit board with stepped blind holes according to the present invention;
FIG. 4 is a schematic diagram showing a front cross-sectional structure of a blind hole mechanism of a circuit board with stepped blind holes according to the present invention;
FIG. 5 is a schematic diagram showing a front cross-sectional structure of a blind hole mechanism of another embodiment of a circuit board with stepped blind holes according to the present invention;
fig. 6 is a schematic perspective cross-sectional view of an assembly sleeve of a circuit board with stepped blind holes according to the present invention;
fig. 7 is a schematic diagram of a three-dimensional assembly structure of an elastic washer of a circuit board with stepped blind holes according to the present invention.
Legend description:
1. a fixing frame; 2. an assembly mechanism; 201. a slide; 202. a slide block; 203. an elastic washer; 204. a bottom plate; 205. a support block; 206. an insulating block; 207. an insertion hole; 3. a blind hole mechanism; 301. a blind hole seat; 302. a liquid discharge duct; 303. a branch hole; 304. a stepped bore; 305. a conical groove; 306. a bore sleeve; 4. a slide plate; 5. positioning columns; 6. positioning holes; 7. a glue injection hole; 8. sealing glue; 9. a circuit board main body; 10. bonding colloid; 11. assembling a set; 12. and a heat dissipation block.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Example 1
Referring to fig. 1-7, the present invention provides a technical solution: the utility model provides a circuit board that contains notch cuttype blind hole, includes circuit board main part 9 and swing joint's mount 1, a plurality of notch cuttype blind hole mechanism 3 have been seted up through laser in circuit board main part 9 top, and notch cuttype blind hole mechanism 3 inner chamber has seted up flowing back pore 302, and notch cuttype blind hole mechanism 3 inner chamber is equipped with the taper groove 305, and the coating has modified coating in the taper groove 305, circuit board main part 9 top inlays and has had a plurality of dress subassemblies 11, blind hole mechanism 3 includes blind hole seat 301, blind hole seat 301 founds in circuit board main part 9 top, and the punching press of blind hole seat 301 inner chamber has seted up three stepped hole 304, and blind hole seat 301 stepped hole 304 is taper groove 305, and three stepped blind hole inner chamber diameter reduces in proper order from top to bottom, and the flowing back pore 302 has all been seted up to flowing back pore 302 through supporting hole 303 and stepped hole 304, and the coating has modified coating in the taper groove 305.
The implementation mode specifically comprises the following steps: in this embodiment, the adaptation capability to the laser drilling process is achieved through the plurality of stepped cavities 304 punched in the blind hole seat 301, and the coating can be distributed and loaded in the blind hole seat 301 through the micropores of the blind hole seat 301 by the liquid discharge pore canal 302 formed at the top of the blind hole seat 301, and meanwhile, excessive glue solution can overflow into the liquid discharge pore canal 302.
Example 2
As shown in fig. 5, unlike the embodiment 1, the blind hole mechanism 3 comprises a blind hole seat 301, wherein three hole cavities 306 are sleeved in the cavity of the blind hole seat 301 from top to bottom, the two sides of the top of the blind hole seat 301 are provided with liquid draining holes 302, the liquid draining holes 302 are communicated with the hole cavities 306 at corresponding positions through branch holes 303, the built-in diameters of the hole cavities 306 are reduced from top to bottom, and the cavity of the hole cavities 306 is coated with the modified paint.
The implementation mode specifically comprises the following steps: the pre-assembly of the blind hole seat 301 is realized through the three mutually nested hole cavity sleeves 306, so that the assembly precision of the hole cavity sleeves 306 can be effectively improved, the large-scale preparation of the hole cavity sleeves 306 is realized, and the production assembly precision required by a circuit board is met.
Example 3
As shown in fig. 1-3 and 6, a circuit board with a stepped blind hole comprises a circuit board main body 9 and a movably connected fixing frame 1, wherein a plurality of stepped blind hole mechanisms 3 are arranged at the top of the circuit board main body 9 through laser, a liquid discharging hole channel 302 is arranged in the inner cavity of the stepped blind hole mechanisms 3, a conical groove 305 is arranged in the inner cavity of the stepped blind hole mechanisms 3, a modified coating is coated in the conical groove 305, a plurality of assembling blocks 11 are embedded at the top of the circuit board main body 9, an assembling mechanism 2 is slidingly connected at the bottom of the fixing frame 1, the assembling mechanism 2 comprises a sliding seat 201, one side of the sliding seat 201 is jointed with one side of the fixing frame 1, a sliding groove is arranged at one side of the sliding seat 201, a sliding block 202 is slidingly connected between the sliding blocks 202 at two sides, a sliding plate 4 is fixedly connected between the top of the sliding plate 4 and the bottom of the fixing frame 1 and the bottom of the circuit board main body 9, a bottom plate 204 is fixedly connected between the sliding seats 201 on two sides, a plurality of elastic washers 203 are fixedly connected to the top of the bottom plate 204, the tops of the elastic washers 203 are fixedly connected with the bottom of the sliding plate 4, the cross sections of the sliding blocks 202 and the sliding grooves are T-shaped, a plurality of supporting blocks 205 are fixedly assembled in the inner cavity of the elastic washers 203, limiting holes are formed in two ends of one side of each supporting block 205, inserting rods are inserted and connected in the limiting holes, the inserting rods on two sides penetrate through the bottom side of the elastic washers 203 and extend to the outer side of the elastic washers 203, insulating blocks 206 are fixedly connected between the tail ends of the inserting rods on two sides, a plurality of inserting holes 207 are embedded in the top of the inner cavity of the elastic washers 203, the supporting blocks 205 are connected in the inserting holes 207 in an inserting mode through top inserting blocks, the cross sections of the supporting blocks 205 are arc-shaped, positioning columns 5 are fixedly connected to four corners of the top of the sliding plate 4, the utility model discloses a fixing frame, including fixing frame 1, locating column 5, fixing frame 1, sealing washer, assembly cover 11 inner chamber, sealing washer 8, a plurality of radiating blocks 12 have been encircleed to assembly cover 11 inner chamber, and assembly cover 11 is the insulating aluminium guide thermal cover of anodizing treatment, the locating hole 6 has been seted up with the punching press of locating column 5 corresponding position in locating column 5 in the four corners department of fixing frame 1 bottom, the cross sectional shape of locating hole 6 and locating column 5 is circular, and locating column 5 bottom lateral wall fixedly connected with buffering cushion, circuit board main part 9 bonds through bonding colloid 10 between the double-deck circuit board main part 9, and fixing frame 1 has seted up injecting glue hole 7 with bonding colloid 10 corresponding position, flowing back pore 302 inner chamber cross sectional shape is L type, flowing back pore 302 extends to fixing frame 1 top, still pack between fixing frame 1 and the circuit board main part 9 has sealing washer 8, and sealing washer 8 is sealing washer, assembly cover 11 inner chamber encircleed and has been arranged a plurality of radiating blocks 12.
The implementation mode specifically comprises the following steps: realize the shock attenuation support to slide 4 through elastic washer 203 to the slider 202 through slide 4 both sides T shape is more stable in the slip of slide 201 inner chamber, avoids slide 4 to take place the skew, improves circuit board shock attenuation energy-absorbing stability, can realize the quick assembly of top mount 1 simultaneously through reference column 5, and can carry out the injecting glue solidification between the circuit board main part 9 of both sides through injecting glue hole 7, realizes the quick bonding to circuit board main part 9 of both sides, satisfies the assembly adaptation ability of the circuit board main part 9 of multilayer mainboard, improves its operating condition stability.
A preparation process of a circuit board with stepped blind holes comprises the following steps: in particular comprising the following steps of the method,
s1, pre-burying a blind hole seat 301 raw material in a corresponding position of a circuit substrate with a corresponding layer number when the circuit board is injection molded through a die, wherein the blind hole seat 301 is preferably a multi-airtight foamed aluminum material;
s2, after the circuit substrate is etched and processed, performing light-isolation setting outside the opening position of the blind hole, and brushing and filling the blind hole with paint, wherein the paint is graphene aerogel and covers the corresponding position at the top of the blind hole through brushing means;
s3, punching lithography equipment with three stations and different diameters by using micro laser beams, and sequentially punching blind holes with different diameters by using laser beams with different diameters, wherein the blind holes are in a step structure after the processing is finished;
s4, curing and adsorbing the graphene aerogel filler in the blind hole step structure after laser punching, loading the graphene aerogel in the airtight holes of the blind hole seat 301, and curing and plugging the redundant graphene aerogel in the liquid discharge hole 302 through the larger branch holes 303;
s5, after the processing of the single-layer circuit substrate is completed, merging the punched single-layer circuit substrate into a circuit board main body 9, and electroplating through blind holes among different circuit substrates to realize the electrical communication among the multi-layer circuit substrates;
s6, after the circuit substrate combination is prepared into the circuit board main body 9, the circuit board main bodies 9 on two sides are bonded into the multi-layer circuit board main body 9 through the bonding colloid 10, and the preparation of the circuit board main body 9 is completed.
The foregoing is only a preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art, who is within the scope of the present invention, should make equivalent substitutions or modifications according to the technical scheme of the present invention and the inventive concept thereof, and should be covered by the scope of the present invention.
Claims (8)
1. The utility model provides a circuit board that contains ladder-type blind hole, includes circuit board main part (9) and swing joint's mount (1), its characterized in that, a plurality of ladder-type blind hole mechanism (3) have been seted up through laser in circuit board main part (9) top, and ladder-type blind hole mechanism (3) inner chamber has seted up flowing back pore canal (302), and ladder-type blind hole mechanism (3) inner chamber is equipped with taper groove (305), and the coating has modified paint in taper groove (305), a plurality of assembly pieces (11) are inlayed at circuit board main part (9) top, and mount (1) bottom sliding connection has assembly mechanism (2);
the assembly mechanism (2) comprises a slide seat (201), one side of the slide seat (201) is attached to one side of a fixing frame (1), a sliding groove is formed in one side of the slide seat (201), a sliding block (202) is connected in the sliding groove in a sliding way, a sliding plate (4) is fixedly connected between the sliding blocks (202) on two sides, the top of the sliding plate (4) is attached to the bottom of the fixing frame (1) and the bottom of a circuit board main body (9), a bottom plate (204) is fixedly connected between the sliding blocks (201) on two sides, a plurality of elastic washers (203) are fixedly connected to the top of the bottom plate (204), the tops of the elastic washers (203) are fixedly connected with the bottom of the sliding plate (4), the cross sections of the sliding block (202) and the sliding groove are T-shaped, the inner cavity of the elastic gasket (203) is fixedly provided with a plurality of supporting blocks (205), two ends of one side of the supporting blocks (205) are respectively provided with a limiting hole, the limiting holes are internally provided with inserting rods, the inserting rods at two sides penetrate through the bottom side of the elastic gasket (203) and extend to the outer side of the elastic gasket (203), insulating blocks (206) are fixedly connected between the tail ends of the inserting rods at two sides, the top of the inner cavity of the elastic gasket (203) is embedded with a plurality of inserting holes (207), the supporting blocks (205) are connected in the inserting holes (207) through top inserting blocks in an inserting mode, the cross section of each supporting block (205) is arc-shaped, the blind hole mechanism (3) comprises a blind hole seat (301), the blind hole seat (301) is fused and cast at the top of the circuit board main body (9), three step-shaped cavities (304) are formed in the inner cavity of the blind hole seat (301) in a punching mode, the step-shaped cavities (304) of the blind hole seat (301) are tapered grooves (305), the diameters of the three step-shaped blind hole inner cavities are sequentially reduced from top to bottom, liquid draining pore channels (302) are formed in two sides of the top of the blind hole seat (301), the liquid draining pore channels (302) are communicated with the step-shaped cavities (304) through branch holes (303), and modified paint is coated in the tapered grooves (305).
2. The circuit board with the stepped blind holes according to claim 1, wherein positioning columns (5) are fixedly connected to four corners of the top of the sliding plate (4), positioning holes (6) are punched in positions corresponding to the positioning columns (5) at four corners of the bottom of the fixing frame (1), the cross sections of the positioning holes (6) and the positioning columns (5) are circular, and buffer rubber pads are fixedly connected to the outer side walls of the bottom ends of the positioning columns (5).
3. The circuit board with the stepped blind holes according to claim 1, wherein the circuit board main body (9) is a double-layer spliced circuit board main body (9) and is bonded by an adhesive colloid (10), and the fixing frame (1) and the adhesive colloid (10) are provided with glue injection holes (7) at corresponding positions.
4. The circuit board with the stepped blind holes according to claim 1, wherein the cross section of the inner cavity of the liquid draining hole channel (302) is L-shaped, and the liquid draining hole channel (302) extends to the top of the fixing frame (1).
5. The circuit board with the stepped blind holes according to claim 1, wherein a sealant (8) is further filled between the fixing frame (1) and the circuit board main body (9), and the sealant (8) is sealing latex.
6. A circuit board with stepped blind holes according to claim 1, characterized in that the inner cavity of the assembly sleeve (11) is circumferentially arranged with a plurality of heat dissipation blocks (12), and the assembly sleeve (11) is an anodized insulating aluminum heat conducting sleeve.
7. The circuit board with the stepped blind holes according to claim 1, wherein the inner cavity of the blind hole seat (301) is sequentially sleeved with three hole cavity sleeves (306) from top to bottom, the liquid draining hole channels (302) are communicated with the hole cavity sleeves (306) at corresponding positions through branch holes (303), the built-in diameters of the hole cavity sleeves (306) are sequentially reduced from top to bottom, and the inner cavity of the hole cavity sleeves (306) is coated with modified paint.
8. The process for preparing a circuit board with stepped blind holes according to any one of claims 1 to 7, comprising: in particular comprising the following steps of the method,
s1, pre-burying a blind hole seat (301) raw material at a position corresponding to a circuit substrate with the corresponding layer number when the circuit board is injection molded through a die, wherein the blind hole seat (301) is made of multi-air-tight foamed aluminum material;
s2, after the circuit substrate is etched and processed, performing light-isolation setting outside the opening position of the blind hole, and brushing and filling the blind hole with paint, wherein the paint is graphene aerogel and covers the corresponding position at the top of the blind hole through brushing means;
s3, punching lithography equipment with three stations and different diameters by using micro laser beams, and sequentially punching blind holes with different diameters by using laser beams with different diameters, wherein the blind holes are in a step structure after the processing is finished;
s4, curing and adsorbing the graphene aerogel filler in the blind hole step structure after laser punching, loading the graphene aerogel in the airtight holes of the blind hole seat (301), and curing and plugging the redundant graphene aerogel in the liquid discharge hole channel (302) through the larger branch holes (303);
s5, after the processing of the single-layer circuit substrate is completed, merging the punched single-layer circuit substrate into a circuit board main body (9), and electroplating through blind holes among different circuit substrates to realize the electrical communication among the multi-layer circuit substrates;
s6, after the circuit substrate combination is prepared into a circuit board main body (9), the circuit board main bodies (9) on two sides are bonded into a multi-layer circuit board main body (9) through bonding colloid (10), and the preparation of the circuit board main body (9) is completed.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210313476.5A CN114554681B (en) | 2022-03-28 | 2022-03-28 | Circuit board with stepped blind holes |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210313476.5A CN114554681B (en) | 2022-03-28 | 2022-03-28 | Circuit board with stepped blind holes |
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| CN114554681B true CN114554681B (en) | 2024-04-12 |
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| WO2021248612A1 (en) * | 2020-06-08 | 2021-12-16 | 瑞声声学科技(深圳)有限公司 | Circuit substrate preparation method and circuit substrate |
| CN114222434A (en) * | 2021-11-09 | 2022-03-22 | 深圳市景旺电子股份有限公司 | Manufacturing method of step circuit and circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM576370U (en) * | 2018-09-28 | 2019-04-01 | 先豐通訊股份有限公司 | Circuit board structure |
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| JP2008235801A (en) * | 2007-03-23 | 2008-10-02 | Nippon Mektron Ltd | Multi-layer printed wiring board and manufacturing method therefor |
| WO2021248612A1 (en) * | 2020-06-08 | 2021-12-16 | 瑞声声学科技(深圳)有限公司 | Circuit substrate preparation method and circuit substrate |
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| CN114554681A (en) | 2022-05-27 |
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