CN114554681A - Circuit board that contains notch cuttype blind hole - Google Patents
Circuit board that contains notch cuttype blind hole Download PDFInfo
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- CN114554681A CN114554681A CN202210313476.5A CN202210313476A CN114554681A CN 114554681 A CN114554681 A CN 114554681A CN 202210313476 A CN202210313476 A CN 202210313476A CN 114554681 A CN114554681 A CN 114554681A
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- circuit board
- blind hole
- holes
- stepped
- main body
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- 239000007788 liquid Substances 0.000 claims abstract description 28
- 239000000758 substrate Substances 0.000 claims abstract description 24
- 239000003292 glue Substances 0.000 claims abstract description 14
- 239000000084 colloidal system Substances 0.000 claims abstract description 9
- 230000017525 heat dissipation Effects 0.000 claims abstract description 7
- 238000002347 injection Methods 0.000 claims abstract description 5
- 239000007924 injection Substances 0.000 claims abstract description 5
- 238000007789 sealing Methods 0.000 claims abstract description 5
- 230000007246 mechanism Effects 0.000 claims description 28
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 20
- 229910021389 graphene Inorganic materials 0.000 claims description 20
- 239000004964 aerogel Substances 0.000 claims description 19
- 239000010410 layer Substances 0.000 claims description 14
- 239000003973 paint Substances 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 9
- 238000000576 coating method Methods 0.000 claims description 8
- 238000004080 punching Methods 0.000 claims description 8
- 239000011148 porous material Substances 0.000 claims description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- 230000001680 brushing effect Effects 0.000 claims description 6
- 239000000945 filler Substances 0.000 claims description 6
- 239000002356 single layer Substances 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 4
- 230000000903 blocking effect Effects 0.000 claims description 3
- 230000003139 buffering effect Effects 0.000 claims description 3
- 238000001746 injection moulding Methods 0.000 claims description 3
- 238000002955 isolation Methods 0.000 claims description 3
- 239000004816 latex Substances 0.000 claims description 3
- 229920000126 latex Polymers 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 238000001259 photo etching Methods 0.000 claims description 3
- 238000002360 preparation method Methods 0.000 claims description 3
- 239000002994 raw material Substances 0.000 claims description 3
- 239000000565 sealant Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 229920001971 elastomer Polymers 0.000 claims 1
- 239000000243 solution Substances 0.000 abstract description 14
- 238000009713 electroplating Methods 0.000 abstract description 6
- 230000003044 adaptive effect Effects 0.000 abstract description 4
- 238000009434 installation Methods 0.000 abstract description 4
- 238000010521 absorption reaction Methods 0.000 abstract description 3
- 238000004891 communication Methods 0.000 abstract description 2
- 230000035939 shock Effects 0.000 description 6
- 238000012856 packing Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000002048 anodisation reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Abstract
The invention discloses a circuit board with stepped blind holes, which belongs to the technical field of circuit boards and comprises a circuit board main body and a movably connected fixing frame, wherein the top of the circuit board main body is provided with a plurality of stepped blind holes through laser, a liquid drainage hole channel is formed in a stepped blind inner cavity, and a conical groove is formed in the stepped blind inner cavity. According to the invention, the step-shaped energy absorption arrangement of the electroplated layer is realized through the step-shaped holes in the blind hole seat, the heat dissipation and overflow of the electroplating solution and the blind hole can be realized through the branch holes and the liquid discharge hole channels, the seepage of the seepage liquid to the outside of the substrate is avoided through the step-shaped holes, the relative physical strength of the blind hole seat is improved through the seepage of the seepage liquid, the communication precision between the inner layer circuit and the outer layer circuit is improved, the bonding sealing performance of the circuit board main bodies on two sides is realized through the bonding colloid, the precise glue injection is realized through the glue injection holes on two sides, the installation adaptive capacity of the circuit board substrate is ensured, and the adaptive capacity to external impact is ensured.
Description
Technical Field
The invention belongs to the technical field of circuit boards, and particularly relates to a circuit board with stepped blind holes.
Background
The circuit board is an integrated circuit base component with miniaturized circuits, the circuit board can be fully utilized through a cushion layer layout, and in order to communicate a multilayer circuit, the connection treatment of conductive coatings on an inner layer and an outer layer is generally required to be carried out by using an electroplating process.
The blind hole, be exactly connect with the plated hole between outermost circuit in the printed circuit board and the adjacent inlayer, because can't see the opposite, consequently, be called blind expert, current circuit hole blind hole is mostly simple hole stake structure, circuit layer smooth surface shock resistance is not enough after electroplating, its surface leads to breaking because of external shock easily, influence the conducting wire, and then lead to the intercommunication precision between the outer circuit of ectonexine, lack the installation adaptability to circuit board base plate simultaneously, the whole work heat of circuit board piles in blind hole crosslinked department easily, lack certain shock resistance simultaneously, the satisfied use needs that can not be fine.
Disclosure of Invention
The invention aims to: mostly be simple hole pile structure in order to solve some circuit hole blind holes, circuit layer smooth surface shock resistance is not enough after electroplating, its surface leads to breaking because of external impact easily, influence the conducting wire, and then lead to the intercommunication precision between the outer circuit of ectonexine, lack the installation adaptability to circuit board base plate simultaneously, circuit board whole work heat piles in blind hole crosslinked department easily, influence final product work precision's problem, and the circuit board that contains the notch cuttype blind hole that proposes.
In order to achieve the purpose, the invention adopts the following technical scheme:
a circuit board containing stepped blind holes comprises a circuit board main body and a movably connected fixing frame, wherein the top of the circuit board main body is provided with a plurality of stepped blind hole mechanisms through laser, liquid drainage channels are formed in the inner cavities of the stepped blind hole mechanisms, conical grooves are formed in the inner cavities of the stepped blind hole mechanisms, modified coatings are coated in the conical grooves, a plurality of assembling sets are embedded in the top of the circuit board main body, and the bottom of the fixing frame is connected with an assembling mechanism in a sliding mode;
the assembling mechanism comprises a slide seat, one side of the slide seat is attached to one side of a fixing frame, a sliding groove is formed in one side of the slide seat, a sliding block is connected in the sliding groove in a sliding mode, a sliding plate is fixedly connected between the sliding blocks on two sides, the top of the sliding plate is attached to the bottom of the fixing frame and the bottom of a circuit board main body, a bottom plate is fixedly connected between the slide seats on two sides, a plurality of elastic gaskets are fixedly connected to the top of the bottom plate, the cross sections of the sliding block and the sliding groove are T-shaped, a plurality of supporting blocks are fixedly assembled in inner cavities of the elastic gaskets, limiting holes are formed in two ends of one side of each supporting block, inserting rods are inserted and connected in the limiting holes, the inserting rods on two sides penetrate through the bottom sides of the elastic gaskets and extend to the outer sides of the elastic gaskets, insulating blocks are fixedly connected between the tail ends of the inserting rods on two sides, and a plurality of inserting holes are inserted in the top of the inner cavities of the elastic gaskets, and the supporting block is inserted and connected in the insertion hole through the top insertion block, and the cross section of the supporting block is arc-shaped.
As a further description of the above technical solution:
assembly devices includes the slide, slide one side is laminated mutually with mount one side, the spout has been seted up to slide one side, sliding connection has the slider in the spout, and fixedly connected with slide between the slider of both sides, the laminating of slide top and mount bottom and circuit board main part bottom, and fixedly connected with bottom plate between the slide of both sides, a plurality of elasticity packing rings of bottom plate top fixedly connected with, elasticity packing ring top and slide bottom fixed connection, the shape of cross section of slider and spout is T shape.
As a further description of the above technical solution:
the all fixedly connected with reference column of slide top four corners department, the locating hole has been seted up in the punching press of mount bottom four corners department and reference column corresponding position, the cross sectional shape of locating hole and reference column is circular, and reference column bottom lateral wall fixedly connected with buffering cushion.
As a further description of the above technical solution:
the circuit board main part is double-deck concatenation formula, and bonds through the bonding colloid between the double-deck circuit board main part, and the mount has seted up the notes gluey hole with the bonding colloid corresponds the position.
As a further description of the above technical solution:
the cross section of the inner cavity of the liquid discharge pore channel is L-shaped, and the liquid discharge pore channel extends to the top of the fixing frame.
As a further description of the above technical solution:
and a sealant is filled between the fixing frame and the circuit board main body and is sealing latex.
As a further description of the above technical solution:
a plurality of radiating blocks are arranged in the inner cavity of the assembly sleeve in a surrounding mode, and the assembly sleeve is an anodized insulating aluminum heat conduction sleeve.
As a further description of the above technical solution:
the blind hole mechanism comprises a blind hole seat, the blind hole seat is cast at the top of a circuit board main body, three stepped hole cavities are formed in the inner cavity of the blind hole seat in a stamping mode, the stepped hole cavities of the blind hole seat are conical grooves, the diameters of the three stepped inner cavities of the blind hole seat are sequentially reduced from top to bottom, liquid drainage channels are formed in two sides of the top of the blind hole seat, the liquid drainage channels are communicated with the stepped hole cavities through branch holes, and modified coating is coated in the conical grooves.
As a further description of the above technical solution:
the blind hole mechanism comprises a blind hole seat, wherein three hole cavity sleeves are sequentially sleeved on an inner cavity of the blind hole seat from top to bottom, liquid discharge pore channels are formed in two sides of the top of the blind hole seat and communicated with the hole cavity sleeves at corresponding positions through branch holes, the built-in diameters of the hole cavity sleeves are sequentially reduced from top to bottom, and the inner cavities of the hole cavity sleeves are coated with modified coatings.
A preparation process of a circuit board containing step-type blind holes comprises the following steps: the method specifically comprises the following steps of,
s1, embedding blind hole seat raw materials at corresponding positions of the circuit substrate with the corresponding number of layers during circuit board injection molding through a mold, wherein the blind hole seats are preferably foamed aluminum materials with multiple air-tight holes;
s2, after the circuit substrate is etched, performing light isolation setting outside the position where the blind hole is formed, and performing paint brushing on the blind hole, wherein the paint is formed by selecting graphene aerogel and covering the corresponding position at the top of the blind hole by a brushing method;
s3, punching the photoetching equipment by setting micro laser beams with different stations and different diameters, sequentially punching blind holes with different diameters by the laser beams with different diameters, and forming the machined blind holes into stepped structures;
s4, solidifying and adsorbing the graphene aerogel filler in the stepped structure of the blind hole after the graphene aerogel filler is punched by the laser, loading the graphene aerogel in the air-tight hole of the blind hole seat, and solidifying and blocking the redundant graphene aerogel in the liquid drainage hole channel through the larger branch hole;
s5, combining the punched single-layer circuit substrates into a circuit board main body after the single-layer circuit substrates are processed, and electrically communicating the multiple layers of circuit substrates after different circuit substrates are electroplated through blind holes;
and S6, after the circuit board main body is prepared by combining the circuit substrates, the circuit board main bodies on the two sides are bonded into a multilayer circuit board main body through bonding glue, and the circuit board main body is prepared.
In summary, due to the adoption of the technical scheme, the invention has the beneficial effects that:
1. in the invention, through the designed sliding seat and the sliding plate, the sliding plate can extrude the elastic gasket at the bottom when moving, the elastic gasket can support the circuit board main body at the top through the self strength, the circuit board main body is prevented from shaking and deviating due to shaking, and the elastic washer can extrude the bottom side insulating block when receiving impact, the insulating block can isolate the static electricity at the edge of the circuit board, the assembly safety is improved, meanwhile, the arc-shaped supporting block can ensure the arc-shaped energy absorption effect, the assembly activity is improved through the modularized assembly of the supporting block in the elastic washer, the integral durable use requirement is met, the positioning column is quickly assembled and positioned through the positioning hole at the bottom, the fixed frame is prevented from shaking and deviating through the axial limiting of the positioning column, the heat dissipation and wrapping requirements of the fixing bolt are realized through the assembling sleeve, meanwhile, the heat dissipation block arranged inside the assembly set in a surrounding mode can improve the supporting stress and meanwhile meet the requirement for heat dissipation.
2. According to the invention, the stepped energy absorption arrangement of the electroplated layer is realized through the stepped holes in the blind hole seat, the heat dissipation of the electroplating solution and the blind hole can be realized through the branch holes and the liquid discharge hole channels, the seepage of the percolate to the outside of the substrate is avoided through the stepped holes, the relative physical strength of the blind hole seat is improved through the seepage of the percolate, the communication precision between an inner layer circuit and an outer layer circuit is improved, the bonding sealing performance of circuit board main bodies on two sides is realized through bonding colloid, the precise glue injection is realized through the glue injection holes on two sides, the installation adaptive capacity of the circuit board substrate is ensured, and the adaptive capacity to external impact is ensured.
3. According to the invention, the blind hole is coated by adding the graphene aerogel during processing, the density of the graphene aerogel is low, the graphene aerogel can enter the micropores inside the blind hole seat through impact energy during laser punching, the phenomenon that the graphene aerogel is accumulated in the step-shaped hole cavity to affect subsequent electroplating operation is avoided, the conductive graphene enters the micropores inside the blind hole seat, the modification and the enhancement of the blind hole seat and an electroplated layer are realized, the processing precision reinforcement of the blind hole is realized, and the requirement of large-scale production is met.
Drawings
FIG. 1 is a schematic perspective view of a circuit board with stepped blind holes according to the present invention;
FIG. 2 is a schematic view of a front view cross-sectional structure of a circuit board with stepped blind holes according to the present invention;
FIG. 3 is a schematic view of a front view cross-sectional structure of a circuit board with stepped blind holes according to the present invention;
FIG. 4 is a schematic view of a front view cross section structure of a blind hole mechanism of a circuit board with stepped blind holes according to the present invention;
FIG. 5 is a schematic front sectional view of a blind via mechanism according to another embodiment of the present invention;
FIG. 6 is a schematic view of a three-dimensional cross-sectional structure of an assembly sleeve of a circuit board with stepped blind holes according to the present invention;
fig. 7 is a schematic view of a three-dimensional assembly structure of an elastic washer of a circuit board with stepped blind holes according to the present invention.
Illustration of the drawings:
1. a fixed mount; 2. an assembly mechanism; 201. a slide base; 202. a slider; 203. an elastic washer; 204. a base plate; 205. a support block; 206. an insulating block; 207. inserting holes; 3. a blind hole mechanism; 301. a blind hole seat; 302. a liquid discharge duct; 303. supporting a hole; 304. a stepped bore; 305. a tapered groove; 306. a hole cavity sleeve; 4. a slide plate; 5. a positioning column; 6. positioning holes; 7. injecting glue holes; 8. sealing glue; 9. a circuit board main body; 10. bonding colloid; 11. assembling; 12. and a heat dissipation block.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
Referring to fig. 1-7, the present invention provides a technical solution: a circuit board containing stepped blind holes comprises a circuit board main body 9 and a fixed frame 1 of movable connection, wherein the top of the circuit board main body 9 is provided with a plurality of stepped blind hole mechanisms 3 through laser, the inner cavity of each stepped blind hole mechanism 3 is provided with a liquid drainage hole 302, the inner cavity of each stepped blind hole mechanism 3 is provided with a conical groove 305, modified paint is coated in the conical groove 305, a plurality of assembling sets 11 are embedded at the top of the circuit board main body 9, each blind hole mechanism 3 comprises a blind hole seat 301, the blind hole seat 301 is cast at the top of the circuit board main body 9, the inner cavity of the blind hole seat 301 is punched and provided with three stepped hole cavities 304, the stepped hole cavities 304 of the blind hole seats 301 are conical grooves 305, the diameters of the three stepped blind hole cavities are sequentially reduced from top to bottom, liquid drainage hole 302 are respectively arranged on two sides of the top of the blind hole seat 301, and the liquid drainage hole 302 is communicated with the stepped hole cavities 304 through a branch hole 303, and the inside of the tapered groove 305 is coated with a modified paint.
The implementation mode specifically comprises the following steps: in this embodiment, the adaptability to the laser drilling process is realized by the plurality of stepped cavities 304 punched in the blind hole seat 301, and the liquid drainage channel 302 formed in the top of the blind hole seat 301 can distribute and load the coating in the blind hole seat 301 through the micropores of the blind hole seat 301, and meanwhile, the excessive glue solution can overflow into the liquid drainage channel 302.
Example 2
As shown in fig. 5, different from embodiment 1, the blind hole mechanism 3 includes a blind hole seat 301, the inner cavity of the blind hole seat 301 is sequentially sleeved with three hole cavity sleeves 306 from top to bottom, both sides of the top of the blind hole seat 301 are provided with liquid discharge holes 302, the liquid discharge holes 302 are communicated with the hole cavity sleeves 306 at corresponding positions through support holes 303, the inner diameter of the hole cavity sleeves 306 is sequentially reduced from top to bottom, and the inner cavity of the hole cavity sleeve 306 is coated with a modified coating.
The implementation mode is specifically as follows: in this embodiment, the blind hole seat 301 is pre-assembled by three mutually nested hole cavity sleeves 306, so that the assembly precision of the hole cavity sleeves 306 can be effectively improved, the hole cavity sleeves 306 can be prepared in a large scale, and the production assembly precision required by a circuit board is met.
Example 3
As shown in fig. 1-3 and 6, a circuit board with stepped blind holes comprises a circuit board main body 9 and a movably connected fixing frame 1, wherein a plurality of stepped blind hole mechanisms 3 are arranged at the top of the circuit board main body 9 through laser, liquid discharge holes 302 are arranged in the inner cavities of the stepped blind hole mechanisms 3, tapered grooves 305 are arranged in the inner cavities of the stepped blind hole mechanisms 3, modified paint is coated in the tapered grooves 305, a plurality of assembling sets 11 are embedded at the top of the circuit board main body 9, an assembling mechanism 2 is slidably connected to the bottom of the fixing frame 1, the assembling mechanism 2 comprises a sliding seat 201, one side of the sliding seat 201 is attached to one side of the fixing frame 1, a sliding groove is arranged on one side of the sliding seat 201, sliding blocks 202 are slidably connected in the sliding groove, a sliding plate 4 is fixedly connected between the sliding blocks 202 on two sides, the top of the sliding plate 4 is attached to the bottom of the fixing frame 1 and the bottom of the circuit board main body 9, a bottom plate 204 is fixedly connected between the sliding seats 201 at the two sides, a plurality of elastic washers 203 are fixedly connected to the top of the bottom plate 204, the top of the elastic washers 203 is fixedly connected with the bottom of the sliding plate 4, the cross-sectional shapes of the sliding block 202 and the sliding groove are both T-shaped, a plurality of supporting blocks 205 are fixedly assembled in the inner cavity of the elastic washers 203, two ends of one side of each supporting block 205 are respectively provided with a limiting hole, an inserting rod is inserted and connected in the limiting hole, the inserting rods at the two sides penetrate through the bottom side of the elastic washers 203 and extend to the outer side of the elastic washers 203, an insulating block 206 is fixedly connected between the tail ends of the inserting rods at the two sides, a plurality of inserting holes 207 are embedded in the top of the inner cavity of the elastic washers 203, the supporting blocks 205 are inserted and connected in the inserting holes 207 through top inserting blocks, the cross-sectional shapes of the supporting blocks 205 are arc, positioning columns 5 are fixedly connected to four corners at the top of the sliding plate 4, positioning holes 6 are punched at the four corners at the bottom of the fixing frame 1 corresponding to the positioning columns 5, the cross sectional shape of locating hole 6 and reference column 5 is circular, and 5 bottom lateral wall fixedly connected with buffering cushions of reference column, circuit board main part 9 is double-deck concatenation formula, and bonds through bonding colloid 10 between the double-deck circuit board main part 9, and mount 1 corresponds the position with bonding colloid 10 and has seted up notes gluey hole 7, flowing back pore 302 inner chamber cross sectional shape is the L type, flowing back pore 302 extends to 1 top of mount, it has sealed glue 8 still to fill between mount 1 and the circuit board main part 9, and sealed glue 8 is sealed latex, 11 inner chambers of the assembly cover encircle to be arranged and have a plurality of radiating blocks 12, and assembly cover 11 is anodization insulated aluminum heat conduction cover.
The implementation mode is specifically as follows: realize supporting the shock attenuation of slide 4 through elasticity packing ring 203, and slider 202 through slide 4 both sides T shape is more stable in the slip of slide 201 inner chamber, avoid slide 4 to take place the skew, improve circuit board shock attenuation energy-absorbing stability, can realize the rapid Assembly of top mount 1 simultaneously through reference column 5, and can carry out the injecting glue solidification between both sides circuit board main part 9 through injecting glue hole 7, the realization is to the quick bonding of both sides circuit board main part 9, satisfy the assembly adaptation ability of the circuit board main part 9 of multilayer mainboard, improve its operating condition stability.
A preparation process of a circuit board containing step-type blind holes comprises the following steps: the method specifically comprises the following steps of,
s1, embedding the raw material of the blind hole seat 301 in the corresponding position of the circuit substrate with the corresponding number of layers when the circuit board is subjected to injection molding through the mold, wherein the blind hole seat 301 is preferably a foamed aluminum material with multiple air-tight holes;
s2, after the circuit substrate is etched, performing light isolation setting outside the position where the blind hole is formed, and performing paint brushing on the blind hole, wherein the paint is formed by selecting graphene aerogel and covering the corresponding position at the top of the blind hole by a brushing method;
s3, punching the photoetching equipment by setting micro laser beams with different stations and different diameters, sequentially punching blind holes with different diameters by the laser beams with different diameters, and forming the machined blind holes into stepped structures;
s4, solidifying and adsorbing the graphene aerogel filler in the stepped structure of the blind hole after the graphene aerogel filler is punched by the laser, loading the graphene aerogel in the air-tight hole of the blind hole seat 301, and solidifying and blocking the redundant graphene aerogel in the liquid drainage hole channel 302 through the larger branch hole 303;
s5, combining the punched single-layer circuit substrates into a circuit board main body 9 after the single-layer circuit substrates are processed, and electrically communicating the multiple layers of circuit substrates after different circuit substrates are electroplated through blind holes;
s6, after the circuit board main body 9 is prepared by combining the circuit boards, the circuit board main bodies 9 on both sides are bonded by the adhesive 10 to form the multilayer circuit board main body 9, and the circuit board main body 9 is prepared.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (9)
1. The circuit board with the stepped blind holes comprises a circuit board main body (9) and a fixing frame (1) movably connected with the circuit board main body, and is characterized in that a plurality of stepped blind hole mechanisms (3) are arranged at the top of the circuit board main body (9) through laser, liquid drainage channels (302) are arranged in inner cavities of the stepped blind hole mechanisms (3), tapered grooves (305) are formed in the inner cavities of the stepped blind hole mechanisms (3), modified paint is coated in the tapered grooves (305), a plurality of assembling sets (11) are embedded in the top of the circuit board main body (9), and the bottom of the fixing frame (1) is slidably connected with an assembling mechanism (2);
the assembling mechanism (2) comprises a sliding seat (201), one side of the sliding seat (201) is attached to one side of a fixing frame (1), a sliding groove is formed in one side of the sliding seat (201), a sliding block (202) is connected in the sliding groove in a sliding mode, a sliding plate (4) is fixedly connected between the sliding blocks (202) on the two sides, the top of the sliding plate (4) is attached to the bottom of the fixing frame (1) and the bottom of a circuit board main body (9), a bottom plate (204) is fixedly connected between the sliding seats (201) on the two sides, a plurality of elastic gaskets (203) are fixedly connected to the top of the bottom plate (204), the top of each elastic gasket (203) is fixedly connected to the bottom of the sliding plate (4), the sliding blocks (202) and the sliding groove are both in a T shape in cross section, a plurality of supporting blocks (205) are fixedly assembled in an inner cavity of each elastic gasket (203), and limiting holes are formed in two ends of one side of each supporting block (205), and the limiting holes are internally inserted and connected with inserting rods, the inserting rods on two sides penetrate through the bottom side of the elastic gasket (203) and extend to the outer side of the elastic gasket (203), an insulating block (206) is fixedly connected between the tail ends of the inserting rods on two sides, a plurality of inserting holes (207) are embedded in the top of the inner cavity of the elastic gasket (203), the supporting block (205) is inserted and connected into the inserting holes (207) through the top inserting block, and the cross section of the supporting block (205) is arc-shaped.
2. The circuit board with the stepped blind hole according to claim 1, wherein the top four corners of the sliding plate (4) are fixedly connected with positioning columns (5), the bottom four corners of the fixing frame (1) are punched with positioning holes (6) corresponding to the positioning columns (5), the cross-sectional shapes of the positioning holes (6) and the positioning columns (5) are circular, and the outer side wall of the bottom end of each positioning column (5) is fixedly connected with a buffering rubber pad.
3. The circuit board with the stepped blind holes according to claim 1, wherein the circuit board main body (9) is a double-layer split joint type, the double-layer circuit board main body (9) is bonded through a bonding colloid (10), and the fixing frame (1) is provided with glue injection holes (7) at positions corresponding to the bonding colloid (10).
4. The circuit board with the stepped blind hole according to claim 1, wherein the cross section of the inner cavity of the drainage hole (302) is L-shaped, and the drainage hole (302) extends to the top of the fixing frame (1).
5. The circuit board with the stepped blind hole according to claim 1, wherein a sealant (8) is further filled between the fixing frame (1) and the circuit board main body (9), and the sealant (8) is sealing latex.
6. The circuit board with the stepped blind holes as claimed in claim 1, wherein the inner cavity of the assembly sleeve (11) is circumferentially provided with a plurality of heat dissipation blocks (12), and the assembly sleeve (11) is an anodized insulated aluminum heat conduction sleeve.
7. The circuit board with the stepped blind hole according to claim 1, wherein the blind hole mechanism (3) comprises a blind hole seat (301), the blind hole seat (301) is fused and cast on the top of the circuit board main body (9), three stepped holes (304) are punched in the inner cavity of the blind hole seat (301), the stepped holes (304) of the blind hole seat (301) are tapered grooves (305), the diameters of the three stepped blind holes are sequentially reduced from top to bottom, liquid drainage channels (302) are formed in both sides of the top of the blind hole seat (301), the liquid drainage channels (302) are communicated with the stepped holes (304) through the branch holes (303), and the interior of the tapered grooves (305) is coated with a modified coating.
8. The circuit board with the stepped blind holes according to claim 1, wherein the blind hole mechanism (3) comprises a blind hole seat (301), three hole cavity sleeves (306) are sequentially sleeved in the inner cavity of the blind hole seat (301) from top to bottom, liquid discharge pore channels (302) are respectively formed in two sides of the top of the blind hole seat (301), the liquid discharge pore channels (302) are communicated with the corresponding hole cavity sleeves (306) through branch holes (303), the inner diameters of the hole cavity sleeves (306) are sequentially reduced from top to bottom, and the inner cavities of the hole cavity sleeves (306) are coated with modified coatings.
9. The circuit board with the stepped blind holes according to any one of claims 1 to 8, further comprising a process for preparing the circuit board with the stepped blind holes, wherein the process comprises the following steps: the method specifically comprises the following steps of,
s1, embedding raw materials of a blind hole seat (301) in the corresponding positions of the circuit substrate with the corresponding number of layers during circuit board injection molding through a mold, wherein the blind hole seat (301) is preferably a foamed aluminum material with multiple air-tight holes;
s2, after the circuit substrate is etched, performing light isolation setting outside the position where the blind hole is formed, and performing paint brushing on the blind hole, wherein the paint is formed by selecting graphene aerogel and covering the corresponding position at the top of the blind hole by a brushing method;
s3, punching the photoetching equipment by setting micro laser beams with different stations and different diameters, sequentially punching blind holes with different diameters by the laser beams with different diameters, and forming the machined blind holes into stepped structures;
s4, solidifying and adsorbing the graphene aerogel filler in the stepped structure of the blind hole after the graphene aerogel filler is punched by the laser, loading the graphene aerogel in the air-tight hole of the blind hole seat (301), and solidifying and blocking the redundant graphene aerogel in the liquid drainage hole channel (302) through the larger branch hole (303);
s5, combining the punched single-layer circuit substrates into a circuit board main body (9) after the single-layer circuit substrates are processed, and electrically communicating the multiple layers of circuit substrates after different circuit substrates are electroplated through blind holes;
and S6, preparing a circuit board main body (9) by combining the circuit substrates, and then bonding the circuit board main bodies (9) at two sides into a multilayer circuit board main body (9) through bonding glue bodies (10), thus completing the preparation of the circuit board main body (9).
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| CN202210313476.5A CN114554681B (en) | 2022-03-28 | 2022-03-28 | Circuit board with stepped blind holes |
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| CN202210313476.5A CN114554681B (en) | 2022-03-28 | 2022-03-28 | Circuit board with stepped blind holes |
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| CN114554681B (en) | 2024-04-12 |
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