CN215121318U

CN215121318U - Multilayer circuit board with high aspect ratio blind hole

Info

Publication number: CN215121318U
Application number: CN202121593320.4U
Authority: CN
Inventors: 向一敏
Original assignee: Shenzhen Zhengyang Jiye Electronics Co ltd
Current assignee: Shenzhen Zhengyang Jiye Electronics Co ltd
Priority date: 2021-07-14
Filing date: 2021-07-14
Publication date: 2021-12-10
Anticipated expiration: 2031-07-14

Abstract

The utility model discloses a multilayer circuit board with high aspect ratio blind hole, including PCB board, blind hole, fixed slot, insulating rubber ring, slider, radiator unit, side stationary vane, heat radiation fins, spout, component face, first inlayer, first insulation layer, second inlayer, second insulating layer, third inlayer, face of weld, absorber plate, soaking board, tungsten cladding material, the upper end of PCB board is provided with the blind hole, and the four corners of PCB board is provided with the fixed slot, the outside of fixed slot is fixed with insulating rubber ring, and the inside of fixed slot is provided with tungsten cladding material, the both ends of PCB board are fixed with the slider. The multilayer circuit board with the blind hole with the high aspect ratio is provided with the insulating rubber ring and the tungsten coating, so that the effect of insulating and blocking is achieved, and the PCB can not be damaged by the bolts or the rivets fixed in the fixing grooves due to the fact that the tungsten is high in metal hardness, high in resistance and good in corrosion resistance, and the circuit inside the PCB is prevented from being short-circuited or corroded due to the fact that the bolts or the rivets are fixed in the fixing grooves.

Description

Multilayer circuit board with high aspect ratio blind hole

Technical Field

The utility model relates to a multilayer circuit board technical field specifically is a multilayer circuit board with high aspect ratio blind hole.

Background

The circuit board determines the process difficulty and the processing price according to the number of wiring surfaces, the multilayer circuit board is formed by superposing a plurality of layers of circuits in one circuit board through positioning and pressing by optical equipment, the multilayer circuit board is at least provided with three conductive layers, two conductive layers are arranged on the outer surface, the rest conductive layer is synthesized in an insulating board, a dielectric layer is arranged between every two conductive layers, and the blind holes are positioned on the surfaces of the top layer and the bottom layer of the printed circuit board, have certain depth and are used for connecting a surface layer circuit and a lower inner layer circuit.

When a multi-layer circuit board with a blind hole with a high aspect ratio in the market is fixed in use, rivets or bolts are usually used for fixing, after the fixing piece is fixed for a long time, a PCB is easily corroded and scratched due to electric corrosion and friction, the fixing piece is in contact with a conducting layer in the PCB, short circuit occurs, and equipment damage is caused.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a multilayer circuit board with high aspect ratio blind hole to when solving the multilayer circuit board in use of having high aspect ratio blind hole on the market that proposes in the above-mentioned background art and fixing, adopt rivet or bolt to fix usually, this type of mounting causes corruption and scratch to the PCB board because of electrocorrosion and friction easily after fixing for a long time, makes mounting and the inside conducting layer contact of PCB board and takes place the short circuit, causes the problem of equipment damage.

In order to achieve the above object, the utility model provides a following technical scheme: a multilayer circuit board with high aspect ratio blind holes comprises a PCB, blind holes, fixing grooves, an insulating rubber ring, sliding blocks, heat dissipation components, side fixing wings, heat dissipation fins, sliding grooves, component surfaces, a first inner layer, a first insulating layer, a second inner layer, a second insulating layer, a third inner layer, a welding surface, a heat absorbing plate, a soaking plate and tungsten coatings, wherein the blind holes are formed in the upper end of the PCB, the fixing grooves are formed in the four corners of the PCB, the insulating rubber ring is fixed to the outer portion of each fixing groove, the tungsten coatings are arranged in the fixing grooves, the sliding blocks are fixed to the two ends of the PCB, the heat dissipation components are arranged on the outer portion of the PCB, the side fixing wings are fixed to the two ends of each heat dissipation component, the sliding grooves are formed in the inner sides of the side fixing wings, the heat absorbing plate is arranged at the lower end of each heat dissipation component, the soaking plate is fixed to the upper end of the heat absorbing plate, the heat dissipation fins are fixed to the upper end of the soaking plate, the PCB comprises a PCB and is characterized in that an element surface is arranged at the upper end of the PCB, a first inner layer is fixed at the lower end of the element surface, a first insulation layer is arranged at the lower end of the first inner layer, a second inner layer is fixed at the lower end of the first insulation layer, a second insulation layer is arranged at the lower end of the second inner layer, a third inner layer is fixed at the lower end of the second insulation layer, and a welding surface is fixed at the lower end of the third inner layer.

Preferably, the blind hole penetrates through the upper surface of the PCB, and the blind hole is in common electrical connection with the PCB.

Preferably, a half-surrounding structure is formed between the insulating rubber ring and the fixing groove, and the tungsten coating is tightly attached to the insulating rubber ring.

Preferably, the PCB board forms a sliding structure with the heat dissipation assembly through the sliding block and the sliding groove, and the PCB board is matched with the appearance structure of the heat dissipation assembly.

Preferably, the side fixing wings are symmetrical about a central axis of the heat dissipation assembly, the sliding grooves penetrate through inner side surfaces of the side fixing wings, and the height of the side fixing wings is greater than the thickness of the PCB board.

Preferably, the first insulating layer is tightly attached to the first inner layer, the first insulating layer is tightly attached to the second inner layer, the second inner layer is tightly attached to the second insulating layer, and the second insulating layer is tightly attached to the third inner layer.

Preferably, the heat absorbing plate is matched with the soaking plate in shape and size, the heat absorbing plate is tightly attached to the soaking plate, and the radiating fins are uniformly distributed along the upper surface of the soaking plate.

Compared with the prior art, the beneficial effects of the utility model are that: the multilayer circuit board with the blind hole with the high aspect ratio is provided with the insulating rubber ring and the tungsten coating, so that the effect of insulating and blocking is achieved, and the PCB can not be damaged by the bolts or the rivets fixed in the fixing grooves due to the fact that the tungsten is high in metal hardness, high in resistance and good in corrosion resistance, and the circuit inside the PCB is prevented from being short-circuited or corroded due to the fact that the bolts or the rivets are fixed in the fixing grooves.

The blind holes are arranged to open holes according to the circuit cross design and the element mounting positions of the PCB, the number of connected inner layers is determined by the difference of the opening depths, the blind holes with high aspect ratios enable the connection among elements to be more free, and the multilayer inner layers which can be connected enable the circuit design to be simpler and more efficient; the first insulating layer and the second insulating layer that set up can effectively separate first inlayer, second inlayer and third inlayer, make can not contact between the inlayer and take place the short circuit, ensure that there is not interconnect's place between the inlayer except blind hole trompil initiative junction, ensure PCB board safe in utilization, avoid installation component back circular telegram short circuit to make the component damage.

The arranged heat dissipation assembly can be simply and conveniently installed or taken down from the outside of the PCB through the sliding block and the sliding groove, and is simple to assemble and convenient to produce and operate; the arranged side fixed wings are more protruded than the two ends of the PCB, so that a certain falling collision protection function can be provided, and the PCB is prevented from being directly contacted with a collision source to generate large damage when being collided; the heat absorption plate arranged absorbs heat generated by welding spots on the welding surface of the PCB during the working of elements and conducts the heat to the soaking plate, and finally the heat dissipation fins arranged on the surface of the soaking plate distribute out, so that the PCB is prevented from generating faults after the heat is accumulated due to high-load working, the service life of the PCB is prolonged, and the fault rate is reduced.

Drawings

FIG. 1 is a schematic view of a front perspective structure of the present invention in an installation state;

FIG. 2 is a schematic view of a PCB board of the present invention;

fig. 3 is a schematic view of a front perspective structure of the heat dissipation assembly of the present invention;

FIG. 4 is a schematic view of the cross-sectional structure of the PCB of the present invention at the blind hole;

FIG. 5 is a schematic view of a cross-sectional structure of the heat dissipation assembly of the present invention;

fig. 6 is a schematic view of the sectional three-dimensional structure of the fixing groove of the present invention.

In the figure: 1. a PCB board; 2. blind holes; 3. fixing grooves; 4. an insulating rubber ring; 5. a slider; 6. a heat dissipating component; 7. a side fixed wing; 8. heat dissipation fins; 9. a chute; 10. an element surface; 11. a first inner layer; 12. a first insulating layer; 13. a second inner layer; 14. a second insulating layer; 15. a third inner layer; 16. welding a surface; 17. a heat absorbing plate; 18. a vapor chamber; 19. and (5) tungsten plating.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-6, the present invention provides a technical solution: a multilayer circuit board with high aspect ratio blind holes comprises a PCB (printed Circuit Board) 1, blind holes 2, fixing grooves 3, insulating rubber rings 4, sliders 5, heat dissipation assemblies 6, side fixing wings 7, heat dissipation fins 8, sliding grooves 9, element surfaces 10, a first inner layer 11, a first insulating layer 12, a second inner layer 13, a second insulating layer 14, a third inner layer 15, a welding surface 16, heat absorption plates 17, soaking plates 18 and tungsten coatings 19, wherein the blind holes 2 are formed in the upper end of the PCB 1, the fixing grooves 3 are formed in four corners of the PCB 1, the insulating rubber rings 4 are fixed to the outer portions of the fixing grooves 3, the tungsten coatings 19 are arranged in the inner portions of the fixing grooves 3, the sliders 5 are fixed to two ends of the PCB 1, the heat dissipation assemblies 6 are arranged on the outer portions of the PCB 1, the side fixing wings 7 are fixed to two ends of the heat dissipation assemblies 6, the sliding grooves 9 are formed in the inner sides of the side fixing wings 7, the heat absorption plates 17 are arranged at the lower ends of the heat dissipation assemblies 6, and a soaking plate 18 is fixed at the upper end of the heat absorbing plate 17, a heat radiating fin 8 is fixed at the upper end of the soaking plate 18, an element surface 10 is arranged at the upper end of the PCB 1, a first inner layer 11 is fixed at the lower end of the element surface 10, a first insulating layer 12 is arranged at the lower end of the first inner layer 11, a second inner layer 13 is fixed at the lower end of the first insulating layer 12, a second insulating layer 14 is arranged at the lower end of the second inner layer 13, a third inner layer 15 is fixed at the lower end of the second insulating layer 14, and a welding surface 16 is fixed at the lower end of the third inner layer 15.

The utility model discloses in: the blind hole 2 penetrates through the upper surface of the PCB 1, and the blind hole 2 is in common electrical connection with the PCB 1; the blind hole 2 that sets up carries out the trompil according to PCB board 1's circuit cross design and component mounted position, and the difference of trompil degree of depth has decided the inlayer number of piles of connecting, and the blind hole 2 of high aspect ratio makes the component connection more free, and the multilayer inlayer that can supply to connect makes circuit design simple more high-efficient.

The utility model discloses in: a semi-surrounding structure is formed between the insulating rubber ring 4 and the fixing groove 3, and the tungsten coating 19 is tightly attached to the insulating rubber ring 4; the insulating rubber ring 4 and the tungsten coating 19 play a role in insulating and blocking, and because the metal hardness of tungsten is high, the resistance is high, the corrosion resistance is good, the bolt or the rivet fixed in the fixing groove 3 can not damage the PCB 1, and the short circuit or the corrosion of the inner circuit of the PCB 1 caused by the contact with the fixing piece can be avoided.

The utility model discloses in: the PCB 1 and the heat dissipation assembly 6 form a sliding structure through the sliding block 5 and the sliding groove 9, and the appearance structures of the PCB 1 and the heat dissipation assembly 6 are matched; the heat dissipation assembly 6 can be simply and conveniently installed or taken down from the outside of the PCB board 1 through the sliding block 5 and the sliding groove 9, and is simple to assemble and convenient to produce and operate.

The utility model discloses in: the side fixed wings 7 are symmetrical about the central axis position of the heat dissipation assembly 6, the sliding grooves 9 penetrate through the inner side surfaces of the side fixed wings 7, and the height of the side fixed wings 7 is greater than the thickness of the PCB 1; the side fixed wing 7 that sets up is more outstanding than 1 both ends of PCB board, can provide certain collision protect function that falls, avoids PCB board 1 directly to produce great damage with the contact of collision source when receiving the collision.

The utility model discloses in: the first insulating layer 12 is tightly attached to the first inner layer 11, the first insulating layer 12 is tightly attached to the second inner layer 13, the second inner layer 13 is tightly attached to the second insulating layer 14, and the second insulating layer 14 is tightly attached to the third inner layer 15; the first insulating layer 12 and the second insulating layer 14 that set up can effectively separate first inlayer 11, second inlayer 13 and third inlayer 15, make and can not contact between the inlayer and take place the short circuit, ensure that except that blind hole 2 trompil initiative junction can not have interconnect's place between the inlayer, ensure PCB board 1 safe in utilization, avoid installation component back circular telegram short circuit to make the component damage.

The utility model discloses in: the heat absorbing plate 17 is matched with the soaking plate 18 in shape and size, the heat absorbing plate 17 is tightly attached to the soaking plate 18, and the radiating fins 8 are uniformly distributed along the upper surface of the soaking plate 18; the heat absorption plate 17 arranged absorbs heat generated by welding spots on the welding surface 16 of the PCB 1 during the working of elements, and conducts the heat to the soaking plate 18, and finally the heat dissipation fins 8 arranged on the surface of the soaking plate 18 distribute out, so that the PCB 1 is prevented from generating faults after heat accumulation due to high-load working, the service life of the PCB 1 is prolonged, and the fault rate is reduced.

The working principle is as follows: for the multilayer circuit board with the blind hole with high aspect ratio, firstly, the PCB 1 is fixed on a working plate through the fixing groove 3, the element on the element surface 10 is installed through the blind hole 2, and is welded through the welding surface 16, when the PCB 1 is fixed through the fixing groove 3, the tungsten coating 19 in the fixing groove 3 has high resistance and hardness and can provide insulating and wear-resistant effects, the insulating rubber ring 4 is used for preventing an iron fixing part for fixing from contacting with a conductive part in the PCB 1 to form short circuit and damage the PCB 1, then the welded PCB 1 slides into the heat dissipation component 6 through the sliding grooves 9 arranged on the inner sides of the sliding blocks 5 and the side fixing wings 7 on two sides, the heat absorption plate 17 of the heat dissipation component 6 absorbs the heat of the welding surface 16 of the PCB 1 and then conducts to the soaking plate 18, and finally the soaking plate 18 uniformly dissipates the heat through the heat dissipation fins 8, the PCB board 1 is prevented from being damaged due to overheating during work, the opening depth of the blind hole 2 is determined according to the depth of an inner layer to which board-mounted elements are connected during design, and a first inner layer 11, a second inner layer 13 and a third inner layer 15 in the PCB board 1 are separated by a first insulating layer 12 and a second insulating layer 14, so that short circuit between the inner layers is avoided.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a multilayer circuit board with high aspect ratio blind hole, includes PCB board (1), blind hole (2), fixed slot (3), insulating rubber ring (4), slider (5), radiator unit (6), side stationary vane (7), heat radiation fin (8), spout (9), component face (10), first inlayer (11), first insulating layer (12), second inlayer (13), second insulating layer (14), third inlayer (15), welding face (16), absorber plate (17), soaking plate (18), tungsten coating (19), its characterized in that: the PCB is characterized in that blind holes (2) are formed in the upper end of the PCB (1), fixing grooves (3) are formed in four corners of the PCB (1), insulating rubber rings (4) are fixed on the outer portions of the fixing grooves (3), tungsten coatings (19) are arranged inside the fixing grooves (3), sliding blocks (5) are fixed at two ends of the PCB (1), heat dissipation assemblies (6) are arranged on the outer portions of the PCB (1), side fixing wings (7) are fixed at two ends of each heat dissipation assembly (6), sliding grooves (9) are formed in the inner sides of the side fixing wings (7), heat absorbing plates (17) are arranged at the lower ends of the heat dissipation assemblies (6), soaking plates (18) are fixed at the upper ends of the heat absorbing plates (17), heat dissipation fins (8) are fixed at the upper ends of the soaking plates (18), element faces (10) are arranged at the upper ends of the PCB (1), and first inner layers (11) are fixed at the lower ends of the element faces (10), the lower extreme of first inlayer (11) is provided with first insulating layer (12), and the lower extreme of first insulating layer (12) is fixed with second inlayer (13), the lower extreme of second inlayer (13) is provided with second insulating layer (14), and the lower extreme of second insulating layer (14) is fixed with third inlayer (15), the lower extreme of third inlayer (15) is fixed with face of weld (16).

2. A multilayer circuit board having high aspect ratio blind vias as defined in claim 1, wherein: the blind hole (2) penetrates through the upper surface of the PCB (1), and the blind hole (2) is in common electrical connection with the PCB (1).

3. A multilayer circuit board having high aspect ratio blind vias as defined in claim 1, wherein: and a semi-surrounding structure is formed between the insulating rubber ring (4) and the fixing groove (3), and the tungsten coating (19) is tightly attached to the insulating rubber ring (4).

4. A multilayer circuit board having high aspect ratio blind vias as defined in claim 1, wherein: the PCB (1) forms a sliding structure with the heat dissipation assembly (6) through the sliding block (5) and the sliding groove (9), and the appearance structure of the PCB (1) is identical with that of the heat dissipation assembly (6).

5. A multilayer circuit board having high aspect ratio blind vias as defined in claim 1, wherein: the side fixing wings (7) are symmetrical about the central axis of the heat dissipation assembly (6), the sliding grooves (9) penetrate through the inner side surfaces of the side fixing wings (7), and the height of the side fixing wings (7) is larger than the thickness of the PCB (1).

6. A multilayer circuit board having high aspect ratio blind vias as defined in claim 1, wherein: the first insulating layer (12) is tightly attached to the first inner layer (11), the first insulating layer (12) is tightly attached to the second inner layer (13), the second inner layer (13) is tightly attached to the second insulating layer (14), and the second insulating layer (14) is tightly attached to the third inner layer (15).

7. A multilayer circuit board having high aspect ratio blind vias as defined in claim 1, wherein: the heat absorbing plate (17) is matched with the soaking plate (18) in shape and size, the heat absorbing plate (17) is tightly attached to the soaking plate (18), and the radiating fins (8) are uniformly distributed along the upper surface of the soaking plate (18).