CN212876523U

CN212876523U - Conductive radiator

Info

Publication number: CN212876523U
Application number: CN202022262228.1U
Authority: CN
Inventors: 刘靖嵩; 李宁; 陈建文
Original assignee: Provence Technology Shenzhen Co ltd
Current assignee: Aixin Environmental Protection Materials (Shenzhen) Co.,Ltd.
Priority date: 2020-10-13
Filing date: 2020-10-13
Publication date: 2021-04-02
Anticipated expiration: 2030-10-13

Abstract

The utility model provides a conductive radiator relates to radiator technical field, has solved current fin of taking the stitch and has generally passed through the screw hole with the stitch or the riveting is fixed on the heat-conducting plate, and manufacturing cost is higher to it is unstable to connect, causes contact failure's technical problem easily. The conductive radiator comprises a heat conducting plate, a heat radiating strip and a PIN PIN; the heat conducting plate and the heat dissipation strip are of an integrated structure; the number of the heat dissipation strips is at least four, and a groove is formed between the adjacent heat dissipation strips at the edges of two sides; the PIN foot can conduct electricity and is connected with the heat conduction plate and the heat dissipation strip in a clamping mode at the position of the groove; the PIN is provided with a protruding conductive contact. The utility model discloses a PIN foot is connected with heat-conducting plate, heat dissipation strip block at the groove position, convenient operation, and the firm in connection of PIN foot simultaneously, convex conductive contact make the connection stability of PIN foot high, and difficult production contact failure has reduced manufacturing cost simultaneously.

Description

Conductive radiator

Technical Field

The utility model belongs to the technical field of the radiator technique and specifically relates to an electrically conductive radiator is related to.

Background

The electronic industry widely uses the radiator to dispel the heat to the high-power electronic components and parts to reduce the operating temperature of electronic components and parts, guarantee job stabilization, increase of service life, most are made of aluminium, brass or bronze. The general radiator is composed of a heat conducting plate and a plurality of radiating strips vertically arranged on the heat conducting plate, and is simple in structure and good in radiating capacity. The radiating fins are different in form corresponding to different electronic components, wherein the radiating fins with pins have a conductive function and are mainly applied to heat dissipation of CPUs, LEDs and the like.

The applicant has found that the prior art has at least the following technical problems:

the existing radiating fin with the pins generally fixes the pins on the heat conducting plate through threaded holes or riveting, so that the production cost is high, the connection is unstable, and poor contact is easily caused.

Disclosure of Invention

An object of the utility model is to provide an electrically conductive radiator to solve the fin that exists among the prior art and generally pass through the screw hole with the stitch or the riveting is fixed on the heat-conducting plate, manufacturing cost is higher, and connect more unstablely, cause contact failure's technical problem easily. The utility model provides a plurality of technical effects that preferred technical scheme among a great deal of technical scheme can produce see the explanation below in detail.

In order to achieve the above purpose, the utility model provides a following technical scheme:

the utility model provides a conductive radiator, which comprises a heat conducting plate, a heat radiating strip and a PIN foot; the heat conducting plate and the heat dissipation strip are of an integrated structure; the number of the heat dissipation strips is at least four, and a groove is formed between the adjacent heat dissipation strips at the edges of two sides; the PIN foot can conduct electricity and is connected with the heat conduction plate and the heat dissipation strip in a clamping mode at the position of the groove; the PIN feet are positioned at two ends of the heat-conducting plate, and the number of the PIN feet is at least two.

Optionally, the conductive contact has a protrusion thickness of 0.3-0.8mm and is adjacent to the thermal conductive plate.

Optionally, the PIN foot further includes a connection portion and a conductive portion, and the connection portion and the conductive portion are of an integral structure.

Optionally, the connecting portion is provided with a raised structure.

Optionally, the conductive portion is connected with the conductive contact.

Optionally, the end of the connecting portion is provided with a chamfer.

Optionally, the number of the PIN PINs is 2-4 and the PIN PINs are mutually conducted.

Optionally, the PIN is made of iron, and the surface of the PIN is plated with tin.

Optionally, the heat conducting plate is further provided with a connecting hole, and the connecting hole is a through hole.

Optionally, the surface of the heat dissipation strip is provided with a heat dissipation coating, and the surface of the heat conduction plate, which is in contact with the heat dissipation strip, is also provided with a heat dissipation coating.

Any technical scheme can at least produce the following technical effects:

the utility model discloses a PIN foot is connected with heat-conducting plate, heat dissipation strip block at the groove position, convenient operation, and the firm in connection that can ensure the PIN foot is connected to the block simultaneously, and is more simple than screw hole or riveting are fixed, and convex conductive contact makes the connection stability of PIN foot high, is difficult for producing contact failure, has reduced manufacturing cost simultaneously.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a perspective view of the present invention;

FIG. 2 is a front view of the PIN foot;

FIG. 3 is a top view of a PIN foot;

figure 4 is a side view of a PIN foot

Fig. 5 is a front view of the present invention;

FIG. 6 is a cross-sectional view taken along line A-A of FIG. 5;

fig. 7 is a side view of the present invention.

In figure 1, a heat-conducting plate; 11. connecting holes; 2. a heat dissipating strip; 3. a PIN PIN; 31. a connecting portion; 32. a conductive portion; 33. a conductive contact; 34. a raised structure; 4. and (4) a groove.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention clearer, the technical solutions of the present invention will be described in detail below. It is to be understood that the embodiments described are only some embodiments of the invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

The utility model provides a conductive radiator, as shown in figures 1-7, which comprises a heat conducting plate 1, a heat radiating strip 2 and a PIN foot 3. Heat-conducting plate 1 and heat dissipation strip 2 structure as an organic whole, can cast the back cutting shaping, an organic whole structure is convenient for improve the utility model discloses a structural strength also is convenient for reduce the cost of formation. The quantity of heat dissipation strip 2 is four at least, forms recess 4 between the adjacent heat dissipation strip 2 of both sides edge, and recess 4 sets up the both sides at heat-conducting plate 1 width direction promptly, and when the quantity of heat dissipation strip 2 is less when heat-conducting plate 1's width is shorter promptly, also has sufficient space to hold PIN foot 3. The groove 4 is positioned at the joint of the radiating strip 2 and the heat conducting plate 1. PIN foot 3 can electrically conduct, is connected with heat-conducting

plate

1, 2 blocks of heat dissipation strip in recess 4 position, and recess 4 structure is convenient for realize the block and is connected, and the block is connected convenient operation, and the firm in connection that can ensure PIN foot 3 is connected to the block simultaneously, and is more firm for the cooperation between PIN foot 3 and the recess 4, can make the width and the thickness of PIN foot 3 slightly be greater than the width and the height of recess 4, and both carry out interference fit. The PIN foot 3 is provided with convex conductive contact 33, and conductive contact 33 can be as an organic whole structure with PIN foot 3, also can be through welded fastening, and conductive contact 33 is the metal that the preferred electric conductivity of copper, silver etc. is better, and the surface size of conductive contact 33 can set up as required. The utility model discloses a PIN foot 3 is connected with heat-conducting

plate

1, 2 blocks of heat dissipation strip in recess 4 position, convenient operation, and the firm in connection that can ensure PIN foot 3 is connected to the block simultaneously, and is more simple than screw hole or riveting are fixed, and convex conductive contact 33 makes PIN foot 3's connection stability high, is difficult for producing contact failure, has reduced manufacturing cost simultaneously. Simultaneously, increase PIN foot 3 at the radiator and realize electrically conductive back, can ensure the utility model discloses install on specific PCBA PIN foot 3 right the utility model discloses and PCBA between electric field intensity and current density, good electric conductivity suppresses magnetic field noise to PCBA ground connection shielding and plays good improvement effect, thereby has improved the utility model discloses a performance.

As an alternative embodiment, the conductive contact 33 has a projected thickness of 0.3-0.8mm and is adjacent to the plate 1. The conductive contact 33 sets up the installation that this thickness neither influenced PIN foot 3, and convex thickness can make the contact between PIN foot 3 and the electronic components tighter simultaneously, has improved electric conductivity, is difficult for producing contact failure. The conductive contacts 33 are arranged on the side close to the plate 1, the section of the plate 1 adjacent to the conductive contacts 33 also being able to conduct electricity, i.e. the inside as shown in fig. 1.

As an alternative embodiment, as shown in fig. 2 to 4, the PIN foot 3 includes the connection portion 31 and the conductive portion 32, and the connection portion 31 and the conductive portion 32 are of an integrated structure, which improves the structural strength of the PIN foot and facilitates manufacturing. The connecting portion 31 and the conductive portion 32 are perpendicular to each other, so that the PIN is formed into an L shape, the connecting portion 31 is conveniently clamped with the groove 4, and the conductive portion 32 is conveniently electrically connected with the electronic component to realize conduction. Connecting portion 31 is provided with protruding structure 34, and protruding structure 34 sets up at the bilateral symmetry of connecting portion, and protruding structure 34 both has been convenient for connecting portion 31 and has been inserted in recess 4 fast, and connecting portion 31 can not become flexible easily or fall out again after inserting recess 4 simultaneously, avoids contact failure. The conductive portion 32 is connected to the conductive contact 33, and the conductive contact 33 is preferably disposed at a position above the center of the conductive portion 32, and may have a circular, elliptical, rectangular shape, or the like. The end of the connecting portion 31 is provided with a chamfer to facilitate the quick insertion of the connecting portion 31 into the recess 4.

As an optional implementation manner, as shown in fig. 5, the number of the PIN PINs 3 is 2 to 4, and the PIN PINs are mutually conducted, so that the use requirements of most electronic components can be met, and the PIN PINs 3 are widely used in heat dissipation of CPUs and triodes when the number is three.

In an optional embodiment, the PIN 3 is made of iron, and the surface of the PIN is plated with tin. The tin plating on the surface can prevent poor contact caused by iron oxidation, the tin is softer, the tin is protective and prevents corrosion, and the tin plating is cheaper and is easy to weld.

As an alternative embodiment, as shown in fig. 1, the heat conducting plate 1 is further provided with a connecting hole 11, and the connecting hole 11 is a through hole. Connecting hole 11 sets up between two adjacent heat dissipation strips 2 that do not set up recess 4, and preferred connecting hole 11 is the screw hole, is convenient for the utility model discloses and fix between the electronic components, connecting hole 11's quantity can be set for as required, generally for a plurality of fixed effects in order to realize better, as shown in fig. 1-2 three, and three connecting hole 11 evenly distributed realizes better fixed effect.

As an alternative embodiment, the surface of the heat dissipation strip 2 is provided with a heat dissipation coating, and the surface of the heat conduction plate 1, which is in contact with the heat dissipation strip 2, is also provided with a heat dissipation coating. The surface as shown in fig. 2 is provided with a heat dissipation coating, which can improve the heat dissipation effect of the utility model, and the organic solvent type heat dissipation coating or the water-based heat dissipation coating forms the heat dissipation coating on the surface of the heat conduction plate 1 and the heat dissipation strip 2 through brushing, spraying or dip-coating process.

In an alternative embodiment, the heat conducting plate 1 and the heat dissipating strip 2 are made of aluminum. The aluminum density is lighter, has better ductility, is convenient for process, has better heat conductivity simultaneously, and the material of heat-conducting plate 1, heat dissipation strip 2 also can be selected as required to be aluminum alloy or copper alloy certainly.

The above description is only for the specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present invention, and all should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims

1. A conductive radiator is characterized by comprising a heat conducting plate, a heat radiating strip and a PIN PIN; the heat conducting plate and the heat dissipation strip are of an integrated structure; the number of the heat dissipation strips is at least four, and a groove is formed between the adjacent heat dissipation strips at the edges of two sides; the PIN foot can conduct electricity and is connected with the heat conduction plate and the heat dissipation strip in a clamping mode at the position of the groove; the PIN is provided with a protruding conductive contact.

2. The conductive heat sink of claim 1, wherein the conductive contact has a protrusion thickness of 0.3-0.8mm and is adjacent to the thermal conductive plate.

3. The conductive heat sink of claim 1, wherein the PIN foot further comprises a connecting portion and a conductive portion, the connecting portion and the conductive portion being of unitary construction.

4. The conductive heat sink of claim 3, wherein the connection portion is provided with a raised structure.

5. The electrically conductive heat sink of claim 3, wherein said conductive portion is connected to said electrically conductive contact.

6. The conductive heat sink of claim 3, wherein the end of the connecting portion is provided with a chamfer.

7. The conductive heat sink of claim 1, wherein the PIN legs are 2-4 in number and in conductive communication with each other.

8. The conductive heat sink of claim 1, wherein the PIN is made of iron and is plated with tin.

9. The conductive heat sink as claimed in claim 1, wherein the heat conductive plate is further provided with a connection hole, and the connection hole is a through hole.

10. The conductive heat sink of claim 1, wherein the surface of the heat sink strip is provided with a heat sink coating, and the surface of the thermal conductive plate in contact with the heat sink strip is also provided with a heat sink coating.