CN210432023U - Environment-friendly LED circuit board - Google Patents

Environment-friendly LED circuit board Download PDF

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Publication number
CN210432023U
CN210432023U CN201920918866.9U CN201920918866U CN210432023U CN 210432023 U CN210432023 U CN 210432023U CN 201920918866 U CN201920918866 U CN 201920918866U CN 210432023 U CN210432023 U CN 210432023U
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heat
groove
copper wires
conducting copper
circuit board
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CN201920918866.9U
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Chinese (zh)
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唐芬娟
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Shaoxing Shangyu Kaida Electronic Co ltd
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Shaoxing Shangyu Kaida Electronic Co ltd
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Abstract

The utility model discloses an environment-friendly LED circuit board, including aluminium base board and radiating block, the both sides of aluminium base board all are equipped with engaging lug piece one, the radiating block top surface is offered and is used for holding the recess of aluminium base board and is used for holding the draw-in groove of engaging lug piece one, the radiating block both sides are equipped with engaging lug piece two that is located under the recess. The utility model has the advantages that: the first heat conducting copper wire is wound on the aluminum substrate and is in contact with the radiating block, and the second heat conducting copper wire arranged in the plurality of arrays is arranged on the bottom surface of the aluminum substrate and is used for being connected with the radiating block, so that the heat conducting area between the aluminum substrate and the radiating block is increased, and the first heat conducting copper wire and the second heat conducting copper wire have high heat conducting performance, so that heat generated by the aluminum substrate can be conducted to the radiating block through the first heat conducting copper wire and the second heat conducting copper wire in time to be radiated.

Description

Environment-friendly LED circuit board
Technical Field
The utility model relates to an environment-friendly LED circuit board belongs to aluminium base board technical field.
Background
With the development of the electronic industry technology, the production and process technology for manufacturing the circuit board are continuously developed, and in some electronic fields with large heat emission, an aluminum substrate is generally used as the circuit board, and the aluminum substrate has good heat conduction and heat dissipation performance, so that the temperature of components can be greatly reduced, and the normal operation of a circuit is ensured.
SUMMERY OF THE UTILITY MODEL
The present invention is directed to solving the above-mentioned problems and providing an environment-friendly LED circuit board.
The utility model discloses a following technical scheme realizes above-mentioned mesh, an environment-friendly LED circuit board, including aluminium base board and radiating block, the both sides of aluminium base board all are equipped with engaging lug piece one, the radiating block top surface is offered and is used for holding the recess of aluminium base board and is used for holding the draw-in groove of engaging lug piece one, the radiating block both sides are equipped with engaging lug piece two that is located under the recess, there is the clearance between the perisporium of aluminium base board and the recess inner wall, be equipped with the heat conduction copper wire one that a plurality of circles twined in aluminium base board periphery in the clearance, be provided with a plurality of heat conduction copper wire two that are rectangular array and distribute between aluminium base board bottom surface and the grooved underside, the both ends of heat conduction copper wire two contact with aluminium base board bottom surface and grooved underside respectively, adjacent between the heat conduction copper wire one, The adjacent second heat conducting copper wires, the top surfaces of the second heat conducting copper wires and the bottom surface of the aluminum substrate, the bottom surfaces of the second heat conducting copper wires and the bottom surface of the groove and the inner peripheral wall of the groove are in mutual contact.
As the utility model discloses a further setting is adjacent all contact each other through heat conduction silicone grease layer between heat conduction copper wire one, between heat conduction copper wire one and the aluminium base board, between heat conduction copper wire one and the recess inner wall, between two adjacent heat conduction copper wire, between two top surfaces of heat conduction copper wire and the aluminium base board bottom surface, between two bottom surfaces of heat conduction copper wire and the recess bottom surface and between two and the recess internal perisporium of heat conduction copper wire.
As the utility model discloses a further setting, aluminium base board comprises metal-based layer, insulating layer and circuit layer from bottom to top, a plurality of circles a heat conduction copper wire winding is on metal-based layer's periphery wall, two a lug piece all with insulating layer fixed connection, the thickness of a lug piece, the thickness of insulating layer and the degree of depth of draw-in groove are the same.
As a further setting of the present invention, the depth of the groove is greater than or equal to the thickness sum of the insulating layer and the metal base layer.
As a further arrangement of the utility model, the first connecting ear block and the second connecting ear block are connected through screws.
As a further setting of the utility model, a plurality of embedded grooves have all been seted up to metal-based layer bottom surface and grooved underside, the embedded groove is used for imbedding the both ends of heat conduction copper wire two, the both ends of heat conduction copper wire two are also through heat conduction silicone grease layer and embedded groove inner wall contact.
As the utility model discloses a further setting is located the metal basal layer the embedded groove sum with be located the recess bottom surface equals two lengths of heat conduction copper wire.
As a further arrangement of the present invention, the thickness of the heat-conducting silicone grease layer is 6-20 microns.
As the utility model discloses a further setting, aluminium base plate top surface is equipped with a plurality of pads, be equipped with a plurality of radiating grooves between the pad, aluminium base plate top surface periphery is equipped with a plurality of circular shape pad setpoint that are, pad setpoint periphery is equipped with and is annular deviation median.
As the utility model discloses a further setting, the radiating block adopts aluminum alloy material, radiating block bottom surface integrated into one piece has a plurality of heat dissipation sand grips and a plurality of heat dissipation concave strip, heat dissipation sand grip and heat dissipation concave strip appear in turn in proper order in the radiating block bottom surface.
Compared with the prior art, the beneficial effects of the utility model are that:
the utility model discloses a wind heat conduction copper wire one and radiating block contact on aluminium base board to set up two heat conduction copper wires that a plurality of arrays were arranged in aluminium base board bottom surface and be used for being connected with the radiating block, thereby make the heat conduction area increase between aluminium base board and the radiating block, and because the stronger heat conductivility that two possesses of heat conduction copper wire one and heat conduction copper wire, can in time radiate on conducting the radiating block through heat conduction copper wire one and two conduction of heat conduction copper wire of the heat that aluminium base board itself produced.
Drawings
FIG. 1 is a first perspective view of an environment-friendly LED circuit board of the present invention;
FIG. 2 is a top view of an environment-friendly LED circuit board according to the present invention;
FIG. 3 is a cross-sectional view of an environment-friendly LED circuit board of the present invention;
FIG. 4 is a second perspective view of the environment-friendly LED circuit board of the present invention;
fig. 5 is a third perspective view of the environment-friendly LED circuit board of the present invention.
Reference numerals: 1. an aluminum substrate; 2. connecting the first lug block; 3. connecting a second lug block; 4. a heat dissipating block; 5. a heat dissipation concave strip; 6. heat dissipation convex strips; 7. a heat sink; 8. a pad; 9. positioning points of the bonding pads; 10. a deviation isolation zone; 11. a first heat conducting copper wire; 12. a metal base layer; 13. an insulating layer; 14. a circuit layer; 15. a second heat conducting copper wire; 16. a groove; 17. a clamping groove.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1 to 5, an environment-friendly LED circuit board includes an aluminum substrate 1 and a heat dissipation block 4, wherein two sides of the aluminum substrate 1 are respectively provided with a first connecting lug 2, a top surface of the heat dissipation block 4 is provided with a groove 16 for accommodating the aluminum substrate 1 and a slot 17 for accommodating the first connecting lug 2, two sides of the heat dissipation block 4 are provided with a second connecting lug 3 located right below the groove 16, a gap is formed between a peripheral wall of the aluminum substrate 1 and an inner wall of the groove 16, a plurality of circles of first heat conducting copper wires 11 wound around the periphery of the aluminum substrate 1 are arranged in the gap, a plurality of second heat conducting copper wires 15 distributed in a rectangular array are arranged between the bottom surface of the aluminum substrate 1 and the bottom surface of the groove 16, two ends of the second heat conducting copper wires 15 are respectively in contact with the bottom surfaces of the aluminum substrate 1 and the groove 16, between adjacent first heat conducting copper, Between two adjacent heat conduction copper wires 15, between two 15 top surfaces of heat conduction copper wire and aluminium base board 1 bottom surface, be mutual contact between two 15 bottom surfaces of heat conduction copper wire and the recess 16 bottom surface and between two 15 and the recess 16 internal perisporium of heat conduction copper wire, through the screw connection between connecting ear piece one 2 and the connecting ear piece two 3, aluminium base board 1 top surface is equipped with a plurality of pads 8, be equipped with a plurality of radiating grooves 7 between the pad 8, aluminium base board 1 top surface periphery is equipped with a plurality of circular shape pad setpoint 9 that are, pad setpoint 9 periphery is equipped with and is annular deviation median 10.
When people need to assemble the circuit board, people can install the first connecting lug blocks 2 on two sides of the aluminum substrate 1, wind a plurality of circles of the first heat conducting copper wires 11 on the aluminum substrate 1, make the plurality of circles of the first heat conducting copper wires 11 closely contact with the outer peripheral wall of the aluminum substrate 1, also make the adjacent first heat conducting copper wires 11 closely contact with each other, and make the plurality of circles of the first heat conducting copper wires 11 be positioned under the first connecting lug blocks 2, then people fixedly connect a plurality of the second heat conducting copper wires 15 on the bottom surface of the heat dissipation block 4 provided with the groove 16, make the adjacent second heat conducting copper wires 15 contact with each other, also make the second heat conducting copper wires 15 positioned at the outermost circle in the groove 16 contact with the inner peripheral wall of the groove 16, then people embed the aluminum substrate 1 wound with the plurality of circles of the first heat conducting copper wires 11 into the groove 16, and make the positions of the first connecting lug blocks 2, when the aluminum substrate and the heat conducting copper wire are embedded, a plurality of circles of the heat conducting copper wires 11 are also in close contact with the inner wall of the groove 16, the top surfaces of a plurality of circles of the heat conducting copper wires 15 are in close contact with the bottom surface of the aluminum substrate 1, then people connect the connecting lug pieces 2 and the connecting lug pieces 3 through screws, and therefore the circuit board is assembled, when electronic elements generate heat on the aluminum substrate 1, the heat is transmitted to the heat conducting copper wires 11 and the heat conducting copper wires 15 which are in close contact with the aluminum substrate 1 through the aluminum substrate 1, the contact area between the aluminum substrate 1 and the heat dissipation blocks 4 is increased through the heat conducting copper wires 11, and as the materials of the heat conducting copper wires 11 and the heat conducting copper wires 15 have extremely high heat conduction coefficients and excellent heat conduction effects, the circuit board can conduct heat effectively when the electronic elements on the aluminum substrate 1 generate heat, the heat in time is led out of the heat in the, therefore, the circuit board is not easy to damage, saves materials and has better environmental protection effect.
The adjacent first heat conducting copper wires 11, the first heat conducting copper wires 11 and the aluminum substrate 1, the first heat conducting copper wires 11 and the inner wall of the groove 16, the adjacent second heat conducting copper wires 15, the top surface of the second heat conducting copper wires 15 and the bottom surface of the aluminum substrate 1, the bottom surfaces of the second heat conducting copper wires 15 and the bottom surface of the groove 16 and the inner peripheral wall of the second heat conducting copper wires 15 and the inner peripheral wall of the groove 16 are in mutual contact through heat conducting silicone layers.
Because all the surfaces have roughness, when the two surfaces are contacted together, the two surfaces cannot be completely contacted together, an air gap can be formed between the two surfaces, the heat conductivity coefficient of air is very small, and the heat conduction silicone grease layer is arranged, so that the heat conduction silicone grease layer can fill the air gaps between the adjacent first heat conduction copper wires 11, between the first heat conduction copper wires 11 and the aluminum substrate 1, between the first heat conduction copper wires 11 and the inner wall of the groove 16, between the adjacent second heat conduction copper wires 15, between the top surface of the second heat conduction copper wires 15 and the bottom surface of the aluminum substrate 1, between the bottom surface of the second heat conduction copper wires 15 and the bottom surface of the groove 16 and between the second heat conduction copper wires 15 and the inner peripheral wall of the groove 16, the contact thermal.
Aluminium base board 1 comprises metal-based 12, insulating layer 13 and circuit layer 14 from bottom to top, and a plurality of rings of heat conduction copper wire 11 twine on the periphery wall of metal-based 12, two connection ear pieces 2 all with insulating layer 13 fixed connection, the thickness of connection ear piece 2, the thickness of insulating layer 13 and the degree of depth of draw-in groove 17 are the same.
Through twine heat conduction copper wire 11 on the periphery wall of metal basic unit 12, because aluminium base board 1 mainly carries out the heat conduction through metal basic unit 12 to make heat conduction copper wire 11 can better conduct the heat that comes from aluminium base board 1.
The depth of the groove 16 is larger than or equal to the sum of the thicknesses of the insulating layer 13 and the metal base layer 12, a plurality of embedded grooves are formed in the bottom surface of the metal base layer 12 and the bottom surface of the groove 16, the embedded grooves are used for being embedded into two ends of the second heat-conducting copper wire 15, the two ends of the second heat-conducting copper wire 15 are also in contact with the inner wall of the embedded groove through the heat-conducting silicone grease layer, and the sum of the embedded groove located in the metal base layer 12 and the embedded groove located in the bottom surface of the groove 16.
Through setting up the embedded groove, can increase the area of contact between two 15 both ends of heat conduction copper wire and metal basic unit 12 and the radiating block 4, thereby strengthen the heat conductivility between aluminium base board 1 and the radiating block 4, and the embedded groove sum that is located metal basic unit 12 and is located the 16 bottom surfaces of recess equals two 15 length of heat conduction copper wire, thereby reduce the air that exists between aluminium base board 1 and the radiating block 4, avoid the heat in the air can't conduct better, guarantee the heat conduction effect between the two.
The thickness of the heat-conducting silicone grease layer is 6-20 microns.
Because the heat-conducting silicone grease layer only plays a role in reducing air gaps, and the heat conductivity coefficient of the heat-conducting silicone grease layer is far smaller than the heat conductivity coefficients of the first heat-conducting copper wire 11 and the second heat-conducting copper wire 15, the smaller the thickness of the heat-conducting silicone grease layer is, the better the thickness of the heat-conducting silicone grease layer is.
The radiating block 4 adopts aluminum alloy material, and 4 bottom surfaces integrated into one piece of radiating block have a plurality of heat dissipation sand grips 6 and a plurality of heat dissipation concave strip 5, and heat dissipation sand grip 6 and heat dissipation concave strip 5 appear in turn in 4 bottom surfaces of radiating block in proper order.
Through setting up a plurality of heat dissipation sand grips 6 and heat dissipation concave strip 5 to the area of contact of increase radiating block 4 and air, thereby make radiating block 4 can be better dispel the heat to the air, strengthen the radiating effect of this circuit board.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims (10)

1. The utility model provides an environment-friendly LED circuit board, includes aluminium base board (1) and radiating block (4), the both sides of aluminium base board (1) all are equipped with connecting ear piece (2), its characterized in that: the aluminum base plate is characterized in that a groove (16) used for accommodating the aluminum base plate (1) and a clamping groove (17) used for accommodating the connecting lug piece (2) are formed in the top surface of the heat dissipation block (4), two connecting lug pieces (3) located right below the groove (16) are arranged on two sides of the heat dissipation block (4), a gap is formed between the peripheral wall of the aluminum base plate (1) and the inner wall of the groove (16), a plurality of circles of heat conduction copper wires (11) wound around the periphery of the aluminum base plate (1) are arranged in the gap, a plurality of heat conduction copper wires (15) distributed in a rectangular array are arranged between the bottom surface of the aluminum base plate (1) and the bottom surface of the groove (16), two ends of each heat conduction copper wire (15) are respectively in contact with the bottom surface of the aluminum base plate (1), and between every two adjacent heat conduction copper wires (11), between the heat conduction copper wires (11) and the aluminum base plate, The adjacent second heat-conducting copper wires (15), the top surfaces of the second heat-conducting copper wires (15) and the bottom surface of the aluminum substrate (1), the bottom surfaces of the second heat-conducting copper wires (15) and the bottom surface of the groove (16) and the inner peripheral walls of the second heat-conducting copper wires (15) and the groove (16) are in mutual contact.
2. The environment-friendly LED circuit board of claim 1, wherein: the adjacent first heat-conducting copper wires (11), the first heat-conducting copper wires (11) and the aluminum substrate (1), the first heat-conducting copper wires (11) and the inner wall of the groove (16), the adjacent second heat-conducting copper wires (15), the top surface of the second heat-conducting copper wires (15) and the bottom surface of the aluminum substrate (1), the bottom surfaces of the second heat-conducting copper wires (15) and the bottom surface of the groove (16) and the inner peripheral wall of the second heat-conducting copper wires (15) and the groove (16) are in mutual contact through heat-conducting silicone grease layers.
3. The environment-friendly LED circuit board of claim 1, wherein: the aluminum substrate (1) is composed of a metal base layer (12), an insulating layer (13) and a circuit layer (14) from bottom to top, a plurality of circles of heat conducting copper wires (11) are wound on the peripheral wall of the metal base layer (12), the two connecting lug blocks (2) are fixedly connected with the insulating layer (13), and the thickness of the connecting lug blocks (2), the thickness of the insulating layer (13) and the depth of the clamping grooves (17) are the same.
4. The environment-friendly LED circuit board of claim 3, wherein: the depth of the groove (16) is more than or equal to the sum of the thicknesses of the insulating layer (13) and the metal base layer (12).
5. The environment-friendly LED circuit board of claim 1, wherein: the connecting lug block I (2) is connected with the connecting lug block II (3) through screws.
6. The environment-friendly LED circuit board of claim 4, wherein: a plurality of embedded grooves are formed in the bottom surface of the metal base layer (12) and the bottom surface of the groove (16), the embedded grooves are used for being embedded into two ends of the second heat-conducting copper wire (15), and the two ends of the second heat-conducting copper wire (15) are also in contact with the inner wall of the embedded grooves through the heat-conducting silicone grease layer.
7. The environment-friendly LED circuit board of claim 6, wherein: the sum of the embedded groove in the metal base layer (12) and the embedded groove in the bottom surface of the groove (16) is equal to the length of the second heat-conducting copper wire (15).
8. The environment-friendly LED circuit board of claim 2 or 6, wherein: the thickness of the heat-conducting silicone grease layer is 6-20 microns.
9. The environment-friendly LED circuit board of claim 1, wherein: the aluminum substrate is characterized in that a plurality of welding pads (8) are arranged on the top surface of the aluminum substrate (1), a plurality of radiating grooves (7) are arranged between the welding pads (8), a plurality of round welding pad positioning points (9) are arranged on the periphery of the top surface of the aluminum substrate (1), and an annular deviation isolation belt (10) is arranged on the periphery of the welding pad positioning points (9).
10. The environment-friendly LED circuit board of claim 1, wherein: the radiating block (4) adopts aluminum alloy material, radiating block (4) bottom surface integrated into one piece has a plurality of heat dissipation sand grips (6) and a plurality of heat dissipation concave strip (5), heat dissipation sand grip (6) and heat dissipation concave strip (5) appear in turn in radiating block (4) bottom surface in proper order.
CN201920918866.9U 2019-06-19 2019-06-19 Environment-friendly LED circuit board Active CN210432023U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201920918866.9U CN210432023U (en) 2019-06-19 2019-06-19 Environment-friendly LED circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201920918866.9U CN210432023U (en) 2019-06-19 2019-06-19 Environment-friendly LED circuit board

Publications (1)

Publication Number Publication Date
CN210432023U true CN210432023U (en) 2020-04-28

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Application Number Title Priority Date Filing Date
CN201920918866.9U Active CN210432023U (en) 2019-06-19 2019-06-19 Environment-friendly LED circuit board

Country Status (1)

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CN (1) CN210432023U (en)

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