CN216752627U - Circuit board packaging device and electronic equipment - Google Patents

Abstract

The utility model provides a circuit board packaging device and electronic equipment, wherein the circuit board packaging device comprises a metal shell, a circuit board and a heat radiating piece, the metal shell comprises a bottom wall and a top wall arranged opposite to the bottom wall, a cavity is arranged between the top wall and the bottom wall, one side of the cavity is provided with an opening, and the circuit board is arranged in the cavity through the opening and is in sliding connection with the metal shell; the circuit board is provided with a heating device on one surface facing the top wall, at least part of the structure of the heat dissipation part is positioned in the cavity, and the heat dissipation part is attached to the heating device and welded with the circuit board; the heat sink has an elastic portion, and the surface of the end of the elastic portion is parallel to the top wall and elastically abuts against the top wall. The utility model not only can realize convenient installation of the radiator and the circuit board, but also has better radiating effect.

Description

Circuit board packaging device and electronic equipment

Technical Field

The present invention relates to the field of circuit board technologies, and in particular, to a circuit board packaging apparatus and an electronic device.

Background

A plurality of heating devices are integrated on the circuit board, and play an important role in electronic equipment.

The circuit board is fixed in the package casing through a screw or a bolt, and is conducted with the package casing, and the circuit board and the package casing form a circuit board packaging device. In the using process of the electronic equipment, the heating device on the circuit board can generate more heat. In order to dissipate heat generated by the heat generating device, the circuit board packaging device is usually further provided with a heat sink inside the package case. At present, a heat sink is generally fixed on a circuit board and a package casing respectively through a screw or bolt, and the heat sink dissipates heat of a heating device.

However, the conventional circuit board packaging device is not only troublesome in mounting the heat sink and the circuit board, but also poor in heat dissipation effect.

SUMMERY OF THE UTILITY MODEL

The utility model provides a circuit board packaging device and electronic equipment, which not only can realize convenient installation of a radiator and a circuit board, but also has a better radiating effect.

The utility model provides a circuit board packaging device, which comprises a metal shell, a circuit board and a heat radiating piece, wherein the metal shell comprises a bottom wall and a top wall arranged opposite to the bottom wall, a cavity is arranged between the top wall and the bottom wall, one side of the cavity is provided with an opening, and the circuit board is arranged in the cavity through the opening and is in sliding connection with the metal shell; the circuit board is provided with a heating device on one surface facing the top wall, at least part of the structure of the heat dissipation part is positioned in the cavity, and the heat dissipation part is attached to the heating device and welded with the circuit board; the heat sink has an elastic portion, and a surface of an end portion of the elastic portion is parallel to and elastically abutted against a top wall of the metal housing.

In some optional embodiments, the elastic portion is disposed toward one side of the opening, and the elastic portion is a bending plate having an end portion disposed at an included angle with the circuit board and bent toward one side away from the circuit board.

In some optional embodiments, the heat dissipation member includes a fixing portion connected to the elastic portion, and the fixing portion is attached to a surface of the heat generating device and welded to the circuit board through a connector.

In some optional embodiments, the circuit board is provided with a mounting hole at a side of the heat generating device, the circuit board is provided with a pad at the mounting hole, the pad is located on a surface of the circuit board opposite to the heat generating device, and an end of the connector passes through the mounting hole and is welded to the pad.

In some optional embodiments, the heat generating device includes a first heat generating device and a second heat generating device, the heat generating amount of the first heat generating device is higher than the heat generating amount of the second heat generating device, and the fixing portion is attached to a surface of the first heat generating device.

In some alternative embodiments, the elastic part includes a first elastic part and a second elastic part connected to the fixing part by the first elastic part and constituting an end of the elastic part.

In some optional embodiments, the first elastic part is vertically connected between the fixing part and the second elastic part, and an included angle between the second elastic part and the first elastic part is an obtuse angle.

In some alternative embodiments, a heat-conducting sheet is provided between the top wall and an end of the elastic portion, and the end of the elastic portion abuts against the top wall through the heat-conducting sheet.

In some optional embodiments, a sliding groove is formed in a side wall of the cavity, the circuit board has a sliding portion adapted to the sliding groove structure, and the sliding portion is inserted into the sliding groove and slidably connected to the sliding groove.

In some optional embodiments, the sliding portion has a conductive layer on a surface opposite to the heat sink, and the conductive layer abuts against the groove body of the sliding groove to conduct the circuit board and the metal housing.

In some alternative embodiments, the conductive layer extends over the sliding portion in a sliding direction of the sliding portion within the cavity.

A second aspect of the utility model provides an electronic device comprising a housing and a circuit board packaging arrangement as defined in any of the above, said circuit board packaging arrangement being provided within said housing.

The utility model provides a circuit board packaging device and electronic equipment, wherein the circuit board packaging device comprises a metal shell, a circuit board and a heat dissipation part, and the heat dissipation part is firstly elastically attached to a heating device of the circuit board and welded with the circuit board, so that the heat dissipation part can be fixed on the circuit board and has a better heat dissipation effect. And secondly, the circuit board and the heat radiating piece can be fixed in the metal shell by sliding connection of the circuit board and the metal shell, so that the fixation of the circuit board and the heat radiating piece in the metal shell can be simplified, and the manufacturing cost of the circuit board packaging device is reduced. Finally, through the setting of elastic part in the radiating piece, the surface of the tip of elastic part is parallel and the butt with metal casing's roof, can be with the better transmission of the heat on the device that generates heat to metal casing like this, when carrying out quick radiating, can strengthen the fixed effect of circuit board and radiating piece in metal casing. Therefore, the utility model not only can realize convenient installation of the radiator and the circuit board, but also has better radiating effect.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic exploded view of a circuit board packaging apparatus according to an embodiment of the present invention;

FIG. 2 is a first schematic view of a circuit board according to an embodiment of the present invention;

fig. 3 is a cross-sectional view of a circuit board package device at an elastic part according to an embodiment of the present invention;

fig. 4 is a schematic structural diagram of a metal shell according to an embodiment of the present invention;

fig. 5a is a schematic structural diagram of a circuit board according to an embodiment of the present invention at a first viewing angle;

fig. 5b is a schematic structural diagram of a circuit board according to an embodiment of the present invention at a second viewing angle;

fig. 6 is a schematic structural diagram of a circuit board packaging apparatus according to an embodiment of the present invention;

FIG. 7 is an enlarged view of the circuit board packaging device of FIG. 3 at section A;

fig. 8 is a schematic structural diagram of a heat sink according to an embodiment of the present invention;

fig. 9 is a first schematic view of a heat sink assembly according to an embodiment of the present invention;

fig. 10 is a second schematic view illustrating the installation of a heat sink according to an embodiment of the present invention.

Description of reference numerals:

100-circuit board package device; 10-a metal housing; 11-a top wall; 12-a cavity; 121-a chute; 13-opening; 14-a thermally conductive sheet; 15-a connecting part;

20-a circuit board; 21-a first mounting surface; 211-a conductive layer; 212-a pad; 22-a second mounting surface; 23-a sliding part; 24-a heat generating device; 241-a first heat generating device; 25-mounting holes;

30-a heat sink; 31-a stationary part; 32-an elastic portion; 321-a first elastic part; 322-a second elastic portion; 33-a limiting part;

40-connecting piece.

Detailed Description

As described in the background art, in the conventional circuit board packaging apparatus, in order to dissipate heat of a heat generating device on a circuit board, a plurality of heat sinks are generally disposed, and the heat sinks are located at one side of the heat generating device and connected through a heat conducting structure, so that heat of the heat generating device is transferred to the heat sinks through the heat conducting structure, and heat dissipation is performed through the heat sinks. The heat sinks are usually fixed to the circuit board and the package case by screws or bolts. Similarly, the circuit board is also usually fixed in the package by screws or bolts and is conducted with the package to realize the fixation and grounding of the circuit board in the package. Therefore, a plurality of screws or bolts are required in the fixing process of the heat sink and the circuit board to enhance the fixing effect of the heat sink and the circuit board.

However, the number of structural members in the circuit board packaging device is large, and a plurality of screws or bolts need to be screwed manually one by one, so that the installation of the heat sink and the circuit board is troublesome, the required material and labor cost are high, and the circuit board packaging device has high production cost. In addition, because the heat sink absorbs the heat of the heating device through the heat conducting structure to dissipate the heat, the heat dissipation effect of the existing circuit board packaging device is poor.

In view of the above, the present invention provides a circuit board packaging device and an electronic apparatus, wherein the circuit board packaging device includes a metal casing, a circuit board and a heat dissipation member, and the heat dissipation member is elastically attached to a heating device of the circuit board and welded to the circuit board, so that the heat dissipation member is fixed on the circuit board and has a good heat dissipation effect. And secondly, the circuit board and the heat radiating piece can be fixed in the metal shell by sliding connection of the circuit board and the metal shell, so that the fixation of the circuit board and the heat radiating piece in the metal shell can be simplified, and the manufacturing cost of the circuit board packaging device is reduced. Finally, through the setting of elastic part in the radiating piece, the surface and the roof of the tip of elastic part are parallel and the butt, can be with the better transmission to the metal casing of the heat on the device that generates heat like this, when carrying out quick radiating, can strengthen the fixed effect of circuit board and radiating piece in the metal casing. Therefore, the utility model not only can realize convenient installation of the radiator and the circuit board, but also has better radiating effect.

The structure of the circuit board packaging device according to the embodiment of the utility model is further explained with reference to the drawings.

Examples

Fig. 1 is a schematic diagram illustrating a circuit board packaging apparatus according to an embodiment of the present invention.

Referring to fig. 1, the circuit board packaging apparatus 100 includes a metal housing 10, a circuit board 20 and a heat sink 30, wherein the metal housing 10 includes a bottom wall and a top wall 11 disposed opposite to the bottom wall, a cavity 12 is disposed between the top wall 11 and the bottom wall, an opening 13 is disposed at one side of the cavity 12, and the circuit board 20 is disposed in the cavity 12 through the opening 13 and slidably connected to the metal housing 10. Compared with the conventional circuit board packaging device 100 in which the circuit board 20 is screwed by screws or bolts, the circuit board packaging device 100 can simplify the fixing of the circuit board 20 in the metal shell 10, facilitate the installation of the circuit board 20, reduce the number of structural components in the circuit board packaging device 100, and reduce the manufacturing cost of the circuit board packaging device 100.

It should be noted that the metal shell 10 may further include two opposite side walls, and the two side walls are vertically connected between the bottom wall and the top wall 11, and together with the bottom wall and the top wall 11, form a cavity 12.

The metal shell 10 may be a shell made of a simple metal or an alloy thereof with good heat dissipation performance. The metal simple substance with better heat dissipation performance may include, but is not limited to, copper or aluminum. In this embodiment, the material of the metal case 10 is not further limited.

As can be seen from fig. 1, the circuit board 20 has a heat generating device 24 on a side facing the top wall 11, at least a part of the heat dissipation member 30 is located in the cavity 12, and the heat dissipation member 30 is attached to the heat generating device 24 and soldered to the circuit board 20. The manner of welding the heat sink 30 to the circuit board 20 may include, but is not limited to, soldering. The heat that heating device 24 produced when using like this can directly transmit to heat sink 30, so that heat on the heating device 24 is absorbed to heat sink 30, to heating device 24 radiating while, because heat sink 30 and circuit board 20 weld, when realizing that heat sink 30 is fixed in circuit board 20 and metal casing 10, can also further reduce the structure in the circuit board packaging device 100, realize the convenient installation of circuit board 20 and heat sink 30, when reinforcing heat sink 30 and circuit board 20's reliability of being connected, the threaded connection of too much screw or bolt has been saved, the installation time of heat sink 30 has been shortened, promote the installation effectiveness of heat sink 30. Since soldering, for example soldering, is a simpler connection means in the circuit board 20, this also has a lower material cost, which can effectively reduce the production cost of the circuit board packaging arrangement 100.

The heat dissipation member 30 may have a sheet structure, that is, the heat dissipation member 30 may also be referred to as a heat dissipation fin, so that the attachment effect of the heat dissipation member 30 and the heat generating device 24 can be enhanced, the heat dissipation area can be increased, the heat dissipation effect can be enhanced, and the heat dissipation member 30 can be conveniently fixed on the circuit board 20.

Illustratively, the heat generating device 24 may include, but is not limited to, a chip, an integrated circuit module (i.e., IC), a resistor, a capacitor, and the like. The heat generating device 24 may include a first heat generating device 241 and a second heat generating device, the heat generating amount of the first heat generating device 241 being higher than that of the second heat generating device, wherein the integrated circuit module and the chip may be understood as the first heat generating device 241 and the resistance and the capacitance may be understood as the second heat generating device. In order to achieve rapid heat dissipation, the heat dissipation member 30 may be attached to the first heat generation device 241, so as to absorb heat of the first heat generation device 241 more rapidly and perform rapid heat dissipation, so as to prevent the first heat generation device 241 from being too hot and affecting the service life of the first heat generation device 241.

Fig. 2 is a first schematic view illustrating the installation of a circuit board according to an embodiment of the present invention, and fig. 3 is a cross-sectional view of a circuit board packaging device at an elastic portion according to an embodiment of the present invention. Wherein the final mounting position of the heat sink 30 and the circuit board 20 within the metal housing 10 may be as shown in fig. 3.

Referring to fig. 1 to 3, the heat sink 30 has an elastic portion 32, and a surface of an end portion of the elastic portion 32 is parallel to and abuts the top wall 11 (as shown in fig. 3). Therefore, the whole surface of the end of the elastic part 32 is in contact with the metal shell 10, heat on the heating device 24 can be better transferred to the metal shell 10, the whole metal shell 10 is utilized as a heat dissipation part to the maximum extent, so that the heat dissipation area of the heat dissipation part 30 is increased, heat exchange is carried out between the metal shell 10 and the external air of the circuit board packaging device 100, so that a better heat dissipation effect is achieved, and meanwhile, the fixing effect of the circuit board 20 and the heat dissipation part 30 in the metal shell 10 can be enhanced due to the fact that the end of the elastic part 32 is abutted to the top wall 11 of the metal shell 10. Therefore, the present invention not only can realize convenient installation of the heat sink and the circuit board 20, but also has a good heat dissipation effect to improve the stability of the circuit board packaging apparatus 100.

In addition, because the circuit board 20 is slidably connected to the metal housing 10, when the circuit board 20 needs to be maintained, the circuit board 20 can be taken out of the metal housing 10 for maintenance in a sliding manner, and then is put into the metal housing 10 for continuous use in a sliding manner. Therefore, the circuit board packaging apparatus 100 in this embodiment can also facilitate maintenance of the circuit board 20, so that the maintenance of the circuit board 20 is more convenient and efficient, and meanwhile, no material loss is caused, which is helpful for reducing the maintenance cost of the circuit board packaging apparatus 100.

It should be noted that, in the present embodiment, while the circuit board 20 and the heat sink 30 are assembled and fixed in the metal housing 10, since no connecting component 40, such as a screw, is exposed outside the circuit board packaging device, the aesthetic performance of the circuit board packaging device can also be improved, and the grade and competitiveness of the circuit board packaging device are greatly improved.

In order to facilitate the surface of the end of the elastic portion 32 to be parallel to and elastically abut against the top wall 11, as shown in fig. 1, the elastic portion 32 may be disposed toward one side of the opening 13, and the elastic portion 32 is a bending plate whose end is disposed at an included angle with the circuit board 20 and is bent toward one side away from the circuit board 20. Thus, under the action of external force, the circuit board 20 is pushed into the cavity 12 from the opening 13, and during the process of penetrating into the cavity 12, the end of the elastic portion 32 first abuts against the top wall 11 of the metal shell 10, and under the action of the top wall 11, such as the edge structure of the top wall 11, the end of the elastic portion 32 is elastically deformed toward one side of the circuit board 20. With the continuous insertion of the circuit board 20 in the cavity 12, under the continuous action of the top wall 11, the end of the elastic portion 32 also penetrates through the cavity 12 along with the circuit board 20 and continues to elastically deform toward one side of the circuit board 20 until the end of the elastic portion 32 is flush with the top wall 11 of the metal shell 10, so that the end of the elastic portion 32 elastically abuts against the top wall 11 of the metal shell 10. At this time, the circuit board 20 is completely mounted in the metal housing 10, and the heat sink 30 may be entirely located in the cavity 12 as shown in fig. 3, or may be partially located in the cavity 12.

Accordingly, during the process that the circuit board 20 is pulled out of the cavity 12 through the opening 13, the end of the elastic portion 32 may gradually recover the elastic deformation under the effect of the elastic force until the elastic portion 32 is pulled out to the outside of the cavity 12 along with the circuit board 20, so as to facilitate the next installation of the circuit board 20 in the metal housing 10.

It should be noted that an included angle between the end of the elastic portion 32 and the circuit board 20 may be an acute angle, such as 30 degrees or 45 degrees, so that during the insertion of the circuit board 20 into the cavity 12, the end of the elastic portion 32 abuts against the top wall 11 of the metal shell 10 and is elastically deformed.

Fig. 4 is a schematic structural diagram of a metal housing according to an embodiment of the present invention, and fig. 5a is a schematic structural diagram of a circuit board according to an embodiment of the present invention in a first viewing angle. Fig. 5a can be understood as a structural diagram of the circuit board on the front side. The heat generating device 24 and the heat sink 30 may be provided on the front side of the circuit board as shown in fig. 5a, the front side of the circuit board 20 may be understood as the second mounting surface 22, and the back side of the circuit board 20 may be understood as the first mounting surface 21.

Referring to fig. 4 and 5a, in order to facilitate the sliding connection between the circuit board 20 and the metal housing 10, a sliding groove 121 is disposed on a sidewall of the cavity 12, wherein the sliding groove 121 may be disposed on a sidewall of the metal housing 10. The circuit board 20 has a sliding portion 23 structurally matched with the sliding slot 121, and the sliding portion 23 can be inserted into the sliding slot 121 and slidably connected to the sliding slot 121. The assembly of the circuit board 20 in the slide groove 121 can be seen in fig. 2. In this way, the circuit board 20 can be inserted into the sliding groove 121 through the sliding portion 23, so that the circuit board 20 is slidably connected to the metal housing 10 in the cavity 12.

Referring to fig. 4, protrusions may be disposed on two opposite side walls of the cavity 12, an end of each protrusion may extend toward a center of the cavity 12, and a sliding groove 121 is disposed in each protrusion, so that the thickness of the metal shell 10 can be reduced while the circuit board 20 is slidably connected to the metal shell 10 in the cavity 12. Alternatively, in some other embodiments, the sliding groove 121 may also be a recessed structure on the inner side wall of the metal shell 10.

In the related art circuit board packaging apparatus 100, the circuit board 20 is usually fixed in the package casing by screws or bolts, and is conducted with the package casing by the screws or bolts, so as to realize grounding of the circuit board 20. However, since the contact area between the screw or the bolt and the package casing is small, the ground impedance is large, the conduction effect between the circuit board 20 and the package casing is poor, and the stability of the product is poor.

Fig. 5b is a schematic structural diagram of a circuit board provided in an embodiment of the present invention in a second viewing angle, and fig. 6 is a schematic structural diagram of a circuit board packaging apparatus provided in an embodiment of the present invention, where fig. 5b can also be regarded as a schematic structural diagram of the circuit board on the first mounting surface.

In order to enhance the conduction effect between the circuit board 20 and the metal housing 10, as shown in fig. 5b and fig. 6, the sliding portion 23 has a conductive layer 211 on a surface opposite to the heat sink 30, and the conductive layer 211 abuts against the groove body of the sliding groove 121 to conduct the circuit board 20 and the metal housing 10. The conductive layer 211 is located on a side of the circuit board 20 opposite to the heat generating device 24 (i.e., a back side of the circuit board 20). The conductive layer 211 may be formed on the sliding portion 23 by coating, plating, depositing, or otherwise forming a conductive metal. Illustratively, the conductive metal may include, but is not limited to, copper. Compared with the existing mode that the circuit board 20 is conducted with the packaging shell through a screw or a bolt, the conductive layer 211 is abutted to the whole surface of the groove 121, so that the conducting area of the circuit board 20 and the metal shell 10 is increased, the conducting effect of the circuit board 20 and the metal shell 10 is improved, the grounding effect of the circuit board 20 is ensured, the stability of the circuit board packaging device 100 and electronic equipment is further improved, and meanwhile, the circuit board packaging device has smaller grounding impedance, so that the electromagnetic compatibility, namely the requirements of EMC and the like of the circuit board packaging device 100 and the electronic equipment are realized and met.

It should be noted that, in the process that the circuit board 20 is inserted into the cavity 12 through the opening 13, because the elastic portion 32 is elastically deformed toward one side of the circuit board 20 under the action of the top wall 11 of the metal shell 10, under the action of the elastic portion 32, the conductive layer 211 is tightly attached to the groove body of the sliding groove 121, the whole surface of the conductive layer 211 is abutted to the groove body of the sliding groove 121, and the conduction effect between the circuit board 20 and the metal shell 10 and the stability of the circuit board packaging device 100 and the electronic device are ensured.

As can be seen in fig. 5b, the conductive layer 211 extends over the slide 23 in the sliding direction of the slide 23 within the cavity 12. This can further increase the conductive area between the circuit board 20 and the metal housing 10, and improve the conductive effect between the circuit board 20 and the metal housing 10, and the stability of the circuit board packaging apparatus 100 and the electronic device.

Fig. 7 is an enlarged view of the circuit board package of fig. 3 at section a.

In order to obtain better heat dissipation efficiency, as shown in fig. 7, a heat conduction sheet 14 is provided between the top wall 11 and the end of the elastic portion 32, and the end of the elastic portion 32 may abut against the top wall 11 through the heat conduction sheet 14. Illustratively, the heat-conducting sheet 14 includes, but is not limited to, a heat-conducting silicone sheet. This enables the heat absorbed by the heat sink 30 to be more quickly transferred to the metal case 10 by the heat conductive sheet 14, thereby improving the heat dissipation efficiency.

In order to avoid the effect of the heat conducting sheet 14 abutting against the top wall 11 at the end of the elastic portion 32 under the action of the metal casing 10, the heat conducting sheet 14 may be attached to the inner top wall of the cavity 12 in advance and located at the fixed position of the elastic portion 32 in the cavity 12, so that when the heat sink 30 is assembled in the metal casing 10 along with the circuit board 20, the end of the elastic portion 32 may abut against the top wall 11 through the heat conducting sheet 14, thereby achieving the purpose of improving the heat dissipation efficiency.

Fig. 8 is a schematic structural diagram of a heat sink according to an embodiment of the present invention.

Referring to fig. 8, the heat sink 30 may further include a fixing portion 31 connected to the elastic portion 32, wherein the fixing portion 31 is attached to the surface of the heat generating device 24 and welded to the circuit board 20 through a connector 40, so as to weld the heat sink 30 to the circuit board 20 and fix the heat sink 30 to the circuit board 20.

Fig. 9 is a first schematic view illustrating installation of a heat sink according to an embodiment of the present invention, and fig. 10 is a second schematic view illustrating installation of a heat sink according to an embodiment of the present invention.

Referring to fig. 9 and 10, the circuit board 20 is provided with mounting holes 25 at the sides of the heat generating device 24 such as the first heat generating device 241, the circuit board 20 is provided with pads 212 at the mounting holes 25, the pads 212 are located on the circuit board 20 at a side opposite to the heat generating device 24, and the ends of the connectors 40 are soldered to the pads 212 through the mounting holes 25. Thus, the fixing part 31 and the circuit board 20 can be welded without affecting the surface attaching effect of the fixing part 31 and the heat generating device 24, so that the connection mode of the heat sink 30 and the circuit board 20 is more reliable, and the production cost of the circuit board packaging device 100 can be effectively reduced.

Illustratively, mounting holes 25 may be through holes and pads 212 include, but are not limited to, copper pads or other metal pads that are solderable to a solder such as tin or the like. In the case of a copper plate, a copper layer may be formed on the back surface of the circuit board 20 at the mounting hole 25 by coating, electroplating or deposition, so as to form the pad 212, so as to facilitate the soldering of the connector 40.

Illustratively, the connector 40 may include, but is not limited to, a pin. The pin may have a tin layer on its surface so that the end of the pin, when inserted through the mounting hole 25, may be soldered to the pad 212, thereby providing corrosion resistance to the pin while allowing the heat sink 30 to be attached to the circuit board 20. In this embodiment, in the fixing process of the heat dissipation member 30, a screw connection manner of screws or bolts is not required, so that connection of excessive screws or bolts is omitted, the installation time of the heat dissipation member 30 is shortened, convenient installation of the heat dissipation member 30 is realized, and the material cost is low, so that the production cost of the circuit board packaging device 100 is reduced.

As shown in fig. 9, the fixing portion 31 may be attached to a surface of the first heat-generating device 241 to enhance a heat dissipation effect of the heat sink 30 on the first heat-generating device 241.

As shown in fig. 8, the elastic part 32 may include a first elastic part 32 and a second elastic part 32, and the second elastic part 32 is connected to the fixing part 31 of the heat sink 30 through the first elastic part 32 and constitutes an end of the elastic part 32. This can be brought into abutment with the top wall 11 of the metal shell 10 by the second elastic portion 32.

The first elastic portion 32 is vertically connected between the fixing portion 31 and the second elastic portion 32, and an included angle a between the second elastic portion 32 and the first elastic portion 32 is an obtuse angle. Illustratively, the included angle a may be 120 degrees, 130 degrees, or other obtuse angles suitable for mounting in the cavity 12. When realizing that second elastic part 32 is connected with fixed part 31 like this, can make second elastic part 32 and circuit board 20 be the contained angle setting to the one side bending that deviates from circuit board 20 is faced away from, so that along with the in-process that circuit board 20 inserted cavity 12, under the effect of roof 11 of metal casing 10, can take place elastic deformation towards one side of circuit board 20, so that the surface of the tip of realization elastic part 32 is parallel with roof 11 and elasticity butt.

It should be noted that the first elastic portion 32, the second elastic portion 32 and the fixing portion 31 constitute a zigzag heat dissipation structure as shown in fig. 8, so that the heat dissipation member 30 is fixed on the circuit board 20 by the fixing portion 31 and can elastically abut against the top wall 11 of the metal housing 10 by the second elastic portion 32.

In order to avoid the second elastic portion 32 from being excessively deformed, in some embodiments, the heat dissipation element 30 further has a position-limiting portion 33, and the position-limiting portion 33 is connected to the second elastic portion 32 and is located on a surface of the second elastic portion 32 facing the circuit board 20. The position-limiting part 33 may be connected to an end of the second elastic part 32 away from the first elastic part 32, or the position-limiting part 33 may be connected to a middle portion or other positions of the second elastic part 32. Through the setting of spacing portion 33, can protect heat dissipation member 30 like this, with the deformation control of second elastic component 32 towards circuit board 20 one side in certain extent to avoid second elastic component 32 to take place excessive deformation, when protecting heat dissipation member 30, can strengthen heat dissipation member 30's life, reliability and stability of reinforcing circuit board packaging hardware 100.

In some embodiments, the circuit board packaging apparatus 100 may further include a cover plate disposed at the opening 13 and detachably connected to the metal housing 10. In order to facilitate the covering of the cover plate, in some embodiments, a connection portion 15 is further provided at an inner top wall of the cavity 12, wherein the connection portion 15 is located at the opening 13, and an end of the connection portion 15 extends toward one side of the circuit board 20, so that the cover plate is connected with the metal housing 10 through the connection portion 15.

It should be noted that, in order to avoid the connecting portion 15 from affecting the arrangement of the heat sink 30 in the cavity 12, the connecting portions 15 may be disposed on two opposite sides of the heat sink 30, so as to avoid the connecting portions 15 from interfering with the arrangement of the heat sink 30 in the cavity 12.

On the basis of the above, the embodiment of the present invention further provides an electronic device, where the electronic device may include a housing and the circuit board packaging apparatus 100 in this embodiment, and the circuit board packaging apparatus 100 is disposed in the housing. The electronic device may include, but is not limited to, a television, an interactive tablet, or other electronic products having the circuit board packaging apparatus 100. Therefore, the radiating effect and the stability of the electronic equipment can be improved, and the production cost of the electronic equipment can be reduced.

It should be noted that, for other effective effects of the electronic device, reference may be made to the above description related to the circuit board packaging apparatus 100, and in this embodiment, further details of beneficial effects of the electronic device provided by the circuit board packaging apparatus 100 are not repeated.

According to the circuit board packaging device and the electronic equipment, the heat dissipation member 30 is elastically attached to the heating device 24 of the circuit board 20, and is welded with the circuit board 20, meanwhile, the circuit board 20 is in sliding connection with the metal shell 10, and the surface of the end part of the elastic part 32 of the heat dissipation member 30 is parallel to and abutted against the top wall 11, so that the circuit board 20 and the heat dissipation member 30 are conveniently installed in the metal shell 10, the manufacturing cost of the circuit board packaging device 100 is reduced, and meanwhile, a good heat dissipation effect is achieved.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on those shown in the drawings, and are used merely for convenience of description and for simplicity of description, and do not indicate or imply that the device or element so referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus should not be considered as limiting the present invention.

In the description of the present invention, it is to be understood that the terms "comprises" and "comprising," and any variations thereof, as used herein, are intended to cover a non-exclusive inclusion, such that a process, method, display structure, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

Unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integral to one another; either directly or indirectly through intervening media, such as through internal communication or through an interaction between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations. Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the utility model has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and these modifications or substitutions do not depart from the spirit of the corresponding technical solutions of the embodiments of the present invention.

Claims (12)

1. A circuit board packaging device is characterized by comprising a metal shell, a circuit board and a heat radiating piece, wherein the metal shell comprises a bottom wall and a top wall arranged opposite to the bottom wall, a cavity is arranged between the top wall and the bottom wall, one side of the cavity is provided with an opening, and the circuit board is arranged in the cavity through the opening and is in sliding connection with the metal shell; the circuit board is provided with a heating device on one surface facing the top wall, at least part of the structure of the heat dissipation part is positioned in the cavity, and the heat dissipation part is attached to the heating device and welded with the circuit board; the heat sink has an elastic portion, and a surface of an end portion of the elastic portion is parallel to the top wall and elastically abuts against the top wall.

2. The circuit board packaging device according to claim 1, wherein the elastic portion is disposed toward one side of the opening, and the elastic portion is a bent plate having an end portion disposed at an included angle with respect to the circuit board and bent toward a side away from the circuit board.

3. The circuit board packaging apparatus according to claim 2, wherein the heat sink includes a fixing portion connected to the elastic portion, the fixing portion is attached to the surface of the heat generating device and is soldered to the circuit board through a connector.

4. The circuit board packaging device according to claim 3, wherein the circuit board is provided with a mounting hole at a side of the heat generating device, the circuit board is provided with a pad at the mounting hole, the pad is located on a surface of the circuit board opposite to the heat generating device, and an end of the connecting member passes through the mounting hole and is soldered to the pad.

5. The circuit board packaging apparatus according to claim 3, wherein the heat generating device includes a first heat generating device and a second heat generating device, a heat generation amount of the first heat generating device is higher than a heat generation amount of the second heat generating device, and the fixing portion is attached to a surface of the first heat generating device.

6. The circuit board packaging apparatus of claim 3, wherein the elastic portion comprises a first elastic portion and a second elastic portion, the second elastic portion is connected to the fixing portion through the first elastic portion and constitutes an end of the elastic portion.

7. The circuit board packaging apparatus of claim 6, wherein the first elastic portion is vertically connected between the fixing portion and the second elastic portion, and an included angle between the second elastic portion and the first elastic portion is an obtuse angle.

8. The circuit board packaging apparatus according to any one of claims 2 to 7, wherein a heat conductive sheet is provided between the top wall and an end of the elastic portion, and the end of the elastic portion abuts against the top wall via the heat conductive sheet.

9. The device for packaging circuit board according to any one of claims 1 to 7, wherein a sliding groove is formed on a side wall of the cavity, the circuit board has a sliding portion adapted to the structure of the sliding groove, and the sliding portion is inserted into the sliding groove and slidably connected to the sliding groove.

10. The circuit board packaging device according to claim 9, wherein the sliding portion has a conductive layer on a surface thereof opposite to the heat sink, and the conductive layer abuts against the groove body of the sliding groove to conduct the circuit board and the metal case.

11. The circuit board packaging arrangement according to claim 10, wherein the conductive layer extends over the sliding portion in a sliding direction of the sliding portion within the cavity.

12. An electronic device comprising a housing and a circuit board encapsulation means according to any of claims 1-11, said circuit board encapsulation means being provided within said housing.

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