CN219697997U - Combined printed circuit board - Google Patents
Combined printed circuit board Download PDFInfo
- Publication number
- CN219697997U CN219697997U CN202321074618.3U CN202321074618U CN219697997U CN 219697997 U CN219697997 U CN 219697997U CN 202321074618 U CN202321074618 U CN 202321074618U CN 219697997 U CN219697997 U CN 219697997U
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- CN
- China
- Prior art keywords
- printed circuit
- board area
- circuit board
- area
- hard board
- Prior art date
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- 239000003292 glue Substances 0.000 claims abstract description 20
- 239000013039 cover film Substances 0.000 claims description 14
- 230000004888 barrier function Effects 0.000 claims description 12
- 239000010408 film Substances 0.000 claims description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 229910052681 coesite Inorganic materials 0.000 claims description 3
- 229910052906 cristobalite Inorganic materials 0.000 claims description 3
- 229920000642 polymer Polymers 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- 235000012239 silicon dioxide Nutrition 0.000 claims description 3
- 229910052682 stishovite Inorganic materials 0.000 claims description 3
- 229910052905 tridymite Inorganic materials 0.000 claims description 3
- 238000007689 inspection Methods 0.000 abstract description 4
- 238000012423 maintenance Methods 0.000 abstract description 4
- 238000000926 separation method Methods 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 48
- 239000012790 adhesive layer Substances 0.000 description 4
- 238000009713 electroplating Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- FPWNLURCHDRMHC-UHFFFAOYSA-N 4-chlorobiphenyl Chemical compound C1=CC(Cl)=CC=C1C1=CC=CC=C1 FPWNLURCHDRMHC-UHFFFAOYSA-N 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003351 stiffener Substances 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
The utility model provides a combined printed circuit board, which comprises a printed circuit board body, wherein a front hard board area is arranged at the front part of the printed circuit board body, a rear hard board area is arranged at the rear part of the printed circuit board body, a middle soft board area is arranged between the middle parts of the front hard board area and the rear hard board area, an IC chip is arranged at the top of the printed circuit board body, and two groups of through holes are arranged in the printed circuit board body; the upper portion in preceding hard board district has set gradually the upper surface and has filled the glue film, and the lower extreme of upper surface filling the glue film is provided with the green oil of separation, the lower part in preceding hard board district is provided with the lower surface and fills the glue film, and the upper end of lower surface filling the glue film is provided with the green oil of separation down. The utility model is convenient for connection and combined use, reduces wiring and assembly errors, saves equipment maintenance, debugging and inspection time, improves labor productivity and reduces the manufacturing cost of electronic equipment.
Description
Technical Field
The utility model relates to the technical field of printed circuit boards, in particular to a combined printed circuit board.
Background
The combined printed circuit board is a common electronic component, with the increase of power of various electronic products, the load of the printed circuit board is also increased continuously, and the electronic component is embedded in the existing electronic component and is generally electrically connected with the circuit pattern through leads or pins. The specification of the comparison document CN207692141U refers to that electrolytic copper foil 12 is arranged on the left side and the right side of the upper side of a circuit board body 1, a film base film 11 is arranged below the electrolytic copper foil 12, an electroplating plate 10 is arranged below the film base film 11, a heat conduction PCB 3 is arranged inside the electroplating plate 10, a buffer plate 9 is arranged below the electroplating plate 10, a pressing plate 4 is arranged below the buffer plate 9, a solder layer 5 is arranged below the pressing plate 4, an inner layer semi-curing plate 8 is arranged below the solder layer 5, an outer layer semi-curing plate 6' is arranged below the inner layer semi-curing plate 8, and the comparison document is convenient for heat dissipation and external interference isolation, wiring in the printed circuit board structure is easy to be staggered together, circuit disorder is easy to occur, and the use is not safe and reliable.
Disclosure of Invention
In order to overcome the defects existing in the prior art, a combined printed circuit board is provided at present to solve the problems that the printed circuit board is easy to stagger together the wiring in the structure of the printed circuit board, easy to generate circuit disorder and unsafe and reliable to use although the comparison file is convenient to dissipate heat and isolate external interference.
In order to achieve the above purpose, a combined printed circuit board is provided, which comprises a printed circuit board body, the front part of the printed circuit board body is provided with a front hard board area, the rear part of the printed circuit board body is provided with a rear hard board area, a middle soft board area is arranged between the middle parts of the front hard board area and the rear hard board area, an IC chip is arranged at the top of the printed circuit board body, and two groups of through holes are arranged in the printed circuit board body.
Further, the upper portion of preceding hard board district has set gradually the upper surface and has filled the glue film, and the lower extreme of upper surface filling the glue film is provided with the green oil of upper separation to the lower extreme of the green oil of upper separation is provided with the rigid dielectric layer PP.
Further, the lower part of the front hard board area is provided with a lower surface filling glue layer, the upper end of the lower surface filling glue layer is provided with lower barrier green oil, and the upper end of the lower barrier green oil is provided with a lower rigid dielectric layer PP.
Furthermore, the upper surface filling glue layer and the lower surface filling glue layer in the front hard plate area are both coated with polymer.
Further, the center of the middle soft board area is provided with a dielectric layer, the front part of the dielectric layer is arranged at the center in the front hard board area, and the rear part of the dielectric layer is arranged at the center in the rear hard board area.
Further, the upper end of the dielectric layer is provided with a lower inner layer circuit, the lower end of the lower inner layer circuit is provided with an upper inner layer circuit, and the dielectric layers are all SiO2 dielectric layers.
Further, a lower cover film is arranged at the upper end of the lower inner layer circuit, an upper cover film is arranged at the lower end of the upper inner layer circuit, and the lower cover film and the upper cover film are both aluminum films with the thickness of 5-30 mu m.
The utility model has the beneficial effects that:
1. the printed circuit board body is formed by combining the front hard board area, the middle soft board area and the rear hard board area, the front hard board area and the rear hard board area are combined through the connection of the middle soft board area, wiring and assembly errors are reduced, equipment maintenance, debugging and inspection time is saved, labor productivity is improved, and manufacturing cost of electronic equipment is reduced.
2. The front hard board area is provided with the wiring on both sides, and the upper wiring and the lower wiring are connected through the through holes, so that the difficulty of staggered wiring in the single-sided board is solved, and the front hard board area is more suitable for being used on a circuit more complicated than the single-sided board.
3. The dielectric layer of the middle soft board area is used for keeping the insulativity between the circuit and each layer, so that the connection between the front hard board area and the rear hard board area is safer and more reliable, and the equipment is safer and safer to use.
Drawings
FIG. 1 is a schematic cross-sectional view of an embodiment of the present utility model;
FIG. 2 is an expanded view of the front stiffener area according to an embodiment of the present utility model;
FIG. 3 is a schematic view showing the development of the structure of the middle soft board area according to the embodiment of the utility model;
FIG. 4 is an expanded view of the structure of the rear hard plate area according to the embodiment of the present utility model.
In the figure: 1. a printed wiring board body; 10. an IC chip; 11. the upper surface is filled with a glue layer; 12. upper barrier green oil; 13. applying a rigid dielectric layer PP; 14. a via hole; 15. a lower rigid dielectric layer PP; 16. lower barrier green oil; 17. the lower surface is filled with a glue layer; 2. a front hard plate area; 3. a medium soft board area; 30. a cover film is arranged on the upper surface; 31. an upper inner layer circuit; 32. a dielectric layer; 33. a lower inner layer circuit; 34. a lower cover film; 4. and a rear hard plate area.
Detailed Description
In order to make the technical problems, technical schemes and beneficial effects to be solved more clearly apparent, the present utility model is further described in detail below with reference to the accompanying drawings and embodiments. The specific embodiments described herein are offered by way of illustration only and not as limitations of the utility model, and specific details such as particular system architectures, techniques, etc. may be set forth in order to provide a more thorough understanding of the embodiments of the utility model. The described embodiments are some, but not all, embodiments of the present disclosure. It will be apparent, however, to one skilled in the art that the present utility model may be practiced in other embodiments that depart from these specific details. Based on the embodiments in this disclosure, all other embodiments that a person skilled in the art would obtain without making any inventive effort are within the scope of protection of this disclosure.
Specific embodiments of the present utility model are described in detail below with reference to the accompanying drawings.
Fig. 1 is a schematic cross-sectional structure of an embodiment of the present utility model, fig. 2 is a schematic structural development of a front hard-board area of an embodiment of the present utility model, fig. 3 is a schematic structural development of a middle soft-board area of an embodiment of the present utility model, and fig. 4 is a schematic structural development of a rear hard-board area of an embodiment of the present utility model.
Referring to fig. 1 to 4, the present utility model provides a combined printed wiring board, which comprises a printed wiring board body 1, wherein a front hard board area 2 is arranged at the front part of the printed wiring board body 1, a rear hard board area 4 is arranged at the rear part of the printed wiring board body 1, a middle soft board area 3 is arranged between the front hard board area 2 and the middle part of the rear hard board area 4, an IC chip 10 is arranged at the top of the printed wiring board body 1, and two groups of through holes 14 are arranged in the printed wiring board body 1.
As a preferred embodiment, the printed circuit board body 1 is formed by combining the front hard board area 2, the middle soft board area 3 and the rear hard board area 4, the front hard board area 2 and the rear hard board area 4 are combined and used through the connection of the middle soft board area 3, wiring and assembly errors are reduced, equipment maintenance, debugging and inspection time is saved, labor productivity is improved, and manufacturing cost of electronic equipment is reduced.
In this embodiment, an upper surface filling glue layer 11 is sequentially arranged at the upper part of the front hard board area 2, an upper barrier green oil 12 is arranged at the lower end of the upper surface filling glue layer 11, and an upper rigid dielectric layer PP13 is arranged at the lower end of the upper barrier green oil 12; the lower part of the front hard board area 2 is provided with a lower surface filling adhesive layer 17, the upper end of the lower surface filling adhesive layer 17 is provided with a lower barrier green oil 16, and the upper end of the lower barrier green oil 16 is provided with a lower rigid dielectric layer PP15; the upper surface-filled adhesive layer 11 and the lower surface-filled adhesive layer 17 in the front hard plate area 2 are both polymer coatings.
As a preferred embodiment, the wires are arranged on both sides of the front hard board area 2, and the upper wires and the lower wires are connected through the through holes, so that the difficulty of staggered wires in the single-sided board is solved, and the circuit board is more suitable for being used on a circuit more complicated than the single-sided board.
In the present embodiment, the center of the middle soft board region 3 is provided with the dielectric layer 32, and the front part of the dielectric layer 32 is installed at the center in the front hard board region 2, and the rear part of the dielectric layer 32 is installed at the center in the rear hard board region 4; the upper end of the dielectric layer 32 is provided with a lower inner layer circuit 33, the lower end of the lower inner layer circuit 33 is provided with an upper inner layer circuit 31, and the dielectric layers 32 are all SiO2 dielectric layers; the lower inner layer wire 33 is provided at an upper end thereof with a lower cover film 34, and the upper inner layer wire 31 is provided at a lower end thereof with an upper cover film 30, and the lower cover film 34 and the upper cover film 30 are each made of an aluminum film of 5-30 μm.
As a preferred embodiment, the dielectric layer 32 of the middle soft board area 3 is used to maintain the insulation between the wires and the layers in the present utility model, so that the connection between the front hard board area 2 and the rear hard board area 4 is safer and more reliable, and the device is safer and safer to use.
The utility model can effectively solve the problems that the wiring in the printed circuit board structure is easy to be staggered together, easy to generate circuit disorder and unsafe and reliable to use although the comparison file is convenient to radiate and isolate external interference, is convenient to connect and use in combination, reduces the error of wiring and assembly, saves the time of maintenance, debugging and inspection of equipment, improves the labor productivity and reduces the cost of electronic equipment.
The above-described embodiments are intended to illustrate the present utility model, not to limit it, and any modifications and variations made to the present utility model within the spirit of the utility model and the scope of the claims should be included in the scope of the present utility model.
Claims (7)
1. The utility model provides a combination formula printed wiring board, includes printed wiring board body (1), its characterized in that: the front part of the printed circuit board body (1) is provided with a front hard board area (2), the rear part of the printed circuit board body (1) is provided with a rear hard board area (4), a middle soft board area (3) is arranged between the front hard board area (2) and the middle part of the rear hard board area (4), the top of the printed circuit board body (1) is provided with an IC chip (10), and two groups of through holes (14) are arranged in the printed circuit board body (1).
2. A combined printed wiring board according to claim 1, characterized in that the upper part of the front hard board area (2) is provided with an upper surface filling glue layer (11) in sequence, the lower end of the upper surface filling glue layer (11) is provided with an upper barrier green oil (12), and the lower end of the upper barrier green oil (12) is provided with an upper rigid dielectric layer PP (13).
3. A combined printed wiring board according to claim 1, characterized in that the lower part of the front hard board area (2) is provided with a lower surface filling glue layer (17), and the upper end of the lower surface filling glue layer (17) is provided with a lower barrier green oil (16), and the upper end of the lower barrier green oil (16) is provided with a lower rigid dielectric layer PP (15).
4. A combined printed wiring board according to claim 1, characterized in that the upper surface-filled glue layer (11) and the lower surface-filled glue layer (17) in the front hard board area (2) are both polymer-coated.
5. A combined printed wiring board according to claim 1, characterized in that the center of the middle soft board area (3) is provided with a dielectric layer (32), and the front part of the dielectric layer (32) is installed at the center in the front hard board area (2), and the rear part of the dielectric layer (32) is installed at the center in the rear hard board area (4).
6. A combined printed wiring board according to claim 5, characterized in that the upper end of the dielectric layer (32) is provided with a lower inner layer wiring (33), and the lower end of the lower inner layer wiring (33) is provided with an upper inner layer wiring (31), and that the dielectric layers (32) are all SiO2 dielectric layers.
7. A combined printed wiring board according to claim 6, wherein the upper end of the lower inner layer wiring (33) is provided with a lower cover film (34), and the lower end of the upper inner layer wiring (31) is provided with an upper cover film (30), and both the lower cover film (34) and the upper cover film (30) are made of an aluminum film of 5-30 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321074618.3U CN219697997U (en) | 2023-05-08 | 2023-05-08 | Combined printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321074618.3U CN219697997U (en) | 2023-05-08 | 2023-05-08 | Combined printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219697997U true CN219697997U (en) | 2023-09-15 |
Family
ID=87944725
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321074618.3U Active CN219697997U (en) | 2023-05-08 | 2023-05-08 | Combined printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219697997U (en) |
-
2023
- 2023-05-08 CN CN202321074618.3U patent/CN219697997U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |