CN113301725A - HDI multilayer circuit board through hole plugging process - Google Patents
HDI multilayer circuit board through hole plugging process Download PDFInfo
- Publication number
- CN113301725A CN113301725A CN202110567706.6A CN202110567706A CN113301725A CN 113301725 A CN113301725 A CN 113301725A CN 202110567706 A CN202110567706 A CN 202110567706A CN 113301725 A CN113301725 A CN 113301725A
- Authority
- CN
- China
- Prior art keywords
- hole
- circuit board
- multilayer circuit
- pressure plate
- glue film
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
Abstract
The invention discloses a HDI multilayer circuit board through hole plugging process, which comprises the following steps: s3, drilling a light hole (3) on one pressure plate and at two ends of the pressure plate to be used as a first pressure plate (4); drilling a unthreaded hole (3) on the other pressure plate at both ends of the other pressure plate, and ensuring that the center distance between the two unthreaded holes (3) is equal to the distance between the two lower threaded holes (2) to be used as a second pressure plate (5); s4, drilling mounting holes communicated with the through holes (13) on the first pressure plate (4) and the second pressure plate (5) to ensure that the diameters of the mounting holes are equal to the diameter of the through holes (13); and S5, wrapping the left half part of the HDI multilayer circuit board with a first half glue film (6), and attaching the upper edge (7) of the first half glue film (6) to the top surface of the HDI multilayer circuit board. The invention has the beneficial effects that: the manufacturing process is simple, the adhesive film is prevented from falling off, and the filling quality of the through hole is improved.
Description
Technical Field
The invention relates to the technical field of through hole filling on a circuit board, in particular to a HDI multilayer circuit board through hole filling process.
Background
At present, the industrial substitute of the printed circuit board in China mainly represents the product substitution in the sub-industry, the market share of the rigid circuit board is shriveled, and the market share of the flexible circuit board is continuously expanded. The development of electronic products towards high density inevitably leads to higher hierarchy and smaller BGA hole pitch, thereby putting higher requirements on the heat resistance of materials. Among them, the HDI multilayer circuit board is applied to a large number of small electronic products, and constitutes an indispensable important component of the electronic products.
The structure of the existing HDI multilayer circuit board is shown in figure 1, and comprises a plurality of unit circuit boards (12) compounded into a whole, wherein each unit circuit board (12) comprises a base plate and circuit layers compounded on the upper surface and the lower surface of the base plate, a plurality of through holes (13) are formed in the HDI multilayer circuit board, and an electroplated layer is plated on the inner wall of each through hole (13) in process requirements so as to complete the filling of the through holes. The existing filling process is that the whole HDI multilayer circuit board is wrapped by using an adhesive film, a through groove which is connected with a through hole (13) is formed in the adhesive film so as to ensure that electroplating solution can enter the through hole (13) through the through groove, and electroplating is not carried out on the surface outside the through hole, so that an electroplating layer is electroplated on the inner wall of the through hole, and filling of the through hole is realized.
However, such a plugging process often suffers from the following drawbacks in actual production: 1. the HDI multilayer circuit board is large in size, and the corresponding adhesive film is large in area, so that the filling cost is increased. 2. There is no part to fix the adhesive film on the HDI multilayer circuit board, resulting in the adhesive film easily falling off from the HDI multilayer circuit board, resulting in the plated layer being plated on the outer surface of the HDI multilayer circuit board, thereby reducing the filling quality. 3. Electroplating solution easily enters the surface of the HDI multilayer circuit board from the contact part of the through groove and the through hole, so that the filling quality is further reduced.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide the HDI multilayer circuit board through hole filling process which is simple in manufacturing process, prevents an adhesive film from falling off and improves the quality of filling the through hole.
The purpose of the invention is realized by the following technical scheme: a HDI multilayer circuit board through hole plugging process comprises the following steps:
s1, drilling an upper threaded hole on the top surface and two ends of the HDI multilayer circuit board, and drilling a lower threaded hole on the bottom surface and two ends of the HDI multilayer circuit board;
s2, two pressing plates are taken to ensure that the area of the pressing plates is equal to the area of the top surface of the HDI multilayer circuit board,
s3, drilling a unthreaded hole on one pressure plate and at two ends of the pressure plate, and ensuring that the center distance between the two unthreaded holes is equal to the distance between the two upper threaded holes to serve as a first pressure plate; drilling a unthreaded hole on the other pressure plate at both ends of the other pressure plate, and ensuring that the center distance between the two unthreaded holes is equal to the distance between the two lower threaded holes to serve as a second pressure plate;
s4, drilling mounting holes communicated with the through holes on the first pressure plate and the second pressure plate, and ensuring that the diameters of the mounting holes are equal to the diameters of the through holes;
s5, wrapping a first half adhesive film on the left half part of the HDI multilayer circuit board, and enabling the upper edge of the first half adhesive film to be attached to the top surface of the HDI multilayer circuit board and the lower edge of the first half adhesive film to be attached to the bottom surface of the HDI multilayer circuit board;
s6, wrapping a second half adhesive film on the right half part of the HDI multilayer circuit board, and enabling the upper edge of the second half adhesive film to be attached to the top surface of the HDI multilayer circuit board and the lower edge of the second half adhesive film to be attached to the bottom surface of the HDI multilayer circuit board;
s7, attaching a first pressing plate to the upper edge of the first half adhesive film and the upper edge of the second half adhesive film, penetrating a locking screw through a unthreaded hole in the first pressing plate and connecting the locking screw with an upper threaded hole in a threaded manner, pressing the upper edge of the first half adhesive film and the upper edge of the second half adhesive film on the top surface of the HDI multilayer circuit board by the first pressing plate under the threaded connection force, and communicating the mounting hole in the first pressing plate with the upper port of the through hole; a plug with a central hole inside is inserted into the mounting hole of the first pressure plate, and the plug is ensured to be embedded into the through hole;
s8, attaching a second pressing plate to the lower edge of the second half glue film and the lower edge of the second half glue film, penetrating a locking screw through a unthreaded hole in the second pressing plate and connecting the locking screw with a lower threaded hole in a threaded manner, pressing the lower edge of the second half glue film and the lower edge of the second half glue film on the bottom surface of the HDI multilayer circuit board by the second pressing plate under the threaded connection force, and communicating the mounting hole in the second pressing plate with the lower port of the through hole; a plug with a central hole inside is inserted into the mounting hole of the second pressure plate, and the plug is ensured to be embedded into the through hole;
s9, placing the HDI multilayer circuit board after the tool into a plating bath for plating, and enabling electroplating liquid to enter the through hole through the center hole of the plug, so that a layer of electroplating layer is plated on the wall of the through hole, and the filling of the through hole is realized.
The plug is in interference fit with the through hole.
The plug is in interference fit with the mounting hole.
The invention has the following advantages: the invention has simple manufacturing process, prevents the adhesive film from falling off and improves the filling quality of the through hole.
Drawings
FIG. 1 is a schematic structural diagram of a conventional HDI multilayer circuit board;
FIG. 2 is a schematic view of a wrapping film and a mounting platen in accordance with the present invention;
FIG. 3 is a schematic view of a plug mounted to the platen of the present invention;
FIG. 4 is an enlarged view of a portion I of FIG. 3;
FIG. 5 is an enlarged partial view of section II of FIG. 3;
in the figure, 1-an upper threaded hole, 2-a lower threaded hole, 3-a unthreaded hole, 4-a first pressing plate, 5-a second pressing plate, 6-a first half glue film, 7-an upper edge, 8-a lower edge, 9-a second half glue film, 10-a plug, 11-a locking screw, 12-a unit circuit board and 13-a through hole.
Detailed Description
The invention will be further described with reference to the accompanying drawings, without limiting the scope of the invention to the following:
a HDI multilayer circuit board through hole plugging process comprises the following steps:
s1, drilling an upper threaded hole 1 on the top surface and two ends of the HDI multilayer circuit board, and drilling a lower threaded hole 2 on the bottom surface and two ends of the HDI multilayer circuit board;
s2, two pressing plates are taken to ensure that the area of the pressing plates is equal to the area of the top surface of the HDI multilayer circuit board,
s3, drilling a unthreaded hole 3 on one pressing plate and at two ends of the pressing plate, and ensuring that the center distance between the two unthreaded holes 3 is equal to the distance between the two upper threaded holes 1 to serve as a first pressing plate 4; drilling a unthreaded hole 3 on the other pressure plate at both ends of the other pressure plate, and ensuring that the center distance between the two unthreaded holes 3 is equal to the distance between the two lower threaded holes 2 to be used as a second pressure plate 5;
s4, drilling mounting holes communicated with the through holes 13 on the first pressure plate 4 and the second pressure plate 5, and ensuring that the diameters of the mounting holes are equal to the diameter of the through holes 13;
s5, wrapping the first half adhesive film 6 on the left half portion of the HDI multilayer circuit board, and attaching the upper edge 7 of the first half adhesive film 6 to the top surface of the HDI multilayer circuit board, and attaching the lower edge 8 of the first half adhesive film 6 to the bottom surface of the HDI multilayer circuit board, as shown in fig. 2;
s6, wrapping the second half adhesive film 9 on the right half portion of the HDI multilayer circuit board, and attaching the upper edge 7 of the second half adhesive film 9 to the top surface of the HDI multilayer circuit board, and attaching the lower edge 8 of the second half adhesive film 9 to the bottom surface of the HDI multilayer circuit board, as shown in fig. 2;
s7, attaching the first pressing plate 4 to the upper edge 7 of the first half glue film 6 and the upper edge 7 of the second half glue film 9, then enabling the locking screw 11 to penetrate through the unthreaded hole 3 in the first pressing plate 4 and be in threaded connection with the upper threaded hole 1, enabling the upper edge 7 of the first half glue film 6 and the upper edge 7 of the second half glue film 9 to be pressed on the top surface of the HDI multilayer circuit board by the first pressing plate 4 under the threaded connection force, and enabling the mounting hole in the first pressing plate 4 to be communicated with the upper port of the through hole 13 at the moment; inserting a plug 10 with a central hole inside into the mounting hole of the first pressing plate 4, and ensuring that the plug 10 is inserted into the through hole 13, as shown in fig. 3-5;
s8, attaching the second pressing plate 5 to the lower edge 8 of the second half glue film 9 and the lower edge 8 of the second half glue film 9, then enabling the locking screw 11 to penetrate through the unthreaded hole 3 in the second pressing plate 5 and be in threaded connection with the lower threaded hole 2, enabling the lower edge 8 of the second half glue film 9 and the lower edge 8 of the second half glue film 9 to be pressed on the bottom surface of the HDI multilayer circuit board by the second pressing plate 5 under the threaded connection force, and enabling the mounting hole in the second pressing plate 5 to be communicated with the lower port of the through hole 13 at the moment; inserting a plug 10 with a central hole inside into the mounting hole of the second pressing plate 5, and ensuring that the plug 10 is inserted into the through hole 13, as shown in fig. 3-5; the plug 10 is in interference fit with the through hole 13. The plug 10 is in interference fit with the mounting hole.
S9, placing the HDI multilayer circuit board after the tool into a plating bath for plating, and enabling plating solution to enter the through hole 13 through the center hole of the plug 10, so that a plating layer is plated on the wall of the through hole 13, and the filling of the through hole is realized.
In the electroplating process, because the plug 10 on the first pressing plate 4 is in interference fit with the upper port of the through hole 13, electroplating liquid is prevented from entering the top surface of the HDI multilayer circuit board, and because the plug 10 on the second pressing plate 5 is in interference fit with the lower port of the through hole 13, electroplating liquid is prevented from entering the bottom surface of the HDI multilayer circuit board, only the inner wall of the through hole 13 is ensured to be electroplated, and compared with the traditional filling method, the filling quality is greatly improved.
In addition, because the upper edge 7 of the first half glue film 6 and the upper edge 7 of the second half glue film 9 are both pressed on the top surface of the HDI multilayer circuit board by the first pressing plate 4, the lower edge 8 of the second half glue film 9 and the lower edge 8 of the second half glue film 9 are both pressed on the bottom surface of the HDI multilayer circuit board by the second pressing plate 5, thereby avoiding that the first half glue film 6 and the second half glue film 9 fall off from the HDI multilayer circuit board in the electroplating process, and ensuring the smooth electroplating. In addition, all not using the glued membrane on HDI multilayer circuit board's the top surface and the bottom surface, only the periphery of HDI multilayer circuit board has just pasted the glued membrane to the very big use amount of having saved the glued membrane, and then reduced and filled the cost.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (3)
1. The HDI multilayer circuit board through hole plugging process is characterized in that: it comprises the following steps:
s1, drilling an upper threaded hole (1) on the top surface and at two ends of the HDI multilayer circuit board, and drilling a lower threaded hole (2) on the bottom surface and at two ends of the HDI multilayer circuit board;
s2, two pressing plates are taken to ensure that the area of the pressing plates is equal to the area of the top surface of the HDI multilayer circuit board,
s3, drilling a unthreaded hole (3) on one pressure plate and at two ends of the pressure plate, and ensuring that the center distance between the two unthreaded holes (3) is equal to the distance between the two upper threaded holes (1) to serve as a first pressure plate (4); drilling a unthreaded hole (3) on the other pressure plate at both ends of the other pressure plate, and ensuring that the center distance between the two unthreaded holes (3) is equal to the distance between the two lower threaded holes (2) to be used as a second pressure plate (5);
s4, drilling mounting holes communicated with the through holes (13) on the first pressure plate (4) and the second pressure plate (5) to ensure that the diameters of the mounting holes are equal to the diameter of the through holes (13);
s5, wrapping a first half glue film (6) on the left half part of the HDI multilayer circuit board, enabling the upper edge (7) of the first half glue film (6) to be attached to the top surface of the HDI multilayer circuit board, and enabling the lower edge (8) of the first half glue film (6) to be attached to the bottom surface of the HDI multilayer circuit board;
s6, wrapping a second half glue film (9) on the right half part of the HDI multilayer circuit board, attaching the upper edge (7) of the second half glue film (9) to the top surface of the HDI multilayer circuit board, and attaching the lower edge (8) of the second half glue film (9) to the bottom surface of the HDI multilayer circuit board;
s7, a first pressing plate (4) is attached to the upper edge (7) of a first half glue film (6) and the upper edge (7) of a second half glue film (9), then a locking screw (11) penetrates through a unthreaded hole (3) in the first pressing plate (4) and is in threaded connection with an upper threaded hole (1), under the threaded connection force, the upper edge (7) of the first half glue film (6) and the upper edge (7) of the second half glue film (9) are pressed on the top surface of the HDI multilayer circuit board by the first pressing plate (4), and at the moment, a mounting hole in the first pressing plate (4) is communicated with an upper port of a through hole (13); a plug (10) with a central hole inside is inserted into the mounting hole of the first pressure plate (4), and the plug (10) is ensured to be inserted into the through hole (13);
s8, a second pressing plate (5) is attached to the lower edge (8) of a second half glue film (9) and the lower edge (8) of the second half glue film (9), then a locking screw (11) penetrates through a unthreaded hole (3) in the second pressing plate (5) and is in threaded connection with a lower threaded hole (2), under the threaded connection force, the lower edge (8) of the second half glue film (9) and the lower edge (8) of the second half glue film (9) are pressed on the bottom surface of the HDI multilayer circuit board by the second pressing plate (5), and at the moment, a mounting hole in the second pressing plate (5) is communicated with a lower port of a through hole (13); a plug (10) with a central hole inside is inserted into the mounting hole of the second pressure plate (5), and the plug (10) is ensured to be inserted into the through hole (13);
s9, placing the HDI multilayer circuit board after the tool into a plating bath for plating, and enabling the plating solution to enter the through hole (13) through the center hole of the plug (10), so that a plating layer is plated on the wall of the through hole (13), and the filling of the through hole is realized.
2. The HDI multilayer circuit board through hole plugging process according to claim 1, wherein: the plug (10) is in interference fit with the through hole (13).
3. The HDI multilayer circuit board through hole plugging process according to claim 1, wherein: and the plug (10) is in interference fit with the mounting hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110567706.6A CN113301725A (en) | 2021-05-24 | 2021-05-24 | HDI multilayer circuit board through hole plugging process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110567706.6A CN113301725A (en) | 2021-05-24 | 2021-05-24 | HDI multilayer circuit board through hole plugging process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113301725A true CN113301725A (en) | 2021-08-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110567706.6A Withdrawn CN113301725A (en) | 2021-05-24 | 2021-05-24 | HDI multilayer circuit board through hole plugging process |
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| CN (1) | CN113301725A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113789552A (en) * | 2021-11-02 | 2021-12-14 | 四川英创力电子科技股份有限公司 | Device for electroplating through hole on HDI board and working method thereof |
-
2021
- 2021-05-24 CN CN202110567706.6A patent/CN113301725A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113789552A (en) * | 2021-11-02 | 2021-12-14 | 四川英创力电子科技股份有限公司 | Device for electroplating through hole on HDI board and working method thereof |
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Application publication date: 20210824 |