CN202127038U

CN202127038U - Substrate for light-emitting diode (LED) suitable for stamping process

Info

Publication number: CN202127038U
Application number: CN2011201854843U
Authority: CN
Inventors: 马憬峰; 吴根秋
Original assignee: GOLDENMAX INTERNATIONAL TECHNOLOGY (ZHUHAI) Ltd
Current assignee: GOLDENMAX INTERNATIONAL TECHNOLOGY (ZHUHAI) Ltd
Priority date: 2011-06-02
Filing date: 2011-06-02
Publication date: 2012-01-25
Anticipated expiration: 2021-06-02

Abstract

The utility model discloses a substrate for light-emitting diode (LED) suitable for stamping process, which comprises copper foil, glass fiber cloth prepreg and non-woven fabric prepreg. The copper foil is distributed on the outermost layer. The substrate is characterized in that the glass fiber cloth prepreg and the non-woven fabric prepreg are alternately collocated at intervals. The substrate for the LED adjusts structures of a glass cloth FR-4 substrate and a CEM-3 substrate, adopts the advantages and abandons the shortages on the basis of the glass cloth FR-4 substrate and the CEM-3 substrate. Due to the fact that the glass fiber cloth prepreg and the non-woven fabric prepreg are alternately collocated at intervals, shear force between two adjacent layers of glue coating sheets are reduced, punching performance is greatly improved, and simultaneously mechanical strength and heating deformation resistant performance are also greatly improved.

Description

The LED that is suitable for Sheet Metal Forming Technology uses substrate

Technical field

The utility model relates to copper clad laminate and makes the field, and the LED that is specifically related to be suitable for Sheet Metal Forming Technology uses substrate.

Background technology

The LED light-emitting diode, as the electrical lighting product, environmental protection and energy saving are popularized day by day in daily life; It is on the PCB substrate, to mount the luminous electron components and parts, forms through Electronic Packaging.LED uses the PCB substrate, and present main material is with two kinds of the FR-4 template of glass fabricbase and CEM-3 type copper clad laminates.FR-4 type copper clad laminate (as shown in Figure 1) is that several glass fabric prepregs 11 are superimposed together, and two sides or single face are covered with Copper Foil 12 and form through hot pressing; And CEM-3 template (as shown in Figure 2), then be with staple glass fibre yarn nonwoven fabrics prepreg 21 as core material, a glass cloth prepreg 22 is respectively pasted on the two sides, again in the two sides or single face be covered with Copper Foil 23 and form through hot pressing.

Because LED belongs to the optical electron product, multi-colored led each luminescence unit all can pass through digital circuit, sends the light of different colours.The one, in order to prevent mutual photochromic interference between each luminescence unit; The 2nd, leak into light-emitting area and pollute luminescent device in order to prevent pcb board when encapsulation sealing resin; So require the pcb board planarization good, limit, lamp hole hole, pcb board limit do not have burr, simultaneously; Because constantly increasing of loading density also requires the PCB substrate to have high mechanical strength.

Conventional FR-4 plate, the mechanical strength of its glass fabric is higher, also is because this point makes its PCB when punching or profile punching press, and limit, hole or pcb board limit are prone to produce a large amount of glass fiber lousiness, burr; These bad defectives cause a hidden trouble all can for the LED quality, have to spend great amount of manpower and material resources in the post-production pcb board is carried out reconditioning.CEM-3 plate, reinforcing material are mainly the glass fiber yarn nonwoven fabrics, and mechanical strength is lower; When punching and sharp processing, limit, hole, edges of boards do not have glass fiber lousiness, burr, can reach the requirement of LED substrate; But lower, the poor heat resistance of its mechanical strength is when the electronic device assembling of postorder, through Reflow Soldering or wave-soldering; Very easy causing is out of shape and warpage, brings for equally the LED quality of stability and has a strong impact on.

By on can know that substrate FR-4 or CEM-3 that LED selects for use at present cut both ways, all need carry out the secondary operations of postorder, this will bring the increase of cost; Particularly, more can bring the pressure of cost to some low toys that require, general lighting, simple civilian disposable consumable products.

Summary of the invention

The utility model purpose provides a kind of punching press does not have burr, good heat resistance, LED that mechanical strength is high uses substrate.

Above-mentioned purpose realizes through following technical scheme: a kind of LED that is suitable for Sheet Metal Forming Technology uses substrate, comprises Copper Foil, glass fabric prepreg and nonwoven fabrics prepreg, and Copper Foil is laid in outermost layer; It is characterized in that said glass fabric prepreg and nonwoven fabrics prepreg staggered floor are arranged in pairs or groups at interval.

The LED that the utility model provides uses substrate, is on the basis of glass fabricbase FR-4 plate and CEM-3 plate, and the structure of the two is adjusted, and gets its advantage, gives up its shortcoming.Because wherein glass fabric prepreg and nonwoven fabrics prepreg staggered floor are arranged in pairs or groups at interval; Therefore; Reduced adjacent two layers and be coated with the shearing force between film, punching property is also changed greatly, and mechanical strength, the anti-deformation nature that is heated also are greatly improved simultaneously.

Description of drawings

Fig. 1 is the composition sketch map of existing FR-4 type copper clad laminate.

Fig. 2 is the composition sketch map of existing C EM-3 type copper clad laminate.

The LED that Fig. 3 provides for the utility model embodiment is with the composition sketch map of substrate.

The LED that Fig. 4 provides for the utility model embodiment is with the manufacturing flow chart of substrate.

Embodiment

Through the structure of CEM-3 plate and FR-4 plate is analyzed, we find: CEM-3 plate sandwich layer is that the organdy nonwoven fabrics is a reinforcing material entirely, is staple glass fibre; Do not pass through twisted weave, so, when punching press; Be difficult for producing burr; But also be owing to this factor, and cause its mechanical strength low, the bigger shortcoming of morphotropism when being heated; And the FR-4 plate complete adopt be long fibre to knit the plain weave glass cloth be reinforcing material, solid and, have bigger mechanical strength and heat resistance, but also be, and make it when punching press owing to this reason, limit, hole, edges of boards glass fiber are difficult for shearing disconnected and the generation burr.

Therefore; The compound structure for covering copper plate that present embodiment provides is intended to blend proportion and the matching structure through glass fabric, glass fibers cloth nonwoven fabrics in the allotment sheet material; Make its glass fabric content than the FR-4 plate lack, more than the CEM-3 plate; The content of glass fibers cloth nonwoven fabrics is more than the FR-4 plate, but lacks than the CEM-3 plate.Like this, the mechanical strength of sheet material will be big by the CEM-3 plate, and the punching performance is better than FR-4 plate.

As shown in Figure 3, the LED that present embodiment provides comprises with substrate: two glass fabric prepregs 34 between inboard two the nonwoven fabrics prepregs 33 laying of inboard two glass fabric prepregs laying of outermost two Copper Foils 31, two Copper Foils 31 32, two glass fabric prepregs 32 and two nonwoven fabrics prepregs 33, laying.Wherein, to be preferably indicated weight be 75g/m to two nonwoven fabrics prepregs 33 ²The nonwoven fabrics prepreg.

Shown in accompanying drawing 4; With 1.6mm thickness sheet material is that example is set forth manufacture process; Manufacturing process of the utility model and glass fabric FR-4 type, CEM-3 copper clad laminate are roughly the same, respectively through overmulling glue, gluing, lamination combination, Copper Foil combination matching board, suppress, tear open operations such as plate, sharp processing, check, packing; Different is its lamination difference to some extent, and compound copper-clad plate, lamination combination are that glass fabric prepreg and nonwoven fabrics prepreg is superimposed by the staggered collocation in certain process proportional spacing.

Claims

1. a LED who is suitable for Sheet Metal Forming Technology uses substrate, comprises Copper Foil, glass fabric prepreg and nonwoven fabrics prepreg, and Copper Foil is laid in outermost layer; It is characterized in that said glass fabric prepreg and nonwoven fabrics prepreg staggered floor are arranged in pairs or groups at interval.

2. the LED that is suitable for Sheet Metal Forming Technology according to claim 1 uses substrate, it is characterized in that: comprise two glass fabric prepregs between inboard two the nonwoven fabrics prepregs laying of outermost two Copper Foils, inboard two the glass fabric prepregs laying of two Copper Foils, two glass fabric prepregs and two nonwoven fabrics prepregs, laying.

3. the LED that is suitable for Sheet Metal Forming Technology according to claim 1 uses substrate, it is characterized in that: it is 75g/m that said nonwoven fabrics prepreg is preferably indicated weight ²The nonwoven fabrics prepreg.