CN213694270U - Blind buried hole circuit board - Google Patents
Blind buried hole circuit board Download PDFInfo
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- CN213694270U CN213694270U CN202022594939.9U CN202022594939U CN213694270U CN 213694270 U CN213694270 U CN 213694270U CN 202022594939 U CN202022594939 U CN 202022594939U CN 213694270 U CN213694270 U CN 213694270U
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Abstract
The utility model discloses a blind buried hole circuit board, which comprises a circuit layer, a substrate layer arranged between the circuit layers, and a guide hole penetrating through the circuit layer and the substrate layer, wherein the circuit layer is sequentially stacked and comprises a first circuit layer to an eighth circuit layer, the guide hole is sequentially provided from left to right and comprises a first blind hole, a first buried hole, a second buried hole and a through hole, the first blind hole penetrates through the first circuit layer and the second circuit layer, the first buried hole penetrates through the second circuit layer and the third circuit layer, the second buried hole penetrates through the second circuit layer to the seventh circuit layer, the through hole penetrates through the first circuit layer to the eighth circuit layer, through the circuit layer and the substrate layer, the position between the guide holes is arranged, the problem that a wiring circuit board is not compact is solved, the running stability of the circuit board is realized, and the running is improved, the maintenance frequency is reduced, the manpower and material resources are effectively saved, and the economic cost is reduced.
Description
Technical Field
The utility model belongs to the technical field of the circuit board, concretely relates to blind buried via hole circuit board.
Background
At present, the quality of common low-end circuit board products cannot be guaranteed, wiring is not compact, the operating yield of the circuit board is reduced, the repair rate proportion is increased, and manpower and material resources are wasted.
SUMMERY OF THE UTILITY MODEL
The embodiment of the application provides a blind buried hole circuit board, and through circuit layer, substrate layer, the position sets up between the guide hole, has solved the not compact problem of circuit board wiring, has realized that the circuit board operation is stable, improves the operation yield, reduces the maintenance number of times, effectively uses manpower sparingly material resources, reduces economic cost.
The technical scheme provided by the embodiment of the application is as follows:
a blind buried hole circuit board comprises circuit layers, a substrate layer arranged between the circuit layers, and guide holes penetrating through the circuit layers and the substrate layer, wherein the circuit layers are sequentially laminated and comprise a first circuit layer, a second circuit layer, a third circuit layer, a fourth circuit layer, a fifth circuit layer, a sixth circuit layer, a seventh circuit layer and an eighth circuit layer, the guide holes are sequentially provided from left to right and comprise a first blind hole, a first buried hole, a second buried hole, a through hole, a third buried hole, a fourth buried hole and a second blind hole, the first blind hole penetrates through the first circuit layer and the second circuit layer, the first buried hole penetrates through the second circuit layer and the third circuit layer, the second buried hole penetrates through the second circuit layer to the seventh circuit layer, the through hole penetrates through the first circuit layer to the eighth circuit layer, and the third buried hole penetrates through the third circuit layer to the sixth circuit layer, the fourth buried via penetrates through the sixth circuit layer and the seventh circuit layer, and the second blind via penetrates through the seventh circuit layer and the eighth circuit layer.
In the utility model, firstly, the fourth circuit layer and the fifth circuit layer are sequentially processed by the procedures of plate drying, inner layer graph, inner layer AOI and browning, secondly, the third circuit layer to the sixth circuit layer are sequentially processed by the procedures of laminating, edge milling, drilling into a third buried hole, copper deposition and whole-plate electroplating, the required copper thickness, inner layer graph, inner layer etching, inner layer AOI and browning are plated, then the second circuit layer is arranged above the third circuit layer, the seventh circuit layer is arranged below the sixth circuit layer, thereby carrying out the procedures of pressing, plate drying, edge milling, mechanical drilling into a second buried hole and a third buried hole respectively, laser drilling into a first buried hole and a fourth buried hole respectively, copper deposition, whole-plate electroplating, inner layer graph, inner layer etching, inner layer AOI and browning, finally, the first circuit layer is arranged above the second circuit layer, the eighth circuit layer is arranged below the seventh circuit layer, thereby carrying out pressing, the circuit board has the advantages that the circuit board is manufactured by drying the board, milling the edges, mechanically drilling the through holes and drilling the first blind holes and the second blind holes by laser, guide holes between circuit layers are reasonably distributed, the wiring structure is reasonable, the circuit board is effectively guaranteed to stably run, the running yield is improved, the maintenance frequency is effectively reduced, and the working efficiency is improved.
Furthermore, the substrate layer is composed of a dielectric layer and copper foil layers, the dielectric layer is arranged between the copper foil layers, the dielectric layer is a resin dielectric layer or a glass fiber dielectric layer, and the material is high in heat resistance through the arrangement of the material of the dielectric layer, so that the stable operation of the circuit board is effectively guaranteed, the operation yield of the circuit board is improved, and the production efficiency is improved.
Furthermore, the copper layer is arranged on the inner side surface of the guide hole, circuits are respectively arranged on the upper surface of the first circuit layer and the lower surface of the eighth circuit layer, the circuits are communicated through the guide hole, the conductivity of the circuit board is enhanced through the arrangement, the use stability of the circuit board is effectively improved, and the service life of the circuit board is prolonged.
Furthermore, the first blind hole, the second blind hole, the first buried hole and the fourth buried hole are all drilled by laser, the second buried hole and the third buried hole are all drilled by machinery, and the through hole is drilled by machinery.
The utility model has the advantages that:
through circuit layer, substrate layer, the position setting between the guide hole has solved the not compact problem of circuit board wiring, has realized that the circuit board operation is stable, improves the operation yield, reduces the maintenance number of times, effectively uses manpower and materials sparingly, reduces economic cost.
Drawings
Fig. 1 is a schematic structural view of the present invention;
fig. 2 is the structure schematic diagram of the middle substrate layer of the present invention.
The labels in the figure are: a circuit layer 1, a first circuit layer 11, a second circuit layer 12, a third circuit layer 13, a fourth circuit layer 14, a fifth circuit layer 15, a sixth circuit layer 16, a seventh circuit layer 17, and an eighth circuit layer 18; a substrate layer 2, a dielectric layer 21 and a copper foil layer 22; the guide hole 3, the first blind hole 31, the first buried hole 32, the second buried hole 33, the through hole 34, the third buried hole 35, the fourth buried hole 36, and the second blind hole 37.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Examples
To facilitate understanding of the present invention for those skilled in the art, the present invention will be described in further detail with reference to the following detailed description and accompanying drawings.
A blind buried via circuit board comprises circuit layers 1, a substrate layer 2 arranged between the circuit layers 1, and a via hole 3 penetrating through the circuit layers 1 and the substrate layer 2, wherein the circuit layer 1 comprises a first circuit layer 11, a second circuit layer 12, a third circuit layer 13, a fourth circuit layer 14, a fifth circuit layer 15, a sixth circuit layer 16, a seventh circuit layer 17, and an eighth circuit layer 18 which are sequentially stacked, the via hole 3 comprises a first blind via 31, a first buried via 32, a second buried via 33, a via hole 34, a third buried via 35, a fourth buried via 36, and a second blind via 37 from left to right, the first blind via 33 penetrates through the first circuit layer 11 and the second circuit layer 12, the first buried via 32 penetrates through the second circuit layer 12 and the third circuit layer 13, the second buried via 33 penetrates through the second circuit layer 12 to the seventh circuit layer 17, the through hole 34 penetrates through the first circuit layer 11 to the eighth circuit layer 18, the third buried hole 35 penetrates through the third circuit layer 13 to the sixth circuit layer 16, the fourth buried hole 36 penetrates through the sixth circuit layer 16 and the seventh circuit layer 17, and the second blind hole 37 penetrates through the seventh circuit layer 17 and the eighth circuit layer 18.
In the utility model, firstly, the fourth circuit layer 14 and the fifth circuit layer 15 are sequentially processed by the procedures of plate drying, inner layer pattern, inner layer AOI and browning, secondly, the third circuit layer 13 to the sixth circuit layer 16 are sequentially laminated, edge milling, hole drilling into a third buried hole 35, copper deposition and whole plate electroplating, the required copper thickness is plated, the inner layer pattern, inner layer etching, inner layer AOI and browning procedures are performed, then the second circuit layer 12 is arranged above the third circuit layer 13, the seventh circuit layer 17 is arranged below the sixth circuit layer 16, thereby pressing, plate drying, edge milling, mechanical drilling into a second buried hole 33 and a third buried hole 35 respectively, laser drilling into a first buried hole 31 and a fourth buried hole 36 respectively, copper deposition, whole plate electroplating, inner layer pattern, inner layer etching, inner layer AOI, browning, finally the first circuit layer 11 is arranged above the second circuit layer 12, and an eighth circuit layer 18 is arranged below the seventh circuit layer 17, therefore, the circuit board is pressed, the board drying, edge milling and mechanical drilling are carried out to form the through hole, the laser drilling is carried out to form the first blind hole 32 and the second blind hole 37, the circuit board is manufactured, the guide holes 3 between the circuit layers 1 are reasonably distributed through the arrangement, the wiring structure is reasonable, the circuit board is effectively guaranteed to stably run, the running yield is improved, the maintenance frequency is effectively reduced, and the working efficiency is improved.
Further, the substrate layer 2 is composed of a dielectric layer 21 and a copper foil layer 22, the dielectric layer 21 is arranged between the copper foil layers 22, the dielectric layer 21 is a resin dielectric layer or a glass fiber dielectric layer, and the material is high in heat resistance through the arrangement of the material of the dielectric layer, so that the stable operation of the circuit board is effectively guaranteed, the operation yield of the circuit board is improved, and the production efficiency is improved.
Furthermore, the copper layer is arranged on the inner side surface of the guide hole 3, circuits are respectively arranged on the upper surface of the first circuit layer 11 and the lower surface of the eighth circuit layer 18, the circuits are communicated through the guide hole 3, and through the arrangement, the conductivity of the circuit board is enhanced, the stability of the circuit board is effectively improved, and the service life of the circuit board is prolonged.
Furthermore, the first blind hole 31, the second blind hole 37, the first buried hole 32 and the fourth buried hole 36 are all laser drilling holes, the second buried hole 33 and the third buried hole 35 are all mechanical drilling holes, and the through hole is a mechanical drilling hole.
The utility model has the advantages that:
through circuit layer, substrate layer, the position setting between the guide hole has solved the not compact problem of circuit board wiring, has realized that the circuit board operation is stable, improves the operation yield, reduces the maintenance number of times, effectively uses manpower and materials sparingly, reduces economic cost.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art. It should be noted that the technical features not described in detail in the present invention can be implemented by any prior art.
Claims (7)
1. A blind buried via circuit board is characterized in that the circuit board comprises circuit layers, a substrate layer arranged between the circuit layers, and guide holes penetrating through the circuit layers and the substrate layer, wherein the circuit layers are sequentially stacked and comprise a first circuit layer, a second circuit layer, a third circuit layer, a fourth circuit layer, a fifth circuit layer, a sixth circuit layer, a seventh circuit layer and an eighth circuit layer, the guide holes sequentially comprise a first blind hole, a first buried hole, a second buried hole, a through hole, a third buried hole, a fourth buried hole and a second blind hole from left to right, the first blind hole penetrates through the first circuit layer and the second circuit layer, the first buried hole penetrates through the second circuit layer and the third circuit layer, the second buried hole penetrates through the second circuit layer to the seventh circuit layer, and the through hole penetrates through the first circuit layer to the eighth circuit layer, the third buried via penetrates through the third circuit layer to the sixth circuit layer, the fourth buried via penetrates through the sixth circuit layer and the seventh circuit layer, and the second blind via penetrates through the seventh circuit layer and the eighth circuit layer.
2. The blind buried via wiring board of claim 1, wherein the substrate layer is composed of a dielectric layer and a copper foil layer, the dielectric layer is disposed between the copper foil layers, and the dielectric layer is a resin dielectric layer or a glass fiber dielectric layer.
3. The blind buried via wiring board of claim 1, wherein the inside surface of the via hole is provided with a copper layer.
4. The blind buried via wiring board of claim 1, wherein the upper surface of the first circuit layer and the lower surface of the eighth circuit layer are respectively provided with a wiring, and the wirings are communicated through the via holes.
5. The blind buried via wiring board of claim 1, wherein said first blind via, said second blind via, said first buried via, and said fourth buried via are all laser drilled holes.
6. The blind buried via wiring board of claim 1, wherein the second buried via and the third buried via are both mechanically drilled holes.
7. The blind buried via wiring board of claim 1, wherein the through hole is a mechanical drilled hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022594939.9U CN213694270U (en) | 2020-11-11 | 2020-11-11 | Blind buried hole circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022594939.9U CN213694270U (en) | 2020-11-11 | 2020-11-11 | Blind buried hole circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213694270U true CN213694270U (en) | 2021-07-13 |
Family
ID=76731710
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022594939.9U Active CN213694270U (en) | 2020-11-11 | 2020-11-11 | Blind buried hole circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213694270U (en) |
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2020
- 2020-11-11 CN CN202022594939.9U patent/CN213694270U/en active Active
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