CN205416589U - Two -sided copper -clad plate of improved generation high peel strength intensity - Google Patents
Two -sided copper -clad plate of improved generation high peel strength intensity Download PDFInfo
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- CN205416589U CN205416589U CN201521060895.4U CN201521060895U CN205416589U CN 205416589 U CN205416589 U CN 205416589U CN 201521060895 U CN201521060895 U CN 201521060895U CN 205416589 U CN205416589 U CN 205416589U
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- copper
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- peel strength
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Abstract
The utility model discloses a two -sided copper -clad plate of improved generation high peel strength intensity has refill and glued copper foil, this refill comprises a plurality of layers of gumming wood pulp paper and glass fiber layer complex, these a plurality of layers of range upon range of settings of gumming wood pulp paper, and every layer of flooding has cardanol modified phenolic resin, the glass fiber layer is equipped with two sets ofly, and compound respectively glued copper foil is equipped with two on the gumming wood pulp paper of the superiors and lower floor, distinguishes the one -to -one complex on two sets of glass fiber layers, scribbles melamine -modified urea -formaldehyde resin's barium phenolic resin glue film on this glued copper foil's the composite surface. This novel paper base copper -clad plate has not only improved the heat resistance and the panel wet skid resistance of copper -clad plate, but also has improved the peel strength and the peel strength's of copper -clad plate homogeneity for among the slim copper foil paper base copper -clad plate production, better economic benefits has been gained.
Description
Technical field
This utility model relates to circuit substrate field, specifically refers to a kind of modified model high-peeling strength double face copper.
Background technology
Paper-based copper-coated board has purposes widely in electronic product.In paper-based copper-coated board manufactures, mainly making product obtain preferable punching, the technology producing paper-based copper-coated board with tung oil modified phenolic resin, epoxy soybean oil modified phenolic resin reaches its maturity, and obtains a wide range of applications.But the copper-clad plate punching using conventional art to produce is the best, bow warping is big, and resistance to dip solderability undesirable, thermostability, tear resistance there is also deficiency.Copper-clad plate production Copper Foil is developing to slimming direction, and tradition paper-based copper-coated board Copper Foil is occupied an leading position based on 35um thickness, current 18um thickness Copper Foil.15um, 13um thickness Copper Foil increases year by year in the use ratio of paper-based copper-coated board in recent years.Along with the minimizing of copper thickness, the roughened layer thickness of adhesive surface is also reducing, and the peel strength of product is affected, and in electronic product assembling process, is susceptible to copper sheet obscission, causes product rejection, and economic loss is serious.How to improve thin copper foil or the peel strength of extra thin copper foil paper-based copper-coated board, improve the reliability of electronic product, be paper-based copper-coated board production firm concern.
Utility model content
The purpose of this utility model is to provide a kind of modified model high-peeling strength double face copper, not only improve thermostability and the sheet material tear resistance of copper-clad plate, but also improve the peel strength of copper-clad plate and the uniformity of peel strength, in slim Copper Foil paper-based copper-coated board produces, achieve preferable economic benefit.
In order to reach above-mentioned purpose, solution of the present utility model is:
A kind of modified model high-peeling strength double face copper, has refill and adhesive coated foil；If this refill is constituted by dried layer impreg slurry paper and glass layer are compound, if being somebody's turn to do, dried layer impreg slurry ply of paper is folded to be arranged, and every layer is impregnated with Cardanol Modified PF Resin；Glass layer is provided with two groups, it is compound in respectively on the superiors and undermost impregnation wood pulp paper, adhesive coated foil is provided with two panels, and one_to_one corresponding is compound on two groups of glass layers respectively, and the composite surface of this adhesive coated foil scribbles cyanurotriamide modified ba phenolic resin glue-line.
Described glass layer is impregnated with epoxy resin.
The thickness of described two panels adhesive coated foil is different.
The thickness of described adhesive coated foil is 10-40um.
After using such scheme, this case modified model high-peeling strength double face copper, if refill is constituted by dried layer impreg slurry paper and glass layer are compound, impregnation wood pulp paper uses Cardanol Modified PF Resin dipping, the refill made has preferable toughness and thermostability, in this thermostability substantially improving copper-clad plate and sheet material tear resistance.Glass layer can strengthen heat resistance, uses in high temperature environments and is not likely to produce deformation.Have again, cyanurotriamide modified ba phenolic resin glue-line is used to bind between Copper Foil and refill, cyanurotriamide modified ba phenolic resin crosslink density is high, highly polar group is many, it is remarkably improved thermostability and the adhesion strength of resin, in electronic product assembling process, it is not easy that the defects such as layering, foaming, Copper Foil come off occur, also improve adhesion strength, improve the peel strength of Copper Foil and improve the uniformity of peel strength, in slim Copper Foil paper-based copper-coated board produces, achieve preferable economic benefit.
Accompanying drawing explanation
Fig. 1 is the Rotating fields schematic diagram of this case modified model high-peeling strength double face copper.
Label declaration
Refill 1 impregnation wood pulp paper 11
Cardanol Modified PF Resin 12 glass layer 13
Adhesive coated foil 2.
Detailed description of the invention
With detailed description of the invention, this case is described in further detail below in conjunction with the accompanying drawings.
This case relates to a kind of modified model high-peeling strength double face copper, as it is shown in figure 1, have refill 1 and adhesive coated foil 2.
If refill 1 is combined is constituted by dried layer impreg slurry paper 11 and glass layer 13.If slurry paper 11 stacking of described dried layer impreg is arranged, every layer is impregnated with Cardanol Modified PF Resin 12.Being given in preferred embodiment, impregnation wood pulp paper 11 is folded is provided with eight, i.e. refill 1 is combined by eight wood pulp paper stackings being impregnated with Cardanol Modified PF Resin 12 and constitutes.During impregnation wood pulp paper 11 makes, use indicated weight 130-140g/m2Wood pulp paper, soak with the resin liquid of Cardanol Modified PF Resin 12, drying makes the impregnation material of resin content nearly half (44%-46%).Glass layer 13 is provided with two groups, is compound in respectively on the superiors, undermost impregnation wood pulp paper 11, and even dried layer impregnation wood pulp paper 11 is located between two groups of glass layers 13, and this glass layer 13 is impregnated with epoxy resin.If it addition, dried layer impreg slurry paper 11 also clamping can have glass layer.
Further, impregnation wood pulp paper 11 is also impregnated with the small-molecular-weight thermosetting phenolic resin by ammonia-catalyzed, and specifically, a kind of mode is, is impregnated with Cardanol Modified PF Resin 12 and small-molecular-weight thermosetting phenolic resin by whole for every layer of impregnation wood pulp paper 11；Impregnation wood pulp paper 11 is divided into the first Dilvar zone and second Dilvar zone of both sides of centre by another way, and the first middle Dilvar zone is impregnated with Cardanol Modified PF Resin 12, and the second Dilvar zone of both sides is impregnated with small-molecular-weight thermosetting phenolic resin.
Adhesive coated foil 2 is provided with two panels, and one_to_one corresponding is compound on two groups of glass layers 13 respectively, constitutes doublesided copperclad laminate.Cyanurotriamide modified ba phenolic resin glue-line is scribbled on the composite surface of adhesive coated foil 2, by the ba phenolic resin glue-line that this is cyanurotriamide modified, the hot pressing respectively of two panels Copper Foil is compound on the glass layer 13 of both sides, also there is between refill 1 and Copper Foil cyanurotriamide modified ba phenolic resin glue-line, and binded by this glue-line.
It is compound in the thickness of two adhesive coated foils 2 of refill 1 upper and lower surface according to application demand, may be designed as thickness identical；Providing preferred embodiment, the thickness of two adhesive coated foils 2 is different, and wherein the copper thickness of upper surface is 2-3 times of copper thickness of lower surface, and the thickness of Copper Foil can be 10-40um.Thicker Copper Foil can be used by bigger electric current, beneficially complicated circuit, makes double face copper be applicable to various occasion with this, strengthens relevance grade and practicality.
This case modified model high-peeling strength double face copper, the impregnation wood pulp paper 11 of refill 1 uses Cardanol Modified PF Resin 12 to impregnate, on Cardanol phenyl ring, long chain hydrocarbon groups is owing to there being double bond structure, a certain degree of self-polymeric reaction chain extension is carried out time modified, reactant is in phenolic resin building-up process, long-chain participates in the formation of macromolecular main chain, and the refill 1 made has preferable toughness and thermostability, in this thermostability substantially improving copper-clad plate and sheet material tear resistance.The use of described small-molecular-weight thermosetting phenolic resin, improves the degree of cross linking of resin cured matter, is used in combination with Cardanol Modified PF Resin 12, can improve the thermostability of copper-clad plate further, and make sheet material have excellent tear resistance.The setting of glass layer 13, is used for further enhancing heat resistance, uses in high temperature environments and is not likely to produce deformation.
Have again, cyanurotriamide modified ba phenolic resin glue-line is used to bind between Copper Foil and refill 1, cyanurotriamide modified ba phenolic resin crosslink density is high, highly polar group is many, it is remarkably improved thermostability and the adhesion strength of resin, in electronic product assembling process, it is not easy that the defects such as layering, foaming, Copper Foil come off occur, also improve adhesion strength, improve the peel strength of Copper Foil and improve the uniformity of peel strength, in slim Copper Foil (15um, 13um) paper-based copper-coated board produces, achieve preferable economic benefit.
The foregoing is only this novel preferred embodiment, all impartial changes done with this novel right and modification, the scope of this novel claim all should be belonged to.
Claims (4)
1. a modified model high-peeling strength double face copper, it is characterised in that: there is refill and adhesive coated foil；If this refill is constituted by dried layer impreg slurry paper and glass layer are compound, if being somebody's turn to do, dried layer impreg slurry ply of paper is folded to be arranged, and every layer is impregnated with Cardanol Modified PF Resin and small-molecular-weight thermosetting phenolic resin；Glass layer is provided with two groups, it is compound in respectively on the superiors and undermost impregnation wood pulp paper, adhesive coated foil is provided with two panels, and one_to_one corresponding is compound on two groups of glass layers respectively, and the composite surface of this adhesive coated foil scribbles cyanurotriamide modified ba phenolic resin glue-line.
2. a kind of modified model high-peeling strength double face copper as claimed in claim 1, it is characterised in that: described glass layer is impregnated with epoxy resin.
3. a kind of modified model high-peeling strength double face copper as claimed in claim 1, it is characterised in that: the thickness of described two panels adhesive coated foil is different.
4. a kind of modified model high-peeling strength double face copper as described in claim 1 or 3, it is characterised in that: the thickness of described adhesive coated foil is 10-40um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521060895.4U CN205416589U (en) | 2015-12-17 | 2015-12-17 | Two -sided copper -clad plate of improved generation high peel strength intensity |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521060895.4U CN205416589U (en) | 2015-12-17 | 2015-12-17 | Two -sided copper -clad plate of improved generation high peel strength intensity |
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| Publication Number | Publication Date |
|---|---|
| CN205416589U true CN205416589U (en) | 2016-08-03 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201521060895.4U Expired - Fee Related CN205416589U (en) | 2015-12-17 | 2015-12-17 | Two -sided copper -clad plate of improved generation high peel strength intensity |
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| Country | Link |
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| CN (1) | CN205416589U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108528125A (en) * | 2018-03-21 | 2018-09-14 | 江苏博大木业有限公司 | A kind of preparation method and high pressure decorative laminate of high impact-resistant high pressure decorative laminate |
-
2015
- 2015-12-17 CN CN201521060895.4U patent/CN205416589U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108528125A (en) * | 2018-03-21 | 2018-09-14 | 江苏博大木业有限公司 | A kind of preparation method and high pressure decorative laminate of high impact-resistant high pressure decorative laminate |
| CN108528125B (en) * | 2018-03-21 | 2019-04-30 | 江苏博大木业有限公司 | A kind of preparation method and high pressure decorative laminate of high impact-resistant high pressure decorative laminate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160803 Termination date: 20161217 |
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| CF01 | Termination of patent right due to non-payment of annual fee |