CN107567194A - A kind of compression method of PCB copper-clad plates - Google Patents
A kind of compression method of PCB copper-clad plates Download PDFInfo
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- CN107567194A CN107567194A CN201711048728.1A CN201711048728A CN107567194A CN 107567194 A CN107567194 A CN 107567194A CN 201711048728 A CN201711048728 A CN 201711048728A CN 107567194 A CN107567194 A CN 107567194A
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- copper
- film
- copper coin
- clad plates
- core plate
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Abstract
The present invention relates to a kind of compression method of PCB copper-clad plates, including core plate, film and copper coin, the film includes upper film and lower film, and the copper coin includes upper copper coin and lower copper coin, the alignment connection successively from top to bottom of the upper copper coin, upper film, core plate, lower film and lower copper coin.Copper-clad plate is pressed by rational temperature and time simultaneously, makes to be well combined between sheet material, the method process is simple, and cost is low and the copper-clad plate produced is cost-effective.
Description
Technical field
The present invention relates to PCB production fields, more particularly to a kind of compression method of PCB copper-clad plates.
Background technology
PCB（ Printed Circuit Board）, Chinese is printed circuit board, also known as printed substrate, is weight
The electronic unit wanted, it is the supporter of electronic component, is the carrier of electronic component electrical connection.With the hair of electronic product
Exhibition tends to multifunction, and the parts of electronic product also constantly develop to light, thin, short, small etc., especially high density collection
Into the extensive use of circuit engineering.And in the manufacturing process of PCB substrate, copper-clad plate is also faced with higher technical requirements and more
Severe cost form, therefore to be directed to exploitation a kind of comprehensive good by those skilled in the art, it is cost-effective and can batch
The compression method of the PCB copper-clad plates of making.
The content of the invention
To achieve the above object, the present invention adopts the following technical scheme that：A kind of compression method of PCB copper-clad plates, including：Core
Plate, film and copper coin, the film include upper film and lower film, and the copper coin includes upper copper coin and lower copper coin, the upper copper
The alignment connection successively from top to bottom of plate, upper film, core plate, lower film and lower copper coin.
The present invention operation principle be：Including core plate, film and copper coin, the film includes upper film and lower film, institute
Stating copper coin includes upper copper coin and lower copper coin, and the upper copper coin, upper film, core plate, lower film and lower copper coin are right successively from top to bottom
Neat connection.
First by core plate through overetch, scanning AOI and brown pre-process, by upper copper coin, upper film, core plate, lower film and under
Copper coin stacks successively from top to bottom, is pressed under conditions of HTHP；By bilevel film by copper coin and
Core plate is sticky, and ensures the steadiness and resistance to pressure of pressing.
Further, the film is PP films.
Shown by substantial amounts of experimental data, the degree of adhesion of PP films is functional, and the copper-clad plate combination property of making is more
It is good.
Present invention also offers a kind of compression method of PCB copper-clad plates, comprise the following steps：
S1：Core plate etches by etching machine；
S2：AOI is scanned to core plate after etching；
S3：Brown processing is carried out to core plate；
S4：By upper copper coin, upper film, core plate, lower film and lower copper coin, alignment is placed successively from top to bottom；
S5：Hot-press solidifying is carried out to it under high-temperature and high-pressure conditions；
S6：Isothermal holding is carried out to PCB copper-clad plates after the completion of pressing；
S7：After PCB copper-clad plates cooling, gong side is carried out to the PCB copper-clad plates that pressing is completed using gong machine.
The core plate for etching completion is scanned AOI, detection etches the circuit come and whether there is problem, non-defective unit is carried out
Handle in next step, defective products is returned and etched again；The core plate that detection is passed carries out brown processing, improves the combination between film
Degree, it is not in the probability to drop to reduce product, improves yields；After the completion of pretreatment by upper copper coin, upper film, core plate, under
Alignment stacks and is put into the environment of HTHP and is pressed successively from top to bottom for film and lower copper coin, to ensure after the completion of pressing
Film fully merges solidification and carries out isothermal holding, and cooled copper is completed in insulation makes film fully solidify, and finally utilizes gong machine edges of boards
The glue of outflow or irregular part.
Further, temperature when being pressed in the step S5 is 150 DEG C ~ 200 DEG C.
Need hot environment film is fully melted in bonding processes, drawn through lot of experiments in the range of 150 DEG C ~ 200 DEG C
It is last to carry out pressing effect, and will not high-temperature damage sheet material.
Further, the holding temperature in the step S6 is 200 DEG C.
Pressing is completed, to make abundant combination between film and core plate and copper coin, it is necessary to be incubated at a certain temperature, to pass through
Lot of experiments will not both damage sheet material under the conditions of drawing 200 DEG C, also film can be made fully to be combined with core plate and copper coin.
Further, the soaking time in the step S6 is 70 minutes.
Press and complete to make fully to combine between film and core plate and copper coin, it is necessary to carry out being incubated necessarily at a certain temperature
Time, show that the soaking time of 70 minutes or so both will not damage sheet material because of overlong time through lot of experiments, can also make glue
Piece fully solidifies.
Beneficial effects of the present invention are：Copper coin and core plate are sticky by the present invention by bilevel film, are ensured
The steadiness and resistance to pressure of pressing.Copper-clad plate is pressed by rational temperature and time simultaneously, makes to be well combined between sheet material, this
Method process is simple, and cost is low and the copper-clad plate produced is cost-effective.
Brief description of the drawings
The invention will be further described for accompanying drawing, but the embodiment in accompanying drawing does not form any limitation of the invention.
Fig. 1 is that the copper-clad plate section structure that one embodiment of the invention provides is intended to.
Embodiment
As shown in fig. 1, the compression method for a kind of PCB copper-clad plates that one embodiment of the invention provides
In one embodiment, the compression method of the PCB copper-clad plates, including core plate 1, film and copper coin, the film include gluing
Piece 21 and lower film 22, the copper coin include upper copper coin 31 and lower copper coin 32, the upper copper coin 31, upper film 21, core plate 1, under
Film 22 and the alignment connection successively from top to bottom of lower copper coin 32.
First core plate 1 is pre-processed through overetch, scanning AOI and brown, by upper copper coin 31, upper film 21, core plate 1, lower glue
Piece 22 and lower copper coin 32 stack successively from top to bottom, are pressed under conditions of HTHP；Pass through bilevel glue
Copper coin and core plate 1 are sticky by piece, ensure the steadiness and resistance to pressure of pressing.
In one embodiment, the film is PP films.
Shown by substantial amounts of experimental data, the degree of adhesion of PP films is functional, and the copper-clad plate combination property of making is more
It is good.
Present invention also offers a kind of compression method of PCB copper-clad plates, comprise the following steps：
S1：Core plate 1 etches by etching machine；
S2：AOI is scanned to core plate 1 after etching；
S3：Brown processing is carried out to core plate 1；
S4：By upper copper coin 31, upper film 21, core plate 1, lower film 22 and lower copper coin 32, alignment is placed successively from top to bottom；
S5：Hot-press solidifying is carried out to it under high-temperature and high-pressure conditions；
S6：Isothermal holding is carried out to PCB copper-clad plates after the completion of pressing；
S7：After PCB copper-clad plates cooling, gong side is carried out to the PCB copper-clad plates that pressing is completed using gong machine.
The core plate 1 for etching completion is scanned AOI, detection etches the circuit come and whether there is problem, non-defective unit is entered
Row is handled in next step, and defective products is returned and etched again；The core plate 1 that detection is passed carries out brown processing, improves between film
Conjugation, it is not in the probability to drop to reduce product, improves yields；After the completion of pretreatment by upper copper coin 31, upper film 21,
Alignment stacks and is put into the environment of HTHP and is pressed successively from top to bottom for core plate 1, lower film 22 and lower copper coin 32, presses
After the completion of for ensure film fully merge solidification carry out isothermal holding, insulation complete cooled copper film is fully solidified, finally
Glue or irregular part using the outflow of gong machine edges of boards.
In one embodiment, temperature when being pressed in the step S5 is 150 DEG C ~ 200 DEG C.
Need hot environment film is fully melted in bonding processes, drawn through lot of experiments in the range of 150 DEG C ~ 200 DEG C
It is last to carry out pressing effect, and will not high-temperature damage sheet material.
In one embodiment, the holding temperature in the step S6 is 200 DEG C.
Pressing is completed, to make abundant combination between film and core plate 1 and copper coin, it is necessary to be incubated at a certain temperature, to pass through
Lot of experiments will not both damage sheet material under the conditions of drawing 200 DEG C, also film can be made fully to be combined with core plate 1 and copper coin.
In one embodiment, the soaking time in the step S6 is 70 minutes.
Pressing is completed to make fully to combine, it is necessary to carry out insulation one at a certain temperature between film and core plate 1 and copper coin
Fixed time, the soaking time for drawing 70 minutes or so through lot of experiments both will not damage sheet material because of overlong time, and can also make
Film fully solidifies.
Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-mentioned reality
Apply all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, the scope that this specification is recorded all is considered to be.
Embodiment described above only expresses the several embodiments of the present invention, and its description is more specific and detailed, but simultaneously
Can not therefore it be construed as limiting the scope of the patent.It should be pointed out that come for one of ordinary skill in the art
Say, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection of the present invention
Scope.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (6)
- A kind of 1. PCB copper-clad plates, it is characterised in that：Including core plate, film and copper coin, the film includes upper film and lower glue Piece, the copper coin include upper copper coin and lower copper coin, the upper copper coin, upper film, core plate, lower film and lower copper coin from top to bottom according to Secondary alignment connection.
- 2. PCB copper-clad plates according to claim 1, it is characterised in that：The film is PP films.
- A kind of 3. compression method of PCB copper-clad plates, it is characterised in that：The PCB copper-clad plates as described in claim 1 ~ 2 any one, The compression method of PCB copper-clad plates comprises the following steps：S1：Core plate etches by etching machine；S2：AOI is scanned to core plate after etching；S3：Brown processing is carried out to core plate；S4：By upper copper coin, upper film, core plate, lower film and lower copper coin, alignment is placed successively from top to bottom；S5：Hot-press solidifying is carried out to it under high-temperature and high-pressure conditions；S6：Isothermal holding is carried out to PCB copper-clad plates after the completion of pressing；S7：After PCB copper-clad plates cooling, gong side is carried out to the PCB copper-clad plates that pressing is completed using gong machine.
- 4. the compression method of PCB copper-clad plates according to claim 3, it is characterised in that：When being pressed in the step S5 Temperature is 150 DEG C ~ 200 DEG C.
- 5. the compression method of PCB copper-clad plates according to claim 3, it is characterised in that：Holding temperature in the step S6 For 200 DEG C.
- 6. the compression method of PCB copper-clad plates according to claim 4, it is characterised in that：Soaking time in the step S6 For 70 minutes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711048728.1A CN107567194A (en) | 2017-10-31 | 2017-10-31 | A kind of compression method of PCB copper-clad plates |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711048728.1A CN107567194A (en) | 2017-10-31 | 2017-10-31 | A kind of compression method of PCB copper-clad plates |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107567194A true CN107567194A (en) | 2018-01-09 |
Family
ID=61031684
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711048728.1A Withdrawn CN107567194A (en) | 2017-10-31 | 2017-10-31 | A kind of compression method of PCB copper-clad plates |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0955795A3 (en) * | 1998-05-08 | 2001-03-14 | Matsushita Electric Industrial Co., Ltd. | Conductive paste for filing via-hole, double-sided and multilayer printed circuit boards using the same, and method for producing the same |
| CN201797646U (en) * | 2010-09-21 | 2011-04-13 | 广东生益科技股份有限公司 | Printed circuit board (PCB) structure capable for improving difference of dimensional stability of multilayer board |
| CN202005063U (en) * | 2011-01-30 | 2011-10-05 | 金安国纪科技股份有限公司 | Copper clad plate |
| CN103327756A (en) * | 2013-06-03 | 2013-09-25 | 东莞生益电子有限公司 | Multilayer circuit board with partial mixed structure and manufacturing method thereof |
| CN105472912A (en) * | 2015-11-23 | 2016-04-06 | 深圳崇达多层线路板有限公司 | Press fit method for high-voltage-resistant PCB with thick copper plate |
-
2017
- 2017-10-31 CN CN201711048728.1A patent/CN107567194A/en not_active Withdrawn
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0955795A3 (en) * | 1998-05-08 | 2001-03-14 | Matsushita Electric Industrial Co., Ltd. | Conductive paste for filing via-hole, double-sided and multilayer printed circuit boards using the same, and method for producing the same |
| CN201797646U (en) * | 2010-09-21 | 2011-04-13 | 广东生益科技股份有限公司 | Printed circuit board (PCB) structure capable for improving difference of dimensional stability of multilayer board |
| CN202005063U (en) * | 2011-01-30 | 2011-10-05 | 金安国纪科技股份有限公司 | Copper clad plate |
| CN103327756A (en) * | 2013-06-03 | 2013-09-25 | 东莞生益电子有限公司 | Multilayer circuit board with partial mixed structure and manufacturing method thereof |
| CN105472912A (en) * | 2015-11-23 | 2016-04-06 | 深圳崇达多层线路板有限公司 | Press fit method for high-voltage-resistant PCB with thick copper plate |
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Application publication date: 20180109 |