CN102404936A - Circuit board capable of embedding discrete part and manufacturing method thereof - Google Patents
Circuit board capable of embedding discrete part and manufacturing method thereof Download PDFInfo
- Publication number
- CN102404936A CN102404936A CN201010274581XA CN201010274581A CN102404936A CN 102404936 A CN102404936 A CN 102404936A CN 201010274581X A CN201010274581X A CN 201010274581XA CN 201010274581 A CN201010274581 A CN 201010274581A CN 102404936 A CN102404936 A CN 102404936A
- Authority
- CN
- China
- Prior art keywords
- substrate
- discrete part
- conductive layer
- bonding
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention provides a circuit board capable of embedding a discrete part and a manufacturing method of the circuit board and is applicable to the field of printed circuit boards. The circuit board comprises the discrete part and a first substrate, wherein a first conductive layer is arranged on at least one surface of the first substrate, and the discrete part is adhered to the first conductive layer through an anisotropic adhesive and conductive material. In the embodiment of the invention, the discrete part is fixed on the conductive layer of the substrate by adopting the anisotropic adhesive and conductive material, and an electrode of the discrete part is communicated with an external circuit through the anisotropic adhesive and conductive material in a conductive manner after a hot pressing process, so that the punched alignment area is increased, the processing difficulty of the circuit board is reduced, and the yield of mass production is increased.
Description
Technical field
The invention belongs to the printed circuit board field, relate in particular to a kind of discrete part wiring board and manufacturing approach thereof imbedded.
Background technology
(Printed Circuit Board PCB) mainly plays the effect of supporting with the interconnection circuit element to printed circuit board in electronic product, be embedded to a large amount of passive components in the printed circuit intralamellar part, can improve the reliability of encapsulation, increases the effective area of encapsulation.In the existing manufacture craft of imbedding the discrete part wiring board; Be after discrete part is fixed in the core material surface of circuit board; Offer blind hole in outer central layer and discrete part electrode corresponding position again; Thereby the electrode of discrete part is derived, be that perhaps offering through hole on the pad that electrode connects realizes that electrode is connected with skin.Because discrete part is less, and its electrode area is limited, when on outer central layer, offering blind hole or through hole, the aligning accuracy of blind hole or through hole and electrode requires high in this manufacture craft, and difficulty of processing is big, and production efficiency is low.
Summary of the invention
The purpose of the embodiment of the invention is to provide a kind of discrete part wiring board of imbedding; Be intended to solve the existing discrete part wiring board of imbedding through offering blind hole or the through hole mode connects the separate type device; The aligning accuracy of blind hole or through hole and electrode requires high, the problem that difficulty of processing is big.
The embodiment of the invention is achieved in that a kind of discrete part wiring board of imbedding, and said wiring board comprises:
Discrete part; And
At least one surface has first substrate of first conductive layer;
Bond through anisotropy bonding electric conducting material between said discrete part and said first conductive layer.
Another purpose of the embodiment of the invention is to provide a kind of manufacturing approach of imbedding the discrete part wiring board, and said method comprises the steps:
Prepare first substrate, at least one surface of said first substrate has first conductive layer;
Through anisotropy bonding electric conducting material, discrete part is sticked on the surface of said first conductive layer.
The embodiment of the invention adopts anisotropy bonding electric conducting material discrete part to be fixed on the conductive layer of substrate; And after hot pressing technique with the electrode of discrete part through anisotropy bonding electric conducting material and the bigger conductive layer conducting of area; Increased punching contraposition area; Reduce the difficulty of processing of wiring board, improved the yields of producing in batches.
Description of drawings
Fig. 1 imbeds the structure chart behind the discrete part wiring board hot pressing for what one embodiment of the invention provided;
The structure chart of imbedding the making of discrete part circuit board pattern that Fig. 2 provides for one embodiment of the invention;
The structure chart of imbedding the pressing for the second time of discrete part wiring board that Fig. 3 provides for one embodiment of the invention;
The structure chart of imbedding the punching of discrete part wiring board that Fig. 4 provides for one embodiment of the invention;
Fig. 5 imbeds the structure chart before the discrete part wiring board hot pressing for what another embodiment of the present invention provided;
Fig. 6 imbeds the structure chart behind the discrete part wiring board hot pressing for what another embodiment of the present invention provided.
Embodiment
In order to make the object of the invention, technical scheme and advantage clearer,, the present invention is further elaborated below in conjunction with accompanying drawing and embodiment.Should be appreciated that specific embodiment described herein only in order to explanation the present invention, and be not used in qualification the present invention.
The embodiment of the invention sticks on discrete part the conductive layer surface of substrate through anisotropy bonding electric conducting material; Vertically conduct electricity and the conduction otherness of lateral isolation after utilizing this material hot pressing; Electrode and the bigger conductive layer conducting of area with discrete part; Thereby increased punching contraposition area, reduced difficulty of processing.
The structure of imbedding the discrete part wiring board that provides as first embodiment of the invention comprises:
Discrete part; And
At least one surface has first substrate of first conductive layer;
Bond through anisotropy bonding electric conducting material between said discrete part and said first conductive layer.
Below in conjunction with specific embodiment realization of the present invention is elaborated.
Fig. 1 is the structure of imbedding the discrete part wiring board that the embodiment of the invention provides, and for the ease of explanation, only shows the part relevant with the embodiment of the invention.
The surface of first substrate 13 has first conductive layer, and the surface of first conductive layer is provided with discrete part 11, bonds through anisotropy bonding electric conducting material 12 between the discrete part 11 and first conductive layer.
In embodiments of the present invention, can use Copper Foil as first conductive layer simultaneously as first substrate.
Have only cementation before 12 hot pressing of anisotropy bonding electric conducting material, have the characteristic of vertical conduction lateral isolation after the hot pressing, discrete part 11 is fixed on first substrate 13, and after hot pressing with the first conductive layer conducting.
As a preferred embodiment of the present invention, anisotropy bonding electric conducting material 12 can be anisotropic conductive or anisotropy conductive paste.
The surface of second substrate 14 has second conductive layer, and this second conductive layer makes progress, and second substrate 14 is through bonding film 15 and first substrate, 13 bondings.
In embodiments of the present invention, can use Copper Foil is second substrate as second conductive layer simultaneously.
As the preferred embodiments of the present invention; When the thickness of discrete part 11 during greater than the thickness of single bonding film 15; Has multi-layer bonded film 15 between first substrate 13 and second substrate 14; The integral thickness of this multi-layer bonded film equals the thickness of discrete part 11, and discrete part 11 places in this first opening.Perhaps
Have one or more the 3rd substrates between first substrate 13 and second substrate 14, the upper and lower surface of the 3rd substrate all has conductive layer, and has second opening that is complementary with discrete part 11 sizes, and discrete part 11 places in this second opening.
Through bonding film bonding, when the 3rd substrate has when a plurality of, also by bonding film bonding, make the integral thickness of the 3rd substrate and bonding film equal the thickness of discrete part 11 between a plurality of the 3rd substrates between the 3rd substrate and first substrate 13, second substrate 14.
Referring to Fig. 2, the embodiment of the invention forms pad and circuit through first conductive layer and second conductive layer are carried out graphic making.
Can also be at upper and lower surperficial pressing tetrabasal 16 and the 5th substrate 17 of imbedding the discrete part wiring board shown in Fig. 2, referring to Fig. 3.
Tetrabasal 16 is processed by cured epoxy resin glass cloth, and its lower surface has the 4th conductive layer, is laminated in the lower surface of first substrate 13.
The 5th substrate 17 is also processed by cured epoxy resin glass cloth, and its upper surface has the 5th conductive layer, is laminated in the upper surface of second substrate 14.
In Fig. 4 structure; Blind hole 18 for and the pad of the electrode conduction of discrete part 11 and the 4th conductive layer between the hole got through; The surface of blind hole 18 is coated with Copper Foil; Because bonding pad area so increased punching contraposition area, has improved the machinability of wiring board much larger than the area of the electrode of discrete part 11.
Through hole 19 is the hole of getting through between the 4th conductive layer and the 5th conductive layer, and the surface of through hole 19 is coated with Copper Foil.
After the 4th conductive layer, five conductive layers carry out graphic making, form pad and circuit.
The manufacture method of imbedding the discrete part wiring board that the embodiment of the invention provides is following:
At first, prepare first substrate, 13, the first substrates, 13 at least one surfaces and have first conductive layer.
Secondly, through anisotropy bonding electric conducting material 12, discrete part 11 is sticked on the surface of this first conductive layer.
As one embodiment of the present of invention, all right:
Prepare at least one bonding film 15, on bonding film 15, offer first opening, its size is complementary with discrete part 11 sizes;
Prepare one second substrate, 14, the second substrates, 14 at least one surfaces and have second conductive layer;
On first substrate 13 that is stained with discrete part 11, stack gradually the bonding film 15 and second substrate 14; The surface of second conductive layer upwards; Discrete part 11 is fixed in the opening of bonding film 15; Heating and pressurizing first substrate 13, bonding film 15 and this second substrate 14 make it be bonded in one, and its structure is as shown in Figure 1.
As the preferred embodiments of the present invention,, all right when the thickness of discrete part 11 during greater than the thickness of single bonding film 15:
Range upon range of multi-layer bonded film 15 between first substrate 13 and second substrate 14 makes the integral thickness of this multi-layer bonded film equal the thickness of discrete part 11, and discrete part 11 is placed in this first opening; Perhaps
Prepare one or more the 3rd substrates, the upper and lower surface of said the 3rd substrate all has conductive layer;
On the 3rd substrate, offer second opening that is complementary with discrete part 11 sizes, discrete part 11 is placed in this second opening;
Range upon range of one or more said the 3rd substrates between first substrate 13 and second substrate 14; With bonding film 15 with the 3rd substrate and first substrate 13 and second substrate, 14 bondings; Also by bonding film 15 bondings, make the 3rd substrate and the integral thickness of bonding film 15 between first substrate 13 and second substrate 14 equal said discrete part 11 thickness between a plurality of the 3rd substrates.
In addition, the wiring board of Fig. 1 added hot pressing after, carry out graphic making in the bottom surface of first substrate 13 and the surface of second substrate 14, form pad, as shown in Figure 2.
The upper surface for preparing tetrabasal 16, the tetrabasals 16 has the 4th conductive layer;
Prepare the 5th substrate 17, the five substrates 17 and have the 5th conductive layer;
Range upon range of tetrabasal 16, the four conductive layers of the first conductive layer lower surface in through graphic making are downward;
Range upon range of the 5th substrate of the second conductive layer upper surface 17, the five conductive layers in through graphic making make progress, and carry out hot pressing, and concrete structure is as shown in Figure 3;
In and the pad of the electrode conduction of discrete part 11 and the 4th conductive layer between make a call to a blind hole 18, between the 4th conductive layer and the 5th conductive layer, make a call to a through hole 19; And in blind hole 18 and through hole 19 surface plating one deck Copper Foils; Because bonding pad area is much larger than the area of discrete part electrode; So increased punching contraposition area, improved production efficiency.
Then, the 4th conductive layer and the 5th conductive layer are carried out graphic making, concrete structure is as shown in Figure 4.
The another kind that Fig. 5 shows the embodiment of the invention to be provided is imbedded the structure of discrete part wiring board, for the ease of explanation, only shows the part relevant with the embodiment of the invention.
The electrode of discrete part 11 is with the conductive layer bonding of anisotropy bonding electric conducting material 12 and first substrate, 23 upper surfaces; Second substrate 24 is laminated in the upper surface of discrete part 11; And between first substrate 23 and second substrate 24, stack gradually bonding film 15 and the 3rd substrate 26, make the integral thickness of bonding film 15 and the 3rd substrate 26 equal the thickness of discrete part 11.
Behind the hot pressing, the said structure bonding is one, participates in Fig. 6, and has blind hole 18 between the pad of discrete part 11 conductings and first substrate, the 23 lower surface conductive layers, and blind hole 18 surfaces are coated with Copper Foil.
The manufacture method of imbedding the discrete part wiring board that this embodiment provides repeats no more.
The embodiment of the invention adopts anisotropy bonding electric conducting material discrete part to be fixed on the conductive layer of substrate; And behind heat pressing process with the electrode of discrete part through anisotropy bonding electric conducting material and external circuit conducting; Increased punching contraposition area; Reduce the difficulty of processing of wiring board, improved production efficiency and product reliability.
More than be merely preferred embodiment of the present invention,, all any modifications of within spirit of the present invention and principle, being done, be equal to and replace and improvement etc., all should be included within protection scope of the present invention not in order to restriction the present invention.
Claims (10)
1. imbed the discrete part wiring board for one kind, it is characterized in that, said wiring board comprises:
Discrete part; And
At least one surface has first substrate of first conductive layer;
Bond through anisotropy bonding electric conducting material between said discrete part and said first conductive layer.
2. wiring board as claimed in claim 1 is characterized in that, said anisotropy bonding electric conducting material is anisotropic conductive or anisotropy conductive paste.
3. wiring board as claimed in claim 1 is characterized in that, said wiring board also has:
At least one surface has second substrate of second conductive layer;
Through bonding film bonding, said bonding film is provided with first opening between said second substrate and said first substrate, and said discrete part places in said first opening.
4. wiring board as claimed in claim 3 is characterized in that, said wiring board also comprises one or more layers said bonding film;
Said bonding film is between said first substrate and said second substrate;
The integral thickness of a plurality of said bonding films between said first substrate and said second substrate equals said discrete part thickness;
Said discrete part places in said first opening.
5. wiring board as claimed in claim 3 is characterized in that, said wiring board also comprises one or more layers the 3rd substrate;
The upper and lower surface of said the 3rd substrate all has conductive layer, and is provided with second opening that is complementary with said discrete part size, and said discrete part places in said second opening;
Said the 3rd substrate and through bonding film and first substrate, second substrate bonding, is bondd by bonding film between said the 3rd substrate of multilayer between said first substrate and said second substrate;
Said the 3rd substrate between said first substrate and said second substrate and the integral thickness of said bonding film equal the thickness of said discrete part.
6. a manufacturing approach of imbedding the discrete part wiring board is characterized in that, said method comprises the steps:
Prepare first substrate, at least one surface of said first substrate has first conductive layer;
Through anisotropy bonding electric conducting material, discrete part is sticked on the surface of said first conductive layer.
7. method as claimed in claim 6 is characterized in that, said anisotropy bonding electric conducting material is anisotropic conductive or anisotropy conductive paste.
8. method as claimed in claim 6 is characterized in that said method also comprises the steps:
Prepare second substrate, at least one surface of said second substrate has second conductive layer;
Prepare a bonding film, said bonding film is provided with first opening;
Said bonding film and said second substrate are stacked gradually on said first substrate, discrete part is placed in first opening.
9. method as claimed in claim 8 is characterized in that said method further comprises the steps:
Range upon range of one or more layers said bonding film between said first substrate and said second substrate makes the integral thickness of the said bonding film of multilayer between said first substrate and said second substrate equal said discrete part thickness;
Said discrete part is placed in said first opening.
10. method as claimed in claim 8 is characterized in that said method further comprises the steps:
Prepare one or more the 3rd substrates, the upper and lower surface of said the 3rd substrate all has conductive layer;
On said the 3rd substrate, offer second opening that is complementary with said discrete part size, said discrete part is placed in said second opening;
Range upon range of one or more said the 3rd substrates between said first substrate and said second substrate; With bonding film with said the 3rd substrate and said first substrate and said second substrate bonding; By said bonding film bonding, make the 3rd substrate and the integral thickness of bonding film between said first substrate and said second substrate equal said discrete part thickness between a plurality of said the 3rd substrates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010274581XA CN102404936A (en) | 2010-09-07 | 2010-09-07 | Circuit board capable of embedding discrete part and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010274581XA CN102404936A (en) | 2010-09-07 | 2010-09-07 | Circuit board capable of embedding discrete part and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102404936A true CN102404936A (en) | 2012-04-04 |
Family
ID=45886570
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010274581XA Pending CN102404936A (en) | 2010-09-07 | 2010-09-07 | Circuit board capable of embedding discrete part and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102404936A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104320925A (en) * | 2014-10-23 | 2015-01-28 | 安捷利（番禺）电子实业有限公司 | Manufacture method of novel embedded type circuit board |
| CN105142370A (en) * | 2015-07-14 | 2015-12-09 | 无锡市同步电子科技有限公司 | Miniaturized electronic module circuit system and manufacturing method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1771627A (en) * | 2003-04-10 | 2006-05-10 | 3M创新有限公司 | Durable electronic assembly with conductive adhesive |
| CN101199246A (en) * | 2005-06-16 | 2008-06-11 | 伊姆贝拉电子有限公司 | Method for manufacturing a circuit board structure, and a circuit board structure |
| CN101689520A (en) * | 2007-07-10 | 2010-03-31 | 奥卡姆业务有限责任公司 | Electronic assemblies without solder and methods for their manufacture |
-
2010
- 2010-09-07 CN CN201010274581XA patent/CN102404936A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1771627A (en) * | 2003-04-10 | 2006-05-10 | 3M创新有限公司 | Durable electronic assembly with conductive adhesive |
| CN101199246A (en) * | 2005-06-16 | 2008-06-11 | 伊姆贝拉电子有限公司 | Method for manufacturing a circuit board structure, and a circuit board structure |
| CN101689520A (en) * | 2007-07-10 | 2010-03-31 | 奥卡姆业务有限责任公司 | Electronic assemblies without solder and methods for their manufacture |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104320925A (en) * | 2014-10-23 | 2015-01-28 | 安捷利（番禺）电子实业有限公司 | Manufacture method of novel embedded type circuit board |
| CN104320925B (en) * | 2014-10-23 | 2018-01-19 | 安捷利（番禺）电子实业有限公司 | A kind of preparation method of new embedded circuit board |
| CN105142370A (en) * | 2015-07-14 | 2015-12-09 | 无锡市同步电子科技有限公司 | Miniaturized electronic module circuit system and manufacturing method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10015885B2 (en) | Printed circuit board, and method for manufacturing same | |
| US10743422B2 (en) | Embedding a component in a core on conductive foil | |
| JP2010153505A5 (en) | ||
| KR20150133249A (en) | Method for manufacturing a flexible printed circuit, flexible printed circuit obtained by said method, and chip card module comprising such a flexible printed circuit | |
| TW201933963A (en) | Embedded flexible circuit board and manufacturing method for same | |
| TW201501600A (en) | Printed circuit board and method for manufacturing same | |
| JP2014072279A (en) | Manufacturing method of wiring board with components incorporated therein | |
| CN103889165B (en) | Circuit board with embedded element and preparation method thereof | |
| KR101701380B1 (en) | Device embedded flexible printed circuit board and manufacturing method thereof | |
| CN109401654B (en) | Packaging carrier tape base material, double-interface carrier tape and manufacturing method thereof | |
| EP2141973A1 (en) | Method of providing conductive structures in a multi-foil system and multi-foil system comprising same | |
| JP2012044163A (en) | Method for embedding electrical component | |
| JP2002246536A (en) | Method for manufacturing three-dimensional mounting package and package module for its manufacturing | |
| CN102404936A (en) | Circuit board capable of embedding discrete part and manufacturing method thereof | |
| JP2015037185A (en) | Method of manufacturing electronic component built-in substrate and electronic component built-in substrate | |
| CN102490435B (en) | Method for manufacturing asymmetric factor multi-layer hardboard in soft and hard combination board by adopting separation lamination method | |
| CN102427679B (en) | Flexible printed circuit board with embedded lug interconnection structure and manufacturing method of flexible printed circuit board | |
| JP2004241526A (en) | Wiring board | |
| CN103717016A (en) | Layered prevention technology of multilayer high-frequency electrosilvering circuit board | |
| TW201427505A (en) | Printed circuit board having buried component and method for manufacturing same | |
| JP5221682B2 (en) | Printed circuit board and manufacturing method thereof | |
| JP3583241B2 (en) | Manufacturing method of metal foil clad laminate and manufacturing method of printed wiring board | |
| CN112838016B (en) | Chip thickening method for embedded substrate | |
| JP3956849B2 (en) | Multilayer substrate manufacturing method | |
| KR20110130604A (en) | Integrated printed circuit board embedded with multiple component chip and manufacturing method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20120404 |