KR20110130604A - Integrated printed circuit board embedded with multiple component chip and manufacturing method thereof - Google Patents

Integrated printed circuit board embedded with multiple component chip and manufacturing method thereof Download PDF

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Publication number
KR20110130604A
KR20110130604A KR1020100050006A KR20100050006A KR20110130604A KR 20110130604 A KR20110130604 A KR 20110130604A KR 1020100050006 A KR1020100050006 A KR 1020100050006A KR 20100050006 A KR20100050006 A KR 20100050006A KR 20110130604 A KR20110130604 A KR 20110130604A
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KR
South Korea
Prior art keywords
inner layer
layer pcb
circuit board
pcb
printed circuit
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Application number
KR1020100050006A
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Korean (ko)
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KR101147343B1 (en
Inventor
윤혜선
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엘지이노텍 주식회사
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Priority to KR1020100050006A priority Critical patent/KR101147343B1/en
Publication of KR20110130604A publication Critical patent/KR20110130604A/en
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Publication of KR101147343B1 publication Critical patent/KR101147343B1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/568—Temporary substrate used as encapsulation process aid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04105—Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L2224/19—Manufacturing methods of high density interconnect preforms

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

PURPOSE: An integrated PCB(Printed Circuit Board) and a manufacturing method thereof are provided to produce a highly integrated embedded printed circuit board by increasing the area of a PCB in an internal layer. CONSTITUTION: A carrier substrate(30), in which a copper film(200a) is formed, is prepared(S1). The copper film and the carrier substrate are adhered with an adhesive layer(35)(S2). A bonding paste(40) is spread on an electric component bonded area on the copper film. Electric components(10, 20) are placed in an area in which the bonding paste is spread(S3). Each device is attached to the area in which the bonding paste is spread(S4).

Description

INTEGRATED PRINTED CIRCUIT BOARD EMBEDDED WITH MULTIPLE COMPONENT CHIP AND MANUFACTURING METHOD THEREOF

The present invention relates to a printed circuit board having a built-in device and a method of manufacturing the same, and more particularly, to include a plurality of devices that can implement a highly integrated embedded printed circuit board by increasing an area of an inner layer PCB capable of implementing a circuit. An integrated printed circuit board and a method of manufacturing the same.

A printed circuit board (PCB) is a printed circuit board formed of a conductive material such as copper on an electrically insulating board, and refers to a board immediately before mounting an electronic component. That is, it means a circuit board which fixed the mounting position of each component, and printed and fixed the circuit line which connects components on the flat surface in order to mount many electronic components of various types densely on a flat plate.

Meanwhile, an embedded PCB is a PCB in which passive components such as resistors, capacitors, and inductors are embedded in a substrate. Recently, however, technologies for embedding active components, such as IC chips, have been developed, and in this sense, they are used as a term for PCBs with electronic components regardless of their type. In order to embed such electronic components in printed circuit board technology, a method of mounting a component, a cavity processing method, and a method of connecting an electrode of a chip and a PCB circuit are generally very important.

1 is a cross-sectional view of an embedded printed circuit board in which an active device and a passive device are built according to the prior art. Referring to FIG. 1, when both the active element 10 and the passive element 20 are embedded in the substrate, a problem occurs due to a difference in thickness between the active element 10 and the passive element 20. More specifically, the active element 10 can be lowered to 100 μm or less through grindign, but the passive element 20 has a thickness of 220 μm to 330 μm, which is higher than the active element 10. On the passive element 20, the insulating layer 100 (prepreg) is present more than necessary as shown. In addition, the active element 10 requires considerable area for embedding due to the relatively large planar size compared to the passive element 20.

On the other hand, when the active element 10 and the passive element 20 are embedded in the printed circuit board in this way, the thickness of the printed circuit board is determined by the thickness of the passive element 20. In addition, in the case of inserting the inner layer PCB into the printed circuit board, after attaching the active element and the passive element to the base substrate, the prefabricated buried substrate is matched with the element position to process and stack a cavity. In this case, since the cavity is processed in the portions corresponding to both the active element and the passive element, the portion where the actual circuit can be formed is excluded, thereby limiting the circuit area.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problem, and an object of the present invention is to provide a cavity only in a portion corresponding to a passive element when processing an inner layer PCB inserted into an embedded printed circuit board including an active element and a passive element. The present invention provides an integrated printed circuit board having a plurality of devices embedded therein and a method of manufacturing the same, capable of manufacturing a highly integrated printed circuit board by increasing an area of an inner layer PCB capable of implementing a circuit.

An integrated printed circuit board having a plurality of devices includes a first device horizontally formed and a second device thicker than the first device; A first inner layer PCB including a cavity formed in the second device portion and formed on the first device; An insulating layer filling the first and second devices and the first inner layer PCB; A circuit pattern layer formed on an upper surface or a lower surface of the insulating layer; And a plating part embedded in the insulating layer to electrically connect the upper or lower circuit pattern layer to the inner layer PCB, wherein the first element is formed within the upper and lower surfaces of the second element.

The integrated printed circuit board having the plurality of devices may include a cavity formed in the first and second device portions, and further include a second inner layer PCB formed under the first inner layer PCB.

Here, an insulating layer may be formed between the first inner layer PCB and the second inner layer PCB.

Meanwhile, the first inner layer PCB and the second inner layer PCB may be bonded to bury the first device.

The first device may be an active device, and the second device may be a passive device.

In addition, an integrated printed circuit board manufacturing method including a plurality of devices according to the present invention includes: (a) attaching a first device and a second device thicker than the first device on a metal layer on a carrier substrate; (b) stacking and pressing an insulating layer, a first inner layer PCB including a cavity formed in the second element portion, and a metal layer so as to fill the first and second elements; (c) removing the carrier substrate; (d) forming a via hole to expose the inner layer PCB and plating the via hole; And (e) etching the metal layer above or below the first and second devices to form a circuit pattern layer.

In addition, step (b) may further include stacking a second inner layer PCB including a cavity formed in the first and second device portions.

Here, the step (b) may be a step of further stacking an insulating layer between the first inner layer PCB and the second inner layer PCB.

On the other hand, step (b) may be a step of laminating by bonding the first inner layer PCB and the second inner layer PCB to embed the first device.

In addition, the first device of step (a) may be an active device, the second device may be a passive device.

According to the present invention, in an embedded printed circuit board in which both active and passive elements are mounted, the cavity processing area of the inner layer PCB can be reduced as much as possible. As a result, the area of the inner layer PCB capable of implementing the circuit is increased, thereby realizing a highly integrated embedded printed circuit board.

1 is a cross-sectional view of an embedded printed circuit board in which an active device and a passive device are built according to the prior art.
2 is a cross-sectional view of a basic process for an integrated printed circuit board having a plurality of devices embedded therein according to the present invention.
3 is a cross-sectional view of an integrated printed circuit board fabrication process incorporating a plurality of devices according to an embodiment of the present invention.
4 is a cross-sectional view of a manufacturing process of an integrated printed circuit board having a plurality of devices embedded therein according to another embodiment of the present invention.
5 is a cross-sectional view of a manufacturing process of an integrated printed circuit board having a plurality of devices embedded therein according to another embodiment of the present invention.

Hereinafter, an integrated printed circuit board and a method of manufacturing the same, in which a plurality of devices are built, according to an exemplary embodiment will be described in detail with reference to the accompanying drawings. In the following description, well-known functions or constructions are not described in detail to avoid unnecessarily obscuring the subject matter of the present invention.

2 is a cross-sectional view of a basic process for an integrated printed circuit board having a plurality of devices according to the present invention. Referring to FIG. 2, a basic process for an integrated printed circuit board having a plurality of devices according to the present invention first prepares a carrier substrate 30 on which a metal substrate, for example, copper film 200a is formed (S1). ). Here, the copper film 200a and the carrier substrate 30 may be bonded by the adhesive layer 35 (S2). And the bonding paste 40 is apply | coated to the part to which the electronic element on the copper film 200a is attached. Then, the electronic devices 10 and 20 are positioned at the portion where the bonding paste is applied (S3), and the respective devices are attached (S4). The electronic elements 10 and 20 here differ in thickness from one another, such as active elements and passive elements. Therefore, when the passive element 20 is thicker than the active element 10 when attached on the same plane as shown, the height of the passive element 20 is formed higher than the height of the active element 10.

3 is a cross-sectional view of a process of manufacturing an integrated printed circuit board having a plurality of devices according to an embodiment of the present invention. Referring to Figure 3, once the basic process is the same as the process S1 to S4 of FIG. Thereafter, a bonding sheet, that is, the first inner layer PCB 310, the insulating layers 110, 120, and 130, and the metal layer 200b are laminated to fill the active element 10 and the passive element 20 ( S5). More specifically, a first inner layer PCB 310 having a cavity in the passive element 20 portion is formed only on the active element 10, and each layer (first inner layer PCB 310, active element ( 10), insulating layers 110, 120, and 130, such as prepregs, are laminated between the passive elements 20 and the upper and lower copper films 200a and 200b for insulation and bonding between the layers. In addition, a metal layer, for example, a copper film 200b, is laminated on the top for circuit formation.

In particular, since the first inner layer PCB 310 includes a cavity only in the passive element 20 portion, a circuit can be implemented on the active element 20 portion, thereby increasing the degree of integration. Each of the layers 110, 120, 130, 310, and 200b stacked in this manner is pressed and fired (S6), and the carrier substrate 30 is removed and flipped (S7). In this case, upon removal of the carrier substrate, the adhesive layer 35 is also removed.

Finally, drilling, plating, and patterning processes are performed. Specifically, a through-hole 60 penetrating the entire embedded printed circuit board and a via hole penetrating to the first inner layer PCB 310 are formed by a drilling process. Further, by forming the plating portion 50 in the inner wall of the through hole 60 and the via hole inside by the plating process, and forming the circuit pattern layers 210a and 210b by the patterning process, the respective layers 210a, 310, 210b) to complete the embedded printed circuit board electrically connected.

4 is a cross-sectional view of an integrated printed circuit board manufacturing process in which a plurality of devices is built according to still another embodiment of the present invention. Referring to FIG. 4, once the basic process is the same as the process S1 to S4 of FIG. 2. In addition, the present process is the same as the process of FIG. 3 except for further laminating the second inner layer PCB 320. Specifically, the bonding sheet, that is, the first inner layer PCB 310, the second inner layer PCB 320, the insulating layers 110, 120, and 130 to fill the active element 10 and the passive element 20. The metal layer 200b is laminated (S5). Here, the second inner layer PCB 320 not only has a cavity in the passive element portion 20, but also has a cavity in the active element 10 portion. In addition, an insulating layer 120 such as a prepreg is inserted between the first inner layer PCB 310 and the second inner layer PCB 320 for insulation and adhesion.

In particular, the second inner layer PCB 320, unlike the first inner layer PCB 310, the cavity is formed in the portion of the active element 10, there is less area to form a circuit. However, since the passive element 20 is formed up and down with the first inner layer PCB 310, the integration degree can be increased without increasing the thickness in the printed circuit board of FIG. 3.

Thereafter, the pressing and firing (S6), carrier substrate removal and flipping (S7), drilling, plating, and circuit pattern formation (S8) processes are the same as in FIG.

5 is a cross-sectional view of an integrated printed circuit board manufacturing process in which a plurality of devices according to another embodiment of the present invention is incorporated. Referring to Figure 5, once the basic process is the same as the process S1 to S4 of FIG. Thereafter, a bonding sheet, that is, a third inner layer PCB 330, insulating layers 110 and 140, and a metal layer 200b is laminated to fill the active element 10 and the passive element 20 (S5). Here, the third inner layer PCB 330 is bonded to each other such that the first inner layer PCB 310 and the second inner layer PCB 320 embed the active element 10. That is, the insulating layer does not exist between the first inner layer PCB 310 and the second inner layer PCB 320, and is bonded to each other so as to surround the top and side surfaces of the active element 10. The first inner layer PCB 310 and the second inner layer PCB 320 bonded to each other are electrically connected to each other through the inner via hole 70.

Thereafter, the pressing and firing (S6), carrier substrate removal and flipping (S7), drilling, plating, and circuit pattern formation (S8) processes are the same as in FIG.

In the foregoing detailed description of the present invention, specific examples have been described. However, various modifications are possible within the scope of the present invention. The technical spirit of the present invention should not be limited to the above-described embodiments of the present invention, but should be determined not only by the claims, but also by those equivalent to the claims.

10: active element 20: passive element
100: bonding sheet 30: carrier substrate
35: adhesive layer 40: adhesive paste
50: via hole plating layer 60: through hole
70: internal via holes 110, 120, 130, 140: insulating layer
200a, 200b: metal layer 210a, 210b: circuit pattern layer
310: first inner layer PCB 320: second inner layer PCB
330: third inner layer PCB

Claims (10)

A first device formed horizontally and a second device thicker than the first device;
A first inner layer PCB including a cavity formed in the second device portion and formed on the first device;
An insulating layer filling the first and second devices and the first inner layer PCB;
A circuit pattern layer formed on an upper surface or a lower surface of the insulating layer; And
A plating part embedded in the insulating layer to electrically connect the upper or lower circuit pattern layer to the inner layer PCB,
The first device includes an integrated printed circuit board having a plurality of devices formed within the upper and lower surfaces of the second device.
The method of claim 1,
An integrated printed circuit board having the plurality of devices embedded therein may include
And a cavity formed in the first and second device portions, and further comprising a second inner layer PCB formed under the first inner layer PCB.
The method of claim 2,
And an integrated printed circuit board having a plurality of devices having an insulating layer formed therebetween between the first inner layer PCB and the second inner layer PCB.
The method of claim 2,
And the first inner layer PCB and the second inner layer PCB are embedded with a plurality of elements bonded to embed the first element.
The method according to any one of claims 1 to 4,
And the first device is an active device, and the second device is a passive device.
(a) attaching a first device and a second device thicker than the first device on a metal layer on the carrier substrate;
(b) stacking and pressing an insulating layer, a first inner layer PCB including a cavity formed in the second element portion, and a metal layer so as to fill the first and second elements;
(c) removing the carrier substrate;
(d) forming a via hole to expose the inner layer PCB and plating the via hole; And
(e) forming a circuit pattern layer by etching a metal layer above or below the first and second devices to form a circuit pattern layer.
The method of claim 6,
The step (b) is a step of further stacking a second inner layer PCB including a cavity formed in the first, the second element portion, integrated circuit board manufacturing method having a plurality of devices embedded.
The method of claim 7, wherein
The step (b) is a step of further stacking an insulating layer between the first inner layer PCB and the second inner layer PCB.
The method of claim 7, wherein
The step (b) is a step of laminating by bonding the first inner layer PCB and the second inner layer PCB to bury the first device to embed the plurality of devices embedded integrated circuit board manufacturing method.
The method according to any one of claims 6 to 9,
The first device of step (a) is an active device, the second device is a passive device integrated circuit board manufacturing method containing a plurality of devices.
KR1020100050006A 2010-05-28 2010-05-28 Integrated printed circuit board embedded with multiple component chip and manufacturing method thereof KR101147343B1 (en)

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Application Number Priority Date Filing Date Title
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KR20110130604A true KR20110130604A (en) 2011-12-06
KR101147343B1 KR101147343B1 (en) 2012-05-22

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014069734A1 (en) * 2012-11-02 2014-05-08 Lg Innotek Co., Ltd. Printed circuit board
KR101417264B1 (en) * 2012-04-25 2014-07-08 엘지이노텍 주식회사 The printed circuit board and the method for manufacturing the same

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06120671A (en) * 1991-03-12 1994-04-28 Japan Radio Co Ltd Multilayer wiring board embedded with component
KR100935139B1 (en) * 2005-09-20 2010-01-06 가부시키가이샤 무라타 세이사쿠쇼 Production method for component built­in module and component built­in module
KR100901985B1 (en) 2005-12-22 2009-06-08 가부시키가이샤 무라타 세이사쿠쇼 Component-containing module and method for producing the same
JP2008288298A (en) * 2007-05-16 2008-11-27 Toppan Printing Co Ltd Method for manufacturing printed-wiring board with built-in electronic part

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101417264B1 (en) * 2012-04-25 2014-07-08 엘지이노텍 주식회사 The printed circuit board and the method for manufacturing the same
WO2014069734A1 (en) * 2012-11-02 2014-05-08 Lg Innotek Co., Ltd. Printed circuit board
CN104756615A (en) * 2012-11-02 2015-07-01 Lg伊诺特有限公司 Printed circuit board
US9781835B2 (en) 2012-11-02 2017-10-03 Lg Innotek Co., Ltd. Printed circuit board

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