CN106218192A - A kind of manufacture method of high heat-resisting CEM 3 copper-clad plate of LED halogen-free high-thermal-conductivity - Google Patents
A kind of manufacture method of high heat-resisting CEM 3 copper-clad plate of LED halogen-free high-thermal-conductivity Download PDFInfo
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- CN106218192A CN106218192A CN201610598787.5A CN201610598787A CN106218192A CN 106218192 A CN106218192 A CN 106218192A CN 201610598787 A CN201610598787 A CN 201610598787A CN 106218192 A CN106218192 A CN 106218192A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B37/1284—Application of adhesive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B2038/0052—Other operations not otherwise provided for
- B32B2038/0076—Curing, vulcanising, cross-linking
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2463/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
- C08J2463/04—Epoxynovolacs
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
Abstract
The invention discloses the manufacture method of high heat-resisting CEM 3 copper-clad plate of a kind of LED halogen-free high-thermal-conductivity, step includes: join glue: prepare glue, and mix homogeneously；Gluing: overlay coating: by glass fabric gluing, dries at vertical gluing machine and prepares prepreg；Sandwich of layers: by glass mat gluing, dries at vertical gluing machine and prepares prepreg；Compacting: put up surface layer by two and more than one glass mat is formed by stacking, more two-sided it is covered with Copper Foil, suppress in vacuum press.By use environmental protection phosphorous epoxy resin be that matrix resin is suppressed, hot-forming after CEM 3 plate there is high thermal conductivity, heat conductivity reaches more than 1.4W/m K, can well solve a large amount of quick heat radiatings of LED illumination lamp；Having a splendid thermostability, T260 ＞ 5min, resistance to immersed solder performance is promoted to 120S at present 300 DEG C by 180S at traditional 260 DEG C, can meet client's leadless process production and processing demand simultaneously.
Description
Technical field
The present invention is the manufacture method of the high heat-resisting CEM-3 copper-clad plate of a kind of LED halogen-free high-thermal-conductivity, belongs to copper-clad plate technology
Field.
Background technology
LED (semiconductor light-emitting-diode) electricity-saving lamp is with high brightness white light-emitting diode luminous source, light efficiency height, power consumption
The various public places such as few, the life-span is long, safety and environmental protection, is a new generation's solid cold light source, applicable family, market, hospital are long-time
Illumination.Along with being showing improvement or progress day by day of LED application technology development, application more and more extensive, its power consumption and caloric value also with
Raising, the challenge that the caloric value that is especially greatly improved is the most harsh.Because the fundamental characteristics of LED element is, if temperature
Rising, luminous efficiency will decline, so substrate the most effectively discharges a large amount of exothermic technology producing heat, i.e. possesses height and leads
Hot just become key.
Simultaneously along with the arrival in PCB leadless process epoch, lead-free solder fusing point will be improved to 217 DEG C by original 183 DEG C,
Solder temperature is greatly improved, it is desirable to the substrate as LED to have more preferable thermostability to meet the needs of leadless process.
Chinese patent CN102205675A discloses a kind of LED CEM-3 copper clad plate with high heat conductivity, following method prepare and
: 1) join glue: prepare glue, and mix homogeneously；2) gluing: overlay coating: by glass fabric gluing, dry at vertical gluing machine
Prepare prepreg；Sandwich of layers: by glass mat gluing, dries at vertical gluing machine and prepares prepreg；3) compacting: by two
Put up surface layer and more than one glass mat is formed by stacking, more two-sided be covered with Copper Foil, suppress in vacuum press.This
Bright glue uses difunctional brominated epoxy resin, does not meets the requirement of environmental protection, and halogenide, when ignition, can discharge
A large amount of change hydrogen that toxicity is big, corrosivity is strong, this gas not only pollutes environment, health also can cause a setting loss
Evil, and in Hydrocarbon in the case of there is bromine and chlorine, can produce the severe toxicity such as two English in low temperature partial combustion process
Material.
In sum, it is necessary to develop the manufacture method of the high heat-resisting CEM-3 copper-clad plate of a kind of LED halogen-free high-thermal-conductivity, with
Solve the problems referred to above.
Summary of the invention
The deficiency existed for prior art, it is an object of the present invention to provide the high heat-resisting CEM-3 of a kind of LED halogen-free high-thermal-conductivity
The manufacture method of copper-clad plate.
To achieve these goals, the present invention is to realize by the following technical solutions: a kind of LED halogen-free high-thermal-conductivity
The manufacture method of high heat-resisting CEM-3 copper-clad plate, its step includes:
1) glue is joined: prepare glue, and mix homogeneously by following parts by weight of component；
Phosphorous epoxy resin 122～140；
Orthoresol type epoxy resin 28～30；
DICY firming agent 10～30；
Firming agent accelerator 0.5～1；
High conductive powder 50～72；
10% silane coupler KH560 solution 20～40；
Solvent 150～200；
2) gluing: overlay coating: by glass fabric gluing, dries at vertical gluing machine and prepares prepreg, gluing speed
Be 17～22m/min, control parameter: gelation time is 100～130S, and resin content is 15～20%, fluidity 20%～
30%；
Sandwich of layers: by glass mat gluing, dries at vertical gluing machine and prepares prepreg, gluing speed be 8～
12m/min, controls parameter: resin content is 22～30%, and fluidity is 0.5～1mm；
3) compacting: put up surface layer by two and more than one glass mat is formed by stacking, more two-sided be covered with Copper Foil, in vacuum
Suppressing in press, pressing parameter controls: vacuum: 0～0.01Mpa, pressure: 450～550PSI, heating rate: 2～
3 DEG C/min, temperature of heat plate: 120～230 degree, the press time 120～180min；
The chemical structural formula of described phosphorous epoxy resin is:
Further, the phosphorus content in described glue is 1.0～1.2wt%.
Further, described firming agent accelerator be 2-ethyl-4-methylimidazole, 2-methylimidazole, 2-ethyl imidazol(e) or
One or more in 2-phenylimidazole.
Further, described high conductive powder is micron order conductive filler material.
Further, described high conductive powder selects the aluminium oxide of mean diameter 4～6um.
Further, during described solvent elects acetone, butanone or propylene glycol methyl ether acetate as one or more.
Beneficial effects of the present invention: the present invention uses the phosphorous epoxy resin of environmental protection to be matrix resin, adds micron order
Conductive filler material, and use DICY firming agent, suppressed by regulation pressing parameter.CEM-3 plate after hot-forming has height
Heat conductivility, heat conductivity reaches more than 1.4W/m K, can well solve a large amount of quick heat radiatings of LED illumination lamp；Simultaneously
Having a splendid thermostability, T260 ＞ 5min, resistance to immersed solder performance is promoted at present 300 DEG C by 180S at traditional 260 DEG C
120S, can meet client's leadless process production and processing demand.
Detailed description of the invention
For the technological means making the present invention realize, creation characteristic, reach purpose and be easy to understand with effect, below in conjunction with
Detailed description of the invention, is expanded on further the present invention.
Unless stated otherwise, the glue component that the present invention relates to all can be by being either commercially available.
A kind of manufacture method of the high heat-resisting CEM-3 copper-clad plate of the LED halogen-free high-thermal-conductivity of the present invention, its step includes:
1) glue is joined: prepare glue, and mix homogeneously by following parts by weight of component；
Phosphorous epoxy resin 122～140；
Orthoresol type epoxy resin 28～30；
DICY firming agent 10～30；
Firming agent accelerator 0.5～1；
High conductive powder 50～72；
10% silane coupler KH560 solution 20～40；
Solvent 150～200；
2) gluing: overlay coating: by glass fabric gluing, dries at vertical gluing machine and prepares prepreg, gluing speed
Be 17～22m/min, control parameter: gelation time is 100～130S, and resin content is 15～20%, fluidity 20%～
30%；
Sandwich of layers: by glass mat gluing, dries at vertical gluing machine and prepares prepreg, gluing speed be 8～
12m/min, controls parameter: resin content is 22～30%, and fluidity is 0.5～1mm；
3) compacting: put up surface layer by two and more than one glass mat is formed by stacking, more two-sided be covered with Copper Foil, in vacuum
Suppressing in press, pressing parameter controls: vacuum: 0～0.01Mpa, pressure: 450～550PSI, heating rate: 2～
3 DEG C/min, temperature of heat plate: 120～230 degree, the press time 120～180min；
The chemical structural formula of described phosphorous epoxy resin is:
After described phosphorous epoxy resin is blended with DICY firming agent, heat decomposition temperature and non-flame resistant curable epoxide can be obtained
Thing is identical, the mixture that carbon yield but significantly improves.When the phosphorus content in glue be 1.0 for 1.0wt% time, i.e. can reach
The flame retardant effect of UL94V-0 level.Mix conductive powder in glue, the heat conduction rate of prepreg can be improved.In order to ensure mixing
There is the cementability of the glue of conductive powder, inside glue, with the addition of a certain amount of 10% silane coupler KH560 solution.
The preparation of the high heat-resisting CEM-3 copper-clad plate of embodiment one LED halogen-free high-thermal-conductivity
1) modulation (weight portion) of insulating barrier glue formula:
Phosphorous epoxy resin 122；
Orthoresol type epoxy resin 28；
DICY firming agent 10；
2-methylimidazole 0.5；
The aluminium oxide high conductive powder 50 of mean diameter 4～6um；
10% silane coupler KH560 solution 20；
Propylene glycol methyl ether acetate 150；
Each component is sufficiently mixed uniform 8h, glue gel time 255S.
2) gluing:
Overlay coating: by glass fabric gluing, dries at vertical gluing machine and prepares prepreg, and gluing speed is 20m/
min；Control parameter: gelation time is 125S, and resin content is 16.8%, fluidity 28%；
Sandwich of layers: by glass mat gluing, dries at vertical gluing machine and prepares prepreg, and gluing speed is 12m/
Min, controls parameter: resin content is 26.5%, and fluidity is 0.8mm.
3) compacting:
According to product thickness requirement, put up face by two and required felt is formed by stacking, more two-sided be covered with Copper Foil, in vacuum
Row compacting in press.Pressing parameter:
Vacuum: 0.01Mpa；
Pressure: 530PSI；
Heating rate: 2 DEG C/min；
Temperature of heat plate: 120～230 degree, press time 150min；
Wherein during temperature of heat plate 230 degree, the most also it is high pressure 530PSI, now runs about 60min；
Finally by sheet material outward appearance, interior material test passes, then pack shipment.
The preparation of the high heat-resisting CEM-3 copper-clad plate of embodiment two LED halogen-free high-thermal-conductivity
1) modulation (weight portion) of insulating barrier glue formula:
Phosphorous epoxy resin 130；
Orthoresol type epoxy resin 28；
DICY firming agent 20；
2-methylimidazole 0.8；
The aluminium oxide high conductive powder 60 of mean diameter 4～6um；
10% silane coupler KH560 solution 30；
Propylene glycol methyl ether acetate 175；
Each component is sufficiently mixed uniform 8h, glue gel time 255S.
2) gluing:
Overlay coating: by glass fabric gluing, dries at vertical gluing machine and prepares prepreg, and gluing speed is 21m/
min；Control parameter: gelation time is 125S, and resin content is 17.8%, fluidity 25%；
Sandwich of layers: by glass mat gluing, dries at vertical gluing machine and prepares prepreg, and gluing speed is 12m/
Min, controls parameter: resin content is 27.5%, and fluidity is 0.6mm.
3) compacting:
According to product thickness requirement, put up face by two and required felt is formed by stacking, more two-sided be covered with Copper Foil, in vacuum
Row compacting in press.Pressing parameter:
Vacuum: 0.005Mpa；
Pressure: 480PSI；
Heating rate: 2 DEG C/min；
Temperature of heat plate: 120～230 degree, press time 170min；
Wherein during temperature of heat plate 230 degree, the most also it is high pressure 480PSI, now runs about 60min；
Finally by sheet material outward appearance, interior material test passes, then pack shipment.
The preparation of the high heat-resisting CEM-3 copper-clad plate of embodiment three LED halogen-free high-thermal-conductivity
1) modulation (weight portion) of insulating barrier glue formula:
Phosphorous epoxy resin 140；
Orthoresol type epoxy resin 30；
DICY firming agent 30；
2-phenylimidazole 1；
The aluminium oxide high conductive powder 72 of mean diameter 4～6um；
10% silane coupler KH560 solution 40；
Propylene glycol methyl ether acetate 200；
Each component is sufficiently mixed uniform 8h, glue gel time 255S.
2) gluing:
Overlay coating: by glass fabric gluing, dries at vertical gluing machine and prepares prepreg, and gluing speed is 21m/
min；Control parameter: gelation time is 125S, and resin content is 17.8%, fluidity 25%；
Sandwich of layers: by glass mat gluing, dries at vertical gluing machine and prepares prepreg, and gluing speed is 12m/
Min, controls parameter: resin content is 27.5%, and fluidity is 0.6mm.
3) compacting:
According to product thickness requirement, put up face by two and required felt is formed by stacking, more two-sided be covered with Copper Foil, in vacuum
Row compacting in press.Pressing parameter:
Vacuum: 0.005Mpa；
Pressure: 480PSI；
Heating rate: 2 DEG C/min；
Temperature of heat plate: 120～230 degree, press time 170min；
Wherein during temperature of heat plate 230 degree, the most also it is high pressure 480PSI, now runs about 60min；
Finally by sheet material outward appearance, interior material test passes, then pack shipment.
By step and with reference to the glue in above three embodiment, the high heat-resisting CEM-3 of prepared LED halogen-free high-thermal-conductivity
The test data of copper-clad plate are:
The ultimate principle of the present invention and principal character and advantages of the present invention are more than shown and described, for this area skill
For art personnel, it is clear that the invention is not restricted to the details of above-mentioned one exemplary embodiment, and without departing substantially from the present invention spirit or
In the case of basic feature, it is possible to realize the present invention in other specific forms.Therefore, no matter from the point of view of which point, all should be by
Embodiment regards exemplary as, and is nonrestrictive, the scope of the present invention by claims rather than on state
Bright restriction, it is intended that include all changes fallen in the implication of equivalency and scope of claim in the present invention
In.
Although moreover, it will be appreciated that this specification is been described by according to embodiment, but the most each embodiment only wraps
Containing an independent technical scheme, this narrating mode of description is only that for clarity sake those skilled in the art should
Description can also be formed those skilled in the art through appropriately combined as an entirety, the technical scheme in each embodiment
May be appreciated other embodiments.
Claims (6)
1. a manufacture method for the high heat-resisting CEM-3 copper-clad plate of LED halogen-free high-thermal-conductivity, its step includes:
1) glue is joined: prepare glue, and mix homogeneously by following parts by weight of component；
Phosphorous epoxy resin 122～140；
Orthoresol type epoxy resin 28～30；
DICY firming agent 10～30；
Firming agent accelerator 0.5～1；
High conductive powder 50～72；
10% silane coupler KH560 solution 20～40；
Solvent 150～200；
2) gluing: overlay coating: by glass fabric gluing, dries at vertical gluing machine and prepares prepreg, and gluing speed is 17
～22m/min, control parameter: gelation time is 100～130S, and resin content is 15～20%, fluidity 20%～30%；
Sandwich of layers: by glass mat gluing, dries at vertical gluing machine and prepares prepreg, and gluing speed is 8～12m/
Min, controls parameter: resin content is 22～30%, and fluidity is 0.5～1mm；
3) compacting: put up surface layer by two and more than one glass mat is formed by stacking, more two-sided be covered with Copper Foil, at vacuum press
In suppress, pressing parameter controls: vacuum: 0～0.01Mpa, pressure: 450～550PSI, heating rate: 2～3 DEG C/
Min, temperature of heat plate: 120～230 degree, the press time 120～180min；
The chemical structural formula of described phosphorous epoxy resin is:
The manufacture method of the high heat-resisting CEM-3 copper-clad plate of a kind of LED halogen-free high-thermal-conductivity the most according to claim 1, it is special
Levy and be: the phosphorus content in described glue is 1.0～1.2wt%.
The manufacture method of the high heat-resisting CEM-3 copper-clad plate of a kind of LED halogen-free high-thermal-conductivity the most according to claim 1, it is special
Levy and be: described firming agent accelerator is 2-ethyl-4-methylimidazole, 2-methylimidazole, 2-ethyl imidazol(e) or 2-phenylimidazole
In one or more.
The manufacture method of the high heat-resisting CEM-3 copper-clad plate of a kind of LED halogen-free high-thermal-conductivity the most according to claim 1, it is special
Levy and be: described high conductive powder is micron order conductive filler material.
The manufacture method of the high heat-resisting CEM-3 copper-clad plate of a kind of LED halogen-free high-thermal-conductivity the most according to claim 4, it is special
Levy and be: described high conductive powder selects the aluminium oxide of mean diameter 4～6um.
The manufacture method of the high heat-resisting CEM-3 copper-clad plate of a kind of LED halogen-free high-thermal-conductivity the most according to claim 1, it is special
Levy and be: one or more in acetone, butanone or propylene glycol methyl ether acetate elected as by described solvent.
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|---|---|---|---|
| CN201610598787.5A CN106218192A (en) | 2016-07-27 | 2016-07-27 | A kind of manufacture method of high heat-resisting CEM 3 copper-clad plate of LED halogen-free high-thermal-conductivity |
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|---|---|---|---|
| CN201610598787.5A CN106218192A (en) | 2016-07-27 | 2016-07-27 | A kind of manufacture method of high heat-resisting CEM 3 copper-clad plate of LED halogen-free high-thermal-conductivity |
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| CN106218192A true CN106218192A (en) | 2016-12-14 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107177167A (en) * | 2017-06-22 | 2017-09-19 | 深圳市玖润光电科技有限公司 | Heat-dissipating resin composition for LED-baseplate and preparation method thereof |
| CN109435372A (en) * | 2018-12-06 | 2019-03-08 | 安徽皇广实业有限公司 | A kind of halogen-free and lead-free environment-friendly type LED lamp plate |
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| CN102051026A (en) * | 2011-01-28 | 2011-05-11 | 宏昌电子材料股份有限公司 | Halogen-free flame-retardant epoxy resin composition and application thereof |
| CN102205675A (en) * | 2011-03-29 | 2011-10-05 | 浙江华正新材料股份有限公司 | High thermal conductivity and high heat-resistant copper-clad lamination of CEM-3 grade for LED |
| CN103694644A (en) * | 2013-12-30 | 2014-04-02 | 景旺电子科技(龙川)有限公司 | Epoxy resin composition, metal-based copper-clad plate and manufacturing method thereof |
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2016
- 2016-07-27 CN CN201610598787.5A patent/CN106218192A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102051026A (en) * | 2011-01-28 | 2011-05-11 | 宏昌电子材料股份有限公司 | Halogen-free flame-retardant epoxy resin composition and application thereof |
| CN102205675A (en) * | 2011-03-29 | 2011-10-05 | 浙江华正新材料股份有限公司 | High thermal conductivity and high heat-resistant copper-clad lamination of CEM-3 grade for LED |
| CN103694644A (en) * | 2013-12-30 | 2014-04-02 | 景旺电子科技(龙川)有限公司 | Epoxy resin composition, metal-based copper-clad plate and manufacturing method thereof |
Non-Patent Citations (1)
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| "《印制电路用覆铜箔层压板新技术》" * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107177167A (en) * | 2017-06-22 | 2017-09-19 | 深圳市玖润光电科技有限公司 | Heat-dissipating resin composition for LED-baseplate and preparation method thereof |
| CN107177167B (en) * | 2017-06-22 | 2018-05-04 | 深圳市玖润光电科技有限公司 | Heat-dissipating resin composition for LED substrate and preparation method thereof |
| CN109435372A (en) * | 2018-12-06 | 2019-03-08 | 安徽皇广实业有限公司 | A kind of halogen-free and lead-free environment-friendly type LED lamp plate |
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Application publication date: 20161214 |