CN106274003A - A kind of high Tg, low Dk and the manufacture method of low Df copper-clad plate - Google Patents
A kind of high Tg, low Dk and the manufacture method of low Df copper-clad plate Download PDFInfo
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- CN106274003A CN106274003A CN201610600112.XA CN201610600112A CN106274003A CN 106274003 A CN106274003 A CN 106274003A CN 201610600112 A CN201610600112 A CN 201610600112A CN 106274003 A CN106274003 A CN 106274003A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B37/1207—Heat-activated adhesive
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/067—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of fibres or filaments
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08L79/085—Unsaturated polyimide precursors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B2037/1269—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives multi-component adhesive
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/101—Glass fibres
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2305/00—Condition, form or state of the layers or laminate
- B32B2305/07—Parts immersed or impregnated in a matrix
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2305/00—Condition, form or state of the layers or laminate
- B32B2305/77—Uncured, e.g. green
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/204—Di-electric
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/206—Insulating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2315/00—Other materials containing non-metallic inorganic compounds not provided for in groups B32B2311/00 - B32B2313/04
- B32B2315/08—Glass
- B32B2315/085—Glass fiber cloth or fabric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2363/00—Epoxy resins
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2371/00—Polyethers, e.g. PEEK, i.e. polyether-etherketone; PEK, i.e. polyetherketone
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2379/00—Other polymers having nitrogen, with or without oxygen or carbon only, in the main chain
- B32B2379/08—Polyimides
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
Abstract
The invention discloses a kind of high Tg, low Dk and the manufacture method of low Df copper-clad plate, its step includes: configuration glue gluing overlapping, hot pressing, described glue composition includes: use bimaleimide resin as matrix resin, add epoxy resin, polyether-ether-ketone resin, low-molecular-weight polyimide resin, add reactive diluent, firming agent, curing accelerator and inorganic filler；Prepare as solvent by one or more in acetone, propylene glycol methyl ether acetate, butanone；Gluing: choose the NE glass-fiber-fabric that dielectric constant is 4.0～4.5 and with above-mentioned prepared glue, dry prepared prepreg through vertical gluing machine as reinforcing material, leaching；Overlapping, hot pressing: the prepreg of first-class glue is neatly overlapped, two-sided coated with Copper Foil, hot-forming through vacuum hotpressing machine.The copper-clad plate of the present invention, its Tg ＞ 250 DEG C, Dk ＜ 3.8, Df ＜ 0.07, making high frequency, the demand of high-speed line plate can be fully met.
Description
Technical field
The present invention is a kind of high Tg, low Dk and the manufacture method of low Df copper-clad plate, belongs to copper-clad plate technical field.
Background technology
Along with the development of high-density installation SMT technology, and the requirement of PCB pb-free solder, in PCB processing and whole machine installation
In accessory, the number of occurrence of heat-shock is more than traditional through-hole mounting, so being only improved the vitrification point ability of sheet material
Making reliability ensure and improve, the PCB reliability failures occurred in the life of product phase seems more and more heavier for client
Want；The halogen-free copper-clad plate of low Tg is easier to cause CAF to lose efficacy, and CAF is along glass fibre or resin interface shift shape by copper wire
Become, can between adjacent conductor produce internal electrical short-circuits, this for the design of high density circuit board be one the most serious
Problem.
Information technology develops rapidly now, and all kinds of consumer electronicses with high speed information process function have been daily life
In indispensable key component, the wireless telecommunications of military domain application and wide frequency technology are also rapidly to civilian consumer electronics field
Transfer, the essential core of electronic information communication will be to develop toward high frequency, high speed direction from now on；The present in high frequency technique sustainable development
My god, it being developed to 2GHZ, 3GHZ, 6GHZ and altofrequency from the frequency of tradition below 1GHZ, copper-clad plate is as electronic product
One of important component part, its dielectric constant (Dk) and fissipation factor (Df) just become applies the weight paid close attention in high frequency field
In two performance indications of weight.
The necessary resistance to combustion of circuit board, can not burn at a certain temperature, can only soften.At this moment temperature spot is just called glassy state
Conversion temperature (TG point), this value is related to the dimensional stability of pcb board.At present at printed circuit board industry, its most Halogens
The TG value of copper-clad plate is all at about 150 DEG C, and dielectric constant (Dk) ＞ 4.5, dielectric loss (Df) ＞ 0.12, this type of sheet material is inapplicable
In making HF link plate.
Summary of the invention
The deficiency existed for prior art, it is an object of the present invention to provide a kind of high Tg of high-frequency circuit board, low of being applicable to
Dk and the manufacture method of low Df copper-clad plate.
To achieve these goals, the present invention is to realize by the following technical solutions: a kind of high Tg, low Dk and low Df
The manufacture method of copper-clad plate, its step includes: configuration glue gluing overlapping, hot pressing, described glue composition includes: adopt
With bimaleimide resin as matrix resin, add epoxy resin, polyether-ether-ketone resin, low-molecular-weight polyimides tree
Fat, adds reactive diluent, firming agent, curing accelerator and inorganic filler；With acetone, propylene glycol methyl ether acetate, butanone
In one or more as solvent prepare；
Gluing: choosing NE-glass-fiber-fabric that dielectric constant is 4.0～4.5 as reinforcing material, leaching is with above-mentioned prepared glue
Liquid, dries through vertical gluing machine and prepares prepreg；
Overlapping, hot pressing: the prepreg of first-class glue is neatly overlapped, two-sided coated with Copper Foil, it is hot pressed into through vacuum hotpressing machine
Type.
Further, in described glue, the weight portion of each composition is:
Bimaleimide resin 55～73
Epoxy resin 30～45
Polyether-ether-ketone resin 25～30
Low-molecular-weight polyimides 22～26
Reactive diluent 12～14
Nitrogenated flame retardant 20～35
Firming agent 13～16
Firming agent accelerator 3～5
Inorganic filler 15～22
Solvent 160～200
Further, described epoxy resin is bisphenol A type epoxy resin, phenol aldehyde type epoxy resin or fire-retardant epoxy resin
In one or more.
Further, the molecular weight≤1500g/mol of described polyimides.
Further, during described reactive diluent is diallyl bisphenol, tetrabutyl ammonium bromide or divinylbenzene
One or more.
Further, described nitrogenated flame retardant includes compound in triazine class, for tripolycyanamide and salt thereof
Further, described firming agent is amine Dicy firming agent.
Further, described firming agent accelerator be 2-ethyl-4-methylimidazole, 2-methylimidazole, 2-ethyl imidazol(e) or
One or more in 2-phenylimidazole.
Further, described inorganic filler is micron-class superfine aluminium hydroxide and/or silicon dioxide, and its particle diameter D50 is
1.6-3.2um。
Further, in gumming step, the speed of service of described vertical gluing machine is 12～18m/min, described semi-solid preparation
The gel time of sheet is 200～300S, and resin content is 40～45%, fluidity 20～30%；In overlapping, heat-press step, pressure
State modulator processed is: vacuum is 0～0.01Mpa, and pressure is 0.4～3.6Mpa, and temperature of heat plate is 120～210 DEG C, and heat up speed
Rate is 2～3 DEG C/min；Press time is 120～160min.
Beneficial effects of the present invention: the present invention uses the bimaleimide resin with excellent heat resistance to make on formula
For matrix resin, add the outstanding polyimides of the high polyether-ether-ketone resin of Tg value, dielectric property and it is entered by reactive diluent
Row is mixed and modified, adds the epoxy resin that dielectric property is good, then by using the NE glass-fiber-fabric conduct of low-k
Reinforcing material.Copper-clad plate after hot-forming, except having the key propertys such as the electric property of conventional copper-clad plate, insulating properties
Outward, also there is high glass transition temperature, its Tg ＞ 250 DEG C, and it is also equipped with low-k, dielectric loss property,
Its Dk ＜ 3.8, Df ＜ 0.07, can fully meet making high frequency, the demand of high-speed line plate.
Detailed description of the invention
For the technological means making the present invention realize, creation characteristic, reach purpose and be easy to understand with effect, below in conjunction with
Detailed description of the invention, is expanded on further the present invention.
A kind of high Tg of the present invention, low Dk and the manufacture method of low Df copper-clad plate, its step includes: on configuration glue
Glue overlapping, hot pressing；
Described glue composition includes: uses bimaleimide resin as matrix resin, adds epoxy resin, polyethers ether
Ketone resin, low-molecular-weight polyimide resin, add reactive diluent, firming agent, curing accelerator and inorganic filler, with third
One or more in ketone, propylene glycol methyl ether acetate, butanone are prepared as solvent.Bimaleimide resin is as main body
Resin, it has excellent heat resistance.Polyether-ether-ketone resin is aromatics linear thermoplastic's Special Resin of a kind of high crystalline, and it melts
Point up to 334～380 DEG C, its effect is to strengthen the tough of bimaleimide resin by being blended with bimaleimide resin
Property, the thermostability of bimaleimide resin can also be kept simultaneously.Reactive diluent coordinates low-molecular-weight polyimide resin,
The viscosity of polyether-ether-ketone resin and the hybrid resin of bimaleimide resin can be reduced, make the fracture of hybrid resin simultaneously
Toughness is significantly promoted.Described nitrogenated flame retardant is mainly compound in triazine class, for tripolycyanamide (MA) and salt thereof；Triazine
The fire retardant of compounds is mainly absorbed heat by decomposition and produces non-flammable compressive gas and plays a role with dilution combustible, their master
Wanting advantage is Halogen, low toxicity, low cigarette, does not produce etchant gas.Inorganic filler can reduce the thermal coefficient of expansion of resin.
Gluing: choosing NE-glass-fiber-fabric that dielectric constant is 4.0～4.5 as reinforcing material, leaching is with above-mentioned prepared glue
Liquid, dries through vertical gluing machine and prepares prepreg.
Overlapping, hot pressing: the prepreg of first-class glue is neatly overlapped, two-sided coated with Copper Foil, it is hot pressed into through vacuum hotpressing machine
Type.
Embodiment one:
Glue composition includes (weight portion):
Bimaleimide resin 55
Bisphenol A type epoxy resin 30
Polyether-ether-ketone resin 25
Low-molecular-weight polyimides 22
Diallyl bisphenol 12
Nitrogenated flame retardant 20
Firming agent 13
2-ethyl-4-methylimidazole 3
Strong oxdiative aluminum 15
Acetone 160
Choosing NE-glass-fiber-fabric that dielectric constant is 4.0 as reinforcing material, leaching is with above-mentioned prepared glue, on vertical
Glue machine is dried and is prepared prepreg, and the speed of service of vertical gluing machine is 16.8m/min, oil temperature 205 DEG C, controls parameter, and half is solid
The gel time changing sheet is 242 ± 5s, and resin content is 43%, fluidity 25%；The prepreg of first-class glue is neatly overlapped,
As a example by making 1.6mm sheet material, its structure is: 8 2116R/C43%；The most two-sided coated with Copper Foil, it is pressed into through vacuum hotpressing machine
Type, concrete pressing parameter is: vacuum: 0～0.01Mpa；Pressure: 0.4～3.6Mpa；Temperature of heat plate: 120～210 DEG C: heat up
Speed is 2 DEG C/min；Press time is 150min.
Embodiment two:
Glue composition includes (weight portion):
Bimaleimide resin 62
Bisphenol A type epoxy resin 40
Polyether-ether-ketone resin 27
Low-molecular-weight polyimides 24
Tetrabutyl ammonium bromide 13
Nitrogenated flame retardant 28
Firming agent 15
2-methylimidazole 4
Silica 18
Propylene glycol methyl ether acetate 180
Choosing NE-glass-fiber-fabric that dielectric constant is 4.0 as reinforcing material, leaching is with above-mentioned prepared glue, on vertical
Glue machine is dried and is prepared prepreg, and the speed of service of vertical gluing machine is 16.8m/min, oil temperature 208 DEG C, controls parameter, and half is solid
The gel time changing sheet is 250 ± 5s, and resin content is 43%, fluidity 25%；The prepreg of first-class glue is neatly overlapped,
As a example by making 1.6mm sheet material, its structure is: 8 2116R/C43%；The most two-sided coated with Copper Foil, it is pressed into through vacuum hotpressing machine
Type, concrete pressing parameter is: vacuum: 0～0.01Mpa；Pressure: 0.4～3.6Mpa；Temperature of heat plate: 120～210 DEG C: heat up
Speed is 2 DEG C/min；Press time is 150min.
Embodiment three:
Glue composition includes (weight portion):
Bimaleimide resin 73
Phenol aldehyde type epoxy resin 45
Polyether-ether-ketone resin 30
Low-molecular-weight polyimides 26
Reactive diluent 14
Nitrogenated flame retardant 35
Firming agent 16
2-phenylimidazole 5
Silicon dioxide 22
Propylene glycol methyl ether acetate 200
Choosing NE-glass-fiber-fabric that dielectric constant is 4.0 as reinforcing material, leaching is with above-mentioned prepared glue, on vertical
Glue machine is dried and is prepared prepreg, and the speed of service of vertical gluing machine is 16.8m/min, oil temperature 208 DEG C, controls parameter, and half is solid
The gel time changing sheet is 250 ± 5s, and resin content is 43%, fluidity 25%；The prepreg of first-class glue is neatly overlapped,
As a example by making 1.6mm sheet material, its structure is: 8 2116R/C43%；The most two-sided coated with Copper Foil, it is pressed into through vacuum hotpressing machine
Type, concrete pressing parameter is: vacuum: 0～0.01Mpa；Pressure: 0.4～3.6Mpa；Temperature of heat plate: 120～210 DEG C: heat up
Speed is 2 DEG C/min；Press time is 150min.
By step and with reference to the glue in above three embodiment, prepared high Tg, low Dk and the survey of low Df copper-clad plate
Examination data are:
In sum, the present invention uses the bimaleimide resin with excellent heat resistance as main body tree on formula
Fat, adds the outstanding polyimides of the high polyether-ether-ketone resin of Tg value, dielectric property and reactive diluent carries out mixing to it and changes
Property, add the epoxy resin that dielectric property is good, then by using the NE glass-fiber-fabric of low-k as reinforcing material.
Copper-clad plate after hot-forming, in addition to having the key propertys such as the electric property of conventional copper-clad plate, insulating properties, also has height
Glass transition temperature, its Tg ＞ 250 DEG C, and be also equipped with low-k, dielectric loss property, its Dk ＜ 3.8, Df
＜ 0.07, can fully meet making high frequency, the demand of high-speed line plate.
The ultimate principle of the present invention and principal character and advantages of the present invention are more than shown and described, for this area skill
For art personnel, it is clear that the invention is not restricted to the details of above-mentioned one exemplary embodiment, and without departing substantially from the present invention spirit or
In the case of basic feature, it is possible to realize the present invention in other specific forms.Therefore, no matter from the point of view of which point, all should be by
Embodiment regards exemplary as, and is nonrestrictive, the scope of the present invention by claims rather than on state
Bright restriction, it is intended that include all changes fallen in the implication of equivalency and scope of claim in the present invention
In.
Although moreover, it will be appreciated that this specification is been described by according to embodiment, but the most each embodiment only wraps
Containing an independent technical scheme, this narrating mode of description is only that for clarity sake those skilled in the art should
Description can also be formed those skilled in the art through appropriately combined as an entirety, the technical scheme in each embodiment
May be appreciated other embodiments.
Claims (10)
1. high Tg, low Dk and a manufacture method for low Df copper-clad plate, its step includes: configuration glue gluing is folded
Conjunction, hot pressing, it is characterised in that: described glue composition includes: uses bimaleimide resin as matrix resin, adds epoxy
Resin, polyether-ether-ketone resin, low-molecular-weight polyimide resin, add reactive diluent, firming agent, curing accelerator and nothing
Machine filler；Prepare as solvent by one or more in acetone, propylene glycol methyl ether acetate, butanone；
Gluing: choosing NE-glass-fiber-fabric that dielectric constant is 4.0～4.5 as reinforcing material, leaching is with above-mentioned prepared glue, warp
Vertical gluing machine is dried and is prepared prepreg；
Overlapping, hot pressing: the prepreg of first-class glue is neatly overlapped, two-sided coated with Copper Foil, hot-forming through vacuum hotpressing machine.
A kind of high Tg the most according to claim 1, low Dk and the manufacture method of low Df copper-clad plate, it is characterised in that: described
In glue, the weight portion of each composition is:
Bimaleimide resin 55～73
Epoxy resin 30～45
Polyether-ether-ketone resin 25～30
Low-molecular-weight polyimides 22～26
Reactive diluent 12～14
Nitrogenated flame retardant 20～35
Firming agent 13～16
Firming agent accelerator 3～5
Inorganic filler 15～22
Solvent 160～200.
A kind of high Tg the most according to claim 2, low Dk and the manufacture method of low Df copper-clad plate, it is characterised in that: described
Epoxy resin is one or more in bisphenol A type epoxy resin, phenol aldehyde type epoxy resin or fire-retardant epoxy resin.
A kind of high Tg the most according to claim 3, low Dk and the manufacture method of low Df copper-clad plate, it is characterised in that: described
Molecular weight≤the 1500g/mol of polyimides.
A kind of high Tg the most according to claim 4, low Dk and the manufacture method of low Df copper-clad plate, it is characterised in that: described
Reactive diluent is one or more in diallyl bisphenol, tetrabutyl ammonium bromide or divinylbenzene.
A kind of high Tg the most according to claim 4, low Dk and the manufacture method of low Df copper-clad plate, it is characterised in that: described
Nitrogenated flame retardant includes compound in triazine class, for tripolycyanamide and salt thereof.
A kind of high Tg the most according to claim 4, low Dk and the manufacture method of low Df copper-clad plate, it is characterised in that: described
Firming agent is amine Dicy firming agent.
A kind of high Tg the most according to claim 4, low Dk and the manufacture method of low Df copper-clad plate, it is characterised in that: described
Firming agent accelerator is the one or many in 2-ethyl-4-methylimidazole, 2-methylimidazole, 2-ethyl imidazol(e) or 2-phenylimidazole
Kind.
A kind of high Tg the most according to claim 4, low Dk and the manufacture method of low Df copper-clad plate, it is characterised in that: described
Inorganic filler is micron-class superfine aluminium hydroxide and/or silicon dioxide, and its particle diameter D50 is 1.6-3.2um.
A kind of high Tg the most according to claim 1, low Dk and the manufacture method of low Df copper-clad plate, it is characterised in that:
In gumming step, the speed of service of described vertical gluing machine is 12～18m/min, and the gel time of described prepreg is
200～300S, resin content is 40～45%, fluidity 20～30%；
In overlapping, heat-press step, pressing parameter control is: vacuum is 0～0.01Mpa, and pressure is 0.4～3.6Mpa, hot plate
Temperature is 120～210 DEG C, and heating rate is 2～3 DEG C/min；Press time is 120～160min.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610600112.XA CN106274003A (en) | 2016-07-27 | 2016-07-27 | A kind of high Tg, low Dk and the manufacture method of low Df copper-clad plate |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610600112.XA CN106274003A (en) | 2016-07-27 | 2016-07-27 | A kind of high Tg, low Dk and the manufacture method of low Df copper-clad plate |
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| CN106274003A true CN106274003A (en) | 2017-01-04 |
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| CN201610600112.XA Pending CN106274003A (en) | 2016-07-27 | 2016-07-27 | A kind of high Tg, low Dk and the manufacture method of low Df copper-clad plate |
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| CN111531983A (en) * | 2020-05-20 | 2020-08-14 | 山东金宝电子股份有限公司 | High-heat-resistance low-dielectric copper-clad plate and preparation method thereof |
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Application publication date: 20170104 |