CN109435372A - A kind of halogen-free and lead-free environment-friendly type LED lamp plate - Google Patents
A kind of halogen-free and lead-free environment-friendly type LED lamp plate Download PDFInfo
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- CN109435372A CN109435372A CN201811487075.1A CN201811487075A CN109435372A CN 109435372 A CN109435372 A CN 109435372A CN 201811487075 A CN201811487075 A CN 201811487075A CN 109435372 A CN109435372 A CN 109435372A
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- Prior art keywords
- free
- halogen
- lead
- led lamp
- aluminum
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/02—Coating on the layer surface on fibrous or filamentary layer
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Led Device Packages (AREA)
Abstract
The present invention relates to a kind of halogen-free and lead-free environment-friendly type LED lamp plate, including LED aluminum base plate, the LED aluminum base plate includes circuit layer, aluminum layer, and halogen-free and lead-free type insulating layer is provided between the circuit layer and aluminum layer.The content of the harmful substances such as antimony, arsenic, lead, halogen meets the related request of Chinese RoHS decree and RoHS Directive, environment friendly and pollution-free, long service life, application value height in the halogen-free and lead-free environment-friendly type LED lamp plate.
Description
Technical field
The present invention relates to a kind of halogen-free and lead-free environment-friendly type LED lamp plates, belong to LED lamp technical field.
Background technique
LED light has that small in size, power consumption is low, long service life, high brightness, low in calories, sturdy and durable, changeable etc. are excellent
Point gradually replaces incandescent lamp in the status in lamps and lanterns market.
Two, European Union instructs the development for promoting halogen-free and lead-free electronic product, and in LED light includes antimony, arsenic, lead, halogen
Etc. harmful substances do not meet the relevant laws and regulations of European Union.Wherein, the toxic element content of part LED light has been over supervision
The standard that department formulates.Such as in low-light level red LED lamp, researcher has found that its lead content is exceeded and reaches 8 times, and halogen contains
Also exceeded 2.5 times of amount.
For aluminum substrate as substrate most important in LED light, aluminum substrate is that a kind of Metal Substrate with good heat radiating function is covered
Copper sheet, general single sided board are made of three-decker, are circuit layer (copper foil), insulating layer and metal-based layer respectively.It is common in LED
Illuminating product.There are tow sides, white is welding LED pin on one side, and another side is presented aluminium true qualities, can generally smear thermally conductive
It is contacted after solidifying slurry with thermal conduction portions.The source of halogen is mainly insulating layer in LED light, if using halogen-free epoxy resin, although
Meet halogen-free requirement, but in subsequent leadless process, such as without lead-tin soldering, relative to having lead-tin soldering, no lead-tin soldering pair
The heat resistance of aluminum substrate is put forward higher requirements, and is impregnated 5 minutes or more such as in 288 DEG C of tin liquor, the copper-clad surface of aluminum substrate is not
It can blistering.In addition, the binding force of halogen-free epoxy resin and copper foil is limited, the peel strength of 1OZ copper foil usually 1.0~
1.3N/mm, this just limits the service life of LED lamp.
Summary of the invention
The present invention is in view of the deficienciess of the prior art, provide a kind of halogen-free and lead-free environment-friendly type LED lamp plate, particular technique
Scheme is as follows:
A kind of halogen-free and lead-free environment-friendly type LED lamp plate, including LED aluminum base plate, the LED aluminum base plate include circuit layer, aluminium sheet
Layer, is provided with halogen-free and lead-free type insulating layer between the circuit layer and aluminum layer.
As an improvement of the above technical solution, the halogen-free and lead-free type insulating layer the production method is as follows: by DOPO type benzene
And oxazines, bismaleimide, metatitanic acid tertiary amine ester, benzimidazole, heat filling, coupling agent, solvent according to mass ratio (120~
150): (50~60): (30~40): (5~8): (100~120): (7~8): the ratio mixing of (200~260) is made
Glue, fills electronic grade glass cloth for glue and is put into baking oven and toasts at 190~200 DEG C and prepreg is made in 3~5 minutes,
It is put into a minimum prepreg between copper foil and aluminium sheet and folds, is put into vacuum press and carries out vacuum hotpressing, 160~
180 DEG C, the pressure of 1.0~1.3Mpa and vacuum degree are hot pressing 30~50 minutes in the environment of 70~80kpa, after the completion of hot pressing
Natural cooling obtains aluminum-based copper-clad plate, processes to aluminum-based copper-clad plate according to PCB processing procedure, the copper foil is processed to circuit
Layer, the aluminium sheet are processed to aluminum layer, obtain halogen-free and lead-free type insulating layer after the prepreg solidification.
As an improvement of the above technical solution, the heat filling is one of ball-aluminium oxide, aluminium nitride, boron nitride
Or it is several.
As an improvement of the above technical solution, the solvent is ethyl alcohol, acetone, butanone, dimethylformamide, propylene glycol first
One of ether is several.
As an improvement of the above technical solution, the coupling agent is titanate coupling agent.
As an improvement of the above technical solution, gelation time of the glue at 250 DEG C is then to sentence for 130~150 seconds
It is set to qualification, if the gelation time of liquid pectin is unqualified, continues stirring until the gelation time of glue is qualified.
Beneficial effects of the present invention:
The content of the harmful substances such as antimony, arsenic, lead, halogen meets Chinese RoHS in the halogen-free and lead-free environment-friendly type LED lamp plate
The related request of decree and RoHS Directive, environment friendly and pollution-free, long service life, application value are high.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of halogen-free and lead-free environment-friendly type LED lamp plate of the present invention；
Fig. 2 is the structural schematic diagram of LED aluminum base plate of the present invention.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to the accompanying drawings and embodiments, right
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
Embodiment 1
As shown in Fig. 1~2, the halogen-free and lead-free environment-friendly type LED lamp plate, including LED aluminum base plate 1, the LED aluminum base plate 1
Including circuit layer 13, aluminum layer 11, halogen-free and lead-free type insulating layer 12 is provided between the circuit layer 13 and aluminum layer 11.
By the DOPO type benzoxazine of 120kg, the bismaleimide of 50kg, the metatitanic acid tertiary amine ester of 30kg, 5kg benzo
Glue is made in the solvent mixing of imidazoles, the heat filling of 100kg, the coupling agent of 7kg, 200kg；Wherein, the glue exists
Gelation time at 250 DEG C is then to be determined as qualification in 130~140 seconds, if the gelation time of liquid pectin is unqualified, is continued
It stirs until the gelation time of glue is qualified.Qualified glue is filled into electronic grade glass cloth and is put into baking oven 190
Prepreg is made in 3 minutes in DEG C baking, and a minimum prepreg is put between 1OZ copper foil and aluminium sheet and is folded, is put into
Vacuum press carries out vacuum hotpressing, hot pressing 50 minutes in the environment of 160 DEG C, the pressure of 1.0Mpa and vacuum degree are 70kpa,
Natural cooling obtains aluminum-based copper-clad plate after the completion of hot pressing, processes to aluminum-based copper-clad plate according to PCB processing procedure, the copper foil is added
For work at circuit layer 13, the aluminium sheet is processed to aluminum layer 11, obtains halogen-free and lead-free type insulating layer after the prepreg solidification
12。
In the embodiment, the peel strength of aluminum-based copper-clad plate is 1.8N/mm, impregnated in 288 DEG C of tin liquor 7 minutes with
Upper copper-clad surface is still not blistering.The Tg value of halogen-free and lead-free type insulating layer 12 is 276.1 DEG C.
Embodiment 2
As shown in Fig. 1~2, the halogen-free and lead-free environment-friendly type LED lamp plate, including LED aluminum base plate 1, the LED aluminum base plate 1
Including circuit layer 13, aluminum layer 11, halogen-free and lead-free type insulating layer 12 is provided between the circuit layer 13 and aluminum layer 11.
By the DOPO type benzoxazine of 130kg, the bismaleimide of 55kg, the metatitanic acid tertiary amine ester of 34kg, 6kg benzo
Glue is made in the solvent mixing of imidazoles, the heat filling of 110kg, the coupling agent of 7.8kg, 250kg；Wherein, the glue
Gelation time at 250 DEG C is then to be determined as qualification in 140~150 seconds, if the gelation time of liquid pectin is unqualified after
Continuous stirring is until the gelation time of glue is qualified.Qualified glue is filled electronic grade glass cloth and is put into baking oven and is existed
Prepreg is made in 4 minutes in 195 DEG C of bakings, and a minimum prepreg is put between 1OZ copper foil and aluminium sheet and is folded, is put into
Vacuum hotpressing is carried out to vacuum press, hot pressing 40 divides in the environment of 170 DEG C, the pressure of 1.2Mpa and vacuum degree are 75kpa
Clock, natural cooling obtains aluminum-based copper-clad plate after the completion of hot pressing, processes to aluminum-based copper-clad plate according to PCB processing procedure, the copper foil
It is processed to circuit layer 13, the aluminium sheet is processed to aluminum layer 11, and it is exhausted to obtain halogen-free and lead-free type after the prepreg solidification
Edge layer 12.
In the embodiment, the peel strength of aluminum-based copper-clad plate is 2.0N/mm, impregnated in 288 DEG C of tin liquor 8 minutes with
Upper copper-clad surface is still not blistering.The Tg value of halogen-free and lead-free type insulating layer 12 is 276.5 DEG C.
Embodiment 3
As shown in Fig. 1~2, the halogen-free and lead-free environment-friendly type LED lamp plate, including LED aluminum base plate 1, the LED aluminum base plate 1
Including circuit layer 13, aluminum layer 11, halogen-free and lead-free type insulating layer 12 is provided between the circuit layer 13 and aluminum layer 11.
By the DOPO type benzoxazine of 150kg, the bismaleimide of 60kg, the metatitanic acid tertiary amine ester of 40kg, 8kg benzo
Glue is made in the solvent mixing of imidazoles, the heat filling of 120kg, the coupling agent of 8kg, 260kg；Wherein, the glue exists
Gelation time at 250 DEG C is then to be determined as qualification in 140~150 seconds, if the gelation time of liquid pectin is unqualified, is continued
It stirs until the gelation time of glue is qualified.Qualified glue is filled into electronic grade glass cloth and is put into baking oven 200
Prepreg is made in 5 minutes in DEG C baking, and a minimum prepreg is put between 1OZ copper foil and aluminium sheet and is folded, is put into
Vacuum press carries out vacuum hotpressing, hot pressing 30 minutes in the environment of 180 DEG C, the pressure of 1.3Mpa and vacuum degree are 80kpa,
Natural cooling obtains aluminum-based copper-clad plate after the completion of hot pressing, processes to aluminum-based copper-clad plate according to PCB processing procedure, the copper foil is added
For work at circuit layer 13, the aluminium sheet is processed to aluminum layer 11, obtains halogen-free and lead-free type insulating layer after the prepreg solidification
12。
In the embodiment, the peel strength of aluminum-based copper-clad plate is 1.9N/mm, impregnated in 288 DEG C of tin liquor 7 minutes with
Upper copper-clad surface is still not blistering.The Tg value of halogen-free and lead-free type insulating layer 12 is 275.3 DEG C.
In the above-described embodiments, the heat filling is one of ball-aluminium oxide, aluminium nitride, boron nitride or several.
The addition of heat filling can significantly improve the thermal coefficient of halogen-free and lead-free type insulating layer 12.The solvent is ethyl alcohol, acetone, fourth
One of ketone, dimethylformamide, propylene glycol monomethyl ether are several.The coupling agent is titanate coupling agent.
The halogen-free and lead-free type insulating layer 12 uses DOPO type benzoxazine and bismaleimide as matrix resin, DOPO
Type benzoxazine is flame retardant type benzoxazine, and V0 fire-retardant rank has lower smoke density, is halogen-free, can individually make simultaneously
For flame-retardant matrix resin use.Bismaleimide overcomes epoxy resin heat resistance for common epoxy resin
Relatively low disadvantage.Halogen-free and lead-free type insulating layer 12 is halogen-free, is free of lead, arsenic in filler, without adding fire retardant
Reach V0 fire-retardant rank, because also just not containing antimony element without adding the fire retardants such as antimony oxide.
Due to the Good Heat-resistance of aluminum-based copper-clad plate, it can be used in no lead-tin soldering etc. in following process electronic component
Leadless process, therefore lead element will not be introduced subsequent, the halogen-free and lead-free environment-friendly type LED lamp plate does not just contain lead yet.
It is arranged in pairs or groups jointly use using DOPO type benzoxazine and bismaleimide, it is exhausted that halogen-free and lead-free type can be significantly improved
Peel strength between edge layer 12 and circuit layer 13, even if circuit layer 13 is also not susceptible to fall off after long-time aging, this
The service life of the halogen-free and lead-free environment-friendly type LED lamp plate is invented than using LED lamp panel made of halogen-free epoxy resin
It is higher by 22~28% service life.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Made any modifications, equivalent replacements, and improvements etc., should all be included in the protection scope of the present invention within mind and principle.
Claims (6)
1. a kind of halogen-free and lead-free environment-friendly type LED lamp plate, including LED aluminum base plate, the LED aluminum base plate includes circuit layer, aluminum layer,
It is characterized in that, being provided with halogen-free and lead-free type insulating layer between the circuit layer and aluminum layer.
2. a kind of halogen-free and lead-free environment-friendly type LED lamp plate according to claim 1, which is characterized in that the halogen-free and lead-free type
Insulating layer the production method is as follows: by DOPO type benzoxazine, bismaleimide, metatitanic acid tertiary amine ester, benzimidazole, thermally conductive fill out
Material, coupling agent, solvent are according to mass ratio (120~150): (50~60): (30~40): and (5~8): (100~120): (7~
8): glue is made in the ratio of (200~260) mixing, glue is filled into electronic grade glass cloth and be put into baking oven 190~
Prepreg is made in 3~5 minutes in 200 DEG C of bakings, and a minimum prepreg is put between copper foil and aluminium sheet and is folded, is put into
Vacuum hotpressing is carried out to vacuum press, is 70~80kpa's in 160~180 DEG C, the pressure of 1.0~1.3Mpa and vacuum degree
Hot pressing 30~50 minutes under environment, natural cooling obtains aluminum-based copper-clad plate after the completion of hot pressing, to aluminum-based copper-clad plate according to PCB processing procedure
It is processed, the copper foil is processed to circuit layer, and the aluminium sheet is processed to aluminum layer, obtains after the prepreg solidification
Halogen-free and lead-free type insulating layer.
3. a kind of halogen-free and lead-free environment-friendly type LED lamp plate according to claim 2, which is characterized in that the heat filling is
One of ball-aluminium oxide, aluminium nitride, boron nitride are several.
4. a kind of halogen-free and lead-free environment-friendly type LED lamp plate according to claim 2, which is characterized in that the solvent be ethyl alcohol,
One of acetone, butanone, dimethylformamide, propylene glycol monomethyl ether are several.
5. a kind of halogen-free and lead-free environment-friendly type LED lamp plate according to claim 2, which is characterized in that the coupling agent is titanium
Acid esters coupling agent.
6. a kind of halogen-free and lead-free environment-friendly type LED lamp plate according to claim 2, which is characterized in that the glue is at 250 DEG C
When gelation time be then to be determined as qualification in 130~150 seconds, if the gelation time of liquid pectin is unqualified, it is straight to continue stirring
Until the gelation time of glue is qualified.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811487075.1A CN109435372A (en) | 2018-12-06 | 2018-12-06 | A kind of halogen-free and lead-free environment-friendly type LED lamp plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811487075.1A CN109435372A (en) | 2018-12-06 | 2018-12-06 | A kind of halogen-free and lead-free environment-friendly type LED lamp plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109435372A true CN109435372A (en) | 2019-03-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811487075.1A Pending CN109435372A (en) | 2018-12-06 | 2018-12-06 | A kind of halogen-free and lead-free environment-friendly type LED lamp plate |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101418937A (en) * | 2007-10-23 | 2009-04-29 | 周广永 | A kind of LED illumination high heat radiation aluminium-based copper foil coated laminated plate and manufacturing process thereof |
| CN101894902A (en) * | 2010-06-24 | 2010-11-24 | 浙江华正电子集团有限公司 | LED substrate and manufacturing method thereof |
| CN103421192A (en) * | 2012-05-24 | 2013-12-04 | 北京化工大学 | Phosphorus-containing benzoxazine resin and composition thereof |
| CN106218192A (en) * | 2016-07-27 | 2016-12-14 | 重庆德凯实业股份有限公司 | A kind of manufacture method of high heat-resisting CEM 3 copper-clad plate of LED halogen-free high-thermal-conductivity |
-
2018
- 2018-12-06 CN CN201811487075.1A patent/CN109435372A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101418937A (en) * | 2007-10-23 | 2009-04-29 | 周广永 | A kind of LED illumination high heat radiation aluminium-based copper foil coated laminated plate and manufacturing process thereof |
| CN101894902A (en) * | 2010-06-24 | 2010-11-24 | 浙江华正电子集团有限公司 | LED substrate and manufacturing method thereof |
| CN103421192A (en) * | 2012-05-24 | 2013-12-04 | 北京化工大学 | Phosphorus-containing benzoxazine resin and composition thereof |
| CN106218192A (en) * | 2016-07-27 | 2016-12-14 | 重庆德凯实业股份有限公司 | A kind of manufacture method of high heat-resisting CEM 3 copper-clad plate of LED halogen-free high-thermal-conductivity |
Non-Patent Citations (1)
| Title |
|---|
| 栾华: "《塑料二次加工基本知识》", 31 March 1984, 轻工业出版社 * |
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Application publication date: 20190308 |