CN101848604A - Preparation method of CEM-3 copper clad plate with high heat conductivity - Google Patents
Preparation method of CEM-3 copper clad plate with high heat conductivity Download PDFInfo
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- CN101848604A CN101848604A CN201010168176A CN201010168176A CN101848604A CN 101848604 A CN101848604 A CN 101848604A CN 201010168176 A CN201010168176 A CN 201010168176A CN 201010168176 A CN201010168176 A CN 201010168176A CN 101848604 A CN101848604 A CN 101848604A
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Abstract
The invention relates to a preparation method of a CEM-3 copper clad plate with high heat conductivity, which comprises the following processes and steps of: (1) preparing a core material: selecting epoxy resin/phenolic resin as a main curing agent, adding a coupling agent, padding and a curing accelerator and preparing into resin liquid for the core material with butanone, and soaking glass fiber paper into a semi-cured state with the core material glue to obtain the core material; (2) preparing a facing material: dissolving the epoxy resin/phenolic resin curing system with butanone, adding padding and preparing into resin liquid for the facing material with butanone, soaking glass fiber cloth into the resin liquid, and curing to obtain the facing material; and (3) proportioning and molding by laminating. The invention not only has the insulating property, the electrical properties, the mechanical properties and other basic properties of a general universal CEM-3 composite copper clad plate, but also has excellent heat conductivity, high CTI, higher heat resistance and excellent PCB (printed circuit board) processing performance. The invention is suitable for LED (Light Emitting Diode), vehicle systems, variable-frequency power sources and other products needing excellent heat conductivity, and can greatly improve the heat dispersion of electronic devices and improve the reliability of electronic products.
Description
Technical field
The present invention is the preparation method of a kind of copper clad laminate CEM-3, specifically be the preparation method of the compound basic copper-clad plate CEM-3 of high heat-conducting type and high anti creepage trace index, the product of this invention preparation is a kind of composite base plate material of printed circuit board (pcb) with copper clad laminate.
Background technology
Development along with low-carbon economy, light-emitting diode (LED) has become the environmental protection and energy saving class luminous product of main flow, its purposes is very extensive, as LED TV, LED Landscape Lighting, LED special lighting (mine lamp, emergency light etc.), LED Automobile lamp ornament, LED marker or the like.LED will keep long-life and high brightness, needs to solve power supply, led light source, heat radiation, safety four big key technologies." heat radiation is difficult " problem of LED product is one of insoluble key problem of LED manufacturing enterprise always, and it directly influences luminous efficiency, useful life and the reliability of products etc. of LED.For example, LED only can be converted into luminous energy with about 20% electric energy, and the electric energy of residue about 80% can be converted into heat energy; Efficient is that 70% power supply can be converted to heat energy with 30% electric energy, unless heat is distributed, otherwise the useful life of rising and will significantly reduce LED and power supply successively of bulb temperature.
In the application of LED product, no matter be used for display backlight source, indicator light, or general lighting, can optionally a plurality of LED be assembled on the circuit substrate usually.This circuit substrate on the one hand carries the led module structure, and on the other hand, along with the LED power output is more and more higher, the heat that substrate is also played the part of the role of heat radiation-led chip is produced passes.Therefore, the selection of circuit base material must take into account structural strength and radiating requirements.
The CEM-3 sheet material that tradition adopts, thermal conductivity is about 0.4-0.6W/m.k.Adopt epoxy resin/dicyandiamide curing system, do filler with aluminium hydroxide, has high peel strength, the good insulation performance performance, good processability and lower cost, but exist thermal conductivity low, thermal endurance is lower, shortcomings such as the Z-direction thermal coefficient of expansion is big, be used in the LED TV, the LED illumination, on the products such as power supply board, there is poor radiation, easily cause the aging of product, the lost of life, power consumption increases, shortcomings such as reliability reduction, so improve the thermal conductivity of CEM-3, high CTI performance provides a kind of cost performance good copper-clad plate, becomes one of direction of electronic technology field research and development.
A kind of novel copper-clad plate that high thermal conductivity CEM-3 composite base laminated board covered with copper foil grows up for the demand that satisfies LED just, report and production are not arranged at present at home as yet, only have several companies such as SUNX, Sumitomo Electric Industries that this type of product introduction is arranged abroad.This product is except that having key propertys such as insulating properties that the compound basic copper-clad plate of general universal CEM-3 had, electric property, mechanical performance, also have good thermal conductivity characteristics, be applicable to that use is in needing products such as the good LED of thermal conductivity, onboard system, variable frequency power supply.This product relative thermal conductivity energy good metal matrix copper-clad laminate except that having price advantage, also has the printed circuit board characteristic that can make the hole metallization double-side conduction.
Summary of the invention
Purpose of the present invention is the deficiency that overcomes traditional C EM-3 sheet material, and the preparation method of the compound basic copper-clad plate CEM-3 of a kind of high heat-conducting type and high anti creepage trace index is provided.
The preparation method and the technological process of the present invention's CEM-3 copper-clad plate are as follows:
The preparation method of I core material
A. be main curing agent with epoxy resin/phenolic resins, add coupling agent and filler.Said coupling agent is KH-550, KH-560 etc.; Said filler is one or more the mixture in aluminium oxide, aluminium nitride, magnesium oxide, boron nitride, aluminium hydroxide, magnesium hydroxide, talcum powder, the titanium dioxide etc.Proportioning therebetween is:
In weight epoxy part is 100,
Phenolic resins is 20～30 parts
Curing accelerator 0.03-0.5 part
Coupling agent is 1.5～4.5 parts
Filler is 100～300 parts
B. above material is modulated into the core material resin liquid with butanone;
C. use above-mentioned core material glue impregnated glass fiber paper, under 130 ℃-210 ℃ of temperature, make it become semi-cured state, make core material;
The preparation method of II lining
D. use epoxy resin/phenolic resin curing system, with butanone it is dissolved into the solution that viscosity is 25 ± 10s (4 glasss of Φ), the mixture of one or more in adding aluminium hydroxide or magnesium hydroxide, boron nitride, aluminium nitride, the aluminium oxide is made filler.
The curing system of said epoxy resin/phenolic resins is 100 in the weight portion of epoxy resin, and phenolic resins is 25 ± 5; The weight portion of aluminium hydroxide or magnesium hydroxide is 50～100, curing accelerator: 0.03-0.3 part.
E. above material is modulated into the lining resin liquid with butanone;
F. use above-mentioned lining glue impregnated glass fiber cloth, under 130 ℃-210 ℃ of temperature, make it become semi-cured state, make lining;
III batching and laminated into type
G. according to the thickness needs, stack 1-10 opens above-mentioned core material.Core material upper and lower surface in stack is respectively sticked and is stated lining, covers Copper Foil at the one or both sides of lining.At 80 ℃-200 ℃ of temperature, pressure 10-100Kg/cm
2And below vacuum degree-60mmHg, hot-forming.
The present invention is except that having key propertys such as insulating properties that the compound basic copper-clad plate of general universal CEM-3 had, electric property, mechanical performance, also have good thermal conductivity and high CTI characteristics, thermal conductivity 〉=1W/m.k, CTI 〉=600V, higher thermal endurance and good PCB processes type.Be applicable in the products such as the LED that needs thermal conductivity good, onboard system, variable frequency power supply, can significantly improve thermal diffusivity, the high reliability of electronic product, be the product of environmental protection and energy saving.
Description of drawings
Schematic flow sheet is made in Fig. 1 .CEM-3 copper-clad plate
Embodiment
Below in conjunction with three embodiment of accompanying drawing narration, the present invention will be further described, but the present invention is not limited to this several embodiment.
Embodiment 1: a kind of preparation method of CEM-3 copper-clad plate
A. prepare the core material resin, its ingredients weight parts is:
90 parts of bisphenol A type epoxy resins, 10 parts of novolak type epoxy resin,
30 parts in phenolic resins, 240 parts of filler Al2O3,
10 parts of filler titanium dioxides, 20 parts of filler talcum powder
0.03 part of 4.5 parts of curing accelerator 2-ethyl-4-methylimidazole of coupling agent KH-560,
B. above material is modulated into the core material resin liquid with butanone;
C. with above-mentioned resin liquid dipping glass paper, under temperature 130-210 ℃, make it become semi-cured state, make the core material bonding sheet.
D. prepare the fabric resin matrix, its component (weight portion) is:
70 parts of bisphenol A type epoxy resins, 30 parts of brominated epoxy resins,
Nitrogenous 20 parts of Al of novolak type phenolic resins (OH)
320 parts,
0.05 part of 40 parts of curing accelerator 2-ethyl-4-methylimidazole of boron nitride
E. above material is modulated into the core material resin liquid with butanone;
F. flood 7628 glass cloth with above-mentioned core material glue, make the lining bonding sheet temperature 130-210 ℃ of dry back, section.
G. suppress 1.6mm thickness sheet material, select 3 core materials for use, upper and lower surface respectively pastes a lining, and one or both sides cover Copper Foil, at 80 ℃-200 ℃ of temperature, pressure 10-100Kg/cm
2And below vacuum degree-60mmHg, heat-insulation pressure keeping 60 minutes is made CEM-3 type copper clad laminate.
Embodiment 2: a kind of preparation method of CEM-3 copper-clad plate
A. prepare the core material resin, its ingredients weight parts is:
90 parts of bisphenol A type epoxy resins, 10 parts of novolak type epoxy resin,
20 parts in phenolic resins, filler Al (OH)
340 parts,
80 parts of filler boron nitride, 1.5 parts of coupling agent KH-560,
0.4 part of curing accelerator 2-ethyl-4-methylimidazole
B. above material is modulated into the core material resin liquid with butanone;
C. with above-mentioned resin liquid dipping glass paper, make core material 130-210 ℃ of dry back, section;
D. prepare fabric resin, its component (weight portion) is:
70 parts of bisphenol A type epoxy resins, 30 parts of brominated epoxy resins,
Nitrogenous 30 parts of Al of novolak type phenolic resins (OH)
340 parts,
0.2 part of 60 parts of curing accelerator 2-ethyl-4-methylimidazole of aluminium nitride
E. above material is modulated into the lining resin liquid with butanone;
F. flood 7628 glass cloth with above-mentioned resin liquid, make lining 130-210 ℃ of dry back, section;
G. suppress 1.6mm thickness sheet material, select 3 core materials for use, upper and lower surface respectively pastes a lining, and one or both sides cover Copper Foil, 170 ℃ of temperature laminated into type, unit pressure 30-60kgf/cm
2And below vacuum degree-60mmHg, heat-insulation pressure keeping 60 minutes is made CEM-3 type copper clad laminate.
Embodiment 3: a kind of preparation method of CEM-3 copper-clad plate
A. prepare the core material resin, its component (weight portion) is:
100 parts of bisphenol A type epoxy resins, 25 parts in phenolic resins,
Filler Al (OH)
380 parts, 20 parts of filler aluminium nitride,
120 parts in filler magnesium oxide, 2.5 parts of coupling agent KH-560;
0.1 part of curing accelerator 2-ethyl-4-methylimidazole.
B. above material is modulated into the core material resin liquid with butanone;
C. with above-mentioned resin liquid dipping glass paper, make core material 130-210 ℃ of dry back, section;
D. prepare fabric resin, its component is:
70 parts of bisphenol A type epoxy resins, 30 parts of brominated epoxy resins,
Nitrogenous 25 parts of Mg of novolak type phenolic resins (OH)
330 parts,
0.2 part of 40 parts of curing accelerator 2-ethyl-4-methylimidazole of aluminium nitride
E. above material is modulated into the lining resin liquid with butanone;
F. flood 7628 glass cloth with above-mentioned resin liquid, make lining 130-210 ℃ of dry back, section;
G. suppress 2.0mm thickness sheet material, select 6 core materials for use, upper and lower surface respectively pastes a lining, and one or both sides cover Copper Foil, and 170 ℃ of temperature laminated into type are at unit pressure 30kgf/cm
2And below vacuum degree-60mmHg, heat-insulation pressure keeping 60 minutes is made CEM-3 type copper clad laminate.
The preparation method of the present invention and traditional C EM-3 compares, thermal conductivity of sheet material (method of testing adopts ASTM5470) and phase ratio creepage tracking index, and test result sees the following form.Anti-tracking is tested by the IEC electrolyte method of dripping; Anti-flammability is pressed the UL-94 test.
Comparative analysis as a result:
1 from above results of property, and product thermal conductivity of the present invention is all more than or equal to 1W/mk.And the thermal conductivity of common CEM-3 product is about 0.5W/mk.
2 product phase ratio creepage tracking indexes of the present invention are all more than or equal to 600V, and Td is more than 330 ℃, and T260 is greater than 60min.And the CTI of common CEM-3 product is at 200V, and T260 is about 7min, and Td is below 310 ℃.
The 3 floating welderings from traditional performance, fried plate compare, and product of the present invention is higher than common CEM-3 product far away; Fried plate behind the pressure cooker is far longer than common sheet material, illustrates that the moisture-proof of this sheet material is good.
Claims (1)
1. preparation method of CEM-3 copper clad plate with high heat conductivity is characterized in that, carries out according to following method and technology:
The preparation method of I core material
A. be main curing agent with epoxy resin/phenolic resins, add coupling agent, filler and curing accelerator.Said coupling agent is KH-550, KH-560 etc.; Said filler is one or more the mixture in aluminium oxide, aluminium nitride, magnesium oxide, boron nitride, aluminium hydroxide, magnesium hydroxide, talcum powder, the titanium dioxide etc.Proportioning therebetween is:
In weight epoxy part is 100,
Phenolic resins is 20～30 parts
Curing accelerator 0.03-0.5 part
Coupling agent is 1.5～4.5 parts
Filler is 100～300 parts
B. above material is modulated into the core material resin liquid with butanone;
C. use above-mentioned core material glue impregnated glass fiber paper, under 130 ℃-210 ℃ of temperature, make it become semi-cured state, make core material;
The preparation method of II lining
D. use epoxy resin/phenolic resin curing system, with butanone it is dissolved into the solution that viscosity is 25 ± 10s (4 glasss of Φ), the mixture of one or more in adding aluminium hydroxide or magnesium hydroxide, boron nitride, aluminium nitride, the aluminium oxide is made filler.
The curing system of said epoxy resin/phenolic resins is 100 in the weight portion of epoxy resin, and phenolic resins is 25 ± 5; The weight portion of aluminium hydroxide or magnesium hydroxide is 50～100, curing accelerator: 0.03-0.3 part.
E. above material is modulated into the lining resin liquid with butanone;
F. use above-mentioned lining glue impregnated glass fiber cloth, under 130 ℃-210 ℃ of temperature, make it become semi-cured state, make lining;
III batching and laminated into type
G. according to the thickness needs, stack 1-10 opens above-mentioned core material.Core material upper and lower surface in stack is respectively sticked and is stated lining, covers Copper Foil at the one or both sides of lining; At 80 ℃-200 ℃ of temperature, pressure 10-100Kg/cm
2And below vacuum degree-60mmHg, hot-forming.
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| CN102006722A (en) * | 2010-11-15 | 2011-04-06 | 中山市格普斯纳米电热科技有限公司 | Quick heat dissipation circuit board |
| CN102031008A (en) * | 2010-11-17 | 2011-04-27 | 广东生益科技股份有限公司 | Production method of thin prepreg with high-content filler adhesive system |
| CN102205675A (en) * | 2011-03-29 | 2011-10-05 | 浙江华正新材料股份有限公司 | High thermal conductivity and high heat-resistant copper-clad lamination of CEM-3 grade for LED |
| CN102612278A (en) * | 2012-03-05 | 2012-07-25 | 景旺电子（深圳）有限公司 | Method for producing multilayer printed circuit board by adopting CEM-3(composite epoxy material grade-3) type copper-clad plate |
| CN102690495A (en) * | 2012-05-30 | 2012-09-26 | 日邦树脂(无锡)有限公司 | Hot-melting type halogen-free fire-retardant heat conducting and dielectric insulating layer resin and application thereof |
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| CN102006722A (en) * | 2010-11-15 | 2011-04-06 | 中山市格普斯纳米电热科技有限公司 | Quick heat dissipation circuit board |
| CN102031008A (en) * | 2010-11-17 | 2011-04-27 | 广东生益科技股份有限公司 | Production method of thin prepreg with high-content filler adhesive system |
| CN102031008B (en) * | 2010-11-17 | 2012-07-25 | 广东生益科技股份有限公司 | Production method of thin prepreg with high-content filler adhesive system |
| CN102205675A (en) * | 2011-03-29 | 2011-10-05 | 浙江华正新材料股份有限公司 | High thermal conductivity and high heat-resistant copper-clad lamination of CEM-3 grade for LED |
| CN102612278A (en) * | 2012-03-05 | 2012-07-25 | 景旺电子（深圳）有限公司 | Method for producing multilayer printed circuit board by adopting CEM-3(composite epoxy material grade-3) type copper-clad plate |
| CN102612278B (en) * | 2012-03-05 | 2014-09-10 | 深圳市景旺电子股份有限公司 | Method for producing multilayer printed circuit board by adopting CEM-3(composite epoxy material grade-3) type copper-clad plate |
| WO2013156906A1 (en) * | 2012-04-16 | 2013-10-24 | Koninklijke Philips N.V. | Pcb laminate material |
| CN102690495A (en) * | 2012-05-30 | 2012-09-26 | 日邦树脂(无锡)有限公司 | Hot-melting type halogen-free fire-retardant heat conducting and dielectric insulating layer resin and application thereof |
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| CN103304961A (en) * | 2013-06-14 | 2013-09-18 | 泰山医学院 | High thermal conductive semi-cured film of composite copper clad plate and preparation method of high thermal conductive semi-cured film |
| CN103770436A (en) * | 2014-01-16 | 2014-05-07 | 陕西生益科技有限公司 | Preparation method and application of halogen-free high-thermal-conductivity resin matrix composition |
| EP2930016A1 (en) * | 2014-04-09 | 2015-10-14 | Shengyi Technology Co., Ltd. | A halogen-free composite-base cem-3 copper clad laminate and preparation method thereof |
| CN105437673A (en) * | 2015-12-25 | 2016-03-30 | 广东生益科技股份有限公司 | Ultrathin copper clad laminate and production method thereof |
| CN106079814B (en) * | 2016-06-06 | 2018-11-09 | 陕西生益科技有限公司 | A kind of copper-clad plate lamination method |
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| CN110370750A (en) * | 2019-07-03 | 2019-10-25 | 江西品升电子有限公司 | Highly heat-conductive copper-clad plate and preparation method |
| CN110370750B (en) * | 2019-07-03 | 2022-01-28 | 江西品升电子有限公司 | High-thermal-conductivity copper-clad plate and preparation method thereof |
| CN110435254A (en) * | 2019-08-29 | 2019-11-12 | 山东金宝电子股份有限公司 | A kind of high heat resistance, high CTI CEM-3 copper-clad plate preparation method |
| CN110435254B (en) * | 2019-08-29 | 2021-12-03 | 山东金宝电子股份有限公司 | Preparation method of CEM-3 copper-clad plate with high heat resistance and high CTI (comparative tracking index) |
| CN116080213A (en) * | 2022-11-11 | 2023-05-09 | 山东金宝电子有限公司 | Preparation method of high-heat-conductivity and high-heat-resistance CEM-3 copper-clad plate for LED |
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