CN101864146A - Epoxy resin composition for printed circuit copper-clad plate - Google Patents
Epoxy resin composition for printed circuit copper-clad plate Download PDFInfo
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Abstract
The invention discloses an epoxy resin composition for a printed circuit copper-clad plate, which consists of the following components in part by weight: 130 to 140 parts of butane solution containing modified epoxy resin, 60 to 70 parts of composite phenolic aldehyde curing agent or 4.5 to 6.5 parts of dicyandiamide curing agent, 0.02 to 0.04 part of curing catalyst, 30 to 40 parts of solvent and 25 to 30 parts of filler, wherein the butane solution containing the modified epoxy resin is prepared by modifying bis-functional epoxy resin, brominated bisphenol epoxy resin, multi-functional novolac epoxy resin and linear novolac epoxy resin. The epoxy resin composition has the characteristics of low viscosity, easy impregnation, convenient operation, good reactivity and high Tg; and the printed circuit copper-clad plate made of the epoxy resin composition has good reliability and workability, excellent heat resistance and Z-axis thermal expansion coefficient and other comprehensive performance.
Description
Technical field
The present invention relates to a kind of composition epoxy resin, be specifically related to a kind of epoxy resin composition for printed circuit copper-clad plate.
Background technology
Fast development along with printed circuit technique, for the encapsulation of electronic product and the progress of interconnection technique provide huge development space, also unprecedented challenge has been proposed for base material, therefore improve second-order transition temperature, reduce thermal expansivity and market efficiency, the people in the industry who has become printed electronic circuit and base material thereof is the maximum several keywords of contact probability in recent years.
Printed circuit technique not only develops towards short and small type, high performance direction, in the printed electronic circuit course of processing, when carrying out micro hole machining, in order to reach good hole wall quality, adopts penetration rate faster, therefore brings the overheated and dirty problem of generation brill of hole wall; For the reliability of high multi-ply wood plated-through-hole,, when carrying out thermal shocking such as hot air leveling, infrared reflow weldering in the sheet material course of processing, be prone to copper fault rupture of hole wall turning and hole wall and shrink and the generation quality problems because the coefficient of expansion of base material and Copper Foil there are differences.
Because the needs of environmental protection, from July 1st, 2006, the global electronic industry entered the pb-free solder epoch, because the raising of pb-free solder temperature is had higher requirement to the thermotolerance and the thermostability of printed circuit copper clad laminate.The copper-clad plate base material of exploitation " unleaded " copper-clad plate, particularly high glass transition temperature Tg, for domestic copper-clad plate manufacturer, extremely urgent.The element welding will be replaced by pb-free solder technology, and welding temperature exceeds than in the past more than 20 ℃, and this just proposes higher requirement to the thermotolerance and the reliability of printed circuit board and base material, such as: high Tg, the thermotolerance of excellence and the low coefficient of expansion.
High-density installation development, the modified resin base plate for packaging material that arises at the historic moment become one of emphasis of copper-clad plate manufacturer exploitation.With woven fiber glass and Resins, epoxy the FR-4 sheet material of strongthener, excellent electricapparatus characteristic and workability are arranged, be the more use of printed electronic circuit at present, though each manufacturer also develops various high Tg sheet materials at present, relative and general T g sheet material has better thermotolerance, can satisfy the multiple-plate requirement of present making substantially.But the demand for development substrate of high-density installation technology possesses the lower coefficient of expansion, reliability; For this reason, must develop and a kind ofly have every performance of present high Tg sheet material but also have the lower coefficient of expansion, higher thermotolerance and the good copper-clad plate material of processibility.
In a word, printed electronic circuit develops aspects such as thermotolerance to copper-clad plate, chemical resistant properties, dimensional stability towards high-density and multiple stratification direction, has higher requirement.These characteristics of copper-clad plate are all relevant with the Tg of resin.In other words, the Tg of resin system has improved, and the related characteristics of sheet material also will improve.The Tg of common FR-4 sheet material is 130～140 ℃, have that the Z-direction thermal expansivity is big, thermotolerance is low, easily produce during boring resin greasy dirty, add and shrink shortcomings such as big unfavorable contraposition man-hour, certain limitation is arranged in the use; And based on resin structure, sheet material is surpassing under the high temperature of Tg, and every performance range of decrease is bigger, limits its use under hot environment; Add the change of no slicker solder stove, harsh more to the Tg and the thermotolerance of resin.Therefore, over-all propertieies such as the second-order transition temperature of raising FR-4 and resistance toheat, the living space of expanding sheet material has become the developing focus of production firm.
Summary of the invention
The objective of the invention is to provides the epoxy resin composition for printed circuit copper-clad plate of a kind of high Tg at the deficiencies in the prior art part.Advantages such as this composition epoxy resin has low, the easy impregnation of viscosity, be convenient to operation, reactive good.
For achieving the above object, first technical scheme of the present invention is as follows:
Epoxy resin composition for printed circuit copper-clad plate, form by the component of following weight part:
Butanone solution 130～140 weight parts that contain modified epoxy
Composite phenolic aldehyde solidifying agent 60～70 weight parts
Or dicy-curing agent 4.5～6.5 weight parts
Curing catalyst 0.02～0.04 weight part
Solvent 30～40 weight parts
Filler 25～30 weight parts;
Wherein, the described butanone solution that contains modified epoxy is prepared by following steps successively:
A1, the tetramethyl ammonium chloride methanol solution of the polyfunctionality novolac epoxy of the brominated bisphenol type Resins, epoxy of the difunctional epoxy resin of 200～250 weight parts, 55～75 weight parts, 70～90 weight parts and 0.5～0.9 weight part 30% joined mix in the reactive tank and heat;
The isocyanic ester of B1, temperature disposable adding 35～40 weight parts in the time of 85～95 ℃, and be warming up to 160～170 ℃ of reactions 3 hours;
C1, be cooled to 130 ℃, add the brominated bisphenol type Resins, epoxy of the linear phenolic epoxy resin of 120～135 weight parts and 210～225 weight parts miscible after, adding butanone solution, to be dissolved into solid be 74～76% the butanone solution that contains modified epoxy.
For achieving the above object, second technical scheme of the present invention is as follows:
Epoxy resin composition for printed circuit copper-clad plate, form by the component of following weight part:
Butanone solution 130～140 weight parts that contain modified epoxy
Composite phenolic aldehyde solidifying agent 60～70 weight parts
Or dicy-curing agent 4.5～6.5 weight parts
Curing catalyst 0.02～0.04 weight part
Solvent 30～40 weight parts
Filler 25～30 weight parts;
Wherein, the described butanone solution that contains modified epoxy is prepared by following steps successively:
A2, the tetramethyl ammonium chloride methanol solution of the brominated bisphenol type Resins, epoxy of the difunctional epoxy resin of 35～45 weight parts, 12～16 weight parts and 0.5～0.9 part 30% joined mix in the reactive tank and heat;
The tetrabromo-bisphenol of B2, temperature disposable adding 18～22 weight parts in the time of 85～95 ℃, and be warming up to 160～170 ℃ of reactions 3 hours;
C2, be cooled to 130 ℃, add the linear phenolic epoxy resin of 20～30 weight parts miscible after, adding butanone solution, to be dissolved into solid be 74～76% the butanone solution that contains modified epoxy.
The present invention adopts the epoxy resin composition of four kinds of modifications and forms special Resins, epoxy, cooperates compound solidifying agent, makes sheet material have the thermotolerance and the high reliability of higher second-order transition temperature, excellence; In resin system, add at least a filler in addition, can reduce resin shared ratio in whole system, thereby reduce the thermal expansivity of resin system, can effectively suppress the generation of internal stress.In case resin shrinks and crackle through high temperature impact the time, stop the crackle tip by filler, make stress be scattered in filler.
As preferably, described difunctional epoxy resin is selected from bisphenol A type epoxy resin, bisphenol f type epoxy resin, dihydroxyphenyl propane D type Resins, epoxy, bisphenol-s epoxy resin, resorcinol type epoxy and bisphenol-A epoxy resin; Described polyfunctionality novolac epoxy is selected from three-functionality-degree novolac epoxy and four functionality novolac epoxys; Described linear phenolic epoxy resin is selected from line style phenol formaldehyde (PF) Resins, epoxy, ortho-cresol formaldehyde Resins, epoxy, resorcinol formaldehyde Resins, epoxy and other polyphenol type formaldehyde Resins, epoxy.
As preferably, described composite phenolic aldehyde solidifying agent is selected from bisphenol A-type resol and phenol type resol.
As preferably, described curing catalyst is an imidazoles promotor, is selected from imidazoles, glyoxal ethyline, 1-benzyl benzene-2-ethyl imidazol(e), 2-ethyl-4-methylimidazole, 1-amino-ethyl-glyoxal ethyline, 1-cyanoethyl substituted imidazole and various imidazoles affixture.
As preferably, described solvent is a 1-Methoxy-2-propyl acetate.
As preferably, described filler is at least a mineral filler, comprises silicon-dioxide, aluminium hydroxide, aluminium sesquioxide and magnesium oxide.
As preferably, the epoxy equivalent (weight) of the modified epoxy in the described butanone solution that contains modified epoxy is 260～300g/eq, and viscosity is 200～1500cps/25 ℃, and hydrolyzable chlorine is less than 1000ppm, and bromine content is 16～25%.
The composition epoxy resin that obtains by the present invention has low, the easy impregnation of viscosity, be convenient to operate, the characteristics of reactive good and high Tg, with the printed circuit copper-clad plate of its manufacturing, have over-all propertieies such as good reliability, processibility and excellent thermotolerance, Z axle thermal expansivity are little.
Embodiment
The present invention is described in further detail below in conjunction with embodiment, but embodiments of the present invention are not limited thereto.
Embodiment 1
(1) contain the preparation of the butanone solution of modified epoxy:
The tetramethyl ammonium chloride methanol solution of 230 parts bisphenol A epoxide resins, 64 parts brominated bisphenol type Resins, epoxy, 82 parts novolac epoxy and 0.7 part 30% is joined reactive tank to mix and heats.The isocyanic ester of 38 parts of disposable addings when temperature is 90 ℃ was in 165 ℃ of reactions 3 hours.Be cooled to 130 ℃ again, add the brominated bisphenol type Resins, epoxy of 129 parts o-cresol formaldehyde epoxy resin and 219 parts miscible after, adding butanone, to be dissolved into solid be 75% the butanone solution that contains modified epoxy.Above-mentioned consumption is parts by weight.
This epoxy resin composition that contains in the butanone solution of modified epoxy has following physical parameter:
| Epoxy equivalent (weight) (g/eq) | Viscosity (cps/25 ℃) | Hydrolyzable chlorine (ppm) | Bromine content (%) |
| ??260～300 | ??200～1500 | ??＜1000 | ??16～25 |
(2) preparation of composition epoxy resin:
Add mineral filler, compound solidifying agent, curing catalyst and solvent in the butanone solution of modified epoxy and mix.The prescription of the composition epoxy resin of present embodiment (consumption is parts by weight) and part gel time such as following table:
| The butanone solution that contains modified epoxy | ??133.3 |
| Bisphenol A-type resol or phenol type phenolic resin curative | ??66.2 |
| Glyoxal ethyline | ??0.03 |
| 1-Methoxy-2-propyl acetate | ??31.9 |
| Solid content (%) | ??62.0 |
| Mineral filler SiO2+Al (OH) 3 | ??10+20 |
| ??Varnish?Gel?Time(171℃，s) | ??289.8 |
| ??Prepreg?Gel?Time(171℃，s) | ??95.6 |
(3) preparation of the curing of resin combination and printed circuit copper-clad plate:
Described copper-clad plate preparation method is: above composition epoxy resin is made prepreg PP 170 ℃ of baking oven bakings, and with mill press pressing and forming, mill press strip spare is: 195 ℃ of * 35kg/cm again
2* 70min.
Embodiment 2
(1) contain the preparation of the butanone solution of modified epoxy:
230 parts bisphenol A epoxide resins, 55 parts brominated bisphenol type Resins, epoxy, 85 parts novolac epoxy and 0.6 part 30% tetramethyl ammonium chloride methanol solution are joined reactive tank mixing and heating.The isocyanic ester of 35 parts of disposable addings when temperature is 90 ℃ was in 165 ℃ of reactions 3 hours.Be cooled to 130 ℃ again, add the brominated bisphenol type Resins, epoxy of 132 parts o-cresol formaldehyde epoxy resin and 220 parts miscible after, add butanone and be dissolved into the butanone solution that solid is 75% modified epoxy.Above-mentioned consumption is parts by weight.
This physical parameter that contains the epoxy resin composition in the butanone solution of modified epoxy is with embodiment 1.
(2) preparation of composition epoxy resin:
Add mineral filler, compound solidifying agent, curing catalyst and solvent in the butanone solution of modified epoxy and mix.The prescription of the composition epoxy resin of present embodiment (consumption is parts by weight) and part gel time such as following table:
| The butanone solution that contains modified epoxy | ??133.3 |
| Dicy-curing agent | ??5.2 |
| Glyoxal ethyline | ??0.03 |
| 1-Methoxy-2-propyl acetate | ??31.9 |
| The butanone solution that contains modified epoxy | ??133.3 |
| Solid content (%) | ??62.0 |
| Mineral filler SiO2+Al (OH) 3 | ??10+20 |
| ??Varnish?Gel?Time(171℃，s) | ??289.8 |
| ??Prepreg?Gel?Time(171℃，s) | ??95.6 |
(3) preparation of the curing of resin combination and printed circuit copper-clad plate:
With embodiment 1.
Embodiment 3
(1) contain the preparation of the butanone solution of modified epoxy:
The tetramethyl ammonium chloride methanol solution of 40 parts bisphenol A epoxide resins, 15 parts brominated bisphenol type Resins, epoxy and 0.8 part 30% is joined reactive tank to mix and heats.The tetrabromo-bisphenol of 19 parts of disposable addings when temperature is 90 ℃ was in 165 ℃ of reactions 3 hours.Be cooled to 130 ℃ again, add 25 parts o-cresol formaldehyde epoxy resin miscible after, add butanone and be dissolved into the butanone solution that solid is 75% modified epoxy.Above-mentioned consumption is parts by weight.
This physical parameter that contains the epoxy resin composition in the butanone solution of modified epoxy is with embodiment 1.
(2) preparation of composition epoxy resin:
With embodiment 2.
(3) preparation of the curing of resin combination and printed circuit copper-clad plate:
With embodiment 1.
Embodiment 4
(1) contain the preparation of the butanone solution of modified epoxy:
The tetramethyl ammonium chloride methanol solution of 240 parts bisphenol A epoxide resins, 70 parts brominated bisphenol type Resins, epoxy, 82 parts novolac epoxy and 0.7 part 30% is joined reactive tank to mix and heats.The isocyanic ester of 36 parts of disposable addings when temperature is 95 ℃ was in 165 ℃ of reactions 3 hours; Be cooled to 130 ℃ again, add the brominated bisphenol type Resins, epoxy of 125 parts o-cresol formaldehyde epoxy resin and 225 parts miscible after, add butanone and be dissolved into the butanone solution that solid is 75% modified epoxy.Above-mentioned consumption is parts by weight.
This physical parameter that contains the epoxy resin composition in the butanone solution of modified epoxy is with embodiment 1.
(2) preparation of composition epoxy resin:
With embodiment 2.
(3) preparation of the curing of resin combination and printed circuit copper-clad plate:
With embodiment 1.
Embodiment 5
(1) contain the preparation of the butanone solution of modified epoxy:
42 parts bisphenol A epoxide resins, 16 parts brominated bisphenol type Resins, epoxy and 0.7 part 30% tetramethyl ammonium chloride methanol solution are joined reactive tank mixing and heating.The tetrabromo-bisphenol of 20 parts of disposable addings when temperature is 90 ℃ was in 165 ℃ of reactions 3 hours.Be cooled to 135 ℃ again, add 27 parts o-cresol formaldehyde epoxy resin miscible after, add butanone and be dissolved into the butanone solution that solid is 75% modified epoxy.Above-mentioned consumption is parts by weight.
This physical parameter that contains the epoxy resin composition in the butanone solution of modified epoxy is with embodiment 1.
(2) preparation of composition epoxy resin:
With embodiment 1.
(3) preparation of the curing of resin combination and printed circuit copper-clad plate:
With embodiment 1.
Embodiment 6
(1) contain the preparation of the butanone solution of modified epoxy:
230 parts bisphenol A epoxide resins, 59 parts brominated bisphenol type Resins, epoxy, 85 parts novolac epoxy and 0.8 part 30% tetramethyl ammonium chloride methanol solution are joined reactive tank mixing and heating.The isocyanic ester of 38 parts of disposable addings when temperature is 95 ℃ was in 170 ℃ of reactions 3 hours.Be cooled to 130 ℃ again, add the brominated bisphenol type Resins, epoxy of 128 parts o-cresol formaldehyde epoxy resin and 225 parts miscible after, add butanone and be dissolved into the butanone solution that solid is 75% modified epoxy.Above-mentioned consumption is parts by weight.
This physical parameter that contains the epoxy resin composition in the butanone solution of modified epoxy is with embodiment 1.
(2) preparation of composition epoxy resin:
With embodiment 2.
(3) preparation of the curing of resin combination and printed circuit copper-clad plate:
With embodiment 1.
Embodiment 7
(1) contain the preparation of the butanone solution of modified epoxy:
The tetramethyl ammonium chloride methanol solution of 250 parts bisphenol A epoxide resins, 55 parts brominated bisphenol type Resins, epoxy, 85 parts novolac epoxy and 0.8 part 30% is joined reactive tank to mix and heats.The isocyanic ester of 36 parts of disposable addings when temperature is 90 ℃ was in 165 ℃ of reactions 3 hours.Be cooled to 130 ℃ again, add the brominated bisphenol type Resins, epoxy of 125 parts o-cresol formaldehyde epoxy resin and 219 parts miscible after, add butanone and be dissolved into the butanone solution that solid is 75% modified epoxy.Above-mentioned consumption is parts by weight.
This physical parameter that contains the epoxy resin composition in the butanone solution of modified epoxy is with embodiment 1.
(2) preparation of composition epoxy resin:
With embodiment 1.
(3) preparation of the curing of resin combination and printed circuit copper-clad plate:
With embodiment 1.
Embodiment 8
(1) contain the preparation of the butanone solution of modified epoxy:
37 parts bisphenol A epoxide resins, 16 parts brominated bisphenol type Resins, epoxy and 0.7 part 30% tetramethyl ammonium chloride methanol solution are joined reactive tank, and the tetrabromo-bisphenol of 18 parts of disposable addings when temperature is 90 ℃ was in 165 ℃ of reactions 3 hours; Be cooled to 135 ℃ again, add 28 parts o-cresol formaldehyde epoxy resin miscible after, add butanone and be dissolved into the butanone solution that solid is 75% modified epoxy.Above-mentioned consumption is parts by weight.
This physical parameter that contains the epoxy resin composition in the butanone solution of modified epoxy is with embodiment 1.
(2) preparation of composition epoxy resin:
With embodiment 1.
(3) preparation of the curing of resin combination and printed circuit copper-clad plate:
With embodiment 1.
Embodiment 9
(1) contain the preparation of the butanone solution of modified epoxy:
The tetramethyl ammonium chloride methanol solution of 250 parts bisphenol A epoxide resins, 55 parts brominated bisphenol type Resins, epoxy, 70 parts degree novolac epoxy and 0.8 part 30% is joined reactive tank to mix and heats.The isocyanic ester of 35 parts of disposable addings when temperature is 85 ℃ was in 160 ℃ of reactions 3 hours.Be cooled to 130 ℃ again, add the brominated bisphenol type Resins, epoxy of 125 parts o-cresol formaldehyde epoxy resin and 215 parts miscible after, add butanone and be dissolved into the butanone solution that solid is 75% modified epoxy.Above-mentioned consumption is parts by weight.
This physical parameter that contains the epoxy resin composition in the butanone solution of modified epoxy is with embodiment 1.
(2) preparation of composition epoxy resin:
With embodiment 2.
(3) preparation of the curing of resin combination and printed circuit copper-clad plate:
With embodiment 1.
Embodiment 10
(1) contain the preparation of the butanone solution of modified epoxy:
The tetramethyl ammonium chloride methanol solution of 230 parts bisphenol A epoxide resins, 83 parts brominated bisphenol type Resins, epoxy, 79 parts novolac epoxy and 0.7 part 30% is joined reactive tank to mix and heats.The isocyanic ester of 37 parts of disposable addings when temperature is 90 ℃ was in 165 ℃ of reactions 3 hours.Be cooled to 130 ℃ again, add the brominated bisphenol type Resins, epoxy of 132 parts o-cresol formaldehyde epoxy resin and 222 parts miscible after, add butanone and be dissolved into the butanone solution that solid is 75% modified epoxy.Above-mentioned consumption is parts by weight.
This physical parameter that contains the epoxy resin composition in the butanone solution of modified epoxy is with embodiment 1.
(2) preparation of composition epoxy resin:
With embodiment 1.
(3) preparation of the curing of resin combination and printed circuit copper-clad plate:
With embodiment 1.
The printed circuit copper-clad plate substrate that the foregoing description obtains is as follows with the characteristic contrast of antagonism product:
Get from above contrast table result: composition epoxy resin of the present invention has the Tg height, and stripping strength is big, good heat resistance (T
288Reach more than the 30min, decomposition temperature Td is more than 340 ℃) and good dimension stability characteristics such as (Z-CTE are lower than 3.5%).
The foregoing description is a preferred implementation of the present invention; but embodiments of the present invention are not restricted to the described embodiments; other any do not deviate from change, the modification done under spirit of the present invention and the principle, substitutes, combination, simplify; all should be the substitute mode of equivalence, all comprise within protection scope of the present invention.
Claims (8)
1. epoxy resin composition for printed circuit copper-clad plate is characterized in that, is made up of the component of following weight part:
Butanone solution 130～140 weight parts that contain modified epoxy
Composite phenolic aldehyde solidifying agent 60～70 weight parts
Or dicy-curing agent 4.5～6.5 weight parts
Curing catalyst 0.02～0.04 weight part
Solvent 30～40 weight parts
Filler 25～30 weight parts;
Wherein, the described butanone solution that contains modified epoxy is prepared by following steps successively:
A1, the tetramethyl ammonium chloride methanol solution of the polyfunctionality novolac epoxy of the brominated bisphenol type Resins, epoxy of the difunctional epoxy resin of 200～250 weight parts, 55～75 weight parts, 70～90 weight parts and 0.5～0.9 weight part 30% joined mix in the reactive tank and heat;
The isocyanic ester of B1, temperature disposable adding 35～40 weight parts in the time of 85～95 ℃, and be warming up to 160～170 ℃ of reactions 3 hours;
C1, be cooled to 130 ℃, add the brominated bisphenol type Resins, epoxy of the linear phenolic epoxy resin of 120～135 weight parts and 210～225 weight parts miscible after, adding butanone solution, to be dissolved into solid be 74～76% the butanone solution that contains modified epoxy.
2. epoxy resin composition for printed circuit copper-clad plate is characterized in that, is made up of the component of following weight part:
Butanone solution 130～140 weight parts that contain modified epoxy
Composite phenolic aldehyde solidifying agent 60～70 weight parts
Or dicy-curing agent 4.5～6.5 weight parts
Curing catalyst 0.02～0.04 weight part
Solvent 30～40 weight parts
Filler 25～30 weight parts;
Wherein, the described butanone solution that contains modified epoxy is prepared by following steps successively:
A2, the tetramethyl ammonium chloride methanol solution of the brominated bisphenol type Resins, epoxy of the difunctional epoxy resin of 35～45 weight parts, 12～16 weight parts and 0.5～0.9 part 30% joined mix in the reactive tank and heat;
The tetrabromo-bisphenol of B2, temperature disposable adding 18～22 weight parts in the time of 85～95 ℃, and be warming up to 160～170 ℃ of reactions 3 hours;
C2, be cooled to 130 ℃, add the linear phenolic epoxy resin of 20～30 weight parts miscible after, adding butanone solution, to be dissolved into solid be 74～76% the butanone solution that contains modified epoxy.
3. composition epoxy resin according to claim 1 and 2, it is characterized in that described difunctional epoxy resin is selected from bisphenol A type epoxy resin, bisphenol f type epoxy resin, dihydroxyphenyl propane D type Resins, epoxy, bisphenol-s epoxy resin, resorcinol type epoxy and bisphenol-A epoxy resin; Described polyfunctionality novolac epoxy is selected from three-functionality-degree novolac epoxy and four functionality novolac epoxys; Described linear phenolic epoxy resin is selected from line style phenol formaldehyde (PF) Resins, epoxy, ortho-cresol formaldehyde Resins, epoxy, resorcinol formaldehyde Resins, epoxy and other polyphenol type formaldehyde Resins, epoxy.
4. composition epoxy resin according to claim 1 and 2 is characterized in that, described composite phenolic aldehyde solidifying agent is selected from bisphenol A-type resol and phenol type resol.
5. composition epoxy resin according to claim 1 and 2, it is characterized in that, described curing catalyst is an imidazoles promotor, is selected from imidazoles, glyoxal ethyline, 1-benzyl benzene-2-ethyl imidazol(e), 2-ethyl-4-methylimidazole, 1-amino-ethyl-glyoxal ethyline, 1-cyanoethyl substituted imidazole and various imidazoles affixture.
6. composition epoxy resin according to claim 1 and 2 is characterized in that, described solvent is a 1-Methoxy-2-propyl acetate.
7. composition epoxy resin according to claim 1 and 2 is characterized in that described filler is at least a mineral filler, comprises silicon-dioxide, aluminium hydroxide, aluminium sesquioxide and magnesium oxide.
8. composition epoxy resin according to claim 1 and 2, it is characterized in that, the epoxy equivalent (weight) of the modified epoxy in the described butanone solution that contains modified epoxy is 260～300g/eq, viscosity is 200～1500cps/25 ℃, hydrolyzable chlorine is less than 1000ppm, and bromine content is 16～25%.
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| CN110239164A (en) * | 2019-06-13 | 2019-09-17 | 重庆德凯实业股份有限公司 | Tg copper-clad plate and preparation method thereof in high-fire resistance |
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| CN110239164A (en) * | 2019-06-13 | 2019-09-17 | 重庆德凯实业股份有限公司 | Tg copper-clad plate and preparation method thereof in high-fire resistance |
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