CN106751523A - A kind of high-power LED chip package protection materials - Google Patents
A kind of high-power LED chip package protection materials Download PDFInfo
- Publication number
- CN106751523A CN106751523A CN201611223148.7A CN201611223148A CN106751523A CN 106751523 A CN106751523 A CN 106751523A CN 201611223148 A CN201611223148 A CN 201611223148A CN 106751523 A CN106751523 A CN 106751523A
- Authority
- CN
- China
- Prior art keywords
- led chip
- chip package
- power led
- protection materials
- package protection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5033—Amines aromatic
Abstract
The invention discloses a kind of high-power LED chip package protection materials; using bisphenol type liquid epoxies as matrix epoxy resin; aromatic amine with hydrophobicity side chain is used as curing agent; hydrophobic type fused silica is filler, obtains the mono-component liquid epoxy resin protection materials with good water resistance and heat resistance.
Description
Technical field
The present invention relates to a kind of high-power LED chip package protection materials.
Background technology
With the progress of LED encapsulation technologies, LED components constantly develop towards miniaturization, slimming, to packaging protection material
The heat endurance of material, mechanical strength, electrical insulating property, humidity resistance, thermal coefficient of expansion, internal stress and modulus etc. require constantly to carry
It is high.Due to epoxy encapsulation protection materials for non-airtight is encapsulated, its exposure can at leisure absorb moisture, will lead in atmosphere
Cause the deterioration of hot property, electrical property and the mechanical property of packaging protection material etc., the service life of final influence product.In addition,
The packaging protection material of hydrone is absorbed, weldering can be occurred because of the vaporized expanding of hydrone and be split phenomenon.Therefore, LED encapsulation is protected
The wet-hot aging performance of protective material is particularly important to the package reliability of electronic component.
The content of the invention
It is an object of the invention to provide a kind of high-power LED chip package protection materials, with bisphenol type Breakup of Liquid Ring oxygen tree
Used as matrix epoxy resin, used as curing agent, hydrophobic type fused silica is filler to the aromatic amine with hydrophobicity side chain to fat,
Mono-component liquid epoxy encapsulation protection materials with good water resistance and heat resistance.
To achieve the above object, the technical scheme is that designing a kind of high-power LED chip package protection materials, lead to
Cross following steps preparation：
（1）, add 130 parts of active fillers to stir 100 parts of bisphenol type liquid epoxies；
（2）, above-mentioned material is uniform through high speed dispersor, double planetary mixer, three-roll grinder grinding distribution；
（3）, vacuum purify add after bubble 35 parts of curing agent and 4 accelerator are well mixed and vacuum purify be poured into after bubble it is anti-
Answer in device；
（4）, carry out by 120 DEG C of conditions of cure solidification 30min after the packaging protection material is obtained.
Preferably, described curing agent is modified aromatic amine.
Preferably, described accelerator is modified imidazole.
Preferably, described active filler is melting silicon powder.
The advantages of the present invention are：Using modified melting silicon powder in water resistance and thermal coefficient of expansion side
Face, due to crystallization silicon powder and calcium carbonate, is conducive to improving the heat resistance and water resistance of encapsulating material；Bisphenol-A epoxy tree
Fat is favorably improved the heat resistance of encapsulating material as matrix epoxy resin.
Specific embodiment
With reference to embodiment, specific embodiment of the invention is further described.Following examples are only used for more
Plus technical scheme is clearly demonstrated, and can not be limited the scope of the invention with this.
The present invention specific implementation technical scheme be：
130 parts of active fillers are added to stir 100 parts of bisphenol type liquid epoxies；By above-mentioned material through telling dispersion
Machine, double planetary mixer, three-roll grinder grinding distribution are uniform；Vacuum adds 35 parts of curing agent and 4 accelerator after purifying bubble
Well mixed and vacuum is poured into reactor after purifying bubble；Institute is obtained after carrying out solidification 30min by 120 DEG C of conditions of cure
State packaging protection material.Described curing agent is modified aromatic amine；Described accelerator is modified imidazole；Described active filler
It is melting silicon powder.
The above is only the preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art
For member, on the premise of the technology of the present invention principle is not departed from, some improvements and modifications can also be made, these improvements and modifications
Also should be regarded as protection scope of the present invention.
Claims (5)
1. a kind of high-power LED chip package protection materials, it is characterised in that including bisphenol type liquid epoxies, curing agent,
Active filler and accelerator are according to 100: 35:130:4 ratio is mixed to prepare.
2. high-power LED chip package protection materials according to claim 1, it is characterised in that make as follows
It is standby：
（1）, add 130 parts of active fillers to stir 100 parts of bisphenol type liquid epoxies；
（2）, by above-mentioned material through telling dispersion machine, double planetary mixer, three-roll grinder grinding distribution uniform；
（3）, vacuum purify add after bubble 35 parts of curing agent and 4 accelerator are well mixed and vacuum purify be poured into after bubble it is anti-
Answer in device；
（4）, carry out by 120 DEG C of conditions of cure solidification 30min after the packaging protection material is obtained.
3. high-power LED chip package protection materials according to claim 2, it is characterised in that described curing agent is
Modified aromatic amine.
4. high-power LED chip package protection materials according to claim 2, it is characterised in that described accelerator is
Modified imidazole.
5. high-power LED chip package protection materials according to claim 2, it is characterised in that described active filler
It is melting silicon powder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611223148.7A CN106751523A (en) | 2016-12-27 | 2016-12-27 | A kind of high-power LED chip package protection materials |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611223148.7A CN106751523A (en) | 2016-12-27 | 2016-12-27 | A kind of high-power LED chip package protection materials |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106751523A true CN106751523A (en) | 2017-05-31 |
Family
ID=58925468
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611223148.7A Pending CN106751523A (en) | 2016-12-27 | 2016-12-27 | A kind of high-power LED chip package protection materials |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106751523A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101864146A (en) * | 2010-06-13 | 2010-10-20 | 宏昌电子材料股份有限公司 | Epoxy resin composition for printed circuit copper-clad plate |
| CN102031081A (en) * | 2010-11-26 | 2011-04-27 | 烟台德邦电子材料有限公司 | Liquid epoxy encapsulating material and preparation method thereof |
| CN102086365A (en) * | 2010-12-27 | 2011-06-08 | 东莞市腾威电子材料技术有限公司 | Adhesive, preparation method and application in integrated circuit board embedment thereof |
| CN102382421A (en) * | 2011-09-16 | 2012-03-21 | 汕头市骏码凯撒有限公司 | Liquid epoxy resin packaging material and preparation method thereof |
| CN102585440A (en) * | 2012-01-16 | 2012-07-18 | 广州宏仁电子工业有限公司 | High-CTI (comparative tracking index) halogen-free flame retardant resin composition for copper-clad laminate |
| CN102850724A (en) * | 2012-09-27 | 2013-01-02 | 江苏中鹏新材料股份有限公司 | Green and environment-friendly epoxy resin composition for high-power device packaging |
| CN104610701A (en) * | 2015-01-14 | 2015-05-13 | 景旺电子科技(龙川)有限公司 | Insulating layer material, stainless steel based copper clad plate, surface treatment method and preparation method |
| CN105838030A (en) * | 2012-07-20 | 2016-08-10 | 纳美仕有限公司 | Liquid sealing material and electronic component using same |
-
2016
- 2016-12-27 CN CN201611223148.7A patent/CN106751523A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101864146A (en) * | 2010-06-13 | 2010-10-20 | 宏昌电子材料股份有限公司 | Epoxy resin composition for printed circuit copper-clad plate |
| CN102031081A (en) * | 2010-11-26 | 2011-04-27 | 烟台德邦电子材料有限公司 | Liquid epoxy encapsulating material and preparation method thereof |
| CN102086365A (en) * | 2010-12-27 | 2011-06-08 | 东莞市腾威电子材料技术有限公司 | Adhesive, preparation method and application in integrated circuit board embedment thereof |
| CN102382421A (en) * | 2011-09-16 | 2012-03-21 | 汕头市骏码凯撒有限公司 | Liquid epoxy resin packaging material and preparation method thereof |
| CN102585440A (en) * | 2012-01-16 | 2012-07-18 | 广州宏仁电子工业有限公司 | High-CTI (comparative tracking index) halogen-free flame retardant resin composition for copper-clad laminate |
| CN105838030A (en) * | 2012-07-20 | 2016-08-10 | 纳美仕有限公司 | Liquid sealing material and electronic component using same |
| CN102850724A (en) * | 2012-09-27 | 2013-01-02 | 江苏中鹏新材料股份有限公司 | Green and environment-friendly epoxy resin composition for high-power device packaging |
| CN104610701A (en) * | 2015-01-14 | 2015-05-13 | 景旺电子科技(龙川)有限公司 | Insulating layer material, stainless steel based copper clad plate, surface treatment method and preparation method |
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Legal Events
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|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170531 |