CN114434911A - High-thermal-conductivity high-frequency flexible copper-clad plate and preparation method thereof - Google Patents
High-thermal-conductivity high-frequency flexible copper-clad plate and preparation method thereof Download PDFInfo
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- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
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- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B37/1284—Application of adhesive
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C09J121/00—Adhesives based on unspecified rubbers
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- C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
- C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
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- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/302—Conductive
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
- B32B2307/3065—Flame resistant or retardant, fire resistant or retardant
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- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
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- C09J2479/00—Presence of polyamine or polyimide
- C09J2479/08—Presence of polyamine or polyimide polyimide
- C09J2479/086—Presence of polyamine or polyimide polyimide in the substrate
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Abstract
The invention provides a high-heat-conductivity high-frequency flexible copper-clad plate and a preparation method thereof, wherein the flexible copper-clad plate comprises an adhesive layer, the adhesive layer is obtained by drying glue, and each 100 parts of the glue comprises the following components in parts by weight: 20-35 parts of inorganic filler, 25-35 parts of rubber, 20-35 parts of resin, a curing agent, a metal ion trapping agent and a catalyst. The preparation method comprises glue coating, pressing and rolling. In the flexible copper clad laminate, the addition amount of the inorganic filler, the resin and the rubber is reasonably designed, so that the obtained flexible copper clad laminate has good high heat conduction and low magnetic loss performance, and can meet the requirement of quick transmission of communication signals; the preparation method provided by the invention has the advantage that the obtained product has high quality stability.
Description
Technical Field
The invention relates to the technical field of flexible copper clad laminate materials, in particular to a high-heat-conductivity high-frequency flexible copper clad laminate and a preparation method thereof.
Background
Flexible Copper Clad Laminates (FCCL) are a substrate material for flexible printed circuit boards, typically consisting of a flexible insulating base film and a metal foil. At present, the commonly used soft board base materials mainly comprise Polyimide (PI) and copper foil, however, the PI and the copper foil have large dielectric constant and loss factor, large moisture absorption and poor reliability, so that the flexible copper clad laminate has serious high-frequency transmission loss and poor structural characteristics, and cannot meet the current high-frequency high-speed transmission requirement. The limitation and disadvantage of the material promote the development of new materials and new processes in the field, and the high-frequency high-speed flexible copper clad laminate with the characteristics of low signal loss, light weight, multiple functions and the like gradually enters the field of view of the public.
In order to solve the problems of the existing flexible copper clad laminate, low-dielectric high-performance flexible copper clad laminate products are successively provided at home and abroad, the products have lower dielectric constant, high-frequency loss and higher peel strength, can well meet the requirements of high-frequency circuit packaging and carriers (printed circuit boards) on the high-frequency microwave flexible copper clad laminate, but still cannot meet the requirements of signal transmission speed in communication at the current levels of dielectric constant, high-frequency loss and peel strength, and cause the application range of the flexible copper clad laminate to be narrow. Therefore, the flexible copper clad laminate with wide application range is significant.
Disclosure of Invention
Aiming at the defects in the prior art, the invention provides the high-heat-conductivity high-frequency flexible copper-clad plate and the preparation method thereof, and the flexible copper-clad plate has the advantages that the obtained flexible copper-clad plate has good high-heat-conductivity and low-magnetic loss performance by reasonably designing the addition amounts of the inorganic filler, the resin and the rubber, and can meet the requirement of quick transmission of communication signals; the preparation method provided by the invention has the advantage that the obtained product has high quality stability.
The technical scheme of the invention is as follows:
a high-heat-conductivity high-frequency flexible copper-clad plate comprises an adhesive layer, wherein the adhesive layer is obtained by drying glue;
every 100 parts of the glue comprises the following components in parts by weight:
20-35 parts of inorganic filler, 25-35 parts of rubber, 20-35 parts of resin, a curing agent, a metal ion capturing agent, a catalyst and a dispersing agent.
Further, each 100 parts of the glue comprises the following components in parts by weight:
27 parts of inorganic filler, 35 parts of rubber, 32 parts of resin, a curing agent, a metal ion trapping agent, a catalyst and a dispersing agent; the peel strength of the glue is up to 1.42 kgf/cm; the glue has the highest peel strength at this composition.
Further, the particle size of the inorganic filler is 3-6 μm; when the inorganic filler meets the range, the obtained flexible copper clad laminate has the peel strength of 1.08-1.15kgf/cm and the shrinkage rate of 0.02-0.006 percent, and meets the standard regulation.
Further, the preparation method of the glue comprises the following steps: the glue components are put into a high-speed mixing dispersion machine, and the parameters of the dispersion machine are set as follows: 700r/m 0.5hr, 850r/m 0.5hr, 1000r/m 4hr, turn over AD at the 4th hr, so that the glue components are mixed in a stepped manner, and the obtained glue has the best fluidity and uniformity.
Further, the inorganic filler is modified graphene, and specifically, a layer of silane coupling agent is coated on the surface of the graphene; the modified graphene can still retain good heat conduction performance on the premise of reducing the conductivity of the graphene.
Furthermore, the resin is benzoxazine liquid crystal polymer resin, and the resin has excellent bending resistance, corrosion resistance and heat resistance, has high strength and low dielectric property, and can effectively meet the requirement of a high-frequency copper-clad plate.
The preparation method of the high-thermal-conductivity high-frequency flexible copper-clad plate comprises the following steps:
(1) glue coating: adopting an extrusion type spraying process, firstly, inputting glue into a liquid storage distribution cavity of a coating die head, and spreading the glue on a coated substrate in a liquid film shape at an outlet lip through the transverse homogenization of a strip seam; then controlling the pressure, spraying the glue on the substrate, and more uniformly coating the coating on the film by using the coating die head to ensure that the coating is more uniform and smooth; by using the coating mode, the uniformity of glue coating and the thickness precision of the adhesive layer can be guaranteed, and the difference between the actual thickness and the preset thickness is +/-1 mu m;
(2) and (3) laminating: after glue is coated, copper foils are respectively placed on the upper surface and the lower surface of a substrate, and the pressing temperature is controlled to be 350-390 ℃;
(3) winding: and (3) using an automatic winding machine, wherein the sending tension of the winding machine is 60N, and the winding tension is 60-70N, so that winding is completed, and the flexible copper-clad plate is obtained.
Further, in the pressing process in the step (2), the pressing temperature is 350 ℃; the peel strength of the product at this time is 1.4 to 1.5 kgf/cm.
Further, in the rolling process of the step (3), when the sending tension is 60N and the rolling tension is 70N, the flexible copper clad laminate has the best appearance and the most stable size.
Compared with the prior art, the invention has the beneficial effects that:
1. by setting the proportion of the inorganic filler, the rubber and the resin, the glue has good peel strength, so that when the glue is used for producing the flexible copper-clad plate, the flexible copper-clad plate with high peel strength, heat resistance, flame resistance and limited explosion all meeting the requirements can be obtained.
2. The flexible copper clad laminate prepared by using the glue provided by the invention has the advantages of high thickness uniformity of an adhesive layer and good size stability of a product; the obtained product has good peel strength, shrinkage and welding resistance, and also has high heat conduction and low electromagnetic loss performance, and can meet the requirements of telephone and mobile communication system industries, broadcasting, television, computer and other industries, automobile industries, medical equipment and the like.
3. The preparation method of the flexible copper clad laminate provided by the invention has the advantages of simple and easily-controlled preparation process and good method stability, and the flexible copper clad laminate prepared by the method has the advantage of high quality consistency.
Drawings
In order to more clearly illustrate the embodiments or technical solutions in the prior art of the present invention, the drawings used in the description of the embodiments or prior art will be briefly described below, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is a schematic view of a flexible copper clad laminate structure according to embodiment 2.
In the figure, 1-PI layer, 2-copper foil layer and 3-adhesive layer.
Detailed Description
In order to make those skilled in the art better understand the technical solutions in the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, shall fall within the scope of protection of the present invention.
In the following examples and comparative examples of the present application, the curing agent is DDS, the catalyst is imidazole catalyst, and the ion scavenger is IEX-100; the inorganic filler is modified graphene, and specifically, a layer of silane coupling agent is coated on the surface of the graphene; the resin is benzoxazine liquid crystal polymer resin.
In the examples described below, the thickness of the PI film was 10 μm, and the thickness of the copper foil was 12 μm.
Example 1
25 parts of glue with different weight compositions were prepared according to the formulation of table 1 below, as follows:
TABLE 1 formulation of glue Nos. 1-25
The glue components in table 1 above were made into glue as follows: put into telling the mixing dispersion machine with glue component, adopt mechanical dispersion method and chemical dispersion method to combine together, use high-speed mixing dispersion machine to adopt cascaded mixedly to become dispersion mode to improve the viscosity of glue, the settlement parameter is: 700r/m 0.5hr, 850r/m 0.5hr, 1000r/m 4hr, turn over AD at the 4th hr, avoiding the re-agglomeration of particles after the glue leaves the dispersion machine.
The glue of the serial numbers 1 to 25 are respectively subjected to the peel strength measurement, a peel strength tester is used for the peel strength measurement, and the results are shown in the table 2 and are as follows:
TABLE 2 determination of peel Strength of No. 1-No. 25 glues
| Group of | Peel Strength (kgf/cm) |
| Number 1 | 1.42 |
| |
1.40 |
| Number 3 | 1.40 |
| Number 4 | 1.39 |
| Number 5 | 1.36 |
| Number 6 | 1.35 |
| Number 7 | 1.39 |
| Number 8 | 1.29 |
| Number 9 | 1.18 |
| Serial number 10 | 1.36 |
| Number 11 | 1.33 |
| Serial number 12 | 1.32 |
| Number 13 | 1.28 |
| Serial number 14 | 1.29 |
| Number 15 | 1.27 |
| Serial number 16 | 1.28 |
| Number 17 | 1.35 |
| Serial number 18 | 1.33 |
| Reference numeral 19 | 1.31 |
| Serial number 20 | 1.28 |
| Serial number 21 | 1.37 |
| Serial number 22 | 1.35 |
| Number 23 | 1.18 |
| Serial number 24 | 1.19 |
| Serial number 25 | 1.17 |
As can be seen from the combination of Table 2, the glue provided by the invention has good stripping performance.
Example 2
The glue with the serial number 1, the serial number 2 and the serial number 3 provided by the embodiment 1 is respectively applied to the preparation of the flexible copper-clad plate, and the process is as follows:
(1) glue coating: adopting an extrusion type spraying process, firstly, inputting glue into a liquid storage distribution cavity of a coating die head, and spreading the glue on a coated substrate in a liquid film shape at an outlet lip through the transverse homogenization of a strip seam; using a coating machine, setting the pressure of the coating machine to be 0.2MPa, spraying glue on the PI film, and more uniformly coating the coating on the PI film by using an upper coating die head, wherein the coating thickness of the glue is 6 microns;
(2) and (3) laminating: after coating glue, respectively placing copper foils on the upper surface and the lower surface of a matrix, and controlling the pressing temperature to be 350 ℃;
(3) winding: using an automatic winding machine, wherein the sending tension of the winding machine is 60N, and the winding tension is 70N, completing winding, and obtaining the flexible copper-clad plate; the flexible copper clad laminate comprises a PI layer, a copper foil layer and an adhesive layer;
wherein the adhesive layer is obtained after the glue is cured, the copper foil layer has two layers, one copper foil layer is connected with the upper surface of the PI layer through the adhesive layer, and the other copper foil layer is connected with the lower surface of the PI layer through the other adhesive layer, as shown in figure 1;
the results of the detection of the flexible copper clad laminate A prepared by glue with the serial number 1, the flexible copper clad laminate B prepared by glue with the serial number 2 and the flexible copper clad laminate C prepared by glue with the serial number 3 are shown in Table 3.
TABLE 3 detection of the Performance of Flexible copper clad laminate A, Flexible copper clad laminate B and Flexible copper clad laminate C
As can be seen from Table 3, the products produced by using the glue with high peel strength have the most excellent performance and meet the regulations of the industry standards.
Example 3
In this example, the influence of the change in the particle size of the filler on the performance of the glue is discussed.
In the embodiment, experiment glue A and experiment glue B are arranged;
the difference between the experimental glue A and the glue with the serial number 1 in the embodiment 1 is that the grain diameter of the filler is 4 μm;
the difference between the experimental glue B and the glue No. 1 in the example 1 is that the particle size of the filler is 6 μm.
Comparative example 1
In this comparative example, comparative glue A differs from glue number 1 in example 1 in that the filler particle size is 10 μm.
The experimental glue A and the experimental glue B in the embodiment 3 and the comparative water A in the comparative example 1 are used for preparing the flexible copper clad laminate, the preparation method is the same as the embodiment 2, the flexible copper clad laminate D obtained by using the experimental glue A, the flexible copper clad laminate E obtained by using the experimental glue B and the comparative flexible copper clad laminate A obtained by using the comparative water A are detected, and the detection results are summarized with the detection results of the flexible copper clad laminate A prepared by using the glue with the serial number 1, and the results are shown in the table 4.
TABLE 4 detection results of Flexible copper clad laminate A, comparative Flexible copper clad laminate A, Flexible copper clad laminate D and Flexible copper clad laminate E
As can be seen from the combination of Table 4, the filler particle size has a great influence on the product, and when the filler particle size is 10 μm, the peel strength of the obtained comparative flexible copper clad laminate A does not meet the standard specification, so that the setting of the filler particle size in the invention has important significance on the product performance.
Example 4
In this embodiment, the glue used is glue number 1 in embodiment 1;
the difference between the preparation method of the embodiment and the preparation method of the embodiment 2 is that the coating thicknesses are respectively 4 microns, 8 microns and 10 microns, and the flexible copper clad laminate F, the flexible copper clad laminate G and the flexible copper clad laminate H are sequentially obtained; and (3) detecting the flexible copper clad laminate F, the flexible copper clad laminate G and the flexible copper clad laminate H, and summarizing a detection result and the flexible copper clad laminate A, wherein the result is shown in a table 5.
TABLE 5 detection of Performance of Flexible copper clad laminate F, Flexible copper clad laminate G and Flexible copper clad laminate H
The direct influence of the thickness of the glue on the signal transmission speed and the product bonding can be seen by combining the table 5, the thickness of the glue provided by the invention can meet the signal transmission requirement, and when the thickness of the glue is 6 micrometers, the properties of the product such as viscosity, peeling strength, high-frequency loss and the like are most excellent.
Example 5
In the embodiment, glue with the serial number 1 in the embodiment 1 is used, and the flexible copper clad laminate is prepared at the laminating temperature which is different from that of the embodiment 2, wherein the laminating temperature is 370 ℃ and 390 ℃ respectively, and the flexible copper clad laminate I and the flexible copper clad laminate J are obtained respectively.
Comparative example 2
The difference between the comparative example and the example 5 is that the laminating temperatures are 310 ℃ and 330 ℃ respectively, and the comparative flexible copper clad laminate B and the comparative flexible copper clad laminate C are obtained respectively.
The products obtained in the example 5 and the comparative example 2 are detected, and the results are summarized with the performance results of the flexible copper clad laminate A, and the results are shown in a table 6.
TABLE 6 detection results of Flexible copper clad laminate I, Flexible copper clad laminate J, comparative Flexible copper clad laminate B, and comparative Flexible copper clad laminate C
| Product(s) | Pressing temperature (. degree.C.) | Strong peelingDegree (kgf/cm) |
| Comparative flexible copper clad laminate B | 310 | 0.87 |
| Comparative flexible copper clad laminate C | 330 | 0.94 |
| Flexible copper clad laminate A | 350 | 1.34 |
| Flexible copper clad laminate I | 370 | 1.32 |
| Flexible copper clad laminate J | 390 | 1.16 |
As can be seen from the combination of Table 6, under the condition of reducing the pressing temperature, the peel strength of the product is changed greatly, and the standard requirement cannot be met, so that the pressing strength has great significance for the preparation of the flexible copper clad laminate.
Example 6
In the embodiment, the glue with the serial number 1 in the embodiment 1 is used, and the difference from the embodiment 2 is that when the sending tension is 60N and the rolling tension is 60N, the prepared product is the flexible copper clad laminate K.
Comparative example 3
The difference between the comparative example and the example 6 is that when the sending tension is 60N and the rolling tension is 40N, the prepared product is a comparative flexible copper-clad plate D; when the sending tension is 60N and the rolling tension is 100N, the prepared product is a comparative flexible copper-clad plate E.
The products obtained in the example 6 and the comparative example 3 are detected, and the results are summarized with the performance results of the flexible copper clad laminate A, and the results are shown in a table 7.
TABLE 7 detection results of Flexible copper clad laminate K, comparative Flexible copper clad laminate D, and comparative Flexible copper clad laminate E
Comparative example 4
In the comparative example, glue No. 1 in the example 1 is used, and the difference from the example 2 is that when the winding tension is 70N and the sending tension is 30N, the prepared product is a comparative flexible copper-clad plate F; when the rolling tension is 70N and the sending tension is 40N, the prepared product is a comparative flexible copper-clad plate G; when the rolling tension is 70N and the sending tension is 100N, the prepared product is a comparative flexible copper clad laminate H.
And (3) detecting the product obtained in the comparative example 4, summarizing the product and the performance result of the flexible copper clad laminate A, wherein the result is shown in a table 8.
TABLE 8 detection results for comparison of Flexible copper clad laminate F and comparison of Flexible copper clad laminate H
It can be seen from table 7 and table 8 that, in the preparation process of the flexible copper clad laminate, the sending tension and the rolling tension have great influence on the appearance, dimensional stability and performance of the product. Therefore, it is very important for the product production to select the appropriate sending tension and winding tension.
Example 7
In the same manner as in example 2, 5 batches of flexible copper-clad plates were prepared using glue No. 1 provided in example 1, and the peel strength test was performed on the 5 batches of products, which was summarized as the peel strength of flexible copper-clad plate a in example 2, and the results are shown in table 9.
TABLE 9 Peel Strength testing between batches
| Numbering | Batch 1 | |
Batch 3 | Batch 4 | Batch 5 | Flexible copper clad laminate A |
| Peel Strength (kgf/cm) | 1.31 | 1.35 | 1.30 | 1.33 | 1.34 | 1.34 |
As can be seen from Table 9, the product prepared from the same glue composition has small peel strength difference, which indicates that the preparation method of the invention has high stability and strong repeatability.
Although the present invention has been described in detail by referring to the preferred embodiments, the present invention is not limited thereto. Various equivalent modifications or substitutions can be made on the embodiments of the present invention by those skilled in the art without departing from the spirit and scope of the present invention, and these modifications or substitutions are within the scope of the present invention/any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (9)
1. A high-heat-conductivity high-frequency flexible copper-clad plate comprises an adhesive layer, wherein the adhesive layer is obtained by drying glue,
every 100 parts of the glue comprises the following components in parts by weight:
20-35 parts of inorganic filler, 25-35 parts of rubber, 20-35 parts of resin, a curing agent, a metal ion trapping agent, a catalyst and a dispersing agent.
2. The high-thermal-conductivity high-frequency flexible copper-clad plate according to claim 1, wherein each 100 parts of the glue comprises the following components in parts by weight:
27 parts of inorganic filler, 35 parts of rubber, 32 parts of resin, a curing agent, a metal ion scavenger, a catalyst and a dispersing agent.
3. The high-thermal-conductivity high-frequency flexible copper-clad plate according to claim 1 or 2, wherein the particle size of the inorganic filler is 3 to 6 μm.
4. The high-thermal-conductivity high-frequency flexible copper-clad plate according to claim 1 or 2, wherein the preparation method of the glue comprises the following steps: adopt mechanical dispersion method and chemical dispersion method to combine together, use high-speed mixing dispersion machine to adopt cascaded thoughtlessly to become dispersion mode to handle, the setting parameter of cascaded thoughtlessly becoming dispersion is: 700r/m 0.5hr, 850r/m 0.5hr, 1000r/m 4hr, turn over AD at the 4th hr.
5. The high-thermal-conductivity high-frequency flexible copper-clad plate according to claim 1 or 2, wherein the inorganic filler is modified graphene, and specifically, a layer of silane coupling agent is coated on the surface of the graphene.
6. The high-thermal-conductivity high-frequency flexible copper-clad plate according to claim 1 or 2, wherein the resin is a benzoxazine liquid crystal polymer resin.
7. The method for preparing the high-thermal-conductivity high-frequency flexible copper-clad plate according to any one of claims 1 to 6, which is characterized by comprising the following steps:
(1) glue coating: adopting an extrusion type spraying process, firstly, inputting glue into a liquid storage distribution cavity of a coating die head, and spreading the glue on a coated substrate in a liquid film shape at an outlet lip through the transverse homogenization of a strip seam; then controlling the pressure, spraying the glue on the substrate, and coating the coating on the film by using an upper coating die head for later use;
(2) and (3) laminating: after glue is coated, copper foils are respectively placed on the upper surface and the lower surface of a substrate, and the pressing temperature is controlled to be 350-390 ℃;
(3) winding: and (3) using an automatic winding machine, wherein the sending tension of the winding machine is 60N, and the winding tension is 60-70N, so that winding is completed, and the flexible copper-clad plate is obtained.
8. The preparation method of the high-thermal-conductivity high-frequency flexible copper-clad plate according to claim 7, wherein in the laminating process in the step (2), the laminating temperature is 350 ℃; the peel strength of the product at this time is 1.4 to 1.5 kgf/cm.
9. The preparation method of the high-thermal-conductivity high-frequency flexible copper-clad plate according to claim 7, wherein in the rolling process in the step (3), the sending tension is 60N and the rolling tension is 70N.
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| US20080220282A1 (en) * | 2007-03-09 | 2008-09-11 | Jang Boz Z | Highly conductive, multi-layer composite precursor composition to fuel cell flow field plate or bipolar plate |
| CN105172270A (en) * | 2014-05-27 | 2015-12-23 | 广东生益科技股份有限公司 | Thermosetting resin sandwich preimpregnation body and preparation method thereof, and copper-clad plate |
| WO2017111254A1 (en) * | 2015-12-21 | 2017-06-29 | 주식회사 두산 | Electromagnetic wave shielding film and manufacturing method therefor |
| CN111253709A (en) * | 2020-04-02 | 2020-06-09 | 厦门英勒威新材料科技有限公司 | Copper-clad plate glue solution and black low-transmittance copper-clad plate |
| JP2021027311A (en) * | 2019-11-13 | 2021-02-22 | 東洋インキＳｃホールディングス株式会社 | Electromagnetic wave shielding sheet and electromagnetic wave shielding wiring circuit board |
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080220282A1 (en) * | 2007-03-09 | 2008-09-11 | Jang Boz Z | Highly conductive, multi-layer composite precursor composition to fuel cell flow field plate or bipolar plate |
| CN105172270A (en) * | 2014-05-27 | 2015-12-23 | 广东生益科技股份有限公司 | Thermosetting resin sandwich preimpregnation body and preparation method thereof, and copper-clad plate |
| WO2017111254A1 (en) * | 2015-12-21 | 2017-06-29 | 주식회사 두산 | Electromagnetic wave shielding film and manufacturing method therefor |
| JP2021027311A (en) * | 2019-11-13 | 2021-02-22 | 東洋インキＳｃホールディングス株式会社 | Electromagnetic wave shielding sheet and electromagnetic wave shielding wiring circuit board |
| CN111253709A (en) * | 2020-04-02 | 2020-06-09 | 厦门英勒威新材料科技有限公司 | Copper-clad plate glue solution and black low-transmittance copper-clad plate |
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