CN202601229U - Copper-embedded aluminum copper composite plate band - Google Patents
Copper-embedded aluminum copper composite plate band Download PDFInfo
- Publication number
- CN202601229U CN202601229U CN 201220167256 CN201220167256U CN202601229U CN 202601229 U CN202601229 U CN 202601229U CN 201220167256 CN201220167256 CN 201220167256 CN 201220167256 U CN201220167256 U CN 201220167256U CN 202601229 U CN202601229 U CN 202601229U
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- copper
- plate band
- aluminum
- composite plate
- embedded
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Abstract
The utility model discloses a copper-embedded aluminum copper composite plate band, which belongs to the technical field of composite metals. The copper-embedded aluminum copper composite plate band comprises an aluminum plate band. The copper-embedded aluminum copper composite plate band is characterized in that a copper plate band is embedded in the aluminum plate band to form a composite plate band body structure. The upper surface and the lower surface of the composite plate band are planes. The copper-embedded aluminum copper composite plate band of the utility model has the advantages of simple structure, low cost, high bonding strength, long service life, favorable mechanical performance, convenient deep processing and wide use range. According to the solid-liquid phase composite principle, the aluminum copper composite plate band is manufactured through a continuous rolling process under an anaerobic condition with high surface quality; the cooper plate band is embedded in one surface or two surface of the aluminum plate band so as to be capable of being electrically connected with a copper conductor and an aluminum conductor, realizing favorable conductivity; and the copper-embedded aluminum copper composite plate band can be widely applied to many fields of electric conduction, thermal conduction and decoration and the like.
Description
Technical field
The utility model belongs to the composition metal technical field, is specifically related to the embedded aluminum copper composite plate band of a kind of copper.
Background technology
Existing copper-aluminum composite board band generally adopts the sticking material of copper aluminothermy rolled material, copper aluminium glue, copper al blasting material to form, copper aluminothermy rolled material through the online induction heating of induction furnace after little mill milling copper aluminium is combined with each other because milling train is less; And precision is not high, heats in the air, can produce oxide skin; The oxide skin of aluminium is electrically non-conductive material, and rolling band is used for non-conductive industry more, receives this technogenic influence; Mostly copper layer thickness is 0.2-0.3mm, the thicklyest can only accomplish 0.5mm; The sticking material of copper aluminium glue is combined with each other copper aluminium through glue-line is set between copper layer and aluminium lamination, and the copper-aluminum composite board band of this kind structure is non-refractory on the one hand, can only be used for decoration industry; Can not replace fine copper to be used for technical fields such as conduction, heat conduction; In manufacturing process, receive the restriction of equipment, process conditions on the other hand, the thickness of gluing and the uniformity are not easy to grasp, and the part is prone to the phenomenon of bubbling and cracking; And bond strength is not high; Copper and aluminium are prone to layering only in surface recombination, and glue-line also is prone to the aging weak point in useful life that causes the copper-aluminum composite board band that peels off; Copper al blasting material is the energy with the explosive; Copper coin bumps with aluminium sheet under explosion wave and the effect of detonation product pressure; Thereby between substrate and multiple layer, realize metallurgical binding; But this kind production technology exists recombination rate unstable, receives that effects limit such as operating personnel, technology, gunpowder kind, weather, template are poor, complex process, cost are high, be not suitable for problem such as large-scale industrial production.There is the people to adopt the solid-liquid complex technique to make the aluminum copper composite plate band in the prior art; One side or two sides complex copper base layer at the aluminum substrate layer; This kind technology has solved more existing problems in the prior art, but has range of application problem widely inadequately, especially in the conduction industry; Can not be applied at random between the different conductors, use to receive certain restriction.
Summary of the invention
To the problem that exists in the prior art, the utility model purpose is providing a kind of manufacture craft simple, good plate cut, has wide range of applications, long service life, the embedded aluminum copper composite plate band of copper that bond strength is high.
The utility model is realized through following technical scheme:
The embedded aluminum copper composite plate band of described a kind of copper comprises the aluminium sheet band, it is characterized in that the embedded copper coin band that is provided with constitutes the complex plate strip agent structure on the aluminium sheet band, and the complex plate strip upper and lower surfaces is the plane.
The embedded aluminum copper composite plate band of described a kind of copper is characterized in that the thickness of said aluminium sheet band is not less than the thickness of copper coin band.
The embedded aluminum copper composite plate band of described a kind of copper, the thickness that it is characterized in that said aluminium sheet band is 0.1-20mm, the thickness of said copper coin band is 0.02-4mm.
The utility model is simple in structure, cost is low, bond strength is high, long service life, and good mechanical property is convenient to deep processing, and the scope of application is extensive; The principle mutually compound according to solid-liquid; Copper aluminium is processed through technique for continuous rolling under anaerobic state; Its surface quality is good, and the embedded copper coin band that is provided with of one side or two sides through at the aluminium sheet band can be electrically connected copper conductor and aluminium conductor; Realize excellent conducting performance, be widely used in a plurality of technical fields such as conduction, heat conduction, decoration.
Description of drawings
Fig. 1 is a kind of example structure sketch map of the utility model;
Fig. 2 is a kind of example structure sketch map of the utility model;
Fig. 3 is a kind of example structure sketch map of the utility model;
Fig. 4 is a kind of example structure sketch map of the utility model.
Embodiment
Below in conjunction with Figure of description the utility model is done further explain, and provide embodiment.
Like Fig. 1,2,3, shown in 4; The embedded aluminum copper composite plate band of a kind of copper comprises aluminium sheet band 1, and the embedded copper coin band 2 that is provided with constitutes the complex plate strip agent structure on the aluminium sheet band 1; The upper and lower surfaces of complex plate strip is the plane; The thickness of aluminium sheet band 1 is not less than the thickness of copper coin band 2, and the thickness of aluminium sheet band 1 is for being 0.1-20mm, and the thickness of copper coin band 2 is 0.02-4mm; During making; Solid-state copper coin band after aluminium liquid and the surface preparation is in contact with one another, and under the high temperature action of aluminium liquid, the atom on copper surface is activated; Form Validation Counter and make generation atomic bond combination between fresh particle; Form metallurgical composite bed through the diffusion between copper, the aluminium on copper, the aluminium contact-making surface, make two kinds of different metallic materials be combined into indivisible integral body, combined strength bination is high; Can as processing single metal, carry out deep processings such as bending, boring, punching press, can satisfy the process requirements of different product fully.
Claims (3)
1. the embedded aluminum copper composite plate band of copper comprises aluminium sheet band (1), it is characterized in that upward embedded copper coin band (2) the formation complex plate strip agent structure that is provided with of aluminium sheet band (1), and the complex plate strip upper and lower surfaces is the plane.
2. the embedded aluminum copper composite plate band of a kind of copper according to claim 1 is characterized in that the thickness of said aluminium sheet band (1) is not less than the thickness of copper coin band (2).
3. the embedded aluminum copper composite plate band of a kind of copper according to claim 1, the thickness that it is characterized in that said aluminium sheet band (1) is 0.1-20mm, the thickness of said copper coin band (2) is 0.02-4mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220167256 CN202601229U (en) | 2012-04-19 | 2012-04-19 | Copper-embedded aluminum copper composite plate band |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220167256 CN202601229U (en) | 2012-04-19 | 2012-04-19 | Copper-embedded aluminum copper composite plate band |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202601229U true CN202601229U (en) | 2012-12-12 |
Family
ID=47318759
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220167256 Expired - Fee Related CN202601229U (en) | 2012-04-19 | 2012-04-19 | Copper-embedded aluminum copper composite plate band |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202601229U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105489410A (en) * | 2015-11-17 | 2016-04-13 | 温州新科特种材料有限公司 | Cu-Al composite material, small breaker coil block and preparation method thereof |
| CN105598420A (en) * | 2015-12-23 | 2016-05-25 | 上海交通大学 | Method for preparing double-metal compound material through combined solid-state copper solid-liquid compounding and rolling |
-
2012
- 2012-04-19 CN CN 201220167256 patent/CN202601229U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105489410A (en) * | 2015-11-17 | 2016-04-13 | 温州新科特种材料有限公司 | Cu-Al composite material, small breaker coil block and preparation method thereof |
| CN105489410B (en) * | 2015-11-17 | 2020-04-24 | 温州宏丰电工合金股份有限公司 | Copper-aluminum composite material, miniature circuit breaker coil assembly and preparation method thereof |
| CN105598420A (en) * | 2015-12-23 | 2016-05-25 | 上海交通大学 | Method for preparing double-metal compound material through combined solid-state copper solid-liquid compounding and rolling |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121212 Termination date: 20190419 |