CN210040187U - Novel DBC board - Google Patents
Novel DBC board Download PDFInfo
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- CN210040187U CN210040187U CN201920718185.8U CN201920718185U CN210040187U CN 210040187 U CN210040187 U CN 210040187U CN 201920718185 U CN201920718185 U CN 201920718185U CN 210040187 U CN210040187 U CN 210040187U
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Abstract
The utility model provides a novel DBC board; the DBC board comprises a surface circuit, an electrical isolation layer, a surface copper layer module, an intermediate resin material heat conduction insulation layer and a bottom copper layer; the surface layer circuit is positioned on the upper surface of the surface layer copper layer module and is formed by laser etching of surface layer copper; the electrical isolation layer is positioned between the surface copper layer modules and used for electrical isolation; the surface copper layer module is fixedly connected to the upper surface of the middle resin material heat-conducting insulating layer; the middle resin material heat conduction insulating layer is fixedly connected to the upper surface of the bottom copper layer; the utility model discloses a DBC plate structure adopts and contains thick Cu layer, and the structural design of ultra-thin insulating material layer can improve power module's radiating efficiency by a wide margin, improves power module's heat capacity ability, reduces power device encapsulation volume.
Description
Technical Field
The utility model relates to a power device encapsulates the field, especially relates to a novel DBC board.
Background
The DBC board is also called a direct copper-clad board and is an essential component for packaging a power module in the field of power electronics. The DBC is formed by a three-layer structure of copper (Cu) -ceramic material-copper, and has three key functions of circuit layout, heat conduction, insulation and the like in the power module. The intermediate layer ceramic material of the DBC is generally a hard material having high thermal conductivity, such as Al2O3 or AlN. Generally, the material is prepared by sintering, electroplating and other processes, and then is cut into required sizes by laser.
In the power module, the surface Cu layer of the DBC is directly connected with the chip, so that the circuit is formed and the direct heat dissipation effect is achieved. There are therefore two requirements for the surface Cu layer of DBC: 1. the thicker the thickness, the better the thickness, and the larger current can be conducted when the chip works at a large current; 2. the thicker the copper layer, the larger the heat capacity, and the instant high heat generated by the chip under extreme working conditions can be absorbed in time, so that the power device is protected from being damaged. In terms of heat conduction, the most common Al2O3 ceramic in power modules adopts expensive AlN ceramic in power modules for special applications, but both ceramic materials cannot reach the heat conduction level of metal, and the heat conductivity of common alumina (Al2O3) ceramic is far from that of copper. The requirement for the thickness of the ceramic material of the DBC board is that the thinner the material is, the better the heat dissipation of the power device is on the premise of satisfying the insulation grade.
However, the above requirements cannot be met at all. The ceramic material of the DBC is used as a base material, strong stress with different thermal expansion rates of different materials is borne in the three-layer structure of the DBC, and the stress borne by the ceramic material of the DBC is obviously increased due to the thickening of the Cu material. Ceramic materials are hard and brittle during the preparation process of the DBC plate, so that the ceramic materials are prone to cracking risks; during the operation of the power device, because the power device is subjected to continuous high-temperature and low-temperature cyclic operation, the ceramic material is broken due to the difference of the thermal expansion rates, and thus the power module fails. So the current situation is directly caused: the thickness of the Cu layer of the DBC ranges from 0.1mm to 0.45 mm; the thickness of the ceramic layer is generally between 0.3mm and 1 mm. The thickness of Cu cannot be increased and the thickness of the ceramic layer cannot be reduced.
SUMMERY OF THE UTILITY MODEL
In order to solve the defects of the prior art, the utility model aims to provide a novel DBC board to satisfy the development trend of DBC board among the electronic circuit.
In order to achieve the above object, the present invention provides a novel DBC board, which includes a surface circuit, an electrical isolation layer, a surface copper layer module, an intermediate resin material heat conduction insulation layer, and a bottom copper layer; the surface layer circuit is positioned on the upper surface of the surface layer copper layer module and is formed by laser etching of surface layer copper; the electrical isolation layer is positioned between the surface copper layer modules and used for electrical isolation; the surface copper layer module is fixedly connected to the upper surface of the middle resin material heat-conducting insulating layer; the middle resin material heat conduction insulating layer is fixedly connected to the upper surface of the bottom copper layer.
Preferably, the electrically isolating layer is dimensionally scalable by machining.
Preferably, the surface copper layer module is a thick copper layer, and the thickness range is 0.3mm-5 mm.
Preferably, the intermediate resin material heat conduction insulation layer is composed of a silicone resin material.
Preferably, the bottom copper layer is a whole copper layer, and the thickness of the bottom copper layer ranges from 0.1mm to 1mm or from 1mm to 2 mm.
The utility model provides an adopt the preparation method of DBC board, the method includes following step:
1) placing a base copper plate, and arranging micro air holes on the base copper plate at positions which do not influence the circuit layout;
2) coating or pasting organic silicon resin material on the base copper plate;
3) placing a top copper plate on the organic silicon resin material, and arranging micro air holes on the top copper plate;
4) applying pressure on the top copper plate through pressure equipment to fully bond the three layers of materials of the DBC plate, and exhausting gas; simultaneously, the thickness of the organic silicon resin layer is thinned to a specified thickness to form a preformed DBC plate;
5) placing the preformed DBC plate in a heating environment for high-temperature curing, wherein the heating environment can be realized by various devices such as a high-temperature oven, a welding furnace and the like; the curing temperature is about 70-100 ℃, and the curing process can be carried out in a pressurized state;
6) forming a DBC mother board, wherein the DBC mother board comprises one or more DBC boards with the same function, and finally producing one or more DBC finished products;
7) etching the DBC thick copper layer to form a circuit layout, and adopting a chemical etching or laser etching mode;
8) and cutting the DBC master plate to form 1 or more independent DBC products for packaging the power module.
The utility model discloses another one kind adopts simultaneously the preparation method of DBC board, the method includes following step:
1) placing a base copper plate and arranging micro air holes;
2) coating or pasting organic silicon resin material on the base copper plate;
3) processing a copper layer with a certain thickness into copper pieces with different groups and shapes according to the design of a module, and pasting the copper pieces on the organic silicon resin layer by adopting automatic equipment;
4) applying pressure on the top copper plate through pressure equipment to fully bond the three layers of materials of the DBC plate, exhausting gas, and thinning the thickness of the organic silicon resin layer to a specified thickness to form a preformed DBC plate;
5) placing the preformed DBC plate in a heating environment for high-temperature curing, wherein the heating environment can be realized by various devices such as a high-temperature oven, a welding furnace and the like, the curing temperature is about 70-100 ℃, and the curing process can be carried out in a pressurized state;
6) forming a DBC mother board, wherein the DBC mother board comprises one or more DBC boards with the same function, and finally one or more DBC finished products can be produced;
7) and cutting the DBC master plate to form 1 or more independent DBC products for packaging the power module.
Compared with the prior art, the beneficial effects of the utility model are embodied in:
(1) the thickness of the existing DBC surface copper foil is limited, the surface thick copper technology is adopted, the thickness range is 0.3mm-5mm, and the limitation of the thickness of the surface copper layer in the prior art is broken through.
(2) The thick copper layer on the surface of the DBC is directly connected with the chip, so that heat generated by the chip can be quickly absorbed, and the heat dissipation effect is greatly enhanced.
(3) The thermal capacity of the thick copper layer on the surface of the DBC is greatly improved, the heat conduction efficiency is greatly improved, and meanwhile, instantaneous energy spikes can be absorbed under extreme working conditions such as short circuit and overcurrent, so that the chip and the power module are protected from failure.
(4) The cross section area of a copper foil of a thick copper layer on the surface of the DBC is increased by tens of times, the resistance is reduced in equal proportion, and the power module can output higher power through higher current.
(5) The middle heat-conducting insulating layer of the DBC is made of an organic silicon resin material, and has high heat conductivity, high insulativity, elasticity and thermal stability; the heat conduction and insulation performance of the DBC three-layer structure is easily superior to that of the existing alumina ceramic material, the good cohesiveness and elasticity of the DBC three-layer structure break through the bottleneck of the prior art, and the stress mismatch problem of the existing DBC three-layer structure does not need to be considered.
(6) The DBC board of the utility model can greatly reduce the design volume of the power module; and the system cost is reduced.
(7) The DBC board of the utility model has strong applicability, and can be suitable for packaging power modules in various forms; and the processing technology is simple, and the high-speed mass production can be realized by a power device packaging factory.
Drawings
Fig. 1 is a schematic structural diagram of a novel DBC board of the present invention.
Detailed Description
In order to further understand the structure, characteristics and other objects of the present invention, the following detailed description is given with reference to the accompanying preferred embodiments, which are only used to illustrate the technical solution of the present invention and are not intended to limit the present invention.
As shown in fig. 1, fig. 1 is a schematic structural diagram of a novel DBC board of the present invention; the DBC board is mainly divided into a surface copper layer, an intermediate resin material heat conduction insulating layer and a bottom copper layer. The three-layer main body structure has the following characteristics:
1) the surface copper layer is thick copper, the thickness is 0.5mm-5mm, and the thickness of the surface copper foil can be increased by about 10 times compared with the thickness of about 0.3mm of the existing DBC. The thickness of the surface copper foil is greatly improved, so that the heat capacity of the surface copper layer is greatly increased, and heat generated by a chip in the power module during working is directly and quickly absorbed by the surface thick copper, so that the power module can output higher power. Meanwhile, the heat capacity of the thick copper on the surface layer is greatly improved, and the reliability of the power module is directly improved, so that heat generated by the power device under short-time extreme working conditions (such as short circuit, overcurrent and the like) is conducted out in time, and the burning effect is avoided.
Meanwhile, the surface thick copper layer can also form mutually isolated parts through various processes for electrical isolation and circuit formation inside the power module. The DBC surface thick copper layer can form a surface circuit through a chemical or laser etching method; or forming different character blocks (similar to a jigsaw puzzle) by machining, and forming the surface layer circuit by automatic surface mounting and other processes.
2) The utility model discloses middle heat conduction insulating layer has great difference with prior art equally, and this patent proposes that the intermediate layer material adopts the organosilicon resin material (also called silicon rubber material) of high heat conduction insulating characteristic. The resin material has good heat conductivity and insulativity, and also has good cohesiveness, elasticity and high temperature resistance. These properties make silicone resins the best choice for DBC interlayer materials.
The dielectric constant of the organic silicon resin material reaches 60-80kV/mm, which is improved by 3-4 times compared with the aluminum oxide material (20kV/mm) adopted by the existing DBC. So that it has very good insulating properties. The insulation withstand voltage of the thickness of 6mil (0.15mm) is more than 4kV, and the insulation withstand voltage requirement of a power module with the voltage of more than 6500V can be met. For general power modules with the voltage of less than 1200V, 1-3mil (25.4-76.2 um) can meet the requirement of insulation and voltage resistance. Compared with the existing alumina ceramic material (600um-1200um), the thickness can be reduced by about 10-20 times.
The thermal conductivity of the organic silicon resin material is 1-3W/(m.K), and the performance is 20-30W/(m.K) different from that of the alumina ceramic material. But the thickness of the silicone resin material can be greatly reduced compared with the alumina ceramic material. In general, thinner silicone resin materials can achieve better thermal conductivity than alumina materials.
The organic silicon resin material has good elasticity and high temperature resistance, and can be well adapted to the expansion and contraction of the upper and lower layers of copper metal materials when the power device works. Namely, the DBC board with the heat-conducting and insulating layer made of the organic silicon resin material has very good temperature cycle performance.
The phase change function of the organic silicon resin material makes the organic silicon resin material very suitable for being used as an adhesive material, and the preparation process of the DBC plate in the patent is very simple. Is convenient for mass production.
3) The utility model provides a bottom copper foil is whole copper layer, can with the copper base plate welding encapsulation of power module, also can directly regard as the off-the-shelf radiating basal plate that exposes of power module. The thickness of the copper layer can be 0.1-1mm, so that the material cost is reduced, and a thick copper plate with the thickness of 1-3 mm can be adopted, so that the structural rigidity of the product is enhanced.
Further, the utility model provides a preparation method of the novel DBC plate; the method mainly comprises the following steps:
1) placing a base copper plate, and arranging micro air holes on the base copper plate at positions which do not influence the circuit layout;
2) coating or pasting organic silicon resin material on the base copper plate;
3) placing a top copper plate on the organic silicon resin material, and arranging micro air holes on the top copper plate;
4) applying pressure on the top copper plate through pressure equipment to fully bond the three layers of materials of the DBC plate, and exhausting gas; simultaneously, the thickness of the organic silicon resin layer is thinned to a specified thickness to form a preformed DBC plate;
5) placing the preformed DBC plate in a heating environment for high-temperature curing, wherein the heating environment can be realized by various devices such as a high-temperature oven, a welding furnace and the like; the curing temperature is about 70-100 ℃, and the curing process can be carried out in a pressurized state;
6) forming a DBC mother board, wherein the DBC mother board comprises one or more DBC boards with the same function, and finally producing one or more DBC finished products;
7) etching the DBC thick copper layer to form a circuit layout, and adopting a chemical etching or laser etching mode;
8) and cutting the DBC master plate to form 1 or more independent DBC products for packaging the power module.
In addition, the utility model provides another preparation method of the novel DBC board; the method mainly comprises the following steps:
1) placing a base copper plate and arranging micro air holes;
2) coating or pasting organic silicon resin material on the base copper plate;
3) processing a copper layer with a certain thickness into copper pieces with different groups and shapes according to the design of a module, and pasting the copper pieces on the organic silicon resin layer by adopting automatic equipment;
4) applying pressure on the top copper plate through pressure equipment to fully bond the three layers of materials of the DBC plate, exhausting gas, and thinning the thickness of the organic silicon resin layer to a specified thickness to form a preformed DBC plate;
5) placing the preformed DBC plate in a heating environment for high-temperature curing, wherein the heating environment can be realized by various devices such as a high-temperature oven, a welding furnace and the like, the curing temperature is about 70-100 ℃, and the curing process can be carried out in a pressurized state;
6) forming a DBC mother board, wherein the DBC mother board comprises one or more DBC boards with the same function, and finally one or more DBC finished products can be produced;
7) and cutting the DBC master plate to form 1 or more independent DBC products for packaging the power module.
Finally, the utility model discloses a configurable power supply system and control method, its specific technical characterstic is as follows:
(1) the thickness of the existing DBC surface copper foil is limited, the surface thick copper technology is adopted, the thickness range is 0.3mm-5mm, and the limitation of the thickness of the surface copper layer in the prior art is broken through.
(2) The thick copper layer on the surface of the DBC is directly connected with the chip, so that heat generated by the chip can be quickly absorbed, and the heat dissipation effect is greatly enhanced.
(3) The thermal capacity of the thick copper layer on the surface of the DBC is greatly improved, the heat conduction efficiency is greatly improved, and meanwhile, instantaneous energy spikes can be absorbed under extreme working conditions such as short circuit and overcurrent, so that the chip and the power module are protected from failure.
(4) The cross section area of a copper foil of a thick copper layer on the surface of the DBC is increased by tens of times, the resistance is reduced in equal proportion, and the power module can output higher power through higher current.
(5) The middle heat-conducting insulating layer of the DBC is made of an organic silicon resin material, and has high heat conductivity, high insulativity, elasticity and thermal stability; the heat conduction and insulation performance of the DBC three-layer structure is easily superior to that of the existing alumina ceramic material, the good cohesiveness and elasticity of the DBC three-layer structure break through the bottleneck of the prior art, and the stress mismatch problem of the existing DBC three-layer structure does not need to be considered.
(6) The DBC board of the utility model can greatly reduce the design volume of the power module; and the system cost is reduced.
(7) The DBC board of the utility model has strong applicability, and can be suitable for packaging power modules in various forms; and the processing technology is simple, and the high-speed mass production can be realized by a power device packaging factory.
It should be noted that the above summary and the detailed description are intended to demonstrate the practical application of the technical solution provided by the present invention, and should not be interpreted as limiting the scope of the present invention. Various modifications, equivalent substitutions and improvements will occur to those skilled in the art and are intended to be within the spirit and scope of the present invention. The protection scope of the present invention is subject to the appended claims.
Claims (5)
1. The novel DBC board is characterized by comprising a surface circuit (1), an electric isolation layer (2), a surface copper layer module (3), an intermediate resin material heat conduction insulation layer (4) and a bottom copper layer (5); the surface layer circuit (1) is positioned on the upper surface of the surface layer copper layer module (3) and is formed by laser etching of surface layer copper; the electrical isolation layer (2) is positioned between the surface copper layer modules (3) and used for electrical isolation; the surface copper layer module (3) is fixedly connected to the upper surface of the middle resin material heat-conducting insulating layer (4); the intermediate resin material heat conduction insulating layer (4) is fixedly connected to the upper surface of the bottom copper layer (5).
2. The DBC plate according to claim 1, wherein the electrical isolation layer (2) is dimensionally scalable by machining.
3. The DBC board according to claim 1, wherein the surface copper layer module (3) is a thick copper layer having a thickness in the range of 0.3mm to 5 mm.
4. The DBC board according to claim 1, wherein the intermediate resin material heat conductive insulation layer (4) is composed of a silicone resin material.
5. The DBC board according to claim 1, wherein the underlying copper layer (5) is a full sheet of copper with a thickness in the range of 0.1mm-1mm or 1mm-2 mm.
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| CN201920718185.8U CN210040187U (en) | 2019-05-20 | 2019-05-20 | Novel DBC board |
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| CN201920718185.8U CN210040187U (en) | 2019-05-20 | 2019-05-20 | Novel DBC board |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110098171A (en) * | 2019-05-20 | 2019-08-06 | 北京易威芯能科技有限公司 | A kind of novel DBC plate and preparation method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110098171A (en) * | 2019-05-20 | 2019-08-06 | 北京易威芯能科技有限公司 | A kind of novel DBC plate and preparation method |
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