CN104822223A - Ceramic-based circuit board and preparation method thereof - Google Patents
Ceramic-based circuit board and preparation method thereof Download PDFInfo
- Publication number
- CN104822223A CN104822223A CN201510235215.6A CN201510235215A CN104822223A CN 104822223 A CN104822223 A CN 104822223A CN 201510235215 A CN201510235215 A CN 201510235215A CN 104822223 A CN104822223 A CN 104822223A
- Authority
- CN
- China
- Prior art keywords
- ceramic substrate
- circuit board
- ceramic
- metal
- base circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/017—Glass ceramic coating, e.g. formed on inorganic substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention belongs to the technical field of electronics and electrics, and specifically relates to a ceramic-based circuit board and a preparation method thereof. The ceramic-based circuit board of the invention comprises a ceramic substrate, and the ceramic substrate is provided with a pure metal circuit pattern conductive layer which is sintered by laser. The preparation method comprises the steps of editing a circuit pattern in a computer with use of pattern editing software, putting the ceramic substrate on a laser cutting workbench, injecting metal powder to the ceramic substrate, starting a laser sintering device to scan and sinter the metal powder, polishing the ceramic substrate after scanning and sintering, screen-printing texts, and finally curing the ceramic substrate to obtain a ceramic-based circuit board product. The metal circuit pattern conductive layer of the ceramic-based circuit board is a single-metal uniform conductive layer, and has simpler components and better electrical conductivity and thermal conductivity than a previous metal mixture conductive layer sintered by adding precious metal.
Description
Technical field
The invention belongs to electron and electrician technical field, be specifically related to a kind of ceramic base circuit board and preparation method thereof.
Background technology
Ceramic surface metallization technology is technology ceramic material and metal material are firmly connected, be applied to Ceramic-to-metal seal at first, as the connection of parts in electron tube, the departments such as each sophisticated technology field such as semiconductor and integrated circuit, electric light source, laser, atomic energy, high-energy physics and aerospace and chemical industry, weaving, metallurgy, machinery are now widely used in.Ceramic-to-metal seal is an integrated technology relating to diverse discipline, relates to the knowledge of each side such as physics, chemistry, mechanics, material science, vacuum technique, Surface Science, Modern Scientific Instruments in Chinese.Again because its technology difficulty is large, purposes is more and more wider, thus becomes one of hot technology both domestic and external.Active soldering technology and Mo-Mn metallization process in succession occur that sealing technology is obtained to be developed rapidly, along with the development of ceramic material and the demand of commercial Application, there is some new special Joining Technology.China is from the research of ceramic and metal jointing, and emphasis serves the electronics industry of high speed development, uses electroceramics, glass, Ag-Cu-Ti solder and Kovar alloy etc.
At present, Ceramic-to-metal seal technique still based on typical sintering metal powder method and active metal method, in multi-layer ceramics manufacture craft, mainly takes high temperature sintering metallization process so far.Metal dust method conventional at present and active metal method all need the high-temperature process of more than 1000 DEG C, greatly improve the cost of ceramics-to-metals joining.Ceramic surface metallization technology both domestic and external also has chemical nickel plating or vacuum evaporation silver-bearing copper technique.Wherein chemical plating bond strength is low, noble metal target is needed to activate, especially easily cause Environment pollution serious, although the environmental protection of vacuum evaporation silver-bearing copper, but metallic diaphragm is poor with the bond strength of pottery, rete loosens, and easily comes off, and the thickness of metallic diaphragm is wayward, the uniformity and consistency poor.
Summary of the invention
For prior art Problems existing, the invention provides a kind of ceramic base circuit board and preparation method thereof, object prepares metallic circuit patterned conductive layer to be combined with ceramic substrate closely, and metallic circuit patterned conductive layer composition is single, the uniform ceramic base circuit board of thickness.
Ceramic base circuit board of the present invention includes a ceramic substrate, and ceramic substrate has the simple metal circuitous pattern conductive layer of laser sintered one-tenth, thickness is 5 ~ 100 μm.
Wherein, described simple metal is copper, molybdenum, silver, aluminium or titanium.
The technical scheme realizing the object of the invention is carried out according to following steps:
(1) graphics editing software is used to edit circuitous pattern in a computer;
(2) ceramic substrate is placed on laser cutting operation desk, start metal dust blowing device, to jet on ceramic substrate metal dust, start laser sintering device, according to the circuitous pattern editted, scanning sintering is carried out to metal powder, adopt vacuum low-pressure gathering-device to collect unnecessary non sintered metal powder, scanning sintering is complete, obtains the metallic circuit graph layer on ceramic substrate simultaneously;
(3) polishing is carried out, character silk printing to the complete ceramic substrate of scanning sintering, finally solidify, obtain ceramic base circuit board product.
Wherein, described ceramic substrate is aluminium oxide ceramic substrate or aluminum nitride ceramic substrate, and wherein in aluminium oxide ceramic substrate, the weight content of aluminium oxide is 90 ~ 99%, and in aluminum nitride ceramic substrate, the weight content of aluminium nitride is 90 ~ 99%.
Described metal dust is copper powder, molybdenum powder, silver powder, aluminium powder or titanium valve, and particle size is between 0.3 ~ 10 μm.
Described metal dust blowing device jet velocity is at 1-5L/min.
Described laser sintering device adopts CO
2laser, wavelength is 10.6 μm.
Compared with prior art, feature of the present invention and beneficial effect are:
(1) the present invention is compared with ceramic base circuit board preparation method in the past, eliminate the high temperature sintering step of conducting metal, do not need Post isothermal treatment, save mass energy, the power of high temperature sintering furnace is about 10KW, and in the present invention use plant capacity to be no more than 300W, therefore the inventive method save mass energy, effectively reduce the cost of ceramic base circuit board, be beneficial to industrial mass production;
(2) also adopt injection method to jet metal dust at ceramic base plate surface in the present invention, compared with manual application mode of the prior art, metal conducting layer is uniformity more, and electric conductivity is better;
(3) the metallic pattern conductive layer of ceramic circuit board of the present invention is the uniform conducting layers of single metal, with in the past sinter into compared with metal mixture conductive layer by adding noble metal, composition is simpler, and conductivity and thermal conductivity are also better.
Embodiment
Below in conjunction with embodiment, the present invention will be further described.
The circuitous pattern software for editing used in the embodiment of the present invention is Coredraw.
Embodiment 1
The ceramic base circuit board of the present embodiment includes an aluminium oxide ceramic substrate, and aluminium oxide ceramic substrate has the fine copper circuitous pattern conductive layer of laser sintered one-tenth, thickness is 50 μm.
Its preparation method carries out according to following steps:
(1) graphics editing software is used to edit circuitous pattern in a computer;
(2) aluminium oxide ceramic substrate being of a size of 50*50*1mm is placed on laser cutting operation desk, starts metal dust blowing device, copper powder of jetting on ceramic substrate, copper powder particle size is at 0.3 ~ 10 μm, metal dust blowing device jet velocity, at 2.5L/min, starts laser sintering device, uses CO
2laser, wavelength is 10.6 μm, carries out scanning sintering according to the circuitous pattern editted to copper powder, and adopt vacuum low-pressure gathering-device to collect unnecessary non-sintered copper powder, scanning sintering is complete, obtains the copper metallic circuit graph layer on ceramic substrate simultaneously;
(3) carry out polishing, character silk printing to the complete ceramic substrate of scanning sintering, finally solidify, obtain ceramic base circuit board product, after testing, its thermal transmission coefficient is 18.5W/mk, and resistivity is 1.75 × 10
-8Ω m.
Embodiment 2
The ceramic base circuit board of the present embodiment includes an aluminum nitride ceramic substrate, and aluminum nitride ceramic substrate has the pure molybdenum circuitous pattern conductive layer of laser sintered one-tenth, thickness is 100 μm.
Its preparation method carries out according to following steps:
(1) graphics editing software is used to edit circuitous pattern in a computer;
(2) aluminum nitride ceramic substrate being of a size of 50*50*1mm is placed on laser cutting operation desk, starts metal dust blowing device, molybdenum powder of jetting on ceramic substrate, molybdenum powder granularity is at 0.3 ~ 10 μm, metal dust blowing device jet velocity, at 5L/min, starts laser sintering device, uses CO
2laser, wavelength is 10.6 μm, carries out scanning sintering according to the circuitous pattern editted to molybdenum powder, and adopt vacuum low-pressure gathering-device to collect the unnecessary molybdenum powder that do not sinter, scanning sintering is complete, obtains the molybdenum circuitous pattern layer on ceramic substrate simultaneously;
(3) carry out polishing, character silk printing to the complete ceramic substrate of scanning sintering, finally solidify, obtain ceramic base circuit board product, after testing, its thermal transmission coefficient is 18.6W/mk, and resistivity is 5.17 × 10
-8Ω m.
Embodiment 3
The ceramic base circuit board of the present embodiment includes an aluminum nitride ceramic substrate, and aluminum nitride ceramic substrate has the fine silver circuitous pattern conductive layer of laser sintered one-tenth, thickness is 20 μm.
Its preparation method carries out according to following steps:
(1) graphics editing software is used to edit circuitous pattern in a computer;
(2) aluminum nitride ceramic substrate being of a size of 50*50*1mm is placed on laser cutting operation desk, starts metal dust blowing device, silver powder of jetting on ceramic substrate, silver powder granularity is at 0.3 ~ 10 μm, metal dust blowing device jet velocity, at 1L/min, starts laser sintering device, uses CO
2laser, wavelength is 10.6 μm, carries out scanning sintering according to the circuitous pattern editted to silver powder, and adopt vacuum low-pressure gathering-device to collect the unnecessary silver powder that do not sinter, scanning sintering is complete, obtains the silver metal circuitous pattern layer on ceramic substrate simultaneously;
(3) carry out polishing, character silk printing to the complete ceramic substrate of scanning sintering, finally solidify, obtain ceramic base circuit board product, after testing, its thermal transmission coefficient is 18.5W/mk, and resistivity is 1.59 × 10
-8Ω m.
Embodiment 4
The ceramic base circuit board of the present embodiment includes an aluminum nitride ceramic substrate, and aluminum nitride ceramic substrate has the fine aluminium circuitous pattern conductive layer of laser sintered one-tenth, thickness is 5 μm.
Its preparation method carries out according to following steps:
(1) graphics editing software is used to edit circuitous pattern in a computer;
(2) aluminum nitride ceramic substrate being of a size of 50*50*1mm is placed on laser cutting operation desk, starts metal dust blowing device, aluminium powder of jetting on ceramic substrate, aluminum powder particle size is at 0.3 ~ 10 μm, metal dust blowing device jet velocity, at 3L/min, starts laser sintering device, uses CO
2laser, wavelength is 10.6 μm, carries out scanning sintering according to the circuitous pattern editted to aluminium powder, and adopt vacuum low-pressure gathering-device to collect unnecessary non-sintered-aluminium power, scanning sintering is complete, obtains the aluminum metal circuitous pattern layer on ceramic substrate simultaneously;
(3) carry out polishing, character silk printing to the complete ceramic substrate of scanning sintering, finally solidify, obtain ceramic base circuit board product, after testing, its thermal transmission coefficient is 18.3W/mk, and resistivity is 5.48 × 10
-8Ω m.
Embodiment 5
The ceramic base circuit board of the present embodiment includes an aluminum nitride ceramic substrate, and aluminum nitride ceramic substrate has the pure titanium circuitous pattern conductive layer of laser sintered one-tenth, thickness is 80 μm.
Its preparation method carries out according to following steps:
(1) graphics editing software is used to edit circuitous pattern in a computer;
(2) aluminum nitride ceramic substrate being of a size of 50*50*1mm is placed on laser cutting operation desk, starts metal dust blowing device, titanium valve of jetting on ceramic substrate, titanium valve granularity is at 0.3 ~ 10 μm, metal dust blowing device jet velocity, at 4L/min, starts laser sintering device, uses CO
2laser, wavelength is 10.6 μm, carries out scanning sintering according to the circuitous pattern editted to titanium valve, and adopt vacuum low-pressure gathering-device to collect the unnecessary titanium valve that do not sinter, scanning sintering is complete, obtains the titanium circuitous pattern layer on ceramic substrate simultaneously;
(3) carry out polishing, character silk printing to the complete ceramic substrate of scanning sintering, finally solidify, obtain ceramic base circuit board product, after testing, its thermal transmission coefficient is 18.6W/mk, and resistivity is 4.2 × 10
-8Ω m.
Claims (7)
1. a ceramic base circuit board, includes a ceramic substrate, and it is characterized in that simple metal circuitous pattern conductive layer ceramic substrate with laser sintered one-tenth, thickness is 5 ~ 100 μm.
2. a kind of ceramic base circuit board according to claim 1, is characterized in that described simple metal is copper, molybdenum, silver, aluminium or titanium.
3. a preparation method for ceramic base circuit board as claimed in claim 1, is characterized in that carrying out according to following steps:
(1) graphics editing software is used to edit circuitous pattern in a computer;
(2) ceramic substrate is placed on laser cutting operation desk, start metal dust blowing device, to jet on ceramic substrate metal dust, start laser sintering device, according to the circuitous pattern editted, scanning sintering is carried out to metal powder, adopt vacuum low-pressure gathering-device to collect unnecessary non sintered metal powder, scanning sintering is complete, obtains the metallic circuit graph layer on ceramic substrate simultaneously;
(3) polishing is carried out, character silk printing to the complete ceramic substrate of scanning sintering, finally solidify, obtain ceramic base circuit board product.
4. the preparation method of a kind of ceramic base circuit board according to claim 3, it is characterized in that described ceramic substrate is aluminium oxide ceramic substrate or aluminum nitride ceramic substrate, wherein in aluminium oxide ceramic substrate, the weight content of aluminium oxide is 90 ~ 99%, and in aluminum nitride ceramic substrate, the weight content of aluminium nitride is 90 ~ 99%.
5. the preparation method of a kind of ceramic base circuit board according to claim 3, it is characterized in that described metal dust is copper powder, molybdenum powder, silver powder, aluminium powder or titanium valve, particle size is between 0.3 ~ 10 μm.
6. the preparation method of a kind of ceramic base circuit board according to claim 3, is characterized in that described metal dust blowing device jet velocity is at 1-5L/min.
7. the preparation method of a kind of ceramic base circuit board according to claim 3, is characterized in that described laser sintering device adopts CO
2laser, wavelength is 10.6 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510235215.6A CN104822223A (en) | 2015-05-11 | 2015-05-11 | Ceramic-based circuit board and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510235215.6A CN104822223A (en) | 2015-05-11 | 2015-05-11 | Ceramic-based circuit board and preparation method thereof |
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| CN104822223A true CN104822223A (en) | 2015-08-05 |
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|---|---|---|---|
| CN201510235215.6A Pending CN104822223A (en) | 2015-05-11 | 2015-05-11 | Ceramic-based circuit board and preparation method thereof |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106653630A (en) * | 2017-01-22 | 2017-05-10 | 大连大学 | Silicon surface metallization method |
| CN107986810A (en) * | 2018-01-22 | 2018-05-04 | 中国计量大学 | Power electronic device AlN ceramic bonded copper base and preparation method thereof |
| CN108684154A (en) * | 2018-04-09 | 2018-10-19 | 深圳市可信华成通信科技有限公司 | A kind of non-metal material surface realizes the method and component of microstrip circuit |
| WO2019195976A1 (en) * | 2018-04-09 | 2019-10-17 | 深圳市可信华成通信科技有限公司 | Method for realizing microstrip circuit on surface of non-metal material, and component |
| CN112469199A (en) * | 2020-11-24 | 2021-03-09 | 贵研铂业股份有限公司 | Preparation method of aluminum nitride ceramic circuit board |
| CN112969303A (en) * | 2021-02-01 | 2021-06-15 | 南昌大学 | Circuit printing method based on 3D printing and prepared high-power circuit board |
| DE102020204989B3 (en) | 2020-04-21 | 2021-09-23 | Friedrich-Alexander-Universität Erlangen-Nürnberg | Process for the additive manufacturing of a circuit carrier and circuit carrier |
| CN114213139A (en) * | 2021-12-31 | 2022-03-22 | 深圳市吉迩科技有限公司 | Preparation method of ceramic heating element and ceramic heating element |
| CN115023059A (en) * | 2022-08-08 | 2022-09-06 | 华中科技大学 | Manufacturing method of conformal conductive circuit on surface of dielectric material |
| JP7518365B2 (en) | 2020-08-27 | 2024-07-18 | 日亜化学工業株式会社 | Manufacturing method of composite structure and manufacturing method of semiconductor device |
-
2015
- 2015-05-11 CN CN201510235215.6A patent/CN104822223A/en active Pending
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106653630A (en) * | 2017-01-22 | 2017-05-10 | 大连大学 | Silicon surface metallization method |
| CN107986810A (en) * | 2018-01-22 | 2018-05-04 | 中国计量大学 | Power electronic device AlN ceramic bonded copper base and preparation method thereof |
| CN107986810B (en) * | 2018-01-22 | 2022-11-18 | 中国计量大学 | AlN ceramic copper-clad substrate for power electronic device and preparation method thereof |
| CN108684154A (en) * | 2018-04-09 | 2018-10-19 | 深圳市可信华成通信科技有限公司 | A kind of non-metal material surface realizes the method and component of microstrip circuit |
| WO2019195976A1 (en) * | 2018-04-09 | 2019-10-17 | 深圳市可信华成通信科技有限公司 | Method for realizing microstrip circuit on surface of non-metal material, and component |
| DE102020204989B3 (en) | 2020-04-21 | 2021-09-23 | Friedrich-Alexander-Universität Erlangen-Nürnberg | Process for the additive manufacturing of a circuit carrier and circuit carrier |
| WO2021214050A1 (en) * | 2020-04-21 | 2021-10-28 | Friedrich-Alexander-Universität Erlangen-Nürnberg | Method for the additive manufacture of a circuit carrier, and circuit carrier |
| JP7518365B2 (en) | 2020-08-27 | 2024-07-18 | 日亜化学工業株式会社 | Manufacturing method of composite structure and manufacturing method of semiconductor device |
| CN112469199A (en) * | 2020-11-24 | 2021-03-09 | 贵研铂业股份有限公司 | Preparation method of aluminum nitride ceramic circuit board |
| CN112969303A (en) * | 2021-02-01 | 2021-06-15 | 南昌大学 | Circuit printing method based on 3D printing and prepared high-power circuit board |
| CN114213139A (en) * | 2021-12-31 | 2022-03-22 | 深圳市吉迩科技有限公司 | Preparation method of ceramic heating element and ceramic heating element |
| CN115023059A (en) * | 2022-08-08 | 2022-09-06 | 华中科技大学 | Manufacturing method of conformal conductive circuit on surface of dielectric material |
| CN115023059B (en) * | 2022-08-08 | 2022-10-28 | 华中科技大学 | Manufacturing method of conformal conductive circuit on surface of dielectric material |
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Application publication date: 20150805 |
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