CN108684154A - A kind of non-metal material surface realizes the method and component of microstrip circuit - Google Patents
A kind of non-metal material surface realizes the method and component of microstrip circuit Download PDFInfo
- Publication number
- CN108684154A CN108684154A CN201810310335.1A CN201810310335A CN108684154A CN 108684154 A CN108684154 A CN 108684154A CN 201810310335 A CN201810310335 A CN 201810310335A CN 108684154 A CN108684154 A CN 108684154A
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- China
- Prior art keywords
- microstrip circuit
- corresponding region
- glass
- metal powder
- ceramic
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C24/00—Coating starting from inorganic powder
- C23C24/08—Coating starting from inorganic powder by application of heat or pressure and heat
- C23C24/10—Coating starting from inorganic powder by application of heat or pressure and heat with intermediate formation of a liquid phase in the layer
- C23C24/103—Coating with metallic material, i.e. metals or metal alloys, optionally comprising hard particles, e.g. oxides, carbides or nitrides
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The present invention relates to methods and component that a kind of non-metal material surface realizes microstrip circuit.Nonmetallic in the method for the present invention includes glass or ceramics, and method includes：The corresponding region of S1, selected glass or ceramic surface and microstrip circuit；S2, the mixture of metal powder and catalyst is covered by corresponding region by feeding system；S3, by laser irradiation corresponding region, form microstrip circuit metal layer with activated metal powder and in corresponding region.It is simple to implement manufacturing process of the present invention, entire manufacturing process pollution is small.
Description
Technical field
The present invention relates to circuit design process, and microstrip circuit is realized more specifically to a kind of non-metal material surface
Method and component.
Background technology
With the development of smart mobile phone, user the appearance requirement of smart mobile phone is also surpassed come it is higher.Conventional plastic casing/
Metal shell appearance is difficult to meet the requirement that user embodies product appearance and user at this stage.The novelty of ceramic back-cover and glass
Design, the change that another ID can be caused to design.The nonmetallic materials such as ceramic back-cover and glass are mostly non-conductors electrically and thermally,
Before non-metal material surface metallization, generally requires that non-metal material surface is made to become conductor first, cover one layer of metal
Film is possible to realize metallization.There are many method for forming metal film, have and apply conducting resinl method, aluminium paste high temperature reduction method, chemistry
Coating method etc..Above-mentioned various method and processes are complicated and are also easy to bring pollution.
Invention content
The technical problem to be solved in the present invention is, for the drawbacks described above of the prior art, provides a kind of nonmetallic materials
Realize the method and component of microstrip circuit in surface.
The technical solution adopted by the present invention to solve the technical problems is：Construct a kind of non-metal material surface realization micro-strip
The method of circuit, wherein it is nonmetallic include glass or ceramics, the method includes：
S1, the corresponding region for selecting the glass or ceramic surface and the microstrip circuit；
S2, the mixture of metal powder and catalyst is covered by the corresponding region by feeding system；
S3, by corresponding region described in laser irradiation, to activate the metal powder and be formed in the corresponding region micro-
Band electric circuit metal layer.
Preferably, following steps are executed before the step S1：
S0, oil removing is carried out to the glass or ceramic surface by organic solvent or electrochemical deoiling method.
Preferably, the step S1 further includes：The corresponding region is roughened by laser.
Preferably, the method further includes executing the step S3 in an inert atmosphere；And/or
Antioxidant is added in the metal powder.
Preferably, the feeding system includes the mechanical feeding system of smart electronics.
Preferably, the step S1 further includes：Drop surface treatment is carried out to the corresponding region.
Preferably, the metal powder includes cathode copper.
Preferably, the microstrip circuit includes the match circuit of antenna, coil and/or antenna.
The present invention also constructs a kind of component, including glass or ceramic material surface, and passes through methods described above shape
At the microstrip circuit in the glass or ceramic surface.
Preferably, the component includes the ceramic rear cover for intelligent terminal.
A kind of non-metal material surface of offer for implementing the present invention realizes the method and component of microstrip circuit, has with following
Beneficial effect：Manufacturing process is simple, and entire manufacturing process pollution is small.
Description of the drawings
Present invention will be further explained below with reference to the attached drawings and examples, in attached drawing：
Fig. 1 is the method flow schematic diagram that a kind of non-metal material surface of the present invention realizes microstrip circuit；
Fig. 2 is the method schematic diagram that a kind of non-metal material surface of the present invention realizes microstrip circuit；
Fig. 3 is a kind of structural schematic diagram of one embodiment of component of the present invention；
Fig. 4 is a kind of structural schematic diagram of another embodiment of component of the present invention.
Specific implementation mode
For a clearer understanding of the technical characteristics, objects and effects of the present invention, now control attached drawing is described in detail
The specific implementation mode of the present invention.
As depicted in figs. 1 and 2, in a kind of nonmetallic surface of the present invention realizes the embodiment of the method for microstrip circuit,
In it is nonmetallic include glass or ceramics 100, this method includes：
The corresponding region of S1, selected glass or ceramic 100 surfaces and microstrip circuit；Specifically, can be by pretreated
Mode draws out figure corresponding with microstrip circuit in glass or ceramic 100 surfaces according to the structure of microstrip circuit, by the figure
As processing region corresponding with the microstrip circuit of expected design.Certainly the figure of corresponding region here can also be invisible
's.
S2, the mixture of metal powder and catalyst is covered by corresponding region by feeding system 20；Specifically, by giving
Metal powder figure corresponding with the mixture of catalyst foundation microstrip circuit is covered in glass or ceramic 100 tables by material system 20
On face, here since metal powder is thinner, due to intermolecular left and right, metal powder can be adsorbed on glass or ceramics 100
Surface.
S3, corresponding region is irradiated by laser 30, microstrip circuit metal is formed with activated metal powder and in corresponding region
Layer 110.Specifically, irradiating the region corresponding with microstrip circuit for being covered with metal powder by laser 30, irradiated in laser 30
Under the action of, the activation of metal powder, metal ion can be accumulated to form metal layer, thus pass through entire corresponding region
Metal layer forms the microstrip circuit of needs.Herein, it should be noted that step S2 neutralization procedures S3 can be one in front and one in back
It is synchronous to carry out, such as in embodiment shown in Fig. 2, lateral dominance carries out metal powder covering with feeding system 20 to corresponding region,
Lateral dominance irradiates activation with laser 30 to the metal powder of covering, and is not limited to first complete the entire corresponding region of microstrip circuit
Then covering is irradiated activated metal powder using laser 30.It usually can be by the running route of feeding system 20 and laser 30
Running route setting it is identical, it is only necessary to be arranged two systems operation time difference the above process both may be implemented.
Further, following steps are executed before step S1：
S0, oil removing is carried out to glass or ceramic 100 surfaces by organic solvent or electrochemical deoiling method.Specifically, due to normal
In the exposed and air of material, oily layer can be also formed, forms oily pollution, metal powder is influenced and forms metal layer
Can, so that influencing microstrip circuit performance, it may be used that there are commonly solvents or electrochemical deoiling method to glass or pottery here
100 surface of porcelain carries out oil removal treatment.
Further, step S1 further includes：Corresponding region is roughened by laser.Specifically, in glass or ceramics
After 100 surfaces have selected microstrip circuit corresponding region, corresponding region first can be subjected to roughing in surface using laser, in glass
Or ceramic 100 surfaces form more coarse surface, can increase metal powder and glass or the contact surface of ceramics 100 in this way
Product ensure that metal powder can preferably be adsorbed on glass or ceramic 100 surfaces.
Further, method of the invention further includes executing step S3 in an inert atmosphere；In some embodiments
In, antioxidant can also be added in metal powder.Specifically, metal powder is aoxidized in activation process in order to prevent,
The process for process, that is, above step S3 that entire laser 30 irradiates activated metal powder can carry out in an inert atmosphere,
It is of course also possible to which the process for carrying out metal powder covering in above step S2 by feeding system 20 is also put into inert gas
It is carried out under environment.Here the inert gases such as nitrogen or argon gas may be used in inert gas.In addition, in some embodiments,
It can also use and add reducing agent or antioxidant in metal powder, prevent metal powder in activation process from being aoxidized, directly
Connect the metal layer to be formed and be met the requirements.
Further, in step s 2, feeding system 20 includes the mechanical feeding system of smart electronics.Specifically, can be with
By the feeding system 20 of intelligent control, the accuracy of the uniformity and overlay area of metal powder covering may be implemented.
Further, step S1 further includes：Drop surface treatment is carried out to corresponding region.Specifically, having selected microstrip circuit
Behind corresponding region, first the corresponding region can be carried out drop face, i.e., to make the height in the region by way of cutting down or polishing
Less than other regions, the space for leaving microstrip circuit in this way can be relatively more, especially microstrip circuit for antenna circuit when, can be with
It is effective to increase antenna height, improve antenna radiation efficiency.In embodiment as shown in Figure 4, antenna is in interior ceramic surface, ceramics
Body has drop face, the height for promoting antenna.
Further, metal powder of the invention includes cathode copper.Specifically, the material theme of metal powder is electrolysis
Copper forms layers of copper after activation, can be very good to realize microstrip circuit conductive characteristic.Here use can also be added in metal powder
In the active rare metal for adjusting metal attachment material surface.And catalyst, can be the metallic conductor performance to be formed
It is further preferred that.
Further, the microstrip circuit in the present invention includes the match circuit of antenna, coil and/or antenna.Specifically, main
Using the antenna applications of the smart machines such as intelligent mobile phone antenna or tablet computer glass or ceramic 100 material surfaces, day is reduced
The match circuit of antenna can thus be moved to antenna area by the space that line occupies, such as can be by the tuning electricity on mainboard
Road moves on ceramic back-cover antenna, and when tuning circuit is surface mount elements, antenna is spacial to be reduced so that SMY patches are convenient
And it is small on antenna performance influence, its certain application circuit is not limited to the circuit form enumerated here.
In addition, a kind of component of the present invention, including glass or ceramic 100 material surfaces, and pass through method described above shape
At the microstrip circuit in glass or ceramic 100 surfaces.Specifically, here can be by method described above in glass or ceramics
100 material surfaces form microstrip circuit, glass or ceramic 100 electronic components can be formed in this way, for example, ceramics can be made
Capacitance, ceramic inductance etc..Its best application be exactly in ceramic antenna, in embodiment as shown in Figure 3, the ceramic antenna 111
(being equivalent to microstrip circuit 110) can ceramic 100 body surface faces locally realize the thickness H1 of 0.2MM, pass through the thickness for reducing ceramic body
Degree, to the antenna of its inner surface, there are more spaces, to improve the height H2 of antenna, more conducively the integral radiation effect of antenna
Fruit.
Further, component of the invention includes the ceramic rear cover for intelligent terminal.Specifically, reality as shown in Figure 4
It applies in example, the existing most common ceramic rear cover with antenna, the clearance zone larger due to that can realize antenna, the entirety of antenna
Radiation effect is good, with the performance for providing raising intelligent terminal on intelligent terminal.
Certainly component here is not limited to single small building block, and component here can be understood as intelligence
The various electronic devices such as terminal, such as the mobile phone with microstrip circuit made of method of the invention, also belong to the portion of the present invention
The range that part is protected.It will not enumerate herein.
It should be understood that above example only expresses the preferred embodiment of the present invention, description is more specific and detailed
Carefully, but it cannot be construed as a limitation to the scope of the present invention；It should be pointed out that for the common skill of this field
For art personnel, without departing from the inventive concept of the premise, above-mentioned technical characterstic can be freely combined, can also be done
Go out several modifications and improvements, these are all within the scope of protection of the present invention；Therefore, all to be done with scope of the invention as claimed
Equivalents and modification, should all belong to the covering scope of the claims in the present invention.
Claims (10)
1. a kind of method that nonmetallic surface realizes microstrip circuit, wherein nonmetallic includes glass or ceramics, which is characterized in that institute
The method of stating includes：
S1, the corresponding region for selecting the glass or ceramic surface and the microstrip circuit；
S2, the mixture of metal powder and catalyst is covered by the corresponding region by feeding system；
S3, by corresponding region described in laser irradiation, to activate the metal powder and form micro-strip electricity in the corresponding region
Road metal layer.
2. the method that nonmetallic surface according to claim 1 realizes microstrip circuit, which is characterized in that in the step S1
Following steps are executed before：
S0, oil removing is carried out to the glass or ceramic surface by organic solvent or electrochemical deoiling method.
3. the method that nonmetallic surface according to claim 1 realizes microstrip circuit, which is characterized in that the step S1 is also
Including：The corresponding region is roughened by laser.
4. the method that nonmetallic surface according to claim 1 realizes microstrip circuit, which is characterized in that the method is also wrapped
It includes, executes the step S3 in an inert atmosphere；And/or
Antioxidant is added in the metal powder.
5. the method that nonmetallic surface according to claim 1 realizes microstrip circuit, which is characterized in that the feeding system
Including the mechanical feeding system of smart electronics.
6. the method that nonmetallic surface according to claim 1 realizes microstrip circuit, which is characterized in that the step S1 is also
Including：Drop surface treatment is carried out to the corresponding region.
7. the method that nonmetallic surface according to claim 1 realizes microstrip circuit, which is characterized in that the metal powder
Including cathode copper.
8. the method that the nonmetallic surface according to claim 1-7 any one realizes microstrip circuit, which is characterized in that institute
State the match circuit that microstrip circuit includes antenna, coil and/or antenna.
9. a kind of component, which is characterized in that including glass or ceramic material surface, and pass through claim 1-8 any one
The method is formed in the microstrip circuit of the glass or ceramic surface.
10. component according to claim 9, which is characterized in that the component includes the ceramic rear cover for intelligent terminal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810310335.1A CN108684154A (en) | 2018-04-09 | 2018-04-09 | A kind of non-metal material surface realizes the method and component of microstrip circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810310335.1A CN108684154A (en) | 2018-04-09 | 2018-04-09 | A kind of non-metal material surface realizes the method and component of microstrip circuit |
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| Publication Number | Publication Date |
|---|---|
| CN108684154A true CN108684154A (en) | 2018-10-19 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810310335.1A Pending CN108684154A (en) | 2018-04-09 | 2018-04-09 | A kind of non-metal material surface realizes the method and component of microstrip circuit |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103813639A (en) * | 2013-11-07 | 2014-05-21 | 溧阳市江大技术转移中心有限公司 | Method for forming conductive circuit on flexible substrate |
| US20140353005A1 (en) * | 2013-06-04 | 2014-12-04 | E I Du Pont De Nemours And Company | Method of making microwave and millimeterwave electronic circuits by laser patterning of unfired low temperature co-fired ceramic (ltcc) substrates |
| CN104822223A (en) * | 2015-05-11 | 2015-08-05 | 惠宇 | Ceramic-based circuit board and preparation method thereof |
| CN105811084A (en) * | 2014-12-31 | 2016-07-27 | 比亚迪股份有限公司 | Antenna module and preparation method thereof |
| CN106653630A (en) * | 2017-01-22 | 2017-05-10 | 大连大学 | Silicon surface metallization method |
-
2018
- 2018-04-09 CN CN201810310335.1A patent/CN108684154A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140353005A1 (en) * | 2013-06-04 | 2014-12-04 | E I Du Pont De Nemours And Company | Method of making microwave and millimeterwave electronic circuits by laser patterning of unfired low temperature co-fired ceramic (ltcc) substrates |
| CN103813639A (en) * | 2013-11-07 | 2014-05-21 | 溧阳市江大技术转移中心有限公司 | Method for forming conductive circuit on flexible substrate |
| CN105811084A (en) * | 2014-12-31 | 2016-07-27 | 比亚迪股份有限公司 | Antenna module and preparation method thereof |
| CN104822223A (en) * | 2015-05-11 | 2015-08-05 | 惠宇 | Ceramic-based circuit board and preparation method thereof |
| CN106653630A (en) * | 2017-01-22 | 2017-05-10 | 大连大学 | Silicon surface metallization method |
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Application publication date: 20181019 |
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