CN104228209A - Metal-resin adhesion structure, circuit board and copper cladding foil layer including metal-resin adhesion structure, and method for making same structure - Google Patents
Metal-resin adhesion structure, circuit board and copper cladding foil layer including metal-resin adhesion structure, and method for making same structure Download PDFInfo
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- CN104228209A CN104228209A CN201410247418.2A CN201410247418A CN104228209A CN 104228209 A CN104228209 A CN 104228209A CN 201410247418 A CN201410247418 A CN 201410247418A CN 104228209 A CN104228209 A CN 104228209A
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- resin
- metal
- chemical formula
- resin bed
- bed
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/101—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by casting or moulding of conductive material
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The present invention discloses a metal-resin adhesion structure, a circuit board and a copper cladding foil layer including metal-resin adhesion structure, and a method for making the same metal-resin adhesion structure. According to the present invention, the meta-resin adhesion structure comprises a resin layer, a metal layer attached to the resin layer, and a modified layer that is disposed on the attaching surface between the resin layer and the metal layer, and comprises a silane coupling agent to provide adhesion between the resin layer and the metal layer.
Description
Quoting of related application
This application claims the rights and interests that the autograph submitted on June 24th, 2013 is No. 10-2013-0072568th, the korean patent application sequence number of " Metal-Resin Adhesion Structure and Method for Manufacturing the Same the Same; and Circuit Board and Copper Clad Laminate with the Structure ", its full content by reference entirety is incorporated into the application.
Technical field
The present invention relates to metal-resin adhesion arrangement and manufacture method thereof, and more specifically, relate to a kind of metal-resin adhesion arrangement and the manufacture method thereof that can improve adhesion between metal and polymer resin, and there is circuit board and the copper-clad laminate (copper-clad plate, copper clad laminate) of this structure.
Background technology
The laminates (sheet laminate) that multiple polymer insulation sheets that circuit board is formed on surface by its metal pattern as printed circuit board (PCB) form is made.For the manufacture of the polymer insulation film of circuit board by various resin material as epoxy resin, acrylic resin, phenolic resins, imide resin etc. are made, and metal pattern is by being printed on metal paste on the dielectric film be made up of resin material or using plating technic (plating process) to be formed.At this, the adhesion between metal pattern and dielectric film determines that the characteristic of plate is as the key factor in the stability of circuit board etc. and reliability.
Usually, because metal is chemical stabilization, metal can not adhere to polymer resin effectively, and it is organic material.Therefore, when the plating pattern (plating pattern) formed by chemical plating process (electroless plating process) being formed on polymer insulation film to manufacture printed circuit board (PCB), be not easy to form plating pattern, or formed plating pattern and dielectric film between adhesion obviously weak, make layering (delamination) or the segregation phenomenon that may produce plating pattern.
[relate art literature]
[patent document]
No. 2011-091066th, (patent document 1) Japanese Patent Publication
Summary of the invention
The object of this invention is to provide the metal-resin adhesion arrangement and manufacture method thereof that can improve product stability and reliability, and there is circuit board and the copper-clad laminate of this structure.
Another object of the present invention is to provide metal-resin adhesion arrangement and the manufacture method thereof of the adhesion that can improve between metal pattern and polymer insulation film, and has circuit board and the copper-clad laminate of this structure.
According to an illustrative embodiment of the invention, a kind of metal-resin adhesion arrangement is provided, comprises: resin bed; Adhere to the metal level of resin bed; And the adhesive surface being arranged between resin bed and metal level comprises the material that represented by following chemical formula 1 to provide the modified layer of the adhesion between resin bed and metal level.
[chemical formula 1]
[R comprises alkoxyl, and R ' comprises cyclic group (cyclic group)].
Modified layer is formed by making the surface modification of resin bed.
The material represented by chemical formula 1 can be by making the material represented by chemical formula 2 and the material Reactive Synthesis represented by chemical formula 3.
[chemical formula 2]
[chemical formula 3]
[R comprises alkoxyl, and R ' comprises the cyclic group of alkyl or mesitylene base (mesityl group)]
Resin bed can be made up of any one material in epoxy resin, phenolic resins, imide resin and polyurethane resin.
Metal-resin adhesion arrangement can be used for manufacturing printed circuit board (PCB), and metal level can be the circuit pattern of printed circuit board (PCB).
Metal level can comprise the plating pattern by carrying out plating technic formation on the resin layer.
According to another illustrative embodiments of the present invention, be provided for the method manufacturing metal-resin adhesion arrangement, the method comprises: prepare resin bed; The surface of resin bed forms hydroxyl; The coupling agent that represented by following chemical formula 1 and resin bed is made to react with the surface of modified resin layer; And form metal level on the resin layer.
[chemical formula 1]
[R comprises alkoxyl, and R ' comprises cyclic group].
Can by the coupling agent making the material represented by chemical formula 2 be represented by chemical formula 1 with the material Reactive Synthesis represented by chemical formula 3.
[chemical formula 2]
[chemical formula 3]
[R comprises alkoxyl, and R ' comprises the cyclic group of alkyl or mesitylene base].
The formation of hydroxyl can comprise the surface with plasma (plasma) process resin layer.
The preparation of resin bed can comprise casting and comprise the composite of at least one in epoxy resin, phenolic resins, imide resin and polyurethane resin to prepare dielectric film.
Accompanying drawing explanation
Fig. 1 is the view of the metal-resin adhesion arrangement illustrated according to an illustrative embodiment of the invention.
Fig. 2 is the enlarged drawing of part A shown in Figure 1.
Fig. 3 is the view of the main material of the coupling agent illustrated according to an illustrative embodiment of the invention.
Fig. 4 is the flow chart of the method for the manufacture of metal-resin adhesion arrangement illustrated according to an illustrative embodiment of the invention.
Fig. 5 A to 5D is the view of the manufacture method for illustration of metal-resin adhesion arrangement according to an illustrative embodiment of the invention.
Detailed description of the invention
With reference to accompanying drawing from the description of following embodiment, the method for various advantages and features of the present invention and realization thereof will become apparent.But, the present invention can be revised in different forms and should not be restricted to embodiment illustrated in this article.On the contrary, these embodiments can be provided to make the disclosure thorough and complete, and fully pass on scope of the present invention to those of skill in the art.Run through this description, identical reference number represents identical key element (element).
The term used in this manual is used to explain embodiment instead of restriction the present invention.Be contrary unless expressly stated, otherwise the singulative in this description comprise plural form.Word " comprise (comprise) " and as variants such as " comprising (comprises) " or " containing (comprising) " be interpreted as representing comprise state component part, step, operation and/or key element, but do not represent and get rid of any other component part, step, operation and/or key element.
In addition, with reference to the illustrative embodiments be described in for the cross sectional view of desirable example accompanying drawing and/or plan view described in this description.In the accompanying drawings, the thickness in layer and region is exaggerated effectively technology contents to be described.Therefore, the form of illustration can be changed according to manufacturing technology and/or tolerance (tolerance).Therefore, illustrative embodiments of the present invention is not limited to particular form, but can comprise the pro forma change produced according to manufacturing process.Such as, the etching area vertically illustrated can be that circle maybe can have predetermined bending.
Hereinafter, describe metal-resin adhesion arrangement according to an illustrative embodiment of the invention and manufacture method thereof with reference to the accompanying drawings in detail, and there is printed circuit board (PCB) and the copper-clad laminate of metal-resin adhesion arrangement.
Fig. 1 is the view of the metal-resin adhesion arrangement illustrated according to an illustrative embodiment of the invention, and Fig. 2 is the enlarged drawing of part A shown in Figure 1.In addition, Fig. 3 is the view of the main material of the coupling agent illustrated according to another illustrative embodiments of the present invention.
Referring to figs. 1 to Fig. 3, the plate as printed circuit board (PCB) (PCB), copper-clad laminate (CCL) etc. can be applied to according to the metal-resin adhesion arrangement 100 of exemplary embodiment of the invention, and be the wherein structure that is adhering to each other of metal and resin.Such as, when metal-resin adhesion arrangement 100 being applied to printed circuit board (PCB) wherein, resin bed 110 can be used as interlayer dielectric, and metal level 120 can be formed in the metal circuit pattern on interlayer dielectric and be made up of at least one metal being selected from tin, zinc, nickel, chromium, cobalt, aluminium and copper.As another example, when metal-resin adhesion arrangement 100 is applied to copper-clad laminate wherein, resin bed 110 is dielectric films, and metal level 120 can be formed in the metallic film on dielectric film.
Resin bed 110 can be the layer be made up of polymeric resin material.The dielectric film that the composite insulating material comprising polymeric resin material by casting can be used to be formed prepares resin bed 110.Fluoropolymer resin can be at least one in epoxy resin, phenolic resins, imide resin and polyurethane resin.
Metal level 120 can be the layer be made up of metal material.Metal level 120 can be the plating pattern formed by carrying out predetermined plating technic on dielectric film.Chemical plating process (electroless plating process), electroplating technology (electroplating process) etc. can be used as plating technic.
Meanwhile, in order to resin bed 110 and metal level 120 effectively be adhered to each other, circuit board 100 can comprise the modified layer 130 on the adhesive surface that is formed between these layers 110 and 120.More specifically, the modified layer 130 formed by making the surface modification of resin bed 110 or metal level 120 is not use the adhesive layer that formed of other adhesive (separate adhesive), but can be formed by using predetermined coupling agent to make resin bed 110 and metal level 120 chemical adhesion.
Such as, go out as shown in FIG. 3, in modified layer 130, comprising the coupling agent of material (base material) based on material that chemical formula 1 represents can be main material.In chemical formula 1, R comprise can produce condensation reaction alkoxyl as ethyoxyl or methoxyl group, and R ' can be the cyclic group of alkyl, mesitylene base etc.R ' optionally comprises or does not comprise hetero atom.In addition, imidazoles can comprise there is at least one N heterocyclic compound (heterocompound, hetero compound) as pyridinium, pyridine, triazole etc.
Modified layer 130 as described above can improve the adhesion between resin bed 110 and metal level 120 and not need other adhesive.More specifically, modified layer 130 is by making the surface modification of resin bed 110 and forming metal level 120 to improve the adhesion between resin bed 110 and metal level 120 on the resin bed 110 through surface modification.In this case, with the polymer initial bed (prime coat be wherein made up of the such as thermoset resin material such as polyurethane resin, acrylic resin, primer layer) situation about being provided at as adhesive layer between metal level and resin bed compares, and fundamentally can solve the problem causing the adhesion between resin bed and metal level to reduce owing to producing crack and pore in initial bed.In addition, can prevent, when using initial bed, during manufacture process Technology for Heating Processing or curing process being applied to circuit board, there is the problem of the alteration of form of the resin of poor heat resistance or physical property.
In addition, when resin bed 110 and metal level 120 being adhering to each other by above-mentioned surface modifying method wherein, compare with situation about resin bed and metal level being adhering to each other with providing surface roughness, advantage is the etching process not needing the other chemicals used for being individually formed surface roughness.Especially, consider nearest plate towards meticulous and integrated development trend, use the adhesion method of surface roughness really not meet this trend, but use the adhesive bonding method of above-mentioned surface modification can meet the meticulous and integrated of circuit board.
Compared with the situation of other initial bed or surface roughness is provided, although be with the naked eye difficult to confirm above-mentioned modified layer, by performance and the purity confirmation modified layer 130 using gas chromatography-mass spectrum (GC-MS), nuclear magnetic resonance etc. to analyze its synthesis, and the change of numerical Evaluation in surface nature can be carried out by the wettability etc. on the surface evaluating modified resin layer 110.In addition, adhesion between resin bed 110 and metal level 120 can be measured by the layering evaluated between these layers 110 and 120.
As described above, mutual chemical ground binding resin layer 110 and metal level 120 are come with the adhesion improved between resin bed 110 and metal level 120 in the surface that metal-resin adhesion arrangement 100 according to the embodiment of the present invention can use predetermined coupling agent to carry out modified resin layer 110.In this case, with other initial bed is provided or forms surface roughness with compared with the situation increasing adhesion, the distortion of resin during manufacture process can be prevented, may not need to use chemicals, and this situation can be applied to its nearest trend towards the circuit board developed such as meticulous and integrated.Therefore, according to metal-resin adhesion arrangement of the present invention, and the plate as the printed circuit board (PCB), copper-clad laminate etc. that comprise metal-resin adhesion arrangement improves adhesion by carrying out surface modification on resin bed and metal level, with initial bed is provided or forms rough surface with compared with the technology increasing adhesion, this makes by means of only surface treatment just can realize high adhesion without the need to comprising other adhesive, thus improves the adhesion between resin bed and metal level.
Hereinafter, the method for the manufacture of circuit board according to exemplary embodiment of the invention will be described in detail.Here, can save or simplify the explanation repeated with foregoing circuit plate 100.
Fig. 4 is the flow chart of the method for the manufacture of circuit board illustrated according to an illustrative embodiment of the invention; And Fig. 5 A to 5D is the view of the manufacture process for illustration of circuit board according to an illustrative embodiment of the invention.
With reference to figure 4 and Fig. 5 A, resin bed 110 (S110) can be prepared.The preparation of resin bed 110 can comprise preparation comprise the composite of fluoropolymer resin and casting composite to form film.At least one can be used in epoxy resin, phenolic resins, imide resin and polyurethane resin as fluoropolymer resin.Resin bed 110 can be the insulating trip for the preparation of printed circuit board (PCB), so-called raw cook (green sheet).Alternately, resin bed 110 can be the insulating trip for the preparation of copper-clad laminate.
In addition, the surface of resin bed 110 can be formed with hydroxyl (S120).By carrying out oxygen or H plasma treatment formation hydroxyl on resin bed 110.
With reference to figure 4 and Fig. 5 B, coupling agent (S130) can be formed.As shown in Figure 5 B, the anion in the silane represented by chemical formula 2 is replaced in the formation of coupling agent by the imidazoles represented by chemical formula 3.The situation of chlorion as anion of wherein silane tool is shown by the mode of example, but have different sizes and physical property anion (as BF4, PF6 etc.) can according to the resin that uses differently replaced.Imidazoles can be the heterocyclic compound with at least one N, as pyridinium, pyridine, triazole etc.Therefore, the silane coupling agent with imidazoles can be synthesized.
With reference to figure 4 and Fig. 5 C, the hydroxyl of resin bed 110 can react (S140) with coupling agent.The resin bed 110 being formed with hydroxyl in its surface by using the silane coupling agent with imidazoles carries out condensation reaction and carries out course of reaction.Therefore, as shown in Figure 5 C, silane coupling agent can be formed on resin bed 110 with the surface of modified resin layer 110.
With reference to figure 4 and Fig. 5 D, metal level 120 can be formed in (S150) on resin bed 110.By carrying out chemical plating process or electroplating technology to be formed by metal circuit patterns such as such as copper to form metal level 120 on resin bed 110.At this moment wait, metal level 120 can allow coupling agent to be formed on resin bed 110 to realize chemical coupling (chemical coupling) effect between resin bed 110 and metal level 120, makes it possible to the adhesion improving metal circuit pattern and resin bed 110.After this, another resin bed 110 is laminated on resin bed 110, makes it possible to prepare and there is resin bed 110 and metal level 120 is adhering to each other the circuit board 100 by modified layer 130 with high adhesion simultaneously.
As mentioned above, in the method for the manufacture of metal-resin adhesion arrangement 100 according to an illustrative embodiment of the invention, by have the resin bed 110 using the silane coupling agent that represented by chemical formula 1 to be formed at the hydroxyl on its surface carries out condensation reaction by the surface modification of resin bed 110 after, metal level 120 can be formed on resin bed 110.In this case, with other initial bed is provided or forms surface roughness with compared with the situation increasing adhesion, only can provide the high adhesion between resin bed 110 and metal level 120 by surface modification, make this situation can be applied in the plate technique using adhesion arrangement between resin bed and metal level, the recent trend of plate technique is towards meticulous and precision development.Therefore, the method for the manufacture of metal-resin adhesion arrangement according to an illustrative embodiment of the invention can by means of only the adhesion between the surface modification treatment raising resin bed of resin bed and metal level, therefore, with other initial bed is provided or forms surface roughness with compared with the situation increasing adhesion, high adhesion can be realized and do not need other adhesive layer or chemical treatment, thus making it prepare to have the metal-resin adhesion arrangement of high adhesion.
According to metal-resin adhesion arrangement of the present invention and plate, printed circuit board (PCB), copper-clad laminate etc. as comprised this metal-resin adhesion arrangement improve adhesion by carrying out surface modification on resin bed and metal level, therefore with initial bed is provided or forms surface roughness with compared with the technology increasing adhesion, by means of only surface treatment realizes high adhesion without the need to comprising other adhesive, thus the adhesion between resin bed and metal level can be increased.
The method for the manufacture of metal-resin adhesion arrangement according to an illustrative embodiment of the invention can by means of only the adhesion between the surface modification treatment raising resin bed of resin bed and metal level, therefore, with other initial bed is provided or forms surface roughness with compared with the situation increasing adhesion, can not need to realize high adhesion in other adhesive layer or chemically treated situation, thus make it possible to prepare the metal-resin adhesion arrangement with high adhesion.
Combine the illustrative embodiments being regarded as practicality at present and describe the present invention.Although described illustrative embodiments of the present invention, can change in the concept disclosed in description or revise the present invention, this scope be equal to the scope of technology in the disclosure and/or the field that the present invention relates to or knowledge.Provide above-mentioned exemplary embodiment to explain best mode in the embodiment of this invention.Therefore, in use as in other inventions of the present invention, can other known to this field relate to situation of the present invention under implement these illustrative embodiments, and can to change in a variety of manners under the requirement of concrete application and usage of the present invention equally.Therefore, should be understood that and the invention is not restricted to disclosed embodiment.Should be appreciated that other embodiments are also included within to enclose in the spirit and scope of claim.
Claims (12)
1. a metal-resin adhesion arrangement, comprising:
Resin bed;
Metal level, adheres to described resin bed; And
Modified layer, to be arranged on the adhesive surface between described resin bed and described metal level and to comprise the material that represented by following chemical formula 1 to provide the adhesion between described resin bed and described metal level,
[chemical formula 1]
R comprises alkoxyl, and R ' comprises cyclic group.
2. metal-resin adhesion arrangement according to claim 1, wherein, forms described modified layer by making the surface modification of described resin bed.
3. metal-resin adhesion arrangement according to claim 1, wherein, the described material represented by chemical formula 1 is by making the material represented by chemical formula 2 and the material Reactive Synthesis represented by chemical formula 3,
[chemical formula 2]
[chemical formula 3]
R comprises alkoxyl, and R ' comprises the cyclic group of alkyl or mesitylene base.
4. metal-resin adhesion arrangement according to claim 1, wherein, described resin bed is made up of any one material in epoxy resin, phenolic resins, imide resin and polyurethane resin.
5. metal-resin adhesion arrangement according to claim 1, wherein, described metal-resin adhesion arrangement is used to manufacture printed circuit board (PCB), and described metal level is the circuit pattern of described printed circuit board (PCB).
6. metal-resin adhesion arrangement according to claim 1, wherein, described metal level comprises the plating pattern by carrying out plating technic formation on described resin bed.
7. a circuit board, comprises metal-resin adhesion arrangement according to any one of claim 1 to 6.
8. a copper-clad laminate, comprises metal-resin adhesion arrangement according to any one of claim 1 to 6.
9., for the manufacture of a method for metal-resin adhesion arrangement, described method comprises:
Prepare resin bed;
The surface of described resin bed forms hydroxyl;
The coupling agent that represented by following chemical formula 1 and described resin bed is made to react described surface with resin bed described in modification; And
Described resin bed forms metal level,
[chemical formula 1]
R comprises alkoxyl, and R ' comprises cyclic group.
10. method according to claim 9, wherein, by making the material represented by chemical formula 2 and the coupling agent represented by chemical formula 1 described in the material Reactive Synthesis represented by chemical formula 3,
[chemical formula 2]
[chemical formula 3]
R comprises alkoxyl, and R ' comprises the cyclic group of alkyl or phenyl.
11. methods according to claim 9, wherein, the formation of described hydroxyl comprises the described surface with resin bed described in plasma treatment.
12. methods according to claim 9, wherein, the preparation of described resin bed comprises casting and comprises the composite of at least one in epoxy resin, phenolic resins, imide resin and polyurethane resin to prepare dielectric film.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2013-0072568 | 2013-06-24 | ||
| KR1020130072568A KR101994716B1 (en) | 2013-06-24 | 2013-06-24 | Metal-resin adhesion structure and method for manufacturing the structure, and circuit board and copper clad laminate with the structure |
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| Publication Number | Publication Date |
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| CN104228209A true CN104228209A (en) | 2014-12-24 |
| CN104228209B CN104228209B (en) | 2018-04-10 |
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| CN201410247418.2A Active CN104228209B (en) | 2013-06-24 | 2014-06-05 | The circuit board and copper-clad laminate of metal-resin adhesion arrangement including the structure and the method for manufacturing the structure |
Country Status (3)
| Country | Link |
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| JP (1) | JP6272675B2 (en) |
| KR (1) | KR101994716B1 (en) |
| CN (1) | CN104228209B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017016395A1 (en) * | 2015-07-29 | 2017-02-02 | 苏州卫鹏机电科技有限公司 | Method for preparing adhesive-free, polyimide flexible printed circuit board |
| CN110754141A (en) * | 2017-05-30 | 2020-02-04 | 阿莫绿色技术有限公司 | Method for manufacturing flexible printed circuit board and flexible printed circuit board manufactured by the same |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016186047A (en) * | 2015-03-27 | 2016-10-27 | 味の素株式会社 | Molecular bonding agent |
| JP6940129B2 (en) * | 2016-09-30 | 2021-09-22 | 株式会社朝日Ｆｒ研究所 | Joined body |
| JP2018111788A (en) * | 2017-01-13 | 2018-07-19 | 国立大学法人大阪大学 | Bond structure, and production method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1367734A (en) * | 1998-09-10 | 2002-09-04 | 加-特克公司 | Adhesion promoting layer for use with epoxy prepregs |
| JP2003318499A (en) * | 2002-04-23 | 2003-11-07 | Matsushita Electric Works Ltd | Prepreg for inner layer circuit, metal-foiled laminate for inner layer circuit, and multilayer printed circuit board |
| CN101585955A (en) * | 2008-12-31 | 2009-11-25 | 广东生益科技股份有限公司 | Resin composition, resin-coated copper foil produced by same and copper-clad plate produced by utilizing resin-coated copper foil |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3458050B2 (en) * | 1997-05-22 | 2003-10-20 | 株式会社ジャパンエナジー | Copper foil for printed circuits |
| JP2001348893A (en) * | 2000-06-06 | 2001-12-21 | Kenji Nakayama | Retaining wall structure |
| TW200500204A (en) * | 2002-12-05 | 2005-01-01 | Kaneka Corp | Laminate, printed circuit board and method for manufacturing them |
| WO2005016940A1 (en) * | 2003-08-11 | 2005-02-24 | Merck Patent Gmbh | Imidazolium salts that can be immobilized |
| JP2007150221A (en) * | 2005-10-27 | 2007-06-14 | Fujitsu Ltd | Multilayer circuit board and method for manufacturing the same |
| KR100747627B1 (en) * | 2006-06-22 | 2007-08-08 | 디엠아이텍 주식회사 | Method for producing 2 layered conductive metal plated polyimide substrate |
| JP5463117B2 (en) | 2009-10-20 | 2014-04-09 | 株式会社日立製作所 | Low loss wiring board, multilayer wiring board, copper foil and laminated board used therefor |
-
2013
- 2013-06-24 KR KR1020130072568A patent/KR101994716B1/en active IP Right Grant
- 2013-11-07 JP JP2013231145A patent/JP6272675B2/en active Active
-
2014
- 2014-06-05 CN CN201410247418.2A patent/CN104228209B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1367734A (en) * | 1998-09-10 | 2002-09-04 | 加-特克公司 | Adhesion promoting layer for use with epoxy prepregs |
| JP2003318499A (en) * | 2002-04-23 | 2003-11-07 | Matsushita Electric Works Ltd | Prepreg for inner layer circuit, metal-foiled laminate for inner layer circuit, and multilayer printed circuit board |
| CN101585955A (en) * | 2008-12-31 | 2009-11-25 | 广东生益科技股份有限公司 | Resin composition, resin-coated copper foil produced by same and copper-clad plate produced by utilizing resin-coated copper foil |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017016395A1 (en) * | 2015-07-29 | 2017-02-02 | 苏州卫鹏机电科技有限公司 | Method for preparing adhesive-free, polyimide flexible printed circuit board |
| US10182501B2 (en) | 2015-07-29 | 2019-01-15 | Suzhou Weipeng Electrical Technology Co., Ltd. | Method for preparing adhesive-free polyimide flexible printed circuit board |
| CN110754141A (en) * | 2017-05-30 | 2020-02-04 | 阿莫绿色技术有限公司 | Method for manufacturing flexible printed circuit board and flexible printed circuit board manufactured by the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6272675B2 (en) | 2018-01-31 |
| KR101994716B1 (en) | 2019-07-01 |
| JP2015006783A (en) | 2015-01-15 |
| KR20150000296A (en) | 2015-01-02 |
| CN104228209B (en) | 2018-04-10 |
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